CIG21FR47MNC

Ver. 201306 Multilayer Power Inductor CIG21F Series (2012/ EIA 0805) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES




RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION TYPE 21 Dimension [mm] L W T D 2.0±0.1 1.25±0.1 0.5max 0.5+0.2 -0.3 DESCRIPTION Part no. CIG21FR47MNC Size Inductance DC Rated Current (A) (inch/mm) (uH)@1MHz Resistance(Ω) Max. 0805/2012 0.47 ±20 % 0.12 ±25 % 1.10 CIG21F1R0MNC 0805/2012 1.0 ±20 % 0.19 ±25 % 0.80 CIG21F1R5MNC 0805/2012 1.5 ±20 % 0.25 ±25 % 0.70 CIG21F2R2MNC 0805/2012 2.2 ±20 % 0.34 ±25 % 0.60 ※Rated Current: DC current value when the self-generation of heat rises to 40℃ (Reference ambient temperature:25℃) ※Operating temperature range: –40 to +125°C ( Including self-temperature rise) ※Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201306 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 21 (3) F (4) 1R0 (5) M (6) N (7) C (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (F:Low Profile) Inductance (R47:0.47uH, 1R0:1.0uH) (6) Tolerance (M:±20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Card Board Taping 4,000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.