GP2W1001YP0F

GP2W1001YP0F GP2W1001YP0F IrDA Compliant Transceiver Module 9.6 kb/s to 4 Mb/s (FIR) Low Profile Low Consumption Current ■Description ■Agency approvals/Compliance The GP2W1001YP0F is an infrared transceiver module for IrDA ver. 1.4 (FIR). The transceiver consisits of a pin-photo diode, infrared emitter and control IC in a single package. 1. Compliant with IEC60825-1 class 1 eye safety standard 2. Compliant with RoHS directive (2002/95/EC) 3. Content status of six substances specified in “ Management Methods for Control of Pollution Caused by Electronic Information Products Regulation ” (popular name : China RoHS) RoHS) (Chinese : 电子信息产品污染控制管理办法)) ; refer to page 13 4. Lead (Pb) free device ■Features 1. Compliant with the IrDA 1.4 (FIR) Transmission speed : 9.6 kb/s to 4 Mb/s Transmission distance : 1 m 2. Small package L 10.0 × W 4.38 × H 3.53 mm 3. Peak emission wavelength : 880 nm 4. Side view type 5. Soldering reflow type 6. Shield type 7. Low consumption current due to shutdown function (Consumption current at shutdown mode : Max. 1.0 μA) 8. Operates from 2.7 to 5.5 V ■Applications 1. Mobile equipment (Cellular phone, Pager, Smart phone, PDAs, Portable printer, etc. ) 2. Digital imaging equipment (Digital camera, Photo imaging printer) 3. POS equipment 4. Personal computers 5. Personal information tools Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: E3-A00101EN Date Mar.01.2007 ©SHARP Corporation GP2W1001YP0F ■Block diagram ①AVCC ③F_SEL ④MD0 ⑤MD1 ⑨TXD ⑥DVCC ⑩LEDA DVCC 20Ω LED LOGIC TXDRV AMP ⑧RXD RXDRV CMP PD ⑦DGND ②AGND ■Outline Dimensions (Unit : mm) 1.33 1.33 1.2 3.88 ±0.3 2.36 1 4.38 ±0.3 1 1.2 1.6 2.9 ±0.3 φ3 .6 .8 φ3 1.2 Center of detector +0.3 3.2 −0.2 P0.95 ×9=8.55 0.9 ±0.3 P0.95 ×9=8.55 10-0.65 10-0.49 +0.3 2.05 −0.2 1 2 3 4 5 6 7 8 9 10 0.4 Center of emitter +0.2 −0.3 3.53 ±0.3 2.36 ±0.3 10.01 ±0.3 5.8 ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ Terminal Analog VCC Analog Ground Channel Select Mode Select 0 Mode Select 1 Digital VCC Digital Ground Receiver signal output Transmitter signal input LED Anode Symbol AVCC AGND F_SEL MD0 MD1 DVCC DGND RXD TXD LEDA 1) area: Au plating 2) Unspecified tolerance shall be ± 0.2 mm 3) Adhesion of resin to the terminal area shall be allowed Max. 0.2 mm. Product mass : approx. 0.15g Bottom View Sheet No.: E3-A00101EN 2 GP2W1001YP0F ■Recommended PCB Foot Pattern Dimensions are shown for reference 1.18 (Unit:mm) ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ 1.8 0.925 Symbol AVCC AGND F_SEL MD0 MD1 DVCC DGND RXD TXD LEDA 1.4 0.05 2.75 2.2 0.875 Terminal Analog VCC Analog Ground Channel Select Mode Select 0 Mode Select 1 Digital VCC Digital Ground Receiver signal output Transmitter signal input LED Anode 10 9 8 0.65 7 6 0.475 5 4 3 2 1 1.425 2.375 3.325 4.275 ■Recommended Size of Solder Creamed Paste (Reference) (unit : mm) 1.8 0.925 1.4 0.05 2.2 0.875 2.75 Dimensions are shown for reference. Please open the solder mask as below so that the size of solder creamed paste for this device before reflow soldering must be as large as one of the foot pattern land indicated for reference. 0.65 ⑩ ⑨ ⑧ ⑦ ⑥ ⑤ ④ ③ ② ① 0.475 1.425 2.375 3.325 4.275 : Solder paste area Sheet No.: E3-A00101EN 3 GP2W1001YP0F ■Absolute Maximum Ratings Parameter Supply voltage LED Supply voltage Transmission signal duty ratio Peak forward current Operating temperature Storage temperature (Ta=25°C) Symbol VCC VLEDA Du IFM Topr Tstg Rating 6 6 50 600 -10 to +70 -20 to +85 Unit V V % mA ℃ ℃ Note) Transmission signal duty ratio show the time share of H level of transmission wave at TX terminal. The frequency shall be 1kHz or more. ■Electro-optical Characteristics Parameter Current consumption at no input signal Symbol ICC Current consumption at shutdown mode ICC-S LED peak current ICCP Receiver wakeup time tRSD Receive sensitivity(θ≦±15°) Srxθ VOL VOH TrrA Rise time TrrB TfrA Fall time TfrB λrx Peak receive wavelength tw1 tw2 RXOUT terminal pulse width tw3 tw4 Maximum receive distance L λtx Peak emission wave length IELφ Radiant intensity IEMφ IEFφ VIL1 TXIN terminal "L" level VIH1 TXIN terminal "H" level IIL TXIN terminal input current IIH V Logic terminal "L" level IL2 VIH2 Logic terminal "H" level trtx Output Radiant rise time tftx Output Radiant fall time RXOUT terminal "L" level RXOUT terminal "H" level (Ta=25±3°C, VCC=3.3±0.1V, 5±0.1V, Ambient illuminance of detecting face:10 lx or less) Rating RXOUT:H,TXIN:L,VCC=3.3V RXOUT:H,TXIN:L,VCC=5.0V RXOUT:H,TXIN:L,VCC=3.3V RXOUT:H,TXIN:L,VCC=5.0V Peak value,VCC=3.3V(RL=2.0Ω), VCC=5.0V(RL=5.6Ω) MIN. ― ― ― ― TYP. ― ― 0.1 0.2 MAX. 1.2 1.5 1 2 Unit mA mA μA μA ― 400 600 mA ― SIR:9.6k to 115.2kb/s 0.04 FIR:1.152M/4Mb/s 0.1 VCC=3.3,5.0V ― VCC=3.3,5.0V VCC-0.4 SIR:9.6k to 115.2kb/s ― FIR:1.152M/4Mb/s ― SIR:9.6k to 115.2kb/s ― FIR:1.152M/4Mb/s ― ― *1 1 SIR mode,9.6kb/s *1 1 SIR mode,115.2kb/s *1 110 FIR mode,1.152Mb/s *1 85 FIR mode,4Mb/s (Single) *1 1 850 Low Power ― Middle Power ― Full Power(θ≦±15°) 100 VCC=3.3,5.0V ― VCC=3.3,5.0V VCC×0.67 TXIN=GND -0.1 TXIN=VCC=5.0V ― Terminal F SEL,MID0,MD1 VCC=3.3,5.0V ― Terminal F SEL,MID0,MD1 VCC=3.3,5.0V VCC×0.67 ― ― ― 1.5 ms ― 5000 2 W/m ― 5000 ― 0.4 V ― ― V ― 200 ns ― 40 ― 200 ns ― 40 940 ― nm ― 22 μs ― 4 μs ― 500 ns ― 165 ns ― ― m 880 900 nm 15 ― mW/sr 60 ― ― 500 ― VCC×0.2 V ― ― V 0 0.1 μA ― 50 ― VCC×0.33 V ― ― V ― 40 ns ― 40 ns *1 Refer to Fig. 2, 3 Sheet No.: E3-A00101EN 4 GP2W1001YP0F ■Recommended Operating Conditions Parameter Supply voltage LED Supply voltage Operating temperature Data rate Symbol VCC VLED Topr BR (Ta=25°C) Rating 2.7 to 5.5 2.7 to 7.0 0 to +70 9.6k to 4M Unit V V ℃ b/s ■Truth Table Input Output TXD (Transmitter) Receiver High Low Low − ON OFF State of LED RXD terminal (Transmitter) ON OFF OFF X Low High X:Do not care ■Input Output Logic Table MD0 1 0 0 1 0 0 1 MD1 0 0 0 0 1 1 0 1 1 F_SEL X 1 1 0 0 0 1 1 1 TXD 0 0 1 X X X X X X RXD terminal mode Shut down RXA RXB RXA ↓ ↓ RXB ↓ ↓ TXO *2 Shut down X X HPW MPW LPW HPW MPW LPW Remarks − Latch TXD Latch TXD TXO Output High Power mode TXO Output Middle Power mode TXO Output Low Power mode TXO Output High Power mode TXO Output Middle Power mode TXO Output Low Power mode *1 F_SFL → 0:reset latching state of TXD, and turn to RXA channel. *2 When a power supply is on, F_SFL should be Low. *3 When communication starts from RXB channel mode, once select RXA channel mode and change RXB channel mode. *4 RXA:RXA channel mode:115kb/s or less (SIR 115.2kb/s, 9600b/s) *5 RXB:RXB channel mode:115kb/s or more (FIR 1.152Mb/s, 4Mb/s) Sheet No.: E3-A00101EN 5 GP2W1001YP0F Fig.1 Recommended External Circuit ２ １ ３ ４ AVCC AGND F_SEL MD0 ５ ６ ７ ８ MD1 DVCC DGND RXD ９ 10 TXD LEDA RL C1 C2 RX + + C4 C5 C3 Vcc VLED Components Recommended values C1,C2 1.0μF±10%(Note) C3 4.7μF±10%(Note) RX 1 to 10Ω 1/8W 2.0Ω±5% 1/2W (VLED=3.3V) RL 5.6Ω±5% 1/2W (VLED=5.0V) C4 C5 5.6μF±10%(Note) 0.1μF±10%(Note) (Note)1. Component chooses the most suitable constant of C1,C2,C3,C4 and C5 according to the noise level and noise frequency of a power supply. Depending on the noise level of a power supply, and noise frequency, a noise may be unable to be removed only by capacitor of a standard circuit. At this time, pulses other than a signal may be outputted from a RXD terminal in a specific communication distance. Please confirm with the system that it is satisfactory with each transmission speed in all communication distance at the time of examination. When there is a noise ingredient which cannot be removed only by C1,C2,C3, please insert RX(1 to 10Ω) and it after a check. When there is a problem, please use it after a check as a noise measure Circuit. 2.Don’t connect an Avcc terminal with power supply because it is the connection of only capacitor. Sheet No.: E3-A00101EN 6 GP2W1001YP0F Fig.2 Output Waveform Specification(Receiver side)(CL≤10pF) tf tr VOH 90% 50% 10% VOL tw Fig.3 Standard Optical System(Receiver side) Ee : Light detector face illuminance < 10 lx Transmitter* φ φ GP2W1001YP0F Oscilloscope L Data rate 9.6kb/s 115.2kb/s 1.152Mb/s 4Mb/s T1 T2 104μs 19.53μs 8.68μs 1.63μs 868ns 217ns 500ns 125ns T2/T1 Radiant intensity 3/16 40mW/sr 3/16 40mW/sr 1/4 100mW/sr 1/4 100mW/sr φ : Indicates horizontal and vertical directions. T2 * The light emitting diode (SHARP GL710, λp=850 to 900nm) is used as the transmitter, where the following continuous signals are transmitted. In Fig.3, output signal shall be complete receiver side electro-optical characteristics. Radiant intensity T1 Sheet No.: E3-A00101EN 7 GP2W1001YP0F Fig.4 Output Waveform Specification(Transmitter side) 90% IE 10% tr tf Fig.5 Standard Optical System(Transmitter side) Detector for radiant intensity measuring φ GP2W1001YP0F φ φ : Indicates horizontal and vertical directions. Fig.6 Recommended Circuit of Transmitter side DVCC=3.3V,RL=2.0Ω LEDA 1.63μs TX GP2W1001YP0F VINTx=2.8V BR=115.2kb/s Sheet No.: E3-A00101EN 8 GP2W1001YP0F Fig.7 Peak Forward Current vs. Ambient Temperature Peak forward current IFM (mA) Pulse width 22 μs, Duty ratio 1/4 600 400 200 0 -10 -25 70 0 25 50 75 Ambient temperature Ta (℃) 100 ■Notes (1) When the system (program) is designed, the Turn Around Time shall be secured by considering 500 μs or more that is specified to IrDA. Then, this Turn Around Time means the time when this device does not temporarily detect the signal light, since the transmitted light form the transceiver reaches the detector side of the transceiver. (2) As it is necessary 1.5 ms or more (at Ta =25 °C, no input signal) to return from shut-down mode to readyoperation mode, please consider this point at the system (program) designing. Also, please confirm thoroughly the operation in actual application. (3) When there is much external disturbing light source is located near this transceiver and the detector face resceiver much external disturbing light, there is case that the pulse other than signal output is generated as noise on output terminal of this transceiver. Please consider the lay-out and structure to reduce disturbing light on the detector face. (4) In case that this sensor is adopted in IR communication system, please use it according to the signal method which is specified by [Serial Infrared Physical Layer Link Specification Version 1.4] published by Infrared Data Association. False operation may happen if the different signal method is used. (5) In circuit designing, make allowance for the degradation of light emitting diode output that results from long continuous operation. ( 50 % degradation/5 years) Sheet No.: E3-A00101EN 9 GP2W1001YP0F ■Soldering Method 1. In case of solder reflow Please carry out only one time soldering at the temperature and the time within the temperature profile as shown in the figure below. MAX 245℃ 1 to 3℃/s 225℃ MAX 195℃ 1 to 5℃/s 1 to 3℃/s 25℃ MAX 5s MAX 60s MAX 160s 40s to 90s MAX 115s 2. Other precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item 1. Also avoid immersing the resin part in the solder. Even if within the temperature profile above, there is the possibility that the gold wire in package is broken in case that the deformation of PCB gives the affection to lead pins. Please use after confirming the conditions fully by actual solder reflow machine. 3. Soldering ・Soldering iron shall be less than 25W, and temperature of point of soldering iron shall use at 260℃or less. ・Soldering time shall be within 5s. ・Soldered product shall treat at normal temperature. Sheet No.: E3-A00101EN 10 GP2W1001YP0F ■Package specification ●Tape and Reel package 　2000 pcs/reel Taping materials Name Material Counter measure for ESD Reel PPE Coped(Conductivity) Carrier tape PC Coped(Conductivity) Cover tape PET Coped(Conductivity) Carrier tape structure and Dimensions F E D J G K C B A H I L M (Unit : mm) Dimension List A B C D E F 16.0±0.3 7.5±0.1 1.75±0.1 8.0±0.1 2.0±0.1 4.0±0.1 G H I J K L M 10.6±0.1 4.0±0.1 4.0±0.1 0.33±0.05 4.6±0.1 4.1±0.1 φ1.5+0.1 -0.0 Sheet No.: E3-A00101EN 11 GP2W1001YP0F Reel structure and Dimensions f e d g c b a (Unit : mm) a b c d φ330±2 17.5±1 φ100±1 φ13±0.2 e φ21±0.8 f g 22.5±0.1 2±0.5 Direction of product insertion Pull out direction Lens side Sheet No.: E3-A00101EN 12 GP2W1001YP0F ●Cleaning Instructions Solvent cleaning : Solvent temperature 45℃ or less, Immersion for 3 min or less Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. The cleaning shall be carried out with solvent below. Recommended Solvent materials : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol ●Presence of ODC etc. This product sha shall ll not not conta conta ontain in the foll followi owing owi ng materi materi terials. als. And the theyy are not used used in the product production ion proce process ss for for this this prod prod roduct uct.. uct Regulation Regul ation subst substances ances : CFCs CFCs FCs,, Halon Halon lon,, Carbon tetra tetra etrachlo chlorid chlo ride, rid e, 1.1.1-T 1.1.1-Tric richlor ric hloroet hlor oethane oet hane (M (Methy ethylchlo ethy lchlorof lchlo roform rof orm)) orm Specific Specif ic bromi brominat nated nat ed fla flame me reta reta etardant rdantss such rdant such as the the PBB PBB and and PBDE PBDE are are not used used in this produc productt at all. • The The RoHS RoHS dire directive ctive (2002/95/ (2002/95/EC) EC) Thiss product Thi product com compli plies pli es with with the RoHS dire directive ctive (2002 (2002/95 /95/EC /95 /EC). /EC ). Object Obj ect subst subst bstances: ances: lead, ca cadmi dmium, dmi um, hexaval hexaval xavalent ent chr chromi omium, omi um, polybrom polybrom ybrominated inated biphe biphenyls nyls (P (PBB) BB) and polybrominated polybrom inated diphe diphenyl nyl ether ether therss (PBDE) (PBDE) • Conte Conte ontent nt of six six sub substances stances specif specified ied in “ Ma Manage nagement nage ment Metho Methods ds for for Contr Contr ontrol ol of Pol Pollutio lutionn Cause lutio Cause usedd by Electro Electro ectronic nic Information Informa tion Produc Products ts Regu Regu egulation lation ” (Chines (Chines nesee : 电子信息产品污染控制管理办法) Toxic and hazardous substances Category Infrared data communication device Hexavalent Polybrominated Polybrominated Lead Mercury Cadmium chromium biphenyls diphenyl ethers (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) ✓ ✓ ✓ ✓ ✓ ✓ ✓: indic indic dicates ates that that the the conte conte ntent nt of the the toxic toxic and hazard hazard ardous ous subst subst ubstance ance in all the the homoge homoge omogeneous neous ma materi terials teri als of of the part is bel below ow the the conce conce oncentra ntration ntra tion li limit mit requ requ equire irement ire ment as descri descri escribed bed in in SJ/T SJ/T 11363-2006 stand stand andard ard.. ard Sheet No.: E3-A00101EN 13 GP2W1001YP0F ■Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: E3-A00101EN 14