74LCX646TTR

74LCX646 LOW VOLT. CMOS OCTAL BUS TRANSCEIVER/REGISTER WITH 5 VOLT TOLERANT INPUTS AND OUTPUTS(3-STATE) s s s s s s s s s s 5V TOLERANT INPUTS AND OUTPUTS HIGH SPEED: tPD = 7.0 ns (MAX.) at VCC = 3V POWER DOWN PROTECTION ON INPUTS AND OUTPUTS SYMMETRICAL OUTPUT IMPEDANCE: |IOH| = IOL = 24mA (MIN) at VCC = 3V PCI BUS LEVELS GUARANTEED AT 24 mA BALANCED PROPAGATION DELAYS: tPLH ≅ tPHL OPERATING VOLTAGE RANGE: VCC(OPR) = 2.0V to 3.6V (1.5V Data Retention) PIN AND FUNCTION COMPATIBLE WITH 74 SERIES 646 LATCH-UP PERFORMANCE EXCEEDS 500mA (JESD 17) ESD PERFORMANCE: HBM > 2000V (MIL STD 883 method 3015); MM > 200V SOP TSSOP Table 1: Order Codes PACKAGE SOP TSSOP T&R 74LCX646RM13TR 74LCX646TTR DESCRIPTION The 74LCX646 is a low voltage CMOS OCTAL BUS TRANSCEIVER AND REGISTER (3-STATE) fabricated with sub-micron silicon gate and double-layer metal wiring C2MOS technology. It is ideal for low power and high speed 3.3V applications; it can be interfaced to 5V signal environment for both inputs and outputs. Figure 1: Pin Connection And IEC Logic Symbols This device consists of bus transceiver circuits with 3 state, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus will be clocked into register on the low to high transition of the appropriate clock pin (Clock AB or Clock BA). Enable (G) and direction (DIR) pins are provided to control the transceiver functions. In the transceiver mode, data present at the high-impedance port may be stored in either register or in both. The select controls (Select AB select BA) can multiplex stored and real time (transparent mode) data. The direction control determines which bus will receive data when enable G is active (low). In the isolation mode September 2004 Rev. 6 1/16 M74LCX646 (enable G high), "A" data may be stored in one register and/or "B" data may be stored in the other register. When an output function is disabled, the input function is still enabled and may be used to store and transmit data. Only one of the two buses, A or B, may be driven at a time. It has same speed performance at 3.3V than 5V Figure 2: Input And Output Equivalent Circuit AC/ACT family, combined with a lower power consumption. All inputs and outputs are equipped with protection circuits against static discharge, giving them 2KV ESD immunity and transient excess voltage. Table 2: Pin Description PIN N° 1 2 3 4, 5, 6, 7, 8, 9, 10, 11 20, 19, 18, 17, 16, 15, 14, 13 21 22 23 12 24 SYMBOL CLOCK AB (CAB) SELECT AB (SAB) DIR A1 to A8 B1 to B8 G SELECT BA (SBA) CLOCK BA (CBA) GND VCC NAME AND FUNCTION A to B Clock Input (LOW to HIGH, Edge-Triggered) Select A to B Source Input Direction Control Input A Data Inputs/Outputs B Data Inputs/Outputs Output Enable Input (Active LOW) Select B to A Source Input B to A Clock Input (LOW to HIGH, Edge Triggered) Ground (0V) Positive Supply Voltage 2/16 M74LCX646 Table 3: Truth Table G DIR CAB CBA SAB SBA X H X X X X X X A INPUTS Z B INPUTS Z FUNCTION X X* X* L L H H X X X X L H X X* X* X* X* L L X* X* X X X L L H H X X X Both the A bus and the B bus are inputs The Output functions of the A and B bus are disabled Both the A and B bus are used as inputs to the internal INPUTS INPUTS flip-flops. Data at the bus will be stored on low to high transition of the clock inputs. INPUTS OUTPUTS The A bus are inputs and the B bus are outputs L L The data at the A bus are displayed at the B bus H H L L The data at the A bus are displayed at the B bus. The data of the A bus are stored to internal flip-flop on low H H to high transition of the clock pulse The data stored to the internal flip-flop are displayed at X Qn the B bus. L L The data at the A bus are stored to the internal flip-flop on low to high transition of the clock pulse. The states H H of the internal flip-flops output directly to the B bus. OUTPUTS INPUTS The B bus are inputs and the A bus are outputs. L L The data at the B bus are displayed at the A bus H H L L The data at the B bus are displayed at the A bus. The data of the B bus are stored to the internal flip-flop on H H low to high transition of the clock pulse. The data stored to the internal flip-flops are displayed Qn X at the A bus L L The data at the B bus are stored to the internal flip-flop on low to high transition of the clock pulse. The states H H of the internal flip-flops output directly to the A bus. X : Don’t Care Z : High Impedance Qn: The data stored to the internal flip-flops by most recent low to high transition of the clock inputs * : The data at the A and B bus will be stored to the internal flip-flops on every low to high transition of the clock inputs. 3/16 M74LCX646 Figure 3: Logic Diagram This logic diagram has not be used to estimate propagation delays Figure 4: Timing Chart 4/16 M74LCX646 Table 4: Absolute Maximum Ratings Symbol VCC VI VO VO IIK IOK IO ICC IGND Tstg TL Supply Voltage DC Input Voltage DC Output Voltage (OFF State) DC Output Voltage (High or Low State) (note 1) DC Input Diode Current DC Output Diode Current (note 2) DC Output Current DC Supply Current per Supply Pin DC Ground Current per Supply Pin Storage Temperature Lead Temperature (10 sec) Parameter Value -0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 -0.5 to VCC + 0.5 - 50 - 50 ± 50 ± 100 ± 100 -65 to +150 300 Unit V V V V mA mA mA mA mA °C °C Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied 1) IO absolute maximum rating must be observed 2) VO < GND Table 5: Recommended Operating Conditions Symbol VCC VI VO VO IOH, IOL IOH, IOL Top dt/dv Supply Voltage (note 1) Input Voltage Output Voltage (OFF State) Output Voltage (High or Low State) High or Low Level Output Current (VCC = 3.0 to 3.6V) High or Low Level Output Current (VCC = 2.7V) Operating Temperature Input Rise and Fall Time (note 2) Parameter Value 2.0 to 3.6 0 to 5.5 0 to 5.5 0 to VCC ± 24 ± 12 -55 to 125 0 to 10 Unit V V V V mA mA °C ns/V 1) Truth Table guaranteed: 1.5V to 3.6V 2) VIN from 0.8V to 2V at VCC = 3.0V 5/16 M74LCX646 Table 6: DC Specifications Test Condition Symbol Parameter VCC (V) -40 to 85 °C Min. 2.0 2.7 to 3.6 0.8 2.7 to 3.6 2.7 3.0 VOL Low Level Output Voltage 2.7 to 3.6 2.7 3.0 II Ioff IOZ Input Leakage Current Power Off Leakage Current High Impedance Output Leakage Current Quiescent Supply Current ICC incr. per Input 2.7 to 3.6 0 2.7 to 3.6 IO=-100 µA IO=-12 mA IO=-18 mA IO=-24 mA IO=100 µA IO=12 mA IO=16 mA IO=24 mA VI = 0 to 5.5V VI or VO = 5.5V VI = VIH or VIL VO = 0 to VCC VI = VCC or GND VI or VO= 3.6 to 5.5V VIH = VCC - 0.6V VCC-0.2 2.2 2.4 2.2 0.2 0.4 0.4 0.55 ±5 10 ±5 10 ± 10 500 VCC-0.2 2.2 2.4 2.2 0.2 0.4 0.4 0.55 ±5 10 ±5 10 ± 10 500 µA µA µA µA µA V V 0.8 V Max. Value -55 to 125 °C Min. 2.0 Max. V Unit VIH VIL VOH High Level Input Voltage Low Level Input Voltage High Level Output Voltage ICC ∆ICC 2.7 to 3.6 2.7 to 3.6 Table 7: Dynamic Switching Characteristics Test Condition Symbol Parameter VCC (V) 3.3 CL = 50pF VIL = 0V, VIH = 3.3V Value TA = 25 °C Min. Typ. 0.8 -0.8 Max. V Unit VOLP VOLV Dynamic Low Level Quiet Output (note 1) 1) Number of outputs defined as "n". Measured with "n-1" outputs switching from HIGH to LOW or LOW to HIGH. The remaining output is measured in the LOW state. 6/16 M74LCX646 Table 8: AC Electrical Characteristics Test Condition Symbol Parameter VCC (V) 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 50 50 50 500 500 500 2.5 2.5 2.5 50 500 2.5 50 50 50 50 500 500 500 500 2.5 2.5 2.5 2.5 50 500 2.5 50 500 2.5 CL (pF) RL (Ω ) ts = tr (ns) -40 to 85 °C Min. 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 2.5 2.5 1.5 1.5 4.0 3.3 150 1.0 Max. 9.5 8.5 8.0 7.0 9.5 8.5 9.5 8.5 9.5 8.5 Value -55 to 125 °C Min. 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 2.5 2.5 1.5 1.5 4.0 3.3 150 1.0 ns MHz ns ns Max. 9.5 8.5 8.0 7.0 9.5 8.5 9.5 8.5 9.5 8.5 ns ns ns ns ns ns Unit tPLH tPHL tPLH tPHL tPLH tPHL tPZL tPZH tPLZ tPHZ tS Propagation Delay Time (CAB or CBA to An or Bn) Propagation Delay Time (An to Bn or Bn to An) Propagation Delay Time (SAB or SBA to An or Bn) Output Enable Time (G, DIR to An, Bn) Output Disable Time (G, DIR to An, Bn) Setup Time, HIGH or LOW level Data to CAB, CBA Hold Time, HIGH or LOW level Data to CAB, CBA CAB, CBA Pulse Width, HIGH or LOW Clock Pulse Frequency Output To Output Skew Time (note1, 2) th tW fMAX tOSLH tOSHL 1) Skew is defined as the absolute value of the difference between the actual propagation delay for any two outputs of the same device switching in the same direction, either HIGH or LOW (tOSLH = | tPLHm - tPLHn|, tOSHL = | tPHLm - tPHLn|) 2) Parameter guaranteed by design Table 9: Capacitive Characteristics Test Condition Symbol Parameter VCC (V) 3.3 3.3 3.3 VIN = 0 to VCC VIN = 0 to VCC fIN = 10MHz VIN = 0 or VCC Value TA = 25 °C Min. Typ. 6 10 37 Max. pF pF pF Unit CIN CI/O CPD Input Capacitance I/O Capacitance Power Dissipation Capacitance (note 1) 1) CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. ICC(opr) = CPD x VCC x fIN + ICC/8 (per circuit) 7/16 M74LCX646 Figure 5: Test Circuit TEST tPLH, tPHL tPZL, tPLZ tPZH, tPHZ CL = 50 pF or equivalent (includes jig and probe capacitance) RL = R1 = 500Ω or equivalent RT = ZOUT of pulse generator (typically 50Ω) SWITCH Open 6V GND Figure 6: Waveform - Propagation Delays, SAB, SBA, An, Bn, Times (f=1MHz; 50% duty cycle) 8/16 M74LCX646 Figure 7: Waveform - Output Enable And Disable Time (f=1MHz; 50% duty cycle) Figure 8: Waveform - Setup And Hold Time, CAB, CBA Maximum Frequency (f=1MHz; 50% duty cycle) 9/16 M74LCX646 Figure 9: Waveform - Pulse Width (f=1MHz; 50% duty cycle) 10/16 M74LCX646 SO-24 MECHANICAL DATA DIM. A A1 B C D E e H h L k ddd 10.00 0.25 0.4 0° mm. MIN. 2.35 0.1 0.33 0.23 15.20 7.4 1.27 10.65 0.75 1.27 8° 0.100 0.394 0.010 0.016 0° TYP MAX. 2.65 0.30 0.51 0.32 15.60 7.6 MIN. 0.093 0.004 0.013 0.009 0.598 0.291 0.050 0.419 0.030 0.050 8° 0.004 inch TYP. MAX. 0.104 0.012 0.020 0.013 0.614 0.299 0070769C 11/16 M74LCX646 TSSOP24 MECHANICAL DATA mm. DIM. MIN. A A1 A2 b c D E e H K L 6.25 0° 0.50 0.19 0.09 7.7 4.3 0.65 BSC 6.5 8° 0.70 0.246 0° 0.020 0.05 0.9 0.30 0.20 7.9 4.5 0.0075 0.0035 0.303 0.169 0.0256 BSC 0.256 8° 0.028 TYP MAX. 1.1 0.15 0.002 0.035 0.0118 0.0079 0.311 0.177 MIN. TYP. MAX. 0.043 0.006 inch A A2 A1 b e K c L H D E PIN 1 IDENTIFICATION 1 7047476B 12/16 M74LCX646 Tape & Reel SO-24 MECHANICAL DATA mm. DIM. MIN. A C D N T Ao Bo Ko Po P 10.8 15.7 2.9 3.9 11.9 12.8 20.2 60 30.4 11.0 15.9 3.1 4.1 12.1 0.425 0.618 0.114 0.153 0.468 TYP MAX. 330 13.2 0.504 0.795 2.362 1.197 0.433 0.626 0.122 0.161 0.476 MIN. TYP. MAX. 12.992 0.519 inch 13/16 M74LCX646 Tape & Reel TSSOP24 MECHANICAL DATA mm. DIM. MIN. A C D N T Ao Bo Ko Po P 6.8 8.2 1.7 3.9 11.9 12.8 20.2 60 22.4 7 8.4 1.9 4.1 12.1 0.268 0.323 0.067 0.153 0.468 TYP MAX. 330 13.2 0.504 0.795 2.362 0.882 0.276 0.331 0.075 0.161 0.476 MIN. TYP. MAX. 12.992 0.519 inch 14/16 M74LCX646 Table 10: Revision History Date 15-Sep-2004 Revision 6 Description of Changes Ordering Codes Revision - pag. 1. 15/16 M74LCX646 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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