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BTA16-800BRG

BTA16-800BRG

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO-220-3

  • 描述:

    TRIAC 800V 16A TO220AB

  • 数据手册
  • 价格&库存
BTA16-800BRG 数据手册
T1610, T1635, T1650 BTA16, BTB16 Datasheet Snubberless™, logic level and standard 16 A Triacs Features A2 • • • • G A1 A2 A2 G A1 A1 TO-220AB A2 G • • • Medium current Triac Low thermal resistance with clip bonding Low thermal resistance insulation ceramic for insulated BTA High commutation (4Q) or very high commutation (3Q, Snubberless™) capability BTA series UL1557 certified (file ref: 81734) Packages are RoHS (2002/95/EC) compliant Insulated tab (BTA series, rated at 2500 VRMS) TO-220AB Ins. A2 Applications D²PAK A2 A1 • G • Snubberless versions (BTA/BTB...W and T1635) especially recommended for use on inductive loads, because of their high commutation performances On/off or phase angle function in applications such as static relays, light dimmers and appliance motor speed controllers Description Product status link BTA16 Available either in through-hole or surface mount packages, the BTA16, BTB16 and T1610, T1635 and T1650 Triac series are suitable for general purpose mains power AC switching. They can be used as ON/OFF function in applications such as static relays, heating regulation or induction motor starting circuit. They are also recommended for phase control operations in light dimmers and appliance motors speed controllers. The Snubberless™ versions (W suffix and T1610, T1635, T1650) are especially recommended for use on inductive loads, because of their high commutation performance. BTB16 T1610 By using an internal ceramic pad, the Snubberless™ series provide an insulated tab (rated at 2500 VRMS) complying with UL standards (file reference: E81734). T1635 T1650 Product summary IT(RMS) 16 A VDRM/VRRM 600, 800 V IGTSnubberless™ 10, 35, 50 mA IGTstandard 25, 50 mA DS2114 - Rev 11 - May 2018 For further information contact your local STMicroelectronics sales office. www.st.com T1610, T1635, T1650, BTA16, BTB16 Characteristics 1 Characteristics Table 1. Absolute maximum ratings Symbol Parameters IT(RMS) TO-220AB, RMS on-state current (full sine wave) ITSM I2t tp = 20 ms 160 F = 60 Hz tp = 16.7 ms 168 I2t value for fusing tp = 10 ms A 144 A2s F = 120 Hz Tj = 125 °C 50 A/µs tp = 10 ms Tj = 25 °C VDRM/VRRM + 100 V tp = 20 µs Tj = 125 °C 4 A Tj = 125 °C 1 W Storage junction temperature range -40 to +150 °C Operating junction temperature range -40 to +125 °C Average gate power dissipation Tj A F = 50 Hz Peak gate current Tstg 16 Tc = 100 °C Non repetitive surge peak on-state current (full cycle, Tj initial = 25 °C) VDSM/VRSM Non repetitive surge peak off-state voltage PG(AV) Unit Tc = 86 °C IG = 2 x IGT , tr ≤ 100 ns IGM Value TO-220AB Ins. Critical rate of rise of on-state current dl/dt D2PAK Table 2. Static electrical characteristics Symbol VT(1) VTO(1) RD Tj Test conditions (1) IDRM/IRRM Value Unit ITM = 22.5 A, tp = 380 µs 25 °C Max. 1.55 V threshold on-state voltage 125 °C Max. 0.85 V Dynamic resistance 125 °C Max. 25 mΩ 5 µA 2 mA 25 °C VDRM = VRRM 125 °C Max. 1. For both polarities of A2 referenced to A1 Table 3. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - standard (4 quadrants) BTA16 Symbol IGT(1) Parameters I - II - III VD = 12 V, RL = 33 Ω VGT DS2114 - Rev 11 VGD VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C IH(2) IT = 500 mA IL IG = 1.2 IGT BTB16 Quadrant IV Max. Unit C B 25 50 50 100 mA All Max. 1.3 V All Min. 0.2 V Max. 25 50 I - III - IV Max. 40 60 II Max. 80 120 mA mA page 2/18 T1610, T1635, T1650, BTA16, BTB16 Characteristics BTA16 Symbol Parameters dV/dt(2) (dV/dt)c(2) BTB16 Quadrant Unit C B VD = 67 % VDRM gate open, Tj = 125 °C Min. 200 400 V/µs (dI/dt)c = 7 A/ms, Tj = 125 °C Min. 5 10 V/µs 1. Minimum IGT is guaranteed at 5 % of IGT max. 2. For both polarities of A2 referenced to A1 Table 4. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - Snubberless and logic level (3 quadrants) Symbol IGT(1) VGT Parameters Quadrant Max. VD = 12 V, RL = 30 Ω I - II - III T1610 / BTA16SW / BTB16SW T1635 / BTA16-CW / BTB16-CW T1650 / BTA16-BW / BTB16-BW Unit 10 35 50 mA Max. 1.3 V 0.2 V VGD VD = VDRM, RL = 3,3 kΩ, Tj = 125 °C Min. IH(2) IT = 500 mA Max. 15 35 50 IL IG = 1.2 IGT I - III Max. 25 50 70 II Max. 30 60 80 Min. 40 500 1000 (dV/dt)(2) VD = 67 % VDRM gate open, Tj = 125 °C (dV/dt)c = 0.1 V/μs, Tj = 125 °C mA mA V/µs 8.5 (dI/dt)c(2) (dV/dt)c = 10 V/μs, Tj = 125 °C Min. 3.0 A/ms Without snubber, Tj = 125 °C 8.5 14 1. Minimum IGT is guaranteed at 5 % of IGT max. 2. For both polarities of A2 referenced to A1 Table 5. Thermal resistance Symbol Rth(j-c) Rth(j-a) Parameters Max. junction to case (AC) Junction to ambient (S = 2 cm²) Junction to ambient Value TO-220AB / D²PAK 1.2 TO-220AB insulated 2.1 D²PAK 45 TO-220AB / TO-220AB ins 60 Unit °C/W 1. Copper surface under tab. DS2114 - Rev 11 page 3/18 T1610, T1635, T1650, BTA16, BTB16 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Maximum power dissipation versus on-state RMS current (full cycle) 20 Figure 3. RMS on-state current versus case temperature (full cycle) P(W) IT(RMS)(A) 18 18 16 16 14 14 12 12 10 10 8 8 6 6 4 4 2 2 IT(RMS)(A) 0 0 2 4 6 Tc(°C) 0 8 10 12 14 16 Figure 4. On-state rms current versus ambient temperature (full cycle) 4.0 BTB/T16 BTA 0 25 50 75 100 125 Figure 5. Relative variation of thermal impedance versus pulse duration IT(RMS)(A) K = [Zth/Rth] 1E+0 3.5 Zth(j-c) D²PAK (S = 1 cm²) 3.0 Printed circuit board FR4, copper thickness: 35 µm Zth(j-a) 2.5 2.0 1E-1 1.5 1.0 0.5 tp(s) Tc(°C) 0.0 0 DS2114 - Rev 11 25 50 75 100 125 1E-2 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 page 4/18 T1610, T1635, T1650, BTA16, BTB16 Characteristics (curves) Figure 6. On-state characteristics (maximum values) Figure 7. Surge peak on-state current versus number of cycles ITM(A) 200 ITSM(A) Tj max. Vto = 0.85 V Rd = 25 mΩ 100 180 Tj = Tj max. 160 140 t=20ms 120 One cy cle Non repetitive Tj initial=25°C 100 10 Tj = 25 °C 80 Repetitive TC=85°C 60 40 20 VTM(V) 1 0.5 1.0 1.5 2.0 2.5 Numb er of cy cles 0 3.0 3.5 4.0 4.5 5.0 1 Figure 8. Non-repetitive surge peak on-state current for a sinusoidal 10 100 1000 Figure 9. Relative variation of gate trigger current IGT, IH, IL[Tj] / IGT, IH, IL[Tj = 25 °C] 2 2.5 2 ITSM(A),I t (A s) ho lding cu rrent and latch in g cu rrent versu s ju nc ti on temp erature (typ ic al values) 3000 2.0 Tj initial=25°C dI/dt limitation: 50A/µs IGT 1.5 1000 ITSM 1.0 IH & IL 0.5 T(j °C) pu ls e wi th wid th t p < 10 ms 100 0. 01 0.0 -40 t p (ms) 0. 10 1. 00 -20 02 04 06 08 0 100 120 140 10. 00 Figure 10. Relative variation of critical rate of decrease of Figure 11. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) main current versus (junction temperature (typical values) (dl/dt)c [Tj] / (dl/dt)c [Tj specified] (dl/dt)c [(dV/dt)c] / specified (dl/dt)c 2.0 6 SW/T1610 1.8 1.6 Snubberless and logic level types C 5 B 4 1.4 1.2 T1635/T1650/CW/BW 1.0 3 2 0.8 1 0.6 0.4 0.1 DS2114 - Rev 11 (dV/dt)c (V/µs) 1.0 10.0 Tj(°C) 100.0 0 0 25 50 75 100 125 page 5/18 T1610, T1635, T1650, BTA16, BTB16 Characteristics (curves) Figure 12. D²PAK thermal resistance junction to ambient versus copper surface under tab 80 Rth(j-a) (°C/W) D²PAK 70 Epoxy printed board FR4, copper thickness = 35 µm 60 50 40 30 20 10 SCu (cm²) 0 0 DS2114 - Rev 11 5 10 15 20 25 30 35 40 page 6/18 T1610, T1635, T1650, BTA16, BTB16 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DS2114 - Rev 11 page 7/18 T1610, T1635, T1650, BTA16, BTB16 TO-220AB Insulated and non Insulated package information 2.1 TO-220AB Insulated and non Insulated package information • • • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.70 N·m Figure 13. TO-220AB Insulated and non Insulated package outline C B b2 I Resin gate 0.5 mm max. protusion(1) L F A I4 l3 c2 a1 l2 a2 M b1 e Resin gate 0.5 mm max. protusion(1) c1 (1)Resin gate position accepted in one of the two positions or in the symmetrical opposites. DS2114 - Rev 11 page 8/18 T1610, T1635, T1650, BTA16, BTB16 TO-220AB Insulated and non Insulated package information Table 6. TO-220ABInsulated and non Insulated package mechanical data Dimensions Ref. Millimeters Min. A Typ. 15.20 a1 Inches Max. Min. 15.90 0.5984 3.75 Typ. Max. 0.6260 0.1476 a2 13.00 14.00 0.5118 0.5512 B 10.00 10.40 0.3937 0.4094 b1 0.61 0.88 0.0240 0.0346 b2 1.23 1.32 0.0484 0.0520 C 4.40 4.60 0.1732 0.1811 c1 0.49 0.70 0.0193 0.0276 c2 2.40 2.72 0.0945 0.1071 e 2.40 2.70 0.0945 0.1063 F 6.20 6.60 0.2441 0.2598 I 3.73 3.88 0.1469 0.1528 L 2.65 2.95 0.1043 0.1161 I2 1.14 1.70 0.0449 0.0669 I3 1.14 1.70 0.0449 0.0669 I4 15.80 16.80 0.6220 M 16.40 2.6 0.6457 0.6614 0.1024 1. Inch dimensions are for reference only. DS2114 - Rev 11 page 9/18 T1610, T1635, T1650, BTA16, BTB16 D²PAK package information 2.2 D²PAK package information Figure 14. D²PAK package outline A E E2 L3 D2 H D D1 L2 c2 E1 b2 b Resin gate 0.5 mm max. protrusion(1) e G A1 A2 A3 L R Gauge Plane V2 c (1) Resin gate position accepted in one of the two positions or in the symmetrical opposites DS2114 - Rev 11 page 10/18 T1610, T1635, T1650, BTA16, BTB16 D²PAK package information Table 7. D²PAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.30 4.60 0.1693 0.1811 A1 2.49 2.69 0.0980 0.1059 A2 0.03 0.23 0.0012 0.0091 A3 0.25 0.0098 b 0.70 0.93 0.0276 0.0366 b2 1.25 1.7 0.0492 0.0669 c 0.45 0.60 0.0177 0.0236 c2 1.21 1.36 0.0476 0.0535 D 8.95 9.35 0.3524 0.3681 D1 7.50 8.00 0.2953 0.3150 D2 1.30 1.70 0.0512 0.0669 e 2.54 E 10.00 10.28 0.3937 0.4047 E1 8.30 8.70 0.3268 0.3425 E2 6.85 7.25 0.2697 0.2854 G 4.88 5.28 0.1921 0.2079 H 15 15.85 0.5906 0.6240 L 1.78 2.28 0.0701 0.0898 L2 1.27 1.40 0.0500 0.0551 L3 1.40 1.75 0.0551 0.0689 R V2 0.1 0.40 0° 0.0157 8° 0° 8° 1. Dimensions in inches are given for reference only DS2114 - Rev 11 page 11/18 T1610, T1635, T1650, BTA16, BTB16 D²PAK package information Figure 15. D²PAK recommended footprint (dimensions are in mm) 16.90 10.30 5.08 1.30 8.90 DS2114 - Rev 11 3.70 page 12/18 T1610, T1635, T1650, BTA16, BTB16 Ordering information 3 Ordering information Figure 16. Ordering information scheme (BTA16 and BTB16 series) BT A 16 - 600 BW (RG) Triac Insulation A = Insulated B = Non-insulated Current 16 = 16 A Voltage 600 = 600 V 800 = 800 V Sensitivity and type B = 50 mA BW = 50 mA Snubberless™ C = 25 mA standard CW = 35 mA Snubberless™ SW = 10 mA logic level Packing mode RG = Tube DS2114 - Rev 11 page 13/18 T1610, T1635, T1650, BTA16, BTB16 Ordering information Figure 17. Ordering information scheme (T8 series) T 16 35 - 600 G (-TR) Triac series Current 16 = 16 A Sensitivity 10 = 10 mA 35 = 35 mA 50 = 50 mA Voltage 600 = 600 V 800 = 800 V Package G = D²PAK Packing mode Blank = Tube TR = Tape and reel DS2114 - Rev 11 page 14/18 T1610, T1635, T1650, BTA16, BTB16 Product selector 3.1 Product selector Table 8. Product selector Part Number 600 800 BTB16-600C Type Package 35 mA Standard TO-220AB BTB16-600B BTB16-800B 50 mA Standard TO-220AB BTB16-600SW BTB16-800SW 10 mA Snubberless™ TO-220AB BTB16-600CW BTB16-800CW 35 mA Snubberless™ TO-220AB BTB16-600BW BTB16-800BW 50 mA Snubberless™ TO-220AB 35 mA Standard TO-220AB Ins. BTA16-600C BTA16-600B BTA16-800B 50 mA Standard TO-220AB Ins. BTA16-600SW BTA16-800SW 10 mA Snubberless™ TO-220AB Ins. BTA16-600CW BTA16-800CW 35 mA Snubberless™ TO-220AB Ins. BTA16-600BW BTA16-800BW 50 mA Snubberless™ TO-220AB Ins. T1610-600G T1610-800G 10 mA Snubberless™ D2PAK T1635-600G T1635-800G 35 mA Snubberless™ D2PAK 50 mA Snubberless™ D2PAK T1650-600G DS2114 - Rev 11 Sensitivity page 15/18 T1610, T1635, T1650, BTA16, BTB16 Ordering information 3.2 Ordering information Table 9. Ordering information DS2114 - Rev 11 Order code Marking BTA16-600BRG BTA16-600B BTA16-600BWRG BTA16-600BW BTA16-600CRG BTA16-600C BTA16-600CWRG BTA16-600CW BTA16-600SWRG BTA16-600SW BTA16-800BRG BTA16-800B BTA16-800BWRG BTA16-800BW BTA16-800CWRG BTA16-800CW BTA16-800SWRG BTA16-800SW BTB16-600BRG BTB16-600B BTB16-600BWRG BTB16-600BW BTB16-600CRG BTB16-600C BTB16-600CWRG BTB16-600CW BTB16-600SWRG BTB16-600SW BTB16-800BRG BTB16-800B BTB16-800BWRG BTB16-800BW BTB16-800CWRG BTB16-800CW BTB16-800SWRG BTB16-800SW T1610-600G-TR T1610-600G T1610-800G-TR T1610-800G T1635-600G-TR T1635-600G T1635-800G-TR T1635-800G T1650-600G-TR T1650-600G T1635-600G T1635-600G Package Weight Base qty. TO-220AB Ins. Tube 2.30 50 TO-220AB D²PAK Delivery mode Tube 1.50 1000 Tape and reel 50 Tube page 16/18 T1610, T1635, T1650, BTA16, BTB16 Revision history Table 10. Document revision history DS2114 - Rev 11 Date Revision Changes Oct-2002 6A 13-Feb-2006 7 TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. 03-Jul-2009 8 Added part number T1610. 04-Dec-2009 9 Updated value for VDSM / VRSM in Table 2. Updated temperature in Table 2 from 15 °C to 86 °C. 11-Mar-2010 10 Updated value for VDSM / VRSM in Table 2. Updated temperature in Table 2 from 15 °C to 86 °C. 30-May-2018 11 Updated Section ● Product status / summary. Added T1650 package information. Last update. page 17/18 T1610, T1635, T1650, BTA16, BTB16 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS2114 - Rev 11 page 18/18
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