STB230NH03L
N-channel 30 V, 2.3 mΩ, 80 A D²PAK
STripFET™ Power MOSFET
Features
Order code
VDSS
RDS(on)
ID
STB230NH03L
30V
< 3mΩ
80A(1)
)
s
(
ct
TAB
1. This value is limited by package
■
RDS(on) Qg industry’s benchmark
■
Conduction losses reduced
■
Switching losses reduced
■
Low threshold device
u
d
o
3
1
r
P
e
D²PAK
t
e
l
o
Applications
■
Switching applications
– Specifically designed and optimized for
high efficiency DC/DC converters
■
OR-ing
)
(s
s
b
O
Figure 1.
Internal schematic diagram
t
c
u
Description
$4!"
d
o
r
This N-channel enhancement mode Power
MOSFET benefits from the latest refinement of
STMicroelectronics' unique “single feature size“
strip-based process, which decreases the critical
alignment steps to offer exceptional
manufacturing reproducibility. The result is a
transistor with extremely high packing density for
low on-resistance, rugged avalanche
characteristics and low gate charge.
P
e
'
t
e
l
o
bs
3
O
!-V
Table 1.
Device summary
Order code
Marking
Package
Packaging
STB230NH03L
B230NH03L
D²PAK
Tape and reel
September 2011
Doc ID 13469 Rev 2
1/15
www.st.com
15
Contents
STB230NH03L
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 6
3
Test circuit
................................................ 8
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
2/15
Doc ID 13469 Rev 2
STB230NH03L
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Drain-source voltage (VGS = 0)
30
V
VGS
Gate-source voltage
±20
V
(1)
Drain current (continuous) at TC = 25 °C
80
A
ID(1)
Drain current (continuous) at TC=100 °C
178
A
Drain current (pulsed)
320
Total dissipation at TC = 25 °C
300
IDM
(2)
PTOT
Derating factor
TJ
-55 to 175
P
e
2. Pulse width limited by safe operating area.
Table 3.
Thermal data
Symbol
W
du
ro
Operating junction temperature
Parameter
)-
)
s
(
ct
A
2
1. This value is limited by package.
W/°C
°C
t
e
l
o
s
b
O
Value
Unit
RthJC
Thermal resistance junction-case max
0.5
°C/W
RthJA
Thermal resistance junction-ambient max
62.5
°C/W
u
d
o
Value
Unit
60
A
1150
mJ
Table 4.
s
(
t
c
Avalanche data
r
P
e
Symbol
o
s
b
Unit
VDS
ID
let
Value
IAS
EAS(1)
Parameter
Avalanche current
Single pulse avalanche energy
1. Starting Tj=25 °C, ID=IAV, VDD=24 V.
O
Doc ID 13469 Rev 2
3/15
Electrical characteristics
2
STB230NH03L
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 5.
On/off states
Symbol
Parameter
Test conditions
Drain-source
V(BR)DSS breakdown voltage
(VGS = 0)
IGSS
Gate body leakage
current (VDS = 0)
Gate threshold voltage VDS= VGS, ID = 250 µA
RDS(on)
Static drain-source on
resistance
Ciss
Coss
Crss
Qg
Qgs
Qgd
e
t
e
ol
4/15
RG
)
(s
Input capacitance
Output capacitance
Reverse transfer
capacitance
t
c
u
od
s
b
O
Test conditions
VDS =10 V, f=1 MHz,
VGS=0
±100
nA
2.5
V
2.3
3
mΩ
2.75
3.4
mΩ
Min.
Typ.
Max.
Unit
-
4700
1600
85
-
pF
pF
pF
-
72
15
11
-
nC
nC
nC
-
5.5
-
Ω
1
VGS =10 V
Gate input resistance
f=1 MHz Gate DC Bias = 0
Test signal level = 20 mV
open drain
(see Figure 15)
Doc ID 13469 Rev 2
)
s
(
ct
u
d
o
Pr
VDD=15 V, ID = 60 A
Total gate charge
Gate-source charge
Gate-drain charge
Pr
µA
µA
e
t
e
ol
VGS= 4.5 V, ID= 40 A
Unit
1
10
VGS= 10 V, ID= 40 A
Dynamic
Max.
V
VGS = ±20 V
VGS(th)
Parameter
Typ.
30
VDS = 30 V,
Zero gate voltage
drain current (VGS = 0) VDS = 30 V,Tc=125 °C
Symbol
s
b
O
ID = 1 mA
IDSS
Table 6.
Min.
1.5
STB230NH03L
Electrical characteristics
Table 7.
Switching times
Symbol
td(on)
tr
td(off)
tf
Table 8.
Parameter
Turn-on delay time
Rise time
VDD=15 V, ID=60 A,
Turn-off delay time
Fall time
(see Figure 14)
ISDM
(2)
VSD(3)
trr
Qrr
IRRM
trr
Qrr
IRRM
Min.
Typ.
Max.
Unit
-
11
322
-
ns
ns
-
123
102
-
ns
ns
Min.
Typ.
Max.
RG=4.7 Ω, VGS=10 V
Source drain diode
Symbol
ISD (1)
Test conditions
Parameter
Test conditions
Source-drain current
Source-drain current
(pulsed)
ISD=40 A, VGS=0
Forward on voltage
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Reverse recovery time
Reverse recovery charge
Reverse recovery current
)
s
(
ct
ISD=120 A,
di/dt = 100 A/µs,
VDD=20 V
-O
(see Figure 19)
Unit
250
1000
A
A
1.3
V
-
42
34.7
1.6
ns
nC
A
-
47
41.3
1.8
ns
nC
A
ISD=120 A,
di/dt = 100 A/µs,
VDD=20 V, Tj=150 °C
uc
d
o
r
P
e
let
o
s
b
(see Figure 19)
-
)
s
(
t
u
d
o
1. This value is silicon limited.
2. Pulse width limited by safe operating area.
r
P
e
3. Pulsed: pulse duration=300µs, duty cycle 1.5%
t
e
l
o
s
b
O
Doc ID 13469 Rev 2
5/15
Electrical characteristics
STB230NH03L
2.1
Electrical characteristics (curves)
Figure 2.
Safe operating area
Figure 3.
Thermal impedance
)
s
(
ct
u
d
o
Figure 4.
Output characteristics
Figure 5.
r
P
e
Transfer characteristics
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
bs
Figure 6.
O
Static drain-source on resistance @ Figure 7.
VGS = 4.5 V
AM09112v1
RDS(on)
(mΩ)
VGS=4.5V
3.5
3.0
2.5
2.0
1.5
10
6/15
20
30
40
50
60
70
80
ID(A)
Doc ID 13469 Rev 2
Static drain-source on resistance @
VGS = 10 V
STB230NH03L
Figure 8.
Electrical characteristics
Gate charge vs gate-source voltage Figure 9.
Capacitance variations
)
s
(
ct
Figure 10. Normalized gate threshold voltage
vs temperature
u
d
o
r
P
e
Figure 11. Normalized on resistance vs
temperature
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
Figure 12. Normalized BVDSS vs temperature
s
b
O
Figure 13. Source-drain diode forward
characteristics
Doc ID 13469 Rev 2
7/15
Test circuit
3
STB230NH03L
Test circuit
Figure 14. Switching times test circuit for
resistive load
Figure 15. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
µF
2200
RL
µF
IG=CONST
VDD
VGS
100Ω
Vi=20V=VGMAX
VD
RG
2200
µF
D.U.T.
)
s
(
t
VG
2.7kΩ
c
u
d
PW
47kΩ
1kΩ
PW
D.U.T.
AM01468v1
e
t
e
ol
o
r
P
AM01469v1
Figure 16. Test circuit for inductive load
Figure 17. Unclamped Inductive load test
switching and diode recovery times
circuit
A
A
D.U.T.
FAST
DIODE
B
B
A
D
G
S
s
(
t
c
3.3
µF
B
25 Ω
D
1000
µF
RG
S
r
P
e
2200
µF
3.3
µF
VDD
ID
Vi
D.U.T.
Pw
let
AM01470v1
Figure 18. Unclamped inductive waveform
b
O
L
VD
VDD
u
d
o
G
so
)-
L=100µH
s
b
O
AM01471v1
Figure 19. Switching time waveform
ton
V(BR)DSS
tdon
VD
toff
tr
tdoff
tf
90%
90%
IDM
10%
ID
VDD
10%
0
VDD
VDS
90%
VGS
AM01472v1
8/15
0
Doc ID 13469 Rev 2
10%
AM01473v1
STB230NH03L
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com. ECOPACK
is an ST trademark.
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
Doc ID 13469 Rev 2
9/15
Package mechanical data
Table 9.
STB230NH03L
D²PAK (TO-263) mechanical data
mm
Dim.
Min.
Typ.
A
4.40
4.60
A1
0.03
0.23
b
0.70
0.93
b2
1.14
1.70
c
0.45
0.60
c2
1.23
1.36
D
8.95
9.35
D1
7.50
E
10
E1
8.50
)
s
(
ct
u
d
o
2.54
e1
4.88
H
15
J1
2.49
L
2.29
L1
t(s
1.27
c
u
d
L2
R
o
r
P
V2
bs
5.28
15.85
2.79
1.40
1.30
0°
10.40
2.69
O
)
1.75
0.4
8°
s
b
O
10/15
r
P
e
t
e
l
o
e
e
t
e
ol
Max.
Doc ID 13469 Rev 2
STB230NH03L
Package mechanical data
Figure 20. D²PAK (TO-263) drawing
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
t
c
u
s
b
O
0079457_S
Figure 21. D²PAK footprint(a)
od
r
P
e
16.90
s
b
O
t
e
l
o
12.20
5.08
1.60
3.50
9.75
Footprint
a. All dimension are in millimeters
Doc ID 13469 Rev 2
11/15
Packaging mechanical data
5
STB230NH03L
Packaging mechanical data
Table 10.
D²PAK (TO-263) tape and reel mechanical data
Tape
Reel
mm
mm
Dim.
Dim.
Min.
Max.
A0
10.5
10.7
A
B0
15.7
15.9
B
1.5
D
1.5
1.6
C
12.8
D1
1.59
1.61
D
20.2
E
1.65
1.85
G
24.4
F
11.4
11.6
N
K0
4.8
5.0
T
P0
3.9
4.1
P1
11.9
12.1
P2
1.9
2.1
R
50
T
0.25
W
23.7
)
(s
0.35
t
c
u
Min.
24.3
d
o
r
P
e
t
e
l
o
s
b
O
12/15
Doc ID 13469 Rev 2
330
)
s
(
ct
13.2
u
d
o
r
P
e
100
t
e
l
o
s
b
O
Max.
26.4
30.4
Base qty
1000
Bulk qty
1000
STB230NH03L
Packaging mechanical data
Figure 22. Tape
10 pitches cumulative
tolerance on tape +/- 0.2 mm
P0
Top cover
tape
T
P2
D
E
F
W
K0
B0
A0
D1
P1
)
s
(
ct
User direction of feed
u
d
o
r
P
e
let
o
s
b
O
)
s
(
t
c
Bending radius
User direction of feed
u
d
o
Figure 23. Reel
R
AM08852v2
T
r
P
e
REEL DIMENSIONS
40mm min.
t
e
l
o
Access hole
At sl ot location
s
b
O
B
D
C
N
A
Full radius
Tape slot
in core for
tape start 25 mm min.
width
G measured at hub
AM08851v2
Doc ID 13469 Rev 2
13/15
Revision history
6
STB230NH03L
Revision history
Table 11.
Revision history
Date
Revision
Changes
08-Jun-2007
1
Initial release.
27-Sep-2011
2
– Figure 6: Static drain-source on resistance @ VGS = 4.5 V
has been added.
– Minor text change.
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
14/15
Doc ID 13469 Rev 2
STB230NH03L
)
s
(
ct
Please Read Carefully:
u
d
o
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
r
P
e
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
t
e
l
o
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
)
(s
s
b
O
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
t
c
u
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
d
o
r
P
e
t
e
l
o
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
s
b
O
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID 13469 Rev 2
15/15