CIG10W1R0MNC

Ver. 201306 Multilayer Power Inductor CIG10W Series (1608/ EIA 0603) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES




RECOMMENDED LAND PATTERN The smallest multilayer power inductor(1.6mm×0.8mm) Lower Profile (0.8mm max) Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances DIMENSION TYPE 10 Dimension [mm] L W T D 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 DESCRIPTION Part no. Size Inductance DC Rated Current (A) (inch/mm) (uH)@1MHz Resistance(Ω) Max. CIG10WR27MNC 0603/1608 0.27±25% 0.12 ±25 % 1.30 CIG10WR47MNC 0603/1608 0.47±20% 0.15 ±20 % 1.10 CIG10W1R0MNC 0603/1608 1.0±20% 0.20 ±20 % 0.95 CIG10W1R5MNC 0603/1608 1.5±20% 0.25 ±20 % 0.80 CIG10W2R2MNC 0603/1608 2.2±20% 0.30 ±20 % 0.75 CIG10W3R3MNC 0603/1608 3.3±20% 0.40 ±20 % 0.70 CIG10W4R7MNC 0603/1608 4.7±20% 0.50 ±20 % 0.62 ※Rated Current: DC current value when the self-generation of heat rises to 40℃ (Reference ambient temperature:25℃) ※Operating temperature range: –40 to +125°C ( Including self-temperature rise) ※Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Frequency characteristics(Typ.) 2) DC Bias characteristics (Typ.) Ver. 201306 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 10 (3) W (4) 2R2 (5) M (6) N (7) C (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (W:Normal Type) Inductance (R47:0.47uH, 2R2:2.2uH) (6) Tolerance (M:±20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 4,000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.