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L6221AD

L6221AD

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOIC20

  • 描述:

    TRANS 4NPN DARL 50V 1.8A 20SOIC

  • 数据手册
  • 价格&库存
L6221AD 数据手册
® L 6221A L6221AD L6221N QUAD DARLINGTON SWITCH . . . . . . FOUR NON INVERTING INPUTS WITH ENABLE OUTPUT VOLTAGE UP TO 50 V OUTPUT CURRENT UP TO 1.8 A VERY LOW SATURATION VOLTAGE TTL COMPATIBLE INPUTS INTEGRAL FAST RECIRCULATION DIODES Powerdip 12 + 2 + 2 Multiwatt 15 DESCRIPTION The L6221 monolithic quad darlington switch is designedfor high current, high voltageswitching applications. Each of the four switches is controlled by a logic input and all four are controlled by a common enableinput.All inputsareTTL-compatiblefor direct connection to logic circuits. Eachswitch consists of an open-collectordarlington transistor plus a fast diodefor switchingapplications with inductive device loads. The emitters of the four switches are commoned. Any number of inputsand outputs of the same device may be paralleled. SO16+2+2 ORDERING NUMBERS: L6221A (Powerdip) L6221N (Multiwatt15) L6221AD (SO16+2+2) BLOCK DIAGRAM July 1998 1/15 L6221A - L6221AD - L6221N THERMAL DATA Symbol R th j-pins R th j-case Rth j-amb Parameter Thermal Resistance Junction-pins Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max. Max. Max. SO20 17 – 80 Powerdip Multiwatt15 14 – 80 – 3 35 Unit °C/W °C/W °C/W PIN CONNECTIONS (top views) L6221A (Powerdip) L6221AD (SO16+2+2) OUT4 CLAMPB N.C. OUT3 GND GND OUT2 N.C. CLAMPA OUT1 1 2 3 4 5 6 7 8 9 10 D95IN231 20 19 18 17 16 15 14 13 12 11 IN4 IN3 N.C. ENABLE GND GND VS N.C. IN2 IN1 L6221N (Multiwatt-15) 2/15 L6221A - L6221AD - L6221N ABSOLUTE MAXIMUM RATINGS Symbol Vo Vs VIN, VEN IC IC IC Top Tstg Isub Ptot Output Voltage Logic Supply Voltage Input Voltage, Enable Voltage Continuous Collector Current (for each channel) Collector Peak Current (repetitive, duty cycle = 10 % ton = 5 ms) Collector Peak Current (non repetitive, t = 10 µs) Operating Temperature Range (junction) Storage Temperature Range Output Substrate Current Total Power Dissipation at at at at at at Tpins Tcase Tcase Tamb Tamb Tamb = = = = = = 90 90 90 70 70 70 °C °C °C °C °C °C (powerdip) (multiwatt) (SO20) (powerdip) (multiwatt) (SO20) Parameter Value 50 7 Vs 1.8 2.5 3.2 – 40 to + 150 – 55 to + 150 350 4.3 20 3.5 1 2.3 1 A A A °C °C mA W W W W W W Unit V V TRUTH TABLE Enable H H L For each input : H = High level L = Low level Input H L X Power Out ON OFF OFF PIN FUNCTIONS (see block diagram) Name IN 1 IN 2 OUT 1 OUT 2 CLAMP A IN 3 IN 4 OUT 3 OUT 4 CLAMP B ENABLE VS GND Input to Driver 1 Input to Driver 2 Output of Driver 1 Output of Driver 2 Diode Clamp to Driver 1 and Driver 2 Input to Driver 3 Input to Driver 4 Output of Driver 3 Output of Driver 4 Diode Clamp to Driver 3 and Driver 4 Enable Input to All Drivers Logic Supply Voltage Common Ground 3/15 Function L6221A - L6221AD - L6221N ELECTRICAL CHARACTERISTICS Refer to the test circuit to Fig. 1 to Fig. 9 (VS = 5V, Tamb = 25oC unless otherwise specified) Symbol VS Is VCE(sus) ICEX VCE(sat) Parameter Logic Supply Voltage Logic Supply Current Output Sustaining Voltage Output Leakage Current Collector Emitter Saturation Voltage (one input on ; all others inputs off.) All Outputs ON, IC = 0.7A All Outputs OFF VIN = VINL, VEN = VENH IC = 100 mA VCE = 50V VIN = VINL, VEN = VENH Vs = 4.5V VIN = VINH, VEN = VENH IC = 0.6A IC = 1A IC = 1.8A VIN = VINL, VEN = VENL 2.0 VIN = VINH, VEN = VENH VR = 50 V, VEN = VENH VIN = VINL IF = 1A IF = 1.8A Vp = 5V, RL = 10Ω Vp = 5V, RL = 10Ω VIN = 5V, VEN = 5V Iout = – 300 mA for Each Channel ± 10 100 1.6 2.0 2 5 120 46 1 Test Conditions Min . Typ . Max . 4.5 5.5 20 20 Unit V mA mA V mA V 1 1.2 1.6 0.8 – 100 V µA V µA µA V V µs µs mA VINL, VENL IINL, IENL VINL, VENH IINH , IENH IR VF td (on) td (off) ∆Is Input Low Voltage Input Low Current Input High Voltage Input High Current Clamp Diode Leakage Current Clamp Diode Forward Voltage Turn on Delay Time Turn off Delay Time Logic Supply Current Variation 4/15 L6221A - L6221AD - L6221N TEST CIRCUITS (X) = Referred to Multiwatt package X = Referred to Powerdip package Figure 1 : Logic supply current. Set V IN = 4.5V,V EN = 0.8V,or V IN = 0.8V,V EN = 4.5V, for I S (all outputs off) Set V IN = 2V, V EN = 2V, for I S (all outputs on) Figure 2 : Output Sustaining Voltage. Figure 3 : Output Leakage Current. 5/15 L6221A - L6221AD - L6221N Figure 4 : Collector-emitter Saturation Voltage Figure 5 : Logic Input Characteristics Set Set Set Set S1, S2 open, VIN, VEN = 0.8V for IIN L, IEN L S1, S2 open, VIN, VEN = 2V for IIN H, IEN H S1, S2 close, VIN, VEN = 0.8V for V IN L, VEN L S1, S2 close, VIN, VEN = 2V for VIN H, VEN H Figure 6 : Clamp Diode Leakage Current. Figure 7 : Clamp Diode Forward Voltage. 6/15 L6221A - L6221AD - L6221N F igure 8 : Switching Times Test Circuit . Figure 9 : Switching TImes Waveforms. Figure 10 : Allowed Peak Collector Current versus Duty Cycle for 1, 2, 3 or 4 Contemporary Working Outputs (L6221A) Figure 11 : Allowed Peak Collector Current versus Duty Cycle for 1, 2, 3 or 4 Contemporary Working Outputs (L6221N) 7/15 L6221A - L6221AD - L6221N Figure 12 : Collector Saturation Voltage versus Collector Current Figure 13 : Free-wheeling Diode Forward Voltage versus Diode Current Figure 14 : Collector Saturation Voltage versus Junction Temperature at IC = 1A Figure 15 : Free-wheeling Diode Forward Voltage versus Junction Temperature at IF = 1A Figure 16 : Saturation Voltage vs. Junc- Figure 17 : Free-wheeling Diode Forward 8/15 L6221A - L6221AD - L6221N APPLICATION INFORMATION When inductive loads are driven by L6221A/N, a zener diode in series with the integral free-wheeling diodes increases the voltage across which energy stored in the load is discharged and therefore speeds the current decay (fig. 18). For reliability it is suggestedthat the zener is chosen so that Vp + Vz < 35 V. The reasons for this are two fold : 1) The zener voltage changes in temperature and current. 2) The instantaneouspowermust belimited to avoid the reverse second breakdown. Figure 18. F igure 19 : Driver for Solenoids up to 3A . Some care must be taken to ensure that the collectors are placed close togetherto avoid differentcurrent partitioning at turn-off. We suggest to put in parallel channel 1 and 4 and channel2 and 3 as shown in figure 19 for the similar electrical characteristics of the logic section(turn-on and turn-off delay time) and the power stages (collector saturation voltage, free-wheeling diode forward voltage). 9/15 L6221A - L6221AD - L6221N Figure 20 : Saturation Voltage versus Collector Current Figure 21 : Peak Collector Current versus Duty Cycle for 1 or 2 Paralleled Outputs Driven (L6221A) Figure 22 : Peak Collector Current versus Duty Cycle for 1 or 2 Paralleled Outputs Driven (L6221N) 10/15 L6221A - L6221AD - L6221N MOUNTING INSTRUCTION The Rth j-amb of the L6221A can be reduced by solderingthe GND pins to a suitablecopperarea of the printed circuit board (Fig. 23) or to an external heatsink (Fig. 24). The diagram of figure 25 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side ” α” of two equal square copper areas havFigure 23 : Example of P.C. Board Copper Area Which is Used as Heatsink ing a thickness of 35µ (1.4 mils). During soldering the pins temperature must not exceed 260 °C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 24 : External Heatsink Mounting Example Figure 25 : Maximum Dissipable Power and Junction to Ambient Thermal Resistance versus Side ” α” Figure 26 : Maximum Allowable Power Dissipation versus Ambient Temperature 11/15 L6221A - L6221AD - L6221N POWERDIP 16 PACKAGE MECHANICAL DATA DIM. MIN. a1 B b b1 D E e e3 F I L Z 3.30 1.27 8.80 2.54 17.78 7.10 5.10 0.130 0.050 0.38 0.51 0.85 0.50 0.50 20.0 0.346 0.100 0.700 0.280 0.201 0.015 1.40 mm TYP. MAX. MIN. 0.020 0.033 0.020 0.020 0.787 0.055 inch TYP. MAX. 12/15 L6221A - L6221AD - L6221N MULTIWATT 15 PACKAGE MECHANICAL DATA DIM. MIN. A B C D E F G G1 H1 H2 L L1 L2 L3 L4 L7 M M1 S S1 Dia1 21.9 21.7 17.65 17.25 10.3 2.65 4.25 4.63 1.9 1.9 3.65 4.55 5.08 17.5 10.7 22.2 22.1 0.49 0.66 1.02 17.53 19.6 20.2 22.5 22.5 18.1 17.75 10.9 2.9 4.85 5.53 2.6 2.6 3.85 0.862 0.854 0.695 0.679 0.406 0.104 0.167 0.182 0.075 0.075 0.144 0.179 0.200 0.689 0.421 0.874 0.870 1.27 17.78 1 0.55 0.75 1.52 18.03 0.019 0.026 0.040 0.690 0.772 0.795 0.886 0.886 0.713 0.699 0.429 0.114 0.191 0.218 0.102 0.102 0.152 0.050 0.700 mm TYP. MAX. 5 2.65 1.6 0.039 0.022 0.030 0.060 0.710 MIN. inch TYP. MAX. 0.197 0.104 0.063 13/15 L6221A - L6221AD - L6221N SO20 PACKAGE MECHANICAL DATA DIM. MIN. A A1 B C D E e H h L K 10 0.25 0.4 2.35 0.1 0.33 0.23 12.6 7.4 1.27 10.65 0.75 1.27 0.394 0.010 0.016 mm TYP. MAX. 2.65 0.3 0.51 0.32 13 7.6 MIN. 0.093 0.004 0.013 0.009 0.496 0.291 0.050 0.419 0.030 0.050 inch TYP. MAX. 0.104 0.012 0.020 0.013 0.512 0.299 0 (min.)8 (max.) L h x 45° A B e K H D A1 C 20 11 E 1 10 SO20MEC 14/15 L6221A - L6221AD - L6221N Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1998 STMicroelectronics – Printed in Italy – All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 15/15
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