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RF2L16180CB4

RF2L16180CB4

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    B4E

  • 描述:

    180 W, 28 V, 1.3 TO 1.6 GHZ RF P

  • 数据手册
  • 价格&库存
RF2L16180CB4 数据手册
RF2L16180CB4 Datasheet 180 W, 28 V, 1.3 to 1.6 GHz RF power LDMOS transistor Features 1 2 5 4 3 B4E Pin connection Pin Connection 1 Drain A 2 Drain B 3 Source (bottom side) 4 Gate B 5 Gate A • • • • • • Order code f (MHz) VDD POUT Gain Efficiency RF2L16180CB4 1450 28 V 180 W 14 dB 60% High efficiency and linear gain operations Integrated ESD protection Internally matched for ease of use Optimized for Doherty applications Large positive and negative gate-source voltage range for improved class C operation In compliance with the European Directive 2002/95/EC Applications • • Multicarrier base station Industrial, scientific and medical Description The RF2L16180CB4 is 180 W, 28 V internally matched LDMOS transistor designed for multicarrier WCDMA/PCS/DCS/LTE base station and ISM applications with frequencies from 1300 to 1600 MHz. Four leads can be configured as single ended, 180 degree push-pull or 90 degree hybrid or Doherty with proper external matching network. Product status link RF2L16180CB4 Product summary Order code RF2L16180CB4 Marking 2L16180 Package B4E Packing Tape and reel 13” Base/bulk Quantity 120/120 DS13287 - Rev 2 - April 2021 For further information contact your local STMicroelectronics sales office. www.st.com RF2L16180CB4 Electrical ratings 1 Electrical ratings Table 1. Absolute maximum ratings (TC= 25 °C) Symbol Parameter Value Unit V(BR)DSS Drain-source voltage 65 V VGS Gate-source voltage -6 to 10 V VDD Maximum operating voltage 32 V TSTG Storage temperature range -65 to 150 °C 200 °C Value Unit 0.38 °C/W TJ Maximum junction temperature Table 2. Thermal data Symbol RthJC(1) Parameter Thermal resistance, junction-to-case 1. TC = 85 °C , TJ = 200 °C, DC test. Table 3. ESD protection Symbol DS13287 - Rev 2 Test methodology Class HBM Human body model (according to ANSI/ESDA/JEDEC JS001-2017) 1C CDM Charge device model (according to ANSI/ESDA/JEDEC JS-002-2014) C3 page 2/12 RF2L16180CB4 Electrical characteristics 2 Electrical characteristics TC = 25 °C unless otherwise specified. Table 4. Static (per side) Symbol V(BR)DSS Parameter Drain-source breakdown voltage Test conditions VGS = 0 V, IDS = 100 μA Min. Typ. Max. 65 Unit V VGS = 0 V, VDS = 28 V IDSS Zero-gate voltage drain current IGSS Gate-body leakage current VGS=-6/10 V, VDS=0 V VGS(th) Gate threshold voltage VDS = 28 V, IDS = 600 μA 1.5 2.5 VGS(Q) Gate quiescent voltage VDS= 28 V, IDS = 100 mA 1.5 4 VDS(on) Static drain-source on-voltage VGS = 10 V, IDS = 3 A RDS(on) Drain-source on-state resistance IDS(on) Static drain-source on-current VGS = 0 V, VDS = 50 V 1 μA ±100 nA V 0.5 VGS= 10 V, VDS=100 mV 1 Ω 2.5 A Max. Unit 1.6 GHz Table 5. Dynamic Symbol f DS13287 - Rev 2 Test conditions Frequency POUT Output power GPS Power gain ƞD Note: Parameter Drain efficiency Min. Typ. 1.3 f = 1450 MHz at 1dB compression point in Doherty amplifier test circuit, pulsed CW 180 W 14 dB 60 % VDD = 28 V, IDQMain = 600 mA, VGpeak = 0.9 V, pulse width = 10 µs, duty cycle = 12%. page 3/12 RF2L16180CB4 Typical performance 3 Typical performance Table 6. Output power, power gain and drain efficiency vs input power (f = 1450 MHz) PIN (dBm) POUT (dBm) POUT (W) IDS (A) GPS (dB) ηD(%) 24.6 39.8 9.5 1.3 15.2 25.7 25.6 40.8 12.1 1.5 15.2 29.2 26.6 41.9 15.4 1.7 15.3 33.0 27.6 43.0 19.9 1.9 15.4 36.9 28.6 44.1 25.6 2.2 15.5 40.8 29.6 45.2 33.0 2.7 15.6 44.2 30.6 46.3 42.6 3.2 15.7 47.3 31.6 47.3 53.9 3.9 15.7 49.9 32.6 48.3 67.2 4.6 15.7 51.9 33.5 49.2 82.3 5.5 15.6 53.6 34.5 49.9 96.6 6.2 15.3 55.3 35.5 50.7 116.5 7.3 15.2 57.0 36.5 51.3 135.6 8.3 14.8 58.2 37.4 51.9 154.8 9.2 14.5 60.2 38.4 52.4 172.9 10.1 14.0 61.4 39.3 52.8 188.9 10.8 13.4 62.5 40.2 53.0 200.6 11.4 12.9 63.1 41.1 53.3 213.1 12.0 12.2 63.7 16 70 15 60 14 50 13 40 12 30 11 20 40 41 42 43 Power gain 44 45 46 47 48 49 50 51 DS13287 - Rev 2 52 53 54 POUT (dbm) Efficiency Note: Drain efficiency, ηD (%) Power gain, GPS (dB) Figure 1. Power Gain and drain efficiency vs output power at 1450 MHz (on Doherty test fixture) GADG110620201522MT VDD = 28 V, IDQMain = 600 mA, pulsed CW, pulse width = 10 μs, duty cycle = 12% page 4/12 RF2L16180CB4 Test circuits 4 Test circuits Figure 2. Test circuit layout DS13287 - Rev 2 page 5/12 RF2L16180CB4 Test circuits Figure 3. Test circuit photo 2L16180 Table 7. Component list Component Value Size Reference C2, C8, C13, C18 Ceramic capacitor, 28 pF 0805 ATC600F C3, C16 Ceramic capacitor, 3.3 pF 0805 ATC600F C4, C7, C11, C19 Ceramic capacitor, 5.6 pF 0805 ATC600F C5 Ceramic capacitor, 0.7 pF 0805 ATC600F C6, C14, C15, C17 Ceramic capacitor, 2.7 pF 0805 ATC600F C12 Ceramic capacitor, 1.0 pF 0805 ATC600F C1, C9, C10, C20 10 μF 1210 100 V ceramic multilayer capacitor C21, C22 220 μF 63 V electrolytic capacitor D1 R1 50 Ω 0805 4 W chip resistor R2, R3 10 Ω 0805 Chip resistor PCB DS13287 - Rev 2 Spliter 0.508 mm [0.020''] thick, ԑr = 3.48, Rogers RO4350B, 1 oz. copper page 6/12 RF2L16180CB4 Package information 5 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 5.1 B4E package information Figure 4. B4E package outline DM00418520_2 DS13287 - Rev 2 page 7/12 RF2L16180CB4 B4E package information Table 8. B4E package mechanical data Dim. DS13287 - Rev 2 mm Min. Typ. Max. A 27.81 27.94 28.07 B 18.93 19.43 19.93 C 33.91 34.04 34.17 D 9.65 9.78 9.91 E 19.56 19.81 20.06 F 3.23 3.61 3.99 G 1.40 1.53 1.66 H 0.07 L 9.20 9.40 9.60 M 4.67 4.80 4.93 N 0.89 1.02 1.15 O 4.70 4.83 4.96 P 3.13 3.26 3.39 Q 7.77 7.90 8.03 0.15 R 0.50 R1 1.52 R2 1.63 CH1 2.72 page 8/12 RF2L16180CB4 Marking information 6 Marking information Figure 5. Marking composition PACKAGE FACE : TOP LEGEND Unmarkable Surface Marking Composition Field A - STANDARD ST LOGO B - ECO level (e4) A C - MARKING AREA D - ADDITIONAL INFORMATION B (MAX CHAR ALLOWED = 7) E - COUNTRY OF ORIGIN C (MAX CHAR ALLOWED = 3) F - Assy Plant D E F G H (PP) G - Assy Year (Y) H - Assy Week (WW) GADG040220211644GT DS13287 - Rev 2 page 9/12 RF2L16180CB4 Revision history Table 9. Document revision history Date Version 02-Jul-2020 1 Changes First release. Modified marking on cover page. Modified Table 1. Absolute maximum ratings (TC= 25 °C), Table 2. Thermal data, Table 3. ESD protection. 21-Apr-2021 2 Modified Table 4. Static (per side). Modified Figure 1. Power Gain and drain efficiency vs output power at 1450 MHz (on Doherty test fixture). Added Section 6 Marking information. Minor text changes. DS13287 - Rev 2 page 10/12 RF2L16180CB4 Contents Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 5 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 5.1 6 B4E package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 DS13287 - Rev 2 page 11/12 RF2L16180CB4 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS13287 - Rev 2 page 12/12
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