LV47011P

Ordering number : ENA1838B Monolithic Linear IC LV47011P Overview For Car Audio Systems 4-Channel BTL Power Amplifier The LV47011P is the IC for 4-channel BTL power amplifier that is developed for car audio system. Pch DMOS in the upper side of the output stage and Nch DMOS in the lower side of the output stage are complimentary. High power and high quality sound are realized by that. This IC incorporate various functions (standby switch, muting function, and various protection circuit) necessary for car audio system. Also, it has a self-diagnosis function. Functions • High output : PO max = 50W (typical) (VCC = 15.2V, f = 1kHz, JEITA max, RL = 4Ω) : PO max = 29W (typical) (VCC = 14.4V, f = 1kHz, THD = 10%, RL = 4Ω) : PO max = 22W (typical) (VCC = 14.4V, f = 1kHz, THD = 1%, RL = 4Ω) • Built-in muting function (pin 22) • Built-in Standby switch (pin 4) • Built-in Self-diagnosis function (pin 25) : Signal output in case of output offset detection, shorting to VCC, shorting to ground, and load shorting. • Electric mirror noise decrease • Built-in various protection circuit (shorting to ground, shorting to VCC, load shorting, over voltage and thermal shut down) • No external anti-oscillation part necessary. Note 1 : Please do not mistake connection. A wrong connection may produce destruction, deterioration and damage for the IC or equipment. Note 2 : The protective circuit function is provided to temporarily avoid abnormal state such as incorrect output connection. But, there is no guarantee that the IC is not destroyed by the accident. The protective function do not operate of the operation guarantee range. If the outputs are connected incorrectly, IC destruction may occur when used outside of the operation guarantee range. Note 3 : External parts, such as the anti-oscillation part, may become necessary depending on the set condition. Check their necessity for each set. Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. The products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. O2611 SY 20110930-S00015/60811 SY/92910 SY 20100910-S00002 No.A1838-1/10 LV47011P Specifications Maximum Ratings at Ta = 25°C Parameter Maximum supply voltage Symbol VCC max1 VCC max2 Maximum output current Allowable power dissipation Operating temperature Storage temperature Thermal resistance between the junction and case IO peak Pd max Topr Tstg θj-c Conditions No signal, t = 1 minute During operations Per channel With an infinity heat sink Ratings 26 18 4.5/ch 50 -40 to +85 -40 to +150 1 Unit V V A W °C °C °C/W Recommended Operating Ranges at Ta = 25°C Parameter Recommended supply voltage Recommended load resistance Operating supply voltage range Symbol VCC RL op VCC op A range not exceeding Pdmax Conditions Ratings 14.4 4 8 to 16 Unit V Ω V Electrical Characteristics at Ta = 25°C, VCC = 14.4V, RL = 4Ω, f = 1kHz, Rg = 600Ω Ratings Parameter Quiescent current Standby current Voltage gain Voltage gain difference Output power Symbol ICCO Ist VG ΔVG PO PO max1 PO max2 Output offset voltage Total harmonic distortion Channel separation Ripple rejection ratio Output noise voltage Input resistance Mute attenuation Standby pin control voltage Vn offset THD CHsep SVRR VNO Ri Matt Vstby H Vstby L Mute pin control voltage Vmute H Vmute L Output offset detection Detection threshold voltage * 0dBm = 0.775Vrms Vosdet ±1.2 ±1.8 ±2.4 V VO = 20dBm, mute : on Amp : on Amp : off Mute : off Mute : on 0.0 THD = 10% Max Power VCC = 15.2, Max Power Rg = 0Ω PO = 4W VO = 0dBm, Rg = 10kΩ Rg = 0Ω, fr = 100Hz, VCCR = 0dBm Rg = 0Ω, B.P.F. = 20Hz to 20kHz 40 75 2.5 0.0 Open 1.0 55 50 -100 0.03 65 65 80 50 90 VCC 0.5 150 65 Conditions min RL = ∞, Rg = 0Ω Vst = 0V VO = 0dBm 25 -1 24 29 45 50 +100 0.12 26 typ 200 max 400 3 27 +1 mA μA dB dB W W W mV % dB dB μVrms kΩ dB V V V Unit No.A1838-2/10 LV47011P Package Dimensions unit : mm (typ) 3236A 70 29.2 25.6 (22.8) (8.5) ( 2.5) 4.5 Pd max -- Ta Maximum power dissipation, Pd max -- W 60 50 Infinite heat sink θj-c=1°C/W (5.0) (R1.7) 18.6 max (14.4) 40 21.7 (11.0) 30 heat sink(θf=3.5°C/W) θj-c+θf=4.5°C/W (12.3) 14.5 20 0.4 1 (2.6) (1.0) 0.52 25 3.5 10 4.0 4.2 No heat sink θj-a=39°C/W -20 0 20 40 60 80 100 120 140 160 2.0 2.0 0 -40 Ambient temperature, Ta -- °C SANYO : HZIP25 Block Diagram C8 Tab 1 6 VCC1/2 20 VCC3/4 C7 + VCC C1 IN1 11 + - + - 9 7 OUT 1+ OUT 1RL Protective circuit C2 IN2 12 + DC + C6 AC GND C5 10 Ripple Filter + - PWR GND1 8 OUT 2+ OUT 2RL 5 3 PWR GND2 2 OFFSET DIAG R2 5V 16 25 PRE GND 13 Mute circuit Mute 22 C9 + R1 Low Level Mute ON C3 IN3 15 + Protective circuit + - 17 19 OUT 3+ OUT 3RL PWR GND3 18 OUT 4+ OUT 4RL C4 IN4 14 + - + - 21 23 STBY +5V ST ON 4 Stand by Switch PWR GND4 24 No.A1838-3/10 LV47011P External Components Part Name C1 to C5 C6 C7 C8 C9 R1 R2 Recommended Value 0.47μF 22μF 2200μF 0.1μF 1μF 10kΩ 4.7kΩ Purpose Cuts DC voltage Reduces ripples Reduces pop noise Ripple filter Improves oscillation stability Reduces pop noise Reduces pop noise Pull-up resistor Eliminating power supply ripples Reducing high-frequency noise The larger the constant value, the longer the mute ON/OFF time The larger the constant value, the longer the mute ON/OFF time Remarks The larger the constant value, the lower the cut-off frequency The values of C1 to C5 must be the same The larger the constant value, the longer the amplifier ON/OFF time * The components and constant values within the test circuit are used for confirmation of characteristics and are not guarantees that incorrect or trouble will not occur in application equipment. Description of Operation 1. Standby switch function (pin 4) Threshold voltage of the pin 4 is set by about 2VBE. The amplifier is turned on by the applied voltage of 2.5V or more. Also, the amplifier is turned off by the applied voltage of 0.5V or less. STBY 4 10kΩ 30kΩ Fig1 Standby equivalent circuit 2. Muting function (pin 22) The muted state is obtained by setting pin 22 to the ground potential, enabling audio muting. The muting function is turned on by the applied voltage of 1V or less to the resistance of pin 22. And the muting function is turn off when this pin opens. Also, the time constant of the muting function is determined by external capacitor and resistor constants. It is concerned with a pop noise in amplifier ON/OFF and mute ON/OFF. After enough examination, please set it. about 50μA 10kΩ MUTE 22 200Ω 18kΩ 1μF + MUTE OFF ON about 2.5V Fig2 Mute equivalent circuit 3. ACGND pin (pin 16) The capacitor of the pin 16 must use the same capacitance value as the input capacitor. Also, connect to the same PREGND as the input capacitor. No.A1838-4/10 LV47011P 4. Self-diagnostics function (pin 25) By detecting the unusual state of the IC, the signal is output to the pin 25. Also, by controlling the standby switch after the signal of the pin 25 is detected by the microcomputer, the burnout of the speaker can be prevented. (1) Shorting to VCC/Shorting to ground : The pin 25 becomes the low level. (2) Load shorting : The pin 25 is alternated between the low level and the high level according to the output signal. (3) Output offset detection : when the output offset voltage exceeds the detection threshold voltage, the pin 25 becomes the low level. * Note: The output offset abnormality is thought of as the leakage current of the input capacitor. In addition, the pin 25 has become the NPN open collector output (active low). The pin 25 must be left open when this function is not used. 5. Sound quality (low frequencies) By varying the value of input capacitor, low-frequency characteristic can be improved. However, it is concerned the shock noise. Please confirm in each set when the capacitance value varies. 6. Pop noise For pop noise prevention, it is recommended to use the muting function at the same time. • Please turn on the muting function simultaneously with power supply on when the amplifier is turned on. Next, turn off the muting function after the output DC potential stabilization. • When the amplifier is turn off, turn off the power supply after turning on the muting function. 7. Oscillation stability Pay due attention on the following points because parasitic oscillation may occur due to effects of the capacity load, board layout, etc. (1) Capacity load When the capacitor is to be inserted between each output pin and GND so as to prevent electric mirror noise, select the capacitance of maximum 1500pF. (Conditions : Our recommended board, RL = 4Ω) (2) Board layout • Provide the VCC capacitor of 0.1μF in the position nearest to IC. • PREGND must be independently wired and connected to the GND point that is as stable as possible, such as the minus pin of the 2200μF VCC capacitor. In case of occurrence of parasitic oscillation, any one of following parts may be added as a countermeasure. Note that the optimum capacitance must be checked for each set in the mounted state. • Series connection of CR (0.1μF and 2.2Ω) between BTL outputs • Series connection of CR(0.1μF and 2.2Ω) between each output pin and GND. No.A1838-5/10 LV47011P 300 ICCO -- VCC 14 VN -- VCC Output midpoint voltage, VN -- V Quiescent current, ICCO -- mA 250 12 10 200 8 150 6 100 4 50 2 0 6 0 6 8 10 12 14 16 18 8 10 12 14 16 18 Supply voltage, VCC -- V 50 Supply voltage, VCC -- V 25 PO -- VCC PO -- f 40 20 all channel is similar Output power, PO -- W 30 Output power, PO -- W 18 15 20 10 all channel is similar 10 5 0 8 10 12 14 16 0 10 23 5 7 100 23 5 7 1k 23 5 7 10k 23 5 7100k Supply voltage, VCC -- V 10 7 5 Frequency, f -- Hz 10 7 5 3 2 1 7 5 3 2 0.1 7 5 3 2 0.01 0.1 2 3 57 THD -- PO Total harmonic distortion, THD -- % THD -- PO Total harmonic distortion, THD -- % 3 2 1 7 5 3 2 0.1 7 5 3 2 0.01 0.1 2 3 571 CH2 CH4 CH3 CH1 2 3 5 7 10 2 3 5 7 100 CH4 CH2 CH3 CH1 1 2 3 5 7 10 2 3 5 7 100 Output power, PO -- W 10 7 5 3 2 1 7 5 3 2 Output power, PO -- W 10 7 5 3 2 1 7 5 3 2 0.1 7 5 3 2 0.01 10 THD -- PO Total harmonic distortion, THD -- % THD -- f Total harmonic distortion, THD -- % CH1 0.1 7 5 3 2 0.01 0.1 2 3 571 2 3 CH2 CH4 CH2 CH4 CH3 5 7 10 2 3 5 7 100 CH1 CH3 23 5 7 100 23 5 7 1k 23 5 7 10k 23 57 100k Output power, PO -- W Frequency, f -- Hz No.A1838-6/10 LV47011P 1 Respomse -- f 150 VNO -- Rg CH4 CH1 0 Output noise voltage, VNO -- V Response -- dB 100 all channel is similar --1 CH2 CH3 50 --2 --3 10 23 5 7 100 23 5 7 1k 23 5 7 10k 23 5 7100k 0 10 23 5 7 100 23 5 7 1k 23 5 7 10k 23 5 7100k Frequency, f -- Hz 80 CH.Sep -- f CH1 CH3 80 CH.Sep -- f CH2 CH3 Channel separation -- dB CH 40 CH CH 4 1 2 Channel separation -- dB 60 CH 1 60 CH 2 CH CH4 2 CH 1 40 20 20 0 10 23 5 7 100 23 5 7 1k 23 5 7 10k 23 5 7100k 0 10 23 5 7 100 23 5 7 1k 23 5 7 10k 23 57 100k Frequency, f -- Hz 80 Frequency, f -- Hz 80 CH.Sep -- f CH.Sep -- f CH4 CH3 CH 4 CH CH 4 2 CH 1 CH Channel separation -- dB 60 3 CH3 C H1 CH3 CH 4 40 2 Channel separation -- dB 5 7100k CH 60 40 20 20 0 10 23 5 7 100 23 5 7 1k 23 5 7 10k 23 0 10 23 5 7 100 23 5 7 1k 23 5 7 10k 23 57 100k Frequency, f -- Hz 80 Frequency, f -- Hz 80 SVRR -- VCC Ripple rejection ratio, SVRR -- dB SVRR -- fR CH3 CH1 Ripple rejection ratio, SVRR -- dB CH2 60 CH4 CH1 CH3 60 CH4 CH 2 40 40 20 20 0 8 10 12 14 16 18 0 10 23 5 7 100 23 5 7 1k 23 5 7 10k 23 5 7100k Supply voltage, VCC -- V Ripple frequency, f R -- Hz No.A1838-7/10 LV47011P 4 Offset DIAG -- VCC 60 Pd -- PO Detection threshold voltage, Vosdet -- V 50 3 Power dissipation, Pd -- W 40 Detection Level 2 30 20 VC C =1 6V 1 10 VC C =1 4.4 V 0 8 10 12 14 16 18 0 0.1 2 3 57 1 2 3 5 7 10 2 3 5 7 100 Supply voltage, VCC -- V 300 Output power, PO -- W 100 ICCO -- Vst Mute attenuation, Mute ATT -- dB Mute ATT -- V Mute Quiescent current, ICCO -- mA 250 80 200 60 150 40 100 20 50 0 0 1.0 2.0 3.0 4.0 5.0 0 0 1.0 2.0 3.0 4.0 5.0 Standby control voltage, Vst -- V Mute control voltage, V Mute -- V No.A1838-8/10 LV47011P HZIP25 Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC) Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. d. e. f. g. No.A1838-9/10 LV47011P SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. This catalog provides information as of October, 2011. Specifications and information herein are subject to change without notice. PS No.A1838-10/10