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BT111-A-HCI

BT111-A-HCI

  • 厂商:

    SILABS(芯科科技)

  • 封装:

    模块

  • 描述:

    CLASS 1.5 BLTOOTH 4.0 MODULE

  • 数据手册
  • 价格&库存
BT111-A-HCI 数据手册
BT111: Bluetooth® Smart Ready HCI Module DATA SHEET Monday, 05 August 2013 Version 1.25 Copyright © 2000-2013 Bluegiga Technologies All rights reserved. Bluegiga Technologies assumes no responsibility for any errors which may appear in this manual. Furthermore, Bluegiga Technologies reserves the right to alter the hardware, software, and/or specifications detailed here at any time without notice and does not make any commitment to update the information contained here. Bluegiga’s products are not authorized for use as critical components in life support devices or systems. The WRAP is a registered trademark of Bluegiga Technologies The Bluetooth trademark is owned by the Bluetooth SIG Inc., USA and is licensed to Bluegiga Technologies. All other trademarks listed herein are owned by their respective owners. Bluegiga Technologies Oy VERSION HISTORY Version Comment 1.0 First public release 1.1 Minor changes 1.2 FCC and CE update 1.21 Low energy master and slave mode supported 1.22 IC statement modified 1.23 Contact details updated 1.24 Formatting, reel dimensions 1.25 Recommended PCB land pattern added Bluegiga Technologies Oy TABLE OF CONTENTS 1 BT111 Product numbering ............................................................................................................................7 2 Block Diagram ...............................................................................................................................................8 3 Pinout and Terminal Descriptions .................................................................................................................9 4 External Dimensions and Land Pattern ...................................................................................................... 11 5 Layout Guidelines ....................................................................................................................................... 13 5.1 6 BT111-A Layout Guide ....................................................................................................................... 13 Electrical Characteristics ............................................................................................................................ 15 6.1 Absolute Maximum Ratings ............................................................................................................... 15 6.2 Input/Output Terminal Characteristics ................................................................................................ 15 6.2.1 USB Linear Regulator ................................................................................................................... 15 6.2.2 High-voltage Linear Regulator ...................................................................................................... 16 6.2.3 Digital ............................................................................................................................................ 16 6.3 7 Current Consumption ......................................................................................................................... 17 RF Characteristics ...................................................................................................................................... 20 7.1 Transmitter Characteristics ................................................................................................................ 20 7.2 Receiver Characteristics .................................................................................................................... 21 7.3 Radiated Spurious Emissions ............................................................................................................ 22 7.4 Antenna Characteristics ..................................................................................................................... 22 8 Clock Generation ........................................................................................................................................ 23 9 Bluetooth Stack Microcontroller .................................................................................................................. 24 10 Programmable I/O Ports ......................................................................................................................... 24 11 Wi-Fi Coexistence Interface .................................................................................................................... 24 12 Memory Management ............................................................................................................................. 25 12.1 Memory Management Unit ................................................................................................................. 25 12.2 System RAM ...................................................................................................................................... 25 12.3 Internal ROM Memory (5Mb) ............................................................................................................. 25 12.4 Internal EEPROM ............................................................................................................................... 25 13 Serial Interfaces ...................................................................................................................................... 26 13.1 USB Interface ..................................................................................................................................... 26 13.2 Programming and Debug Interface .................................................................................................... 26 14 Audio Interfaces ...................................................................................................................................... 27 14.1 PCM Interface .................................................................................................................................... 27 14.1.1 PCM Interface Master/Slave ......................................................................................................... 27 14.1.2 Long Frame Sync .......................................................................................................................... 28 14.1.3 Short Frame Sync ......................................................................................................................... 28 14.2 Multi-slot Operation ............................................................................................................................ 29 14.2.1 GCI Interface ................................................................................................................................. 29 Bluegiga Technologies Oy 14.2.2 Slots and Sample Formats ............................................................................................................ 30 14.2.3 Additional Features ....................................................................................................................... 31 14.2.4 PCM Timing Information ............................................................................................................... 31 14.2.5 PCM_CLK and PCM_SYNC Generation ...................................................................................... 35 14.2.6 PCM Configuration ........................................................................................................................ 36 14.3 15 2 Digital Audio Interface (I S) ................................................................................................................ 36 Power Control and Regulation ................................................................................................................ 41 15.1 Voltage Regulator Enable .................................................................................................................. 41 15.2 USB Linear Regulator ........................................................................................................................ 41 15.3 High Voltage Linear Regulator ........................................................................................................... 41 15.4 Low Voltage Linear Regulators .......................................................................................................... 42 15.5 Powering Sequence ........................................................................................................................... 42 15.6 Reset .................................................................................................................................................. 42 16 Example Schematic ................................................................................................................................ 43 17 Software .................................................................................................................................................. 44 17.1 On-chip Software ................................................................................................................................ 45 17.1.1 Bluetooth HCI Stack ...................................................................................................................... 45 17.1.2 Latest Feature of the HCI Stack .................................................................................................... 45 18 Soldering Recommendations .................................................................................................................. 46 19 Certifications ........................................................................................................................................... 47 19.1 Bluetooth ............................................................................................................................................ 47 19.2 FCC/IC (USA/Canada) ....................................................................................................................... 47 19.2.1 FCC et IC ...................................................................................................................................... 48 19.3 CE (Europe) ....................................................................................................................................... 49 19.4 Japan .................................................................................................................................................. 50 20 Moisture Sensitivity Level (MSL) classification ....................................................................................... 51 21 Packaging and Reel Information ............................................................................................................. 52 22 Contact Information................................................................................................................................. 54 Bluegiga Technologies Oy BT111: Bluetooth Smart Ready HCI Module KEY FEATURES DESCRIPTION BT111 is a low cost and ultrasmall Bluetooth Smart Ready HCI module that is designed for applications where both Bluetooth classic and Bluetooth low energy connectivity is needed. BT111 integrates a Bluetooth 4.0 dual mode radio, HCI software stack, USB interface and an antenna. BT111 is compatible with Windows and Linux operating systems and Microsoft and BlueZ Bluetooth stacks and offers OEMs fast and risk free way to integrate Bluetooth 4.0 connectivity into their applications.    APPLICATIONS  Health and fitness gateways  Point of sale  M2M connectivity  Automotive aftermarket  Personal navigation devices  Consumer electronics  Industrial gateways and home     Bluetooth v.4.0, dual mode compliant  Support Bluetooth classic  Supports Bluetooth low energy master and slave mode Radio capabilities  Transmit power: +8dBm  Receiver sensitivity: -89dBm  Line-of-sight range: 100+ meters  Integrated antenna Interfaces  HCI over USB host interface  802.11 co-existence interface  Software programmable GPIO  PCM or I2S audio interfaces Supply voltage: 1.7V to 3.6V or 3.1V to 3.6V Temperature range: -30C to +85C Ultra compact size: 13.05mm x 9.30mm Bluetooth, CE, FCC, IC and Japan PHYSICAL OUTLOOK automation Bluegiga Technologies Oy 1 BT111 Product numbering Antenna: A = Internal BT111-A-HCI Firmware revision Available products and product codes Product code Description BT111-A-HCI BT111 Bluetooth 4.0 HCI module with integrated antenna Bluegiga Technologies Oy Page 7 of 54 2 Block Diagram 26MHz XTAL Antenna CSR8510 PIO3 RAM PIO4 64k EEPROM ROM MMU BPF MCU RF LDO 3V3 5V0 3V3 I/O PIO0 PIO1 PIO2 PIO5 3 x LDO 1V3 SPI / PCM LDO 1V8 USB 1V8 Figure 1: Block diagram of BT111 CSR8510 BT111 is based on CSR8510 dual mode chip. The chip includes all the functions required for a complete Bluetooth radio with on chip LDO regulators. The chip provides SPI, PCM and USB interfaces. Up to 4 general purpose I/Os are available for general usage, such as Wi-Fi coexistence or general indicators. Antenna Antenna is a ceramic monopole chip antenna. See the antenna characteristics in chapter 7. Band Pass Filter The band pass filter filters the out of band emissions from the transmitter to meet the specific regulations for type approvals of various countries. 64k EEPROM The embedded 64k EEPROM can be used to store customizable parameters, such as maximum TX power, PCM configuration, USB product ID, USB vendor ID and USB product description. 26MHz Crystal The embedded 26MHz crystal is used for generating the internal digital clocks. Bluegiga Technologies Oy Page 8 of 54 3 Pinout and Terminal Descriptions GND VREG_EN_RST# VDD_PADS VREG_OUT_HV VREG_IN_USB VDD_HOST PIO0 PCM_OUT/SPI_MISO/PIO22 PIO01 SPI_PCM_SEL GND GND USBUSB+ PCM_SYNC/SPI_CS/PIO23 PIO5 PIO2 PCM_CLK/SPI_CLK/PIO24 PCM_IN/SPI_MOSI/PIO21 GND VREG_IN_HV 21 20 19 18 17 16 11 12 13 14 15 1 2 3 4 5 6 7 8 9 10 Figure 2: BT111 Power Supply Pin No. Pad Type Description Take high to enable internal regulators. Also acts as active low reset. Maximum voltage is VDD_PADS Note: USB regulator is always enabled and not controlled by this pin VREG_EN_RST# 20 Input with strong internal pull-down VREG_IN_HV 10 Analogue regulator input / output VREG_OUT_HV 18 Analogue regulator output VREG_IN_USB 17 Analogue regulator input Input to USB regulator. Connect to external USB bus supply, e.g. USB_VBUS VDD_HOST 16 VDD USB system positive supply VDD_PADS 19 VDD Positive supply for digital I/O pads Input to internal high-voltage regulator to 1.8V regulator, 3.3V output from USB regulator. Output from internal high-voltage to 1.8V regulator. Input to second stage internal regulators. Table 1: Supply Terminal Descriptions Bluegiga Technologies Oy Page 9 of 54 PIO Port Pin No. Pad Type Supply Domain Description PIO0 11 Bidirectional, tristate, with weak internal pulldown VDD_PADS Programmable input/output line PIO1 13 PIO2 6 PIO5 5 Table 2: I/O Terminal Descriptions Pad Type Supply Domain PCM Interface Pin No. Description PCM_OUT/ SPI_MISO/ PIO22 12 Output, tristate, with weak internal pull- VDD_PADS down PCM syncronous data output SPI data output Programmable input/output line PCM_IN/ SPI_MOSI/ PIO21 8 Input, tristate, with weak internal pull-down PCM syncronous data input SPI data input Programmable input/output line PCM_SYNC/ SPI_CS#/ PIO23 4 Bidirectional, tristate, with weak internal pulldown PCM syncronous dara sync SPI chip select, active low Programmable input/output line PCM_CLK/ SPI_CLK/ PIO24 7 SPI_PCM#_SEL 14 PCM syncronous data clock SPI clock Programmable input/output line High switches SPI/PCM lines to SPI, low switches SPI/PCM lines to PCM/PIO use Input with weak internal pull-down Table 3: PCM Interface USB Interface Pin No. Pad Type Supply Domain Description USB+ 3 Bidirectional VDD_HOST USB data plus with selectable internal 1.5kΩ pull-up resistor USB- 2 USB data minus Table 4: USB Interface Bluegiga Technologies Oy Page 10 of 54 4 External Dimensions and Land Pattern Figure 3: Footprint (top view) Figure 4: Recommended PCB land pattern Bluegiga Technologies Oy Page 11 of 54 7.3mm (+/- 0.1mm) 1.9mm (+/- 10%) 2.1mm (+/- 10%) 13.05mm (+/- 0.1mm) 9.3mm (+/- 0.1mm) Figure 5: External dimensions Bluegiga Technologies Oy Page 12 of 54 • – Do not route supply voltage traces across separated GND regions so th path for the return current is cut MIC input – Place LC filtering and DC coupling capacitors symmetrically as close to pins as possible –5 Place MIC biasing resistors symmetrically as close to microhone as pos Layout Guidelines –Use Make sure that the bias trace does not cross separated GND regions (D good layout practices to avoid excessive noise coupling to supply voltage traces or sensitive analog signal traces. If using vias current separated byis max 3 mmIftothis avoid is emission AGND) so overlapping that theground pathplanes for use thestitching return cut. not possibl from the edges of the PCB. Connect all the GND pins directly to a solid GND plane and make sure that there notimpedance separate GND regions but keep one solidtraces GND plane. is a low path for the return current following the signal and supply all the way from start to the end. –A good Keep the trace as short as possible practice is to dedicate one of the inner layers to a solid GND plane and one of the inner layers to supply voltage planes and traces and route all the signals on top and bottom layers of the PCB. This arrangement will make sure that any return current follows the forward current as close as possible and any loops are minimized. Recommended PCB layer configuration Signals GND Power Signals Figure 6: Typical 4-layer PCB construction Overlapping GND layers without GND stitching vias Overlapping GND layers with GND stitching vias shielding the RF energy Figure 7: Use of stitching vias to avoid emissions from the edges of the PCB 5.1 BT111-A Layout Guide For optimal performance of the antenna place the module at the corner of the PCB of the mother board as shown in the Figure 8. Optionally the module can be placed on the long edge of the mother board. In this case the metal clearance area must be extended minimum 10mm from the edge of the module, as shown in Figure 8. The layout of the mother board has an impact on the antenna characteristic and radiation pattern, see the antenna characteristics chapter. Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND vias as close to the GND pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines. Avoid placing plastic or any other dielectric material closer than 5 mm from the antenna. Any dielectric closer than 5 mm from the antenna will detune the antenna to lower frequencies. The antenna is optimized for mother board thickness of 1.0 mm. If the mother board is thicker than this, the resonant frequency will be tuned downwards. If the mother board thickness is thinner than 1.0 mm, the resonant frequency will be tuned upwards. S11 is a measure of how big portion of the transmitted power is reflected back from the antenna. An adequate performance can be expected if S11 is less than – 7 dB. If Bluegiga Technologies Oy Page 13 of 54 using PCB thickness more than 1.6 mm, or if there is dielectric material around the antenna which is likely to detune the resonant frequency, the antenna can be tuned in the mother board layout by removing FR4 below the antenna. Min. 10mm BT111 BT111 Mother board Mother board Metal clearance area Figure 8: Recommended layouts for BT111-A Figure 9: Impedance matching of the antenna of BT111 with two different mother board PCB thickness Bluegiga Technologies Oy Page 14 of 54 6 Electrical Characteristics 6.1 Absolute Maximum Ratings Rating Min Max Unit Storage temperature -40 +85 VREG_IN_USB -0.2 5.85 VREG_IN_HV -0.2 4.9 VDD_HOST -0.2 3.7 VDD_PADS -0.2 3.7 Other terminal voltages VSS - 0.4V VDD + 0.4 V ⁰C V V V V V Table 5: Absolute maximum ratings Rating Min Max Unit Operating temperature -30 +85 VREG_IN_USB 4.25 VREG_IN_HV 2.3 VDD_HOST 3.1 5.75 4.8 3.6 3.6(* ⁰C V V V V VDD_PADS (* (* 1.7 *) NOTE: The internal EEPROM is powered from VDD_PADS. To write the EEPROM, minimum supply voltage is 2.7V and maximum is 3.3V. For reading the EEPROM the minimum supply voltage is 1.7V and the maximum is 3.6V. Table 6: Recommended operating conditions 6.2 Input/Output Terminal Characteristics 6.2.1 USB Linear Regulator Rating Min Typ Max Unit Input voltage 4.25 5.0 Output voltage 3.2 3.3 Output current - - 5.75 3.4 150 V V mA Table 7: USB linear regulator Bluegiga Technologies Oy Page 15 of 54 6.2.2 High-voltage Linear Regulator Normal Operation Min Typ Max Unit Input voltage 2.3 3.3 Output voltage 1.75 1.85 Temperature coefficient Output noise (frequency range 100Hz to 100kHz) Settling time (settling ti within 10% of final value) Output current -200 - 4.8 1.95 200 V V ppm/⁰C - - 0.4 mV rms - - 5 µs - - 100 mA Quiescent current (excluding load, Iload
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