SI4356-B1A-FMR

Si4356 Si4356 S TA NDALONE S UB -GH Z R ECEIVER Applications Remote control  Home security and alarm  Garage and gate openers  Remote keyless entry  fo r Description Home automation  Industrial control  Sensor networks  Health monitors  om m en de d Silicon Laboratories' Si4356 is a pin-strap configurable, low current, sub-GHz EZRadio® receiver. With no external MCU control needed, the Si4356 provides a true plug-and-play receive option. Excellent sensitivity up to –113 dBm allows for a longer operating range, while the low current consumption of 12 mA active and 50 nA standby provides for superior battery life. The Si4356 provides receive data as well as a system clock output for use by an external microcontroller or decoder. D Pin Assignments XOUT  OOK 20 19 18 17 GND 1 RST 2 16 GND RXp 3 RXn 4 13 STBY NC 5 12 MSTAT / OUT0 GND 6 15 SEL1 14 RX_DATA / OUT1 GND 7 8 9 10 CLK_OUT  XIN  SEL2 (G)FSK  GND   SEL3   Low RX Current = 12 mA Low standby current = 50 nA Max data rate = 120 kbps Automatic gain control (AGC) System clock output Low BOM 20-pin 3x3 mm QFN package VDD   VDD  Pin configurable Frequency range = 315–917 MHz Supply Voltage = 1.8–3.6 V Receive sensitivity = Up to –113 dBm Modulation N ew  es ig ns Features 11 SEL0 20-pin QFN (Top View) N ot R ec Patents pending Rev 1.2 1/16 Copyright © 2016 by Silicon Laboratories Si4356 Si4356 Functional Block Diagram RST Synthesizer ÷ 30MHz XO Rx Chain es ig ns XIN XOUT CLK_OUT LNA RXn PGA ADC Rx Modem D STBY RXp N ew MSTAT / OUT0 Configuration Decoder SEL0 SEL1 SEL2 SEL3 N ot R ec om m en de d GND fo r VDD 2 RX_DATA / OUT1 Rev 1.2 Si4356 TABLE O F C ONTENTS Page es ig ns Section N ot R ec om m en de d fo r N ew D 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 1.1. Definition of Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 2. Typical Applications Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3. Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5. Modes and Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1. Power on Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6. Additional Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6.1. System Clock Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 9. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 10. PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 11. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 11.1. Si4356 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 11.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Rev 1.2 3 Si4356 1. Electrical Specifications Table 1. Recommended Operating Conditions Symbol Test Condition Min TA — –40 VDD — 1.8 VGPIO — 1.8 Ambient Temperature Supply Voltage I/O Drive Voltage Unit 25 85 C — 3.6 V — 3.6 V Symbol Test Condition Min Standby Mode Current IStandby Configuration retained, all other functions OFF IRX — Typ Max Unit — 50 — nA — 12 — mA N ew Parameter RX Mode Current Max D Table 2. DC Characteristics* Typ es ig ns Parameter Table 3. Receiver Electrical Characteristics1 Frequency Range Test Condition Min Typ Max Unit FRANGE Only frequencies listed in Table 9 supported 315 — 917 MHz PFSK BER < 0.1%, 2.4 kbps, (G)FSK, Configuration = FSK1 (See Section 3.) — –113 — dBm PFSK BER < 0.1%, 2.4 kbps, (G)FSK, Configuration = FSK6 (See Section 3.) POOK BER < 0.1%, 2.4 kbps, OOK, Configuration = OOK6 (See Section 3.) — –111 — dBm BW — 100 — 535 kHz PRX_RES Up to +5 dBm Input Level — 0 0.1 ppm om Sensitivity2 Symbol m en de d Parameter ec RX Channel Bandwidth3 R BER Variation vs Power Level3 fo r *Note: All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the "Production Test Conditions" section of "1.1. Definition of Test Conditions" on page 8. –104 dBm N ot Notes: 1. Test conditions and max limits are listed in section “1.1. Definition of Test Conditions”. 2. Sensitivity measured at 434 MHz using a PN9 modulated input signal. Received signal is filtered, deglitched, and retimed using an external RC filter (R = 1 k, C = 47 nF) and MCU. 3. Guaranteed by qualification. Qualification test conditions are listed in section “1.1. Definition of Test Conditions”. 4 Rev 1.2 Si4356 Table 3. Receiver Electrical Characteristics1 (Continued) Symbol Test Condition Min Typ Max Unit 200 kHz Selectivity3 C/I1-CH — –42 — dB 400 kHz Selectivity3 C/I2-CH Desired Ref Signal 3 dB above sensitivity, BER < 0.1%. Interferer is CW and desired modulated with 2.4 kbps F = 30 kHz (G)FSK, BT = 0.5, Rx BW = 155 kHz, — es ig ns Parameter –50 — dB –57 — dB –68 — dB Blocking 1 MHz Offset3 — Blocking 8 MHz Offset3 — Desired Ref Signal 3 dB above sensitivity, BER < 0.1% Interferer is CW and desired modulated with 2.4 kbps F = 30 kHz (G)FSK, BT = 0.5, RX BW = 155 kHz ImREJ IF = 468 kHz — –35 — dB POB_RX1 Measured at RX pins — — –54 dBm Spurious Emissions3 D — N ew Image Rejection3 — m en de d fo r Notes: 1. Test conditions and max limits are listed in section “1.1. Definition of Test Conditions”. 2. Sensitivity measured at 434 MHz using a PN9 modulated input signal. Received signal is filtered, deglitched, and retimed using an external RC filter (R = 1 k, C = 47 nF) and MCU. 3. Guaranteed by qualification. Qualification test conditions are listed in section “1.1. Definition of Test Conditions”. Table 4. Auxiliary Block Specifications1 Parameter Symbol Test Condition Min Typ Max Unit — — — 10 — pF — — — 30 — MHz XTAL Series Resistance — — — — 50  XTAL Stability — — — ±50 — ppm tRST — — — 20 ms 3 XTAL Nominal Cap om XTAL Frequency 2 Reset to RX Time N ot R ec Notes: 1. Test conditions and max limits are listed in section in “1.1. Definition of Test Conditions”. 2. Guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" subsection of section “1.1. Definition of Test Conditions”. 3. Targeted nominal capacitive load for both XIN and XOUT pins. Rev 1.2 5 Si4356 Table 5. Digital I/O Specifications (STBY, RX_DATA, MSTAT, CLK_OUT)1 Test Condition Min Typ Max Unit Rise Time TRISE 0.1xVDD to 0.9xVDD, CL=10pF, DRV