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STB85NS04Z

STB85NS04Z

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOT404

  • 描述:

    MOSFET N-CH 33V 80A D2PAK

  • 数据手册
  • 价格&库存
STB85NS04Z 数据手册
STB85NS04Z STB85NS04Z-1 N-channel 11mΩ - 80A - D2PAK - I2PAK SAFeFET™ Power MOSFET General features Type VDSS RDS(on) ID STB85NS04Z Clamped < 0.015Ω 80A(1) STB85NS04Z-1 Clamped < 0.015Ω 80A(1) ) s ( t c u d o ) r s ( P t c e t Description u e d l o o r s P b Internal schematic diagram e O t e l ) o s ( s t b c u O d o ) r s P ( t Applications c e t u e l d o o r s P b OOrder codes e t e l o s b O 1. Current limited by wire bonding 3 12 ■ 100% avalanche tested ■ Low capacitance and gate charge ■ 175°C maximum junction temperature 3 1 I²PAK D²PAK This fully clamped Power MOSFET is produced by using the latest advanced Company’s Mesh Overlay™ process which is based on a novel strip layout. The inherent benefits of the new technology coupled with the extra clamping capabilities make this product particularly suitble for the harshest operation conditions such as those encountered inthe automotive environment. Any other application requiring extra ruggedness is also recommended. ■ Switching application – Automotive Part number Marking Package Packaging STB85NS04ZT4 B85NS04Z D²PAK Tape &reel STB85NS04Z-1 B85NS04Z-1 I²PAK Tube September 2006 Rev 1 1/15 www.st.com 15 Contents STB85NS04Z - STB85NS04Z-1 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 3 Electrical characteristics (curves) Test circuit ............................. 7 ................................................ 9 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2/15 STB85NS04Z - STB85NS04Z-1 1 Electrical ratings Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage (VGS=0) 33 (1) V VGS Gate-source voltage ± 18 V ID Drain current (continuous) at TC = 25°C 80 (2) A ID Drain current (continuous) at TC = 100°C 60 A ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O IDG Drain gate current (continuous) ± 50 mA IGS Gate source current (continuous) ± 50 mA Drain current (pulsed) 320 A Derating factor 1.43 W/°C Total dissipation at TC = 25°C 215 W IDM (3) PTOT VESD(G-S) Gate-source ESD (HBM-C=100pF, R=1.5kΩ) 2 kV VESD(G-D) Gate-drain ESD (HBM-C=100pF, R=1.5kΩ) 4 kV VESD(D-S) Drain-source ESD (HBM-C=100pF, R=1.5kΩ) 4 kV -55 to 175 °C Tj Tstg Operating junction temperature Storage temperature 1. Voltage is limited by zener diodes 2. Current limited by wire bonding 3. Pulse width limited by safe operating area Table 2. Thermal data Value Symbol Parameter Unit D²PAK Rthj-case Thermal resistance junction-case max Rthj-pcb (1) Thermal resistance junction-pcb max Rthj-amb Tl I²PAK 0.7 35 °C/W -- °C/W Thermal resistance junction-amb max 62.5 °C/W Maximum lead temperature for soldering purpose 300 °C 1. When mounted on 1inch² FR-4 board, 2 oz Cu 3/15 Electrical ratings Table 3. STB85NS04Z - STB85NS04Z-1 Avalanche characteristics Symbol Parameter Max value Unit IAS Avalanche current, repetitive or notrepetitive (pulse width limited by Tj max) 60 A EAS Single pulse avalanche energy (starting Tj=25°C, ID=IAS, VDD= 30V) 550 mJ ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 4/15 STB85NS04Z - STB85NS04Z-1 2 Electrical characteristics Electrical characteristics (TCASE=25°C unless otherwise specified) Table 4. Symbol V(BR)DSS On/off states Parameter Drain-source breakdown voltage Test conditions ID = 1mA, VGS= 0 Min. Typ. Max. 33 Unit V VDS = 16V, VDS = 16V, Tc=125°C 10 100 µA µA Gate body leakage current (VDS = 0) VGS = ±10V 10 µA Gate-source breakdown voltage IGS = 100µA 25 V IDSS Zero gate voltage drain current (VGS = 0) IGSS VGSS ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O RG Series gate resistance VGS(th) Gate threshold voltage VDS= VGS, ID = 1mA RDS(on) Static drain-source on resistance VGS= 10V, ID= 30A Table 5. Symbol Parameter Forward transconductance Ciss Input capacitance Output capacitance Reverse transfer capacitance Crss Qg Qgs Qgd Ω 14 2 3 4 V 11 15 mΩ Typ. Max. Unit Dynamic gfs Coss 18 Total gate charge Gate-source charge Gate-drain charge Test conditions VDS = 25V, ID= 30A VDS =25V, f=1MHz, VGS=0 VDD=16V, ID = 60A VGS =10V (see Figure 14) Min. 50 S 2500 800 150 pF pF pF 68 15 19 100 nC nC nC 5/15 Electrical characteristics Table 6. STB85NS04Z - STB85NS04Z-1 Switching times Symbol tr(Voff) tf tc Table 7. Parameter Off-voltage rise time Fall time Cross-over time ISDM VSD(1) trr Qrr IRRM 1. Parameter Test conditions ISD=60A, VGS=0 Reverse recovery time Reverse recovery charge Reverse recovery current ISD=60A,VDD=100V s ( t c u d o r P e s b O 6/15 Unit ns ns ns Min Typ. di/dt=25A/µs,Tj=150°C (see Figure 18) r P e u d o ) s ( ct Unit let e t le 80 320 A A 1.5 V t c u d o r P e o s b O - Max (s) Forward on voltage O ) t e l o Max. 85 145 90 Source-drain current Source-drain current (pulsed) o s b s b O Typ. Vclamp=30V, ID=60A RG=4.7Ω, VGS=10V (see Figure 15) Pulsed: pulse duration = 300µs, duty cycle 1.5% t e l o Min. Source drain diode Symbol ISD Test conditions 65 0.15 4.5 o r P c u d ns µC A ) s t( STB85NS04Z - STB85NS04Z-1 Electrical characteristics 2.1 Electrical characteristics (curves) Figure 1. Safe operating area Figure 2. Thermal impedance ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Figure 3. Output characteristics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance 7/15 Electrical characteristics Figure 7. STB85NS04Z - STB85NS04Z-1 Gate charge vs gate-source voltage Figure 8. Capacitance variations ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Figure 9. Normalized gate threshold voltage vs temperature Figure 11. Zero gate voltage drain current vs temperature 8/15 Figure 10. Normalized on resistance vs temperature Figure 12. Source-drain diode forward characteristics STB85NS04Z - STB85NS04Z-1 3 Test circuit Test circuit Figure 13. Switching times test circuit for resistive load Figure 14. Gate charge test circuit ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test switching and diode recovery times circuit Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform 9/15 Package mechanical data 4 STB85NS04Z - STB85NS04Z-1 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 10/15 STB85NS04Z - STB85NS04Z-1 Package mechanical data TO-262 (I2PAK) MECHANICAL DATA mm. inch DIM. MIN. TYP MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.49 0.70 0.019 0.027 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 E 10 10.40 0.393 0.410 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L2 1.27 1.40 0.050 0.055 11/15 Package mechanical data STB85NS04Z - STB85NS04Z-1 D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. inch DIM. MIN. TYP MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 10.4 0.393 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O D1 E 8 10 E1 0.315 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 R 0º 0.126 0.015 4º 3 V2 0.4 1 12/15 STB85NS04Z - STB85NS04Z-1 5 Packaging mechanical data Packaging mechanical data D2PAK FOOTPRINT ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 MAX. R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 * on sales type 13/15 Revision history 6 STB85NS04Z - STB85NS04Z-1 Revision history Table 8. Revision history Date Revision 25-Sep-2006 1 Changes First release ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 14/15 STB85NS04Z - STB85NS04Z-1 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 15/15
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