Si8440/41/42/45
L O W - P O W E R Q U A D - C H A N N E L D I G I TA L I S O L ATO R
Features
High-speed operation
DC
Up to 2500 VRMS isolation
to 150 Mbps
60-year life at rated working
No start-up initialization required
voltage
Wide Operating Supply Voltage: Precise timing (typical)
2.70–5.5 V
109
*Note: Maintenance of the safety data is ensured by protective circuits. The Si84xx provides a climate classification of
40/125/21.
Table 10. IEC Safety Limiting Values1
Max
Parameter
Symbol
Case Temperature
TS
Safety input, output, or
supply current
IS
Device Power Dissipation2
PD
Test Condition
JA = 100 °C/W (WB SOIC-16),
105 °C/W (NB SOIC-16),
VI = 5.5 V, TJ = 150 °C, TA = 25 °C
Min Typ
WB
SOIC-16
NB
SOIC-16
Unit
—
—
150
150
°C
—
—
220
210
mA
—
—
275
275
mW
Notes:
1. Maximum value allowed in the event of a failure; also see the thermal derating curve in Figures 3 and 4.
2. The Si844x is tested with VDD1 = VDD2 = 5.5 V, TJ = 150 ºC, CL = 15 pF, input a 150 Mbps 50% duty cycle square
wave.
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Table 11. Thermal Characteristics
Typ
Parameter
Symbol
IC Junction-to-Air Thermal
Resistance
JA
Test Condition
Min
—
WB
NB
SOIC-16 SOIC-16
100
105
Max
Unit
—
ºC/W
450
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Safety-Limiting Current (mA)
500
VDD1, VDD2 = 2.70 V
400
370
VDD1, VDD2 = 3.6 V
300
220
200
VDD1, VDD2 = 5.5 V
100
0
0
50
100
Temperature (ºC)
150
200
Figure 3. (WB SOIC-16) Thermal Derating Curve, Dependence of Safety Limiting Values
with Case Temperature per DIN EN 60747-5-2
Safety-Limiting Current (mA)
500
430
VDD1, VDD2 = 2.70 V
400
360
VDD1, VDD2 = 3.6 V
300
210
200
VDD1, VDD2 = 5.5 V
100
0
0
50
100
Temperature (ºC)
150
200
Figure 4. (NB SOIC-16) Thermal Derating Curve, Dependence of Safety Limiting Values
with Case Temperature per DIN EN 60747-5-2
16
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Si8440/41/42/45
2. Functional Description
2.1. Theory of Operation
The operation of an Si844x channel is analogous to that of an opto coupler, except an RF carrier is modulated
instead of light. This simple architecture provides a robust isolated data path and requires no special
considerations or initialization at start-up. A simplified block diagram for a single Si844x channel is shown in
Figure 5.
Transmitter
Receiver
A
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RF
OSCILLATOR
MODULATOR
SemiconductorBased Isolation
Barrier
DEMODULATOR
B
Figure 5. Simplified Channel Diagram
A channel consists of an RF Transmitter and RF Receiver separated by a semiconductor-based isolation barrier.
Referring to the Transmitter, input A modulates the carrier provided by an RF oscillator using on/off keying. The
Receiver contains a demodulator that decodes the input state according to its RF energy content and applies the
result to output B via the output driver. This RF on/off keying scheme is superior to pulse code schemes as it
provides best-in-class noise immunity, low power consumption, and better immunity to magnetic fields. See
Figure 6 for more details.
Input Signal
Modulation Signal
Output Signal
Figure 6. Modulation Scheme
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2.2. Eye Diagram
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Figure 7 illustrates an eye-diagram taken on an Si8440. For the data source, the test used an Anritsu (MP1763C)
Pulse Pattern Generator set to 1000 ns/div. The output of the generator's clock and data from an Si8440 were
captured on an oscilloscope. The results illustrate that data integrity was maintained even at the high data rate of
150 Mbps. The results also show that 2 ns pulse width distortion and 250 ps peak jitter were exhibited.
Figure 7. Eye Diagram
18
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2.3. Device Operation
Device behavior during start-up, normal operation, and shutdown is shown in Table 12. Table 13 provides an
overview of the output states when the Enable pins are active.
Table 12. Si84xx Logic Operation Table
VI
Input1,2
EN
Input1,2,3,4
VDDI
State1,5,6
VDDO
State1,5,6
VO Output1,2
H
H or NC
P
P
H
L
H or NC
P
P
L
X7
X7
X7
L
P
P
Hi-Z or L8
H or NC
UP
P
L
L
UP
P
Hi-Z or L8
Enabled, normal operation.
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X7
Comments
X7
P
UP
Disabled.
Upon transition of VDDI from unpowered to powered, VO returns to the same state as VI in less
than 1 µs.
Disabled.
Upon transition of VDDO from unpowered to powered, VO returns to the same state as VI within
Undetermined 1 µs, if EN is in either the H or NC state. Upon
transition of VDDO from unpowered to powered,
VO returns to Hi-Z within 1 µs if EN is L.
Notes:
1. VDDI and VDDO are the input and output power supplies. VI and VO are the respective input and output terminals. EN
is the enable control input located on the same output side.
2. X = not applicable; H = Logic High; L = Logic Low; Hi-Z = High Impedance.
3. It is recommended that the enable inputs be connected to an external logic high or low level when the Si84xx is
operating in noisy environments.
4. No Connect (NC) replaces EN1 on Si8440/45. No Connect replaces EN2 on the Si8445. No Connects are not internally
connected and can be left floating, tied to VDD, or tied to GND.
5. “Powered” state (P) is defined as 2.70 V < VDD < 5.5 V.
6. "Unpowered" state (UP) is defined as VDD = 0 V.
7. Note that an I/O can power the die for a given side through an internal diode if its source has adequate current.
8. When using the enable pin (EN) function, the output pin state is driven to a logic low state when the EN pin is disabled
(EN = 0) in Revision C. Revision D outputs go into a high-impedance state when the EN pin is disabled (EN = 0). See
"3. Errata and Design Migration Guidelines" on page 24 for more details.
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Table 13. Enable Input Truth Table1
Si8440
Si8441
Si8442
Si8445
EN11,2 EN21,2
Operation
—
H
Outputs B1, B2, B3, B4 are enabled and follow the input state.
—
L
Outputs B1, B2, B3, B4 are disabled and Logic Low or in high impedance state.3
H
X
Output A4 enabled and follows the input state.
L
X
Output A4 disabled and Logic Low or in high impedance state.3
X
H
Outputs B1, B2, B3 are enabled and follow the input state.
X
L
Outputs B1, B2, B3 are disabled and Logic Low or in high impedance state.3
H
X
Outputs A3 and A4 are enabled and follow the input state.
L
X
Outputs A3 and A4 are disabled and Logic Low or in high impedance state.3
X
H
Outputs B1 and B2 are enabled and follow the input state.
X
L
Outputs B1 and B2 are disabled and Logic Low or in high impedance state.3
—
—
Outputs B1, B2, B3, B4 are enabled and follow the input state.
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P/N
Notes:
1. Enable inputs EN1 and EN2 can be used for multiplexing, for clock sync, or other output control. EN1, EN2 logic
operation is summarized for each isolator product in Table 13. These inputs are internally pulled-up to local VDD by a
3 µA current source allowing them to be connected to an external logic level (high or low) or left floating. To minimize
noise coupling, do not connect circuit traces to EN1 or EN2 if they are left floating. If EN1, EN2 are unused, it is
recommended they be connected to an external logic level, especially if the Si84xx is operating in a noisy environment.
2. X = not applicable; H = Logic High; L = Logic Low.
3. When using the enable pin (EN) function, the output pin state is driven to a logic low state when the EN pin is disabled
(EN = 0) in Revision C. Revision D outputs go into a high-impedance state when the EN pin is disabled (EN = 0). See
"3. Errata and Design Migration Guidelines" on page 24 for more details.
20
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Si8440/41/42/45
2.4. Layout Recommendations
To ensure safety in the end user application, high voltage circuits (i.e., circuits with >30 VAC) must be physically
separated from the safety extra-low voltage circuits (SELV is a circuit with