STLED325
I²C interfaced, advanced LED controller/driver with keyscan,
standby power management and real time clock (RTC)
Features
■
LED controller driver with 13 outputs
(8 segments/5 digits)
■
Standby power management to host
■
Integrated low-power, accurate RTC
■
Integrated remote control decoding:
– Philips (RC5, RCMM)
– Thomson (RCA, R2000)
– NEC and R-STEP
■
Wake-up using front panel keys, remote
control, real time clock (RTC), extra pin (AV or
CEC)
■
Battery or super-cap back up mode for real
time clock (RTC)
■
Keyscanning (8x2 matrix)
■
Low power consumption in standby mode
■
I2C serial bus interface (SCL, SDA)
■
16-step dimming circuit to control the display
brightness
■
5.0 V (± 10%) for VCC
■
Built-in thermal protection circuit
■
External crystal with internal oscillator for real
time clock (RTC)
Applications
■
Set-top boxes
■
White goods
■
Home appliances
■
DVD players, VCRs, DVD-R
Table 1.
QFN32
(5 x 5 mm)
Description
The STLED325 is a compact LED controller/
driver that interfaces microprocessors to LED
displays through serial I2C interface. It drives
LEDs connected in common anode configuration
and includes keyscanning for an 8 x 2 key matrix
which automatically scans and de-bounces a
matrix of up to 16 switches.
Furthermore, the STLED325 provides standby
power management to the host. It also integrates
a low-power, highly-accurate RTC and a remotecontrol decoder. All functions are programmable
using the I2C bus. Low power consumption during
standby mode is achieved.
The STLED325 controller/driver is ideal as a
single peripheral device to interface the front
panel display with a single-chip host IC like CPU.
Device summary
Order code
Temp range (° C)
Package
Comments
STLED325QTR
-40 to +85 °C
QFN32
250 parts per reel
April 2011
Doc ID 17576 Rev 1
1/62
www.st.com
62
Contents
STLED325
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Functional and application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1
Low power mode of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2
I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3
Initial power up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.4
Display types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5
Keyscan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.6
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Guard timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.6.2
Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.7
Power-on-reset and soft-start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.8
LED drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.9
Over temperature cut-off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.10
Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.11
2/62
3.6.1
3.10.1
Cold boot up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.10.2
Entering standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.10.3
Wake-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Real time clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.11.1
Reading the real time clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.11.2
Writing to the real time clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.11.3
Register table for RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.11.4
Setting alarm clock registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.11.5
Century bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.11.6
Initial power-on defaults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.11.7
Programmable display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.11.8
Lookup table with ppm against the calibration register values . . . . . . . . 24
3.12
Remote control decoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.13
Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.14
Ready . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.15
Mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Doc ID 17576 Rev 1
STLED325
Contents
3.16
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.17
Power sense circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.18
4
3.17.1
Switchover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.17.2
Battery low warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.17.3
Different power operation modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Bus characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.1
Absolute maximum ratings (TA = 25 °C, GND = 0 V) . . . . . . . . . . . . . . . . 33
4.2
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.2.1
DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.3
Power consumption estimation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
4.4
Oscillator and crystal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
4.5
ESD performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5
Display RAM address and display mode . . . . . . . . . . . . . . . . . . . . . . . 41
6
KEY matrix and key-input data storage RAM . . . . . . . . . . . . . . . . . . . . 42
7
Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.1
Configuration mode setting command . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.2
Data setting command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
7.3
Configuration data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
7.3.1
8
Interrupt flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
7.4
Address setting command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.5
Display control and hotkey setting command . . . . . . . . . . . . . . . . . . . . . . 51
7.6
Keyscanning and display timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8.1
Default state upon power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8.2
Initial state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
9
Remote control protocols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
10
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
10.1
Power supply sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Doc ID 17576 Rev 1
3/62
Contents
STLED325
10.2
ISET variation with RSET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
10.3
Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
11
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4/62
Doc ID 17576 Rev 1
STLED325
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Register table for RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Alarm repeat modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Century bits examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Initial power-on defaults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
RTC display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
LUT with ppm against the calibration register values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Different power operation modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Absolute maximum ratings (TA = 25 °C, GND = 0 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Voltage drop estimation with RGB LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Capacitance (TA = 25°C, f = 1 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Power supply characteristics (TA = -40 to 85°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Dynamic switching characteristics (TA = -40 to +85 °C, VCC = 5.0V ± 10%, GND=0.0V, Typical values are at 25°C). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Timing characteristics (TA = -40 to +85 °C, VCC = 5.0 V ± 10%, GND=0.0 V, typical values
are at 25 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Crystal electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
ESD performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Battery range and battery detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Power down/up AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Power down/up trip points DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Thermal shutdown characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Bit map for segment 1 to segment 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Data write command. b5 b4: 00 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Data Write 2 command. B5 b4: 01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Data Read 1 command. b5 b4: 10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Data Read 2 command. b5 b4: 11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Power-up defaults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
QFN32 (5 x 5 mm) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Doc ID 17576 Rev 1
5/62
List of figures
STLED325
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
6/62
Functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Display types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Power-up condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Power down condition (normal behavior) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Standby condition (normal behavior) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Keyscan and digit mapping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Power sense circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Battery switchover waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Power down/up mode ac waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
VCC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
KEY matrix and key-input data storage RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Data write command (b7 b6) for GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Interrupt bit mapping in Byte 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Interrupt bit mapping in Byte 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Blanking time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Keyscanning and display timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Rext versus Iseg curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
QFN32 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
QFN32 carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Doc ID 17576 Rev 1
STLED325
1
Description
Description
The STLED325 is a compact LED controller/driver that interfaces microprocessors to LED
displays through serial I2C interface. It drives LED connected in common anode configuration. The STLED325 drives up to 40 discrete LEDs in 8 segment/5 digit configuration
while functioning from a supply voltage of 5 V. The maximum segment current for the display
digits is set through a single external resistor. Individual digits may be addressed and
updated without rewriting the entire display. Additionally it includes keyscanning for an 8 x 2
key matrix which automatically scans and de-bounces a matrix of up to 16 switches.
Furthermore, it provides standby power management to the host. The STLED325 also
integrates a low-power, highly-accurate RTC and a remote-control decoder. All functions are
pro-grammable using the I2C bus. Low power consumption during standby mode is
achieved. STLED325 supports numeric-type displays and reduces the overall BOM costs
through high integration. Also it provides ESD protection of greater than 2 kV HBM.
The LED controller/driver is ideal as a single peripheral device to interface the front panel
display with a single-chip Host IC like CPU.
Doc ID 17576 Rev 1
7/62
Functional and application diagram
Functional and application diagram
Functional block diagram
ISET
Current
source
Voltage
regulator
Vcc
Output
segments
Internal
core
supply
POR &
Soft-start
Internal
reset
Bandgap
and UVLO
VCC
Detect
Command
Decoder
I2C
SPI
Serial
Seria
lI/F
I/F
SCL
SDA
Display Mem
(20
(5 x 8)
16)
ThermalCtrl
Remote
protection
Decoder &
Guard
timer
Vbat
Detect
8-bit
20- bit
output
Output
latch
Latch
Timing Gen
Key Scan &
Dimming
OSC
OSC
(Fixed
Freq)
GPIO2
VREG
SEG1/KS1
8
WAKE_UP
GPIO1
MUTE
KeyData Mem
(2
(2xx12)
8)
KEY1-KEY2
IRQ_N
Segment
d rivers
Figure 1.
SEG8/KS8
165 - bit
Shift
Shift
Register
Register
5
Digit
Grid
Drivers
d rivers
2
STLED325
DIG5
DIG4
DIG1
2
XIN
XOUT
RTC +
32KHz
Osc
IR_IN
RC
decoder
VBAT
READY
Power
management
STDBY
GND
(0V)
AM04143V1
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Doc ID 17576 Rev 1
STLED325
Functional and application diagram
Figure 2.
Application diagram
STLED325
SCL
SDA
Microcontroller or
CPU
LED 4-digit 7-segment (+dot-point) display panel
READY
4
DIG1-DIG4
STBY
IRQ_N
SEG1/KS1SEG8/KS8
MUTE
WAKE_UP
8
XIN
External
32.768KHz crystal
DIG5
XOUT
PWR
STBY
REC
MUTE
VBAT
From remote
control sensor
IR_IN
ISET
R
GPIO1
From sensor/To LED
GPIO2
From sensor/To LED
VREG
Connect to external
capacitor
KEY1-KEY2
2
Key scan
(8x2 matrix)
!-6
Doc ID 17576 Rev 1
9/62
Functional and application diagram
MUTE
IRQ_N
GPIO1
READY
STBY
XOUT
XIN
GND
VREG
VBAT
ISET
31
30
29
28
27
26
25
Pin configurations
32
Figure 3.
STLED325
1
24 SEG1/KS1
2
23 SEG2/KS2
3
22 SEG3/KS3
GPIO2 4
21 SEG4/KS4
STLED325
14
15
16
VCC
KEY2
KEY1
17 SEG8/KS8
13
WAKE_UP 8
DIG1
18 SEG7/KS7
12
7
DIG2
SCL
11
19 SEG6/KS6
DIG3
6
10
SDA
DIG4
20 SEG5/KS5
9
5
DIG5
IR_IN
!-6
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Doc ID 17576 Rev 1
STLED325
3
Functional description
Functional description
The STLED325 is a common anode LED driver controller which can be used to drive red,
green or blue LEDs as the current is adjustable through the external resistor. In the common
anode configuration, the digit outputs source the current to the anodes while the segment
outputs sink the current from the cathodes. The configurable output current can be used to
drive LEDs with different current ratings (red, green or blue). The brightness can be
controlled through the I2C interface as described later. The outputs can be connected
together in parallel to drive a single LED. In this case, two parallel current sources of equal
value drive a single LED. The external resistor value can be set accordingly to determine the
desired output current.
Soft-start limits the inrush current during power-up. The built-in thermal protection turns off
the display when the temperature exceeds 140°C with a small hysteresis of 15°C. The
display is blanked (LEDs are turned off or in high-Z state) on power-up.
3.1
Low power mode of operation
When not used, the STLED325 goes into low power mode of operation wherein the current
consumption drops to less than 1 mA. During this mode, the data configured is maintained
as long as the supply voltage is still present (the contents of the internal RAM need the
supply voltage to be present). Port configuration and output levels are restored when the
STLED325 is taken out of shutdown. For minimum supply current in shutdown mode, logic
inputs should be at GND or VCC.
3.2
I2C serial interface
The interface is used to write configuration and display data to the STLED325. The serial
interface comprises of a shift register into which SDA is clocked on the rising edge of the
SCL after a valid start of communication. When communication is stopped, transitions on
SCL do not clock in the data. During this time, the data are parallel-loaded into a latch. The
8-bit data is then decoded to determine and execute the command.
For an overflow condition, if more bytes are written, then they are ignored whereas if more
bytes are read, then the extra bytes are stuffed with 1’s.
3.3
Initial power up
On initial power-up, all control registers are reset, the display is blanked and the STLED325
is in the low-power mode. All the outputs are in high-impedance state at initial power-up.
The SDA is pulled high by an external pull-up resistor. The display driver has to be
configured before the display can be used.
Doc ID 17576 Rev 1
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Functional description
3.4
STLED325
Display types
Figure 4.
Display types
Seven segment display with dot point and common-anode LED panel
3.5
Keyscan
The full keyscan is illustrated in the later section of the datasheet. One diode is required per
key switch. The keyscan circuit detects any combination of keys being pressed during each
de-bounce cycle.
The keyscan matrix on the STLED325 passes command from the front panel to the host
processor through the SDA pin on STLED325. The STLED325 can be programmed to
wake-up the system from standby using any of the 16 keys pressed on the front panel.
These wake-up keys are also referred to as hot-keys.
3.6
Timers
3.6.1
Guard timer
For safety related applications, a guard timer is integrated in the STLED325. The guard
timer gives enhanced reliability to the device.
The guard timer can be used to detect an out of-control microprocessor. The user programs
the guard timer by setting the desired amount of time-out into the Guard timer. This guard
time has an initial de-fault value of 10s upon first power-up and subsequently can be
configured from 1s to 15s during normal operation. If a time period of longer than 15s is
desired, then the watchdog timer from RTC can be used. It can also be disabled after first
power-up. If the processor does not clear the timer within the specified period, the
STLED325 puts the system in the standby mode.
This is only active from L to H transition on READY or WAKE_UP pin but it is not levelbased. The guard timer count is cleared by the guard timer clear/reset bit. While in normal
mode, the count starts from the previously count value that was in the register. During the
cold boot up or warm boot up, the count starts from the configured value.
12/62
Doc ID 17576 Rev 1
STLED325
3.6.2
Functional description
Watchdog timer
Another watchdog timer is present in the Watchdog timer register at address 09h of the RTC
register map. This watchdog timer can be used to program timer values of greater than 15s.
Bits BMB4-BMB0 store a binary multiplier and the three bits RB2-RB0 select the resolution
where:
000 = 1/16 second (16 Hz);
001 = 1/4 second (4 Hz);
010 = 1 second (1 Hz);
011 = 4 seconds (1/4 Hz); and
100 = 1 minute (1/60 Hz).
The Watchdog timer is programmed by setting the desired timeout into the Watchdog
register, address 09h. The amount of timeout time is determined to be the multiplication of
the 5-bit multiplier value with the resolution values depicted by the watchdog resolution bits.
The Watchdog timer is disabled when its register is cleared by writing a value of 00h.
Hence the Watchdog function is not enabled upon power on. It is enabled when a non-zero
value is written into its register. The Watchdog timer is reset by performing a write to the
watchdog register, then the time-out period starts over.
If the processor does not reset the timer within the specified timeout period, and when the
timeout occurs, the watchdog flag is set. The watchdog timer of RTC is cleared by writing a
00 value and starts again whenever any new value is written to it.
The WatchDogEn Flag can be disabled or enabled by writing to the register bit and the reset
of watchdog timer is done by writing to the register.
3.7
Power-on-reset and soft-start
The device integrates two internal power-on-reset circuits which initialize the digital logic
upon power up. One circuit is for the VCC power and the other is for the VBAT power. The
soft-start circuit limits the inrush current and high peak current during power-up. This is done
by delaying the input circuit’s response to the external applied voltage. During soft-start, the
input resistance is higher which lowers the in-rush current when the supply voltage is
applied.
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Functional description
3.8
STLED325
LED drivers
The constant current capability is up to 40 mA per output segment and is set for all the
outputs using a single external resistor. When acting as digit drivers, the outputs source
current to the display anodes. When acting as segment drivers, the LED outputs sink current
from the display common cathodes. The outputs are high impedance when not being used
as digit or segment drivers.
Each port configured as a LED segment driver behaves as a digitally-controlled constant
current sink. The LED drivers are suitable for both discrete LEDs and common anode (CA)
numeric LED digits. When fully configured as a LED driver, the STLED325 controls up to 8
LED segments in a single digit with individual 8-step adjustment of the constant current
through each LED segment. A single resistor sets the maximum segment current for all the
segments, with a maximum of 40 mA per segment. The STLED325 drives any combination
of discrete LEDs and common anode (CA) digits for numeric displays.
The recommended value of RSET is the minimum allowed value, since it sets the display
driver to the maximum allowed segment current. RSET can be a higher value to set the
segment current to a lower maximum value where desired. The user must also ensure that
the maximum current specifications of the LEDs connected to the drivers are not exceeded.
3.9
Over temperature cut-off
The STLED325 contains an internal temperature sensor that turns off all outputs when the
die temperature exceeds 140°C. The outputs are enabled again when the die temperature
drops below 125°C. Register contents are not affected, so when a driver is over-dissipating,
the external symptom will be the load LEDs cycling between on and off as the driver
repeatedly overheats and cools, alternately turning the LEDs off and then back on again.
This feature will protect the device from damage due to excessive power dissipation. It is
important to have good thermal conduction with a proper lay-out to reduce thermal
resistance.
3.10
Standby mode
By utilizing the standby function, the host processor and other ICs can be turned off to
reduce power consumption. The STLED325 is able to wake-up the system when
programmed hotkeys are detected to signal that the full operation of the system is required.
The hotkeys can be entered to the system through the front panel keys or through the
infrared (IR) remote control or the Real Time Clock (RTC) alarm or through the wake-up pin.
STLED325 supports multiple remote control protocols decoding by setting the appropriate
register.
The STLED325 is able to cut-off the power to the main board for standby operation for good
power management. STBY will be set to high when READY signal goes from high to low, I2C
command for standby is seen or when the guard timer has finished counting down to 0,
whichever occurs first.
In the normal mode of operation, the STBY is asserted only when the guard timer has
finished counting down to 0. This is meant to put the system into stand-by even though
standby command was not issued by the host or READY signal did not go low. This occurs
as the guard timer register was not cleared before it finished counting down to 0.
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Doc ID 17576 Rev 1
STLED325
3.10.1
Functional description
Cold boot up
When power is first applied to the system, the STLED325 is reset. It will then manage the
power to the main board by bringing the STBY pin to a low level.
This wakes up the main processor which asserts the READY pin to a high level to indicate to
STLED325 of a proper boot-up sequence.
If the microprocessor does not assert the READY pin to a high within 10s (default), the
STLED325 cuts off the power to the Host by asserting the STBY pin. The high level on
READY pin signifies that the processor is ready. After this, the processor can configure the
STLED325 by sending the various I2C commands for configuration of display, RC protocol,
RTC display mapping, hot-keys.
The power-up behavior in 2 conditions is shown in Figure 5.
Doc ID 17576 Rev 1
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Functional description
Figure 5.
STLED325
Power-up condition
1a) Power-up condition (normal behavior )
VCC to STLED325I
Internal POR
Guard timer counts up to 10s
STBY
READY
MUTE
READY asserts within 10s which is the desired
behavior, processor is active and not hung
1b) Power-up condition (processor not responding )
VCC to STLED325I
Count over
Internal POR
Guard timer counts up to 10s
STBY
READY continues to remain low/high
READY
MUTE
Due to abnormality in the processor, READY did not
change state from low to high, leading to STBY
assertion
!-6
Note:
16/62
1
Guard timer is turned off by default upon READY assertion.
2
If Guard timer is to be kept on during READY high condition, the guard timer registers must
be set accordingly by proper commands through I2C bus.
3
In this power-up condition, Guard timer is triggered by internal POR pulse.
4
During power-up, the Guard timer value is 10s.
Doc ID 17576 Rev 1
STLED325
3.10.2
Functional description
Entering standby mode
The STLED325 controls the power to the main board using the STBY pin. During normal
operation, the STBY pin is a low level which externally controls a Power MOS switch to
enable power to the main board. The STLED325 asserts the STBY pin to a high when any
one of the following conditions occur:
– Processor fails to respond by enabling the READY pin within 10s upon first power-up
(cold boot up)
– Guard timer counts down to 0s
– Processor makes the READY pin to low (can happen in various conditions such as
user presses STBY key on front panel, STBY key on remote control, etc).
Figure 6.
Power down condition (normal behavior)
2a) Power-down condition (normal behavior )
READY
MUTE
STBY
2 us
Guard timer is not required here
2b) Power-down condition (abnormal behavior of processor )
READY
READY continues to remain high
MUTE
STBY
In this case the READY remains high and as long as
READY is high, the MUTE is low and STBY is low.
!-6
– Guard timer can be kept on during normal condition when READY is high (depending
on the user).
– In this condition, the guard timer can be disabled or enabled. If the guard timer is
enabled, the timer needs to be cleared before the programmed count of the timer is
reached. If the programmed count is reached, the STBY will be asserted.
– It is advisable not to enable the guard timer during normal operation.
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Functional description
3.10.3
STLED325
Wake-up
The STLED325 can wake-up from any one of the following sources:
– Front-panel keys
– Remote-control keys
– Real time clock (RTC) in 3 conditions (alarm, watchdog timer, oscillator fail)
– External wake-up pin (by a low to high transition on this pin)
– GPIO status changes
– READY pin goes from low to high
Figure 7.
Standby condition (normal behavior)
3a) Standby condition (normal behavior )
Hot key command from IR
or Key pad or RTC or WAKE_UP for wake up
Guard timer triggers
STBY
READY
MUTE
READY asserts within programmed timer value (1s-15s)
3b) Standby condition (abnormal behavior , processor is not responding)
Hot key command from IR
or Key pad or RTC or WAKE_UP for wake up
Guard timer
triggers
Signals STBY after
guard timer count is over
STBY
READY
READY continues to remain low
MUTE
!-6
– When the hot-key is detected either from front-panel or remote control or RTC or from
a transition (low to high transition) on WAKE_UP pin during stand-by, the STBY pin
de-asserts.
– The de-assertion of the STBY triggers the guard timer.
– The timer value is the programmed value by the user (1-15s). If the user did not
change the value before entering standby, then it remains 10s.
– Also note that the guard timer is off when the STLED325 is in the standby mode.
The guard timer is thus triggered by a de-assertion of the STBY signal or by internal power
on reset signal.
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Doc ID 17576 Rev 1
STLED325
3.11
Functional description
Real time clock (RTC)
The STLED325 integrates a low power Serial RTC with a built-in 32.768 kHz oscillator
(external crystal controlled). Eight bytes of the SRAM are used for the clock/calendar
function and are configured in binary coded decimal (BCD) format. An additional 12 bytes of
SRAM provide status/ control of alarm and watchdog functions. Addresses and data are
transferred serially via a two line, bi-directional I2C interface. The built-in address register is
incremented automatically after each WRITE or READ data byte. Note that all 4 digits must
be enabled before using the RTC display.
Functions available to the user include a non-volatile, time-of-day clock/calendar, alarm
interrupts and watchdog timer. The eight clock address locations contain the century, year,
month, date, day, hour, minute, second and tenths/hundredths of a second in 24 hour BCD
format. Corrections for 28, 29 (leap year - valid until year 2100), 30 and 31 day months are
made automatically.
The RTC operates as a slave device through the slave address of the STLED325 on the
serial bus. Access is obtained by implementing a start condition followed by the correct
device slave address. The 16 bytes contained in the device can then be accessed
sequentially in the following order:
– 1. Reserved
– 2. Seconds register
– 3. Minutes register
– 4. Hours register
– 5. Day register
– 6. Date register
– 7. Century/month register
– 8. Year register
– 9. Calibration register
– 10. Watchdog register
– 11 - 16. Alarm registers
The RTC keeps track of the date and time. Once the date and time are set, the clock works
when the STLED325 is in normal operation and standby operation. Wake-up alarm feature
is also included in the RTC module. The accuracy of the RTC is approximately 20 ppm
(±50secs/month). How-ever this much depends on the accuracy of the external crystal
used.
The wake-up alarm is programmed to wake up once the date and time set are met. This
feature is present in normal and standby mode of operation. Only one date and time is
available for setting.
The real time clock (RTC) uses an external 32.768 kHz quartz crystal to maintain an
accurate internal representation of the second, minute, hour, day, date, month, and year.
The RTC has leap-year correction. The clock also corrects for months having fewer than 31
days.
3.11.1
Reading the real time clock
The RTC is read by initiating a Read command and specifying the address corresponding to
the register of the real time clock. The RTC registers can then be read in a sequential read
mode. Alarms occurring during a read are unaffected by the read operation.
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Functional description
3.11.2
STLED325
Writing to the real time clock
The time and date may be set by writing to the RTC registers. The new RTC time can be
updated by writing to the RTC registers. The new time only takes affect after a complete
write cycle. If the write cycle is incomplete, the new time value is discarded. A single byte
may be written to the RTC without affecting the other bytes.
3.11.3
Register table for RTC
Table 2.
Register table for RTC
Addr
D7
00h
D6
D5
D4
D3
D2
Reserved
D1
D0
Functional/range BCD format
Reserved
01h
OSC_S
T
10 seconds
Seconds
Seconds
00-59
02h
Rsvd
10 minutes
Minutes
Minutes
00-59
03h
MD_HM_MS
Hours (24 hours format)
Hours
00-23
04h
Rsvd
Rsvd
Day
01-7
05h
Rsvd
Rsvd
Day of month
Date
01-31
06h
CB1
CB0
Month
Century/month
0-3/01-12
Year
Year
00-99
07h
10 hours
Rsvd
Rsvd
Rsvd
Day of week
10 date
Rsvd
10M
10 years
08h
12/24
Rsvd
Cal_sig
n
09h
RB2
BMB4
BMB3
BMB2
0Ah
AFE
Rsvd
ABE
AI 10M
0Bh
RPT4
RPT5
0Ch
RPT3
RPT6
0Dh
RPT2
0Eh
0Fh
Calibration
BMB1
BMB0
Calibration
RB1
Watchdog
Alarm month
Al month
01-12
AI 10 date
Alarm date
Al date
01-31
AI 10 hour
AIarm hour
AI hour
00-23
Alarm 10 minutes
Alarm minutes
Al min
00-59
RPT1
Alarm 10 seconds
Alarm seconds
Al sec
00-59
WDFEn
Alarm: day of week
Rsvd (bypass mode)
Flags
Legend:
Cal_Sign = Sign bit
OSC_ST = Oscillator Stop bit
BMB0 – BMB4 = watchdog multiplier bits
CB = Century bits
ABE = Alarm in battery back up mode enable bit
AFE = Alarm flag enable
RB0 – RB2 = watchdog resolution bits
RPT1 – RPT6 = alarm repeat mode bits
20/62
RB0
Doc ID 17576 Rev 1
STLED325
Functional description
WDFEn = watchdog flag enable
12/24 = 12 hour or 24 hour format (‘0’ for 24-hour format and ‘1’ for 12-hour format). For 12
hour PM display, the 8th segment of last digit (digit 4) is driven to indicate PM mode through
a dot on the last digit.
It is recommended to fill the unused bits in the register map to 0 upon a cold boot up. The
timekeepers and alarm store data in BCD format, while the calibration, watchdog bits are in
binary format.
The structure of the frame is shown below. For RTC, all the Dig1 to Dig4 must be configured
to show the proper time.
Figure 8.
Keyscan and digit mapping
Keyscan
Digit 5
(used for
discrete LED)
Dig 1
Dig 2
Dig 3
Dig 4
AM08722V1
If the date programmed in the RTC exceeds a valid date value, then the RTC does not
function as desired. So the invalid dates should never be programmed into the RTC.
3.11.4
Setting alarm clock registers
Address locations 0Ah-0Eh contain the alarm settings. The alarm can be configured to go
off at a prescribed time on a specific month, date, hour, minute, or second or repeat every
year, month, day, hour, minute, or second. It can also be programmed to go off while the
STLED325 is in the standby mode to serve as a system wake-up call.
Bits RPT6-RPT1 put the alarm in the repeat mode of operation. Codes not listed in the table
default to the once per second mode to quickly alert the user of an incorrect alarm setting.
Note that by default, the alarm repeat mode is enabled and by default the repeat frequency
is set to “once per year”.
Address locations 0Ah to 0Eh contain the alarm settings. The alarm can be configured to go
off at a prescribed time. The default repeat alarm mode is once per year. Programming the
RPT[6:1] bits changes the repeat alarm mode.
Doc ID 17576 Rev 1
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Functional description
Table 3.
STLED325
Alarm repeat modes
RPT5
RPT4
RPT3
RPT2
RPT1
RPT6
Repeat alarm mode
1
1
1
1
1
1
Once per week
1
1
1
1
1
0
Once per second
1
1
1
1
0
0
Once per minute
1
1
1
0
0
0
Once per hour
1
1
0
0
0
0
Once per day
1
0
0
0
0
0
Once per month
0
0
0
0
0
0
Once per year
If the RPT value is other than the valid ones listed in the table, the default repeat alarm
mode is once per second so as to quickly alert the user of an incorrect alarm setting.
When the clock information matches the alarm clock settings based on the match criteria
defined by RPT[6:1], then the alarm flag is set. Then if the alarm flag enable bit, is also set,
this will activate the alarm interrupt. Interrupt is cleared by reading the Interrupt registers.
3.11.5
Century bits
The clock shall include correction for leap years. The clock shall also correct for months
fewer than 31 days. Corrections for 28, 29 (leap year –valid until year 2100), 30, 31 day
months must be made automatically.
The two Century bits increment in a binary fashion at the turn of the century, and handles all
leap years correctly. See table for additional explanation.
Table 4.
Century bits examples
CB[0]
CB[1]
Leap year?
Example (1)
0
0
Yes
2000
0
1
No
2100
1
0
No
2200
1
1
No
2300
1. Leap year occurs every 4 years (for years evenly divisible by 4), except for years evenly divisible by 100.
The only exceptions are those years evenly divisible by 400. (The year 2000 was a leap year, year 2100 is
not.)
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Doc ID 17576 Rev 1
STLED325
3.11.6
Functional description
Initial power-on defaults
Upon application of power to the device, the register bits in the RTC initially power-on in the
state indicated in table below.
Table 5.
Initial power-on defaults
OSC_ST
AFE
WDFEn
0
0
0
Initial power-on defaults value of the RTC registers.
Note:
All other control bits power-up in a default state of 0 unless otherwise specified.
Doc ID 17576 Rev 1
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Functional description
3.11.7
STLED325
Programmable display
The default display of the RTC time is the 2 MSB digit for hour and the 2 LSB digit for
minutes. However, if the MD_HM_MS bit is set, then the RTC display for the digits can be
changed according to Table 6.
Table 6.
3.11.8
RTC display
MD_HM_MS
RTC display
10
Date-month
00
Hour-minute (default and recommended)
01
Minute-second
11
Month-date
Lookup table with ppm against the calibration register values
The lookup table of the calibration register values for the equivalent ppm is shown in Table 7
below:
Table 7.
LUT with ppm against the calibration register values
Sign bit
24/62
Counts/bit
PPM
0
0
0
0
0
0
0
0
0
0
0
0
1
2
0
0
0
0
1
0
4
0
0
0
0
1
1
6
0
0
0
1
0
0
8
0
0
0
1
0
1
10
0
0
0
1
1
0
12
0
0
0
1
1
1
14
0
0
1
0
0
0
16
0
0
1
0
0
1
18
0
0
1
0
1
0
20
0
0
1
0
1
1
22
0
0
1
1
0
0
24
0
0
1
1
0
1
26
0
0
1
1
1
0
28
0
0
1
1
1
1
31
0
1
0
0
0
0
33
0
1
0
0
0
1
35
0
1
0
0
1
0
37
0
1
0
0
1
1
39
0
1
0
0
0
0
41
0
1
0
0
0
1
43
0
1
0
0
1
0
45
0
1
0
0
1
1
47
Doc ID 17576 Rev 1
STLED325
Functional description
Table 7.
LUT with ppm against the calibration register values (continued)
Sign bit
Counts/bit
PPM
0
1
1
1
0
0
49
0
1
1
1
0
1
51
0
1
1
1
1
0
53
0
1
1
1
1
1
55
0
1
1
1
0
0
57
0
1
1
1
0
1
59
0
1
1
1
1
0
61
0
1
1
1
1
1
63
1
0
0
0
0
0
0
1
0
0
0
0
1
-4
1
0
0
0
1
0
-8
1
0
0
0
1
1
-12
1
0
0
1
0
0
-16
1
0
0
1
0
1
-20
1
0
0
1
1
0
-24
1
0
0
1
1
1
-28
1
0
1
0
0
0
-33
1
0
1
0
0
1
-37
1
0
1
0
1
0
-41
1
0
1
0
1
1
-45
1
0
1
1
0
0
-49
1
0
1
1
0
1
-53
1
0
1
1
1
0
-57
1
0
1
1
1
1
-61
1
1
0
0
0
0
-65
1
1
0
0
0
1
-69
1
1
0
0
1
0
-73
1
1
0
0
1
1
-77
1
1
0
0
0
0
-81
1
1
0
0
0
1
-85
1
1
0
0
1
0
-90
1
1
0
0
1
1
-94
1
1
1
1
0
0
-98
1
1
1
1
0
1
-102
1
1
1
1
1
0
-106
1
1
1
1
1
1
-110
1
1
1
1
0
0
-114
1
1
1
1
0
1
-118
1
1
1
1
1
0
-122
1
1
1
1
1
1
-126
Doc ID 17576 Rev 1
25/62
Functional description
3.12
STLED325
Remote control decoder
The remote control (RC) decoder module decodes the signal coming from IR_IN pin. The IR
remote control protocols recognized by STLED325 are Philips-RC-5, RCMM, Thomson
RCA, R2000, NEC and R-STEP protocols. The selection of remote control protocol to use is
done by setting the RC protocols register. The command from the remote control is used to
wake-up from standby and resume normal operation. All RC keys can be programmed to act
like RC hotkeys. Upon receiving any one of the designated hotkeys, wake-up operation
begins.
The address of the appliance (8-bit) is stored first into the internal RAM. Then, the command
for the hotkeys is programmed into the internal RAM. Each hotkey memory address could
accommodate one byte (8-bit). Usually one byte is reserved for one command. The hot-keys
can be configured to wake-up the system by more than one RC device address (up to a
maximum of 8 device addresses).
3.13
Interrupt
The STLED325 interrupts the Host by pulling the IRQ_N pin to a low-level both in normal
mode of operation and during wake-up. The interrupt is enabled by STLED325 when any of
the conditions occur:
– Front panel key press in normal operation or during system standby state
– Remote control key press in normal operation or during system standby state
(including the toggle bit changes for all RC protocols)
– A low-to-high on the external pin, WAKE_UP
– Real time clock triggers (alarm, watchdog timer, 32 kHz oscillator fails)
– GPIO input changes
– Low battery indication
– Thermal shutdown
The IRQ_N is an active low level signal and is cleared only after the Interrupt buffer is read.
After reading the interrupt buffer, the Host will know the actual source of the interrupt. This
allows the Host to exactly know the event which caused the interrupt (e.g STBY key on the
Front Panel). The interrupt signal is used to inform the Host of any events detected by the
STLED325. Note that the IRQ_N pin is an open-drain pin which requires an external pull-up
resistor.
Figure 9.
Interrupt
The interrupt output is of active low level type.
26/62
Doc ID 17576 Rev 1
STLED325
Functional description
While the interrupt is being read by the MCU and a new GPIO or key data comes in, no new
interrupt is generated but the register for GPIO and KEY data is updated so that the MCU
does not miss the new KEY and GPIO data.
3.14
Ready
The STLED325 supports cutting-off power to the main board for standby operation for good
power management. STBY will be set to high when the READY transitions from high to low.
During a cold boot up or wake up from standby, if the READY pin stays low, the STLED325
will assert the STBY when the guard timer has finished counting down to 0.
When the READY drops to a low, MUTE goes high immediately and soon after (2µs
minimum) the STBY is asserted.
In the normal mode of operation, when READY is a high, the STBY is asserted only when
the guard timer is enabled and has finished counting down to 0. This is meant to put the
system into stand-by as the READY pin was stuck at high and the guard timer register was
not cleared before it finished counting down to 0. It is advised to disable the guard timer
during normal operation.
3.15
Mute
The MUTE pin will be set to logic high to mute the audio output before power is cut to the
host processor. In wake up mode, the MUTE pin will be set to logic low to enable the audio
output immediately after the high assertion of the READY pin. In general, MUTE follows
READY pin with an inverted polarity. This pin is used to prevent pop-up sound during powerup and power-down states.
3.16
GPIO
The STLED325 supports 2 additional GPIOs that can be configured as inputs or outputs. As
an input, the GPIO can be used to interface to a sensor or a switch or key and as an output,
the GPIO can be used to drive individual indicator LEDs.
3.17
Power sense circuits
The STLED325 has a built-in power sense circuit which detects power failures and
automatically switches to the battery or super-cap supply when a power failure occurs. The
energy needed to sustain the SRAM and clock operations can be supplied by small lithium
button supply or a super-cap when a power failure occurs. When operating from the battery
or super-cap, all the inputs and outputs are driven to a known state (generally L).
Doc ID 17576 Rev 1
27/62
Functional description
STLED325
Figure 10. Power sense circuit
For the STLED325 itself, there is the normal operational mode where the supply is from the
5 V VCC. When the VCC drops below a pre-defined low level, the supply source is switched
from the VCC to the battery or super-cap supply.
To conserve power and maintain long battery life in this battery supply mode, only the RTC
and the clock to the RTC remain operational.
1.
The system will only go into battery mode while:
Vcc < 3.5 V and Vcc < Vbat.
So, it means that the system will only switch to battery mode when Vcc drop below 3.5V and
Battery voltage is higher VCC voltage.
2.
The system will enter back into Vcc mode from battery mode while:
VCC > Vbat
It means that the system will switch back to Vcc mode as soon as the VCC is higher than
Vbat.
The STLED325 continually monitors Vcc for an out-of-tolerance condition. Should VCC fall
below the Switchover voltage (VSO = 3.5 V), the device goes into a low-power mode. Inputs
to the device will not be recognized at this time to prevent any erroneous data or outcome
from device. The device also automatically switches over to the battery and powers down
into an ultra low current mode of operation to maximize the super-cap or battery duration. As
system power returns and VCC rises above Vbat, the battery or super-cap is disconnected
and the power supply is switched to the external VCC. During the battery or super-cap backup mode, the clock registers of RTC are maintained by the attached battery or super-cap.
On power-up, when VCC returns to a nominal value, write protection continues for tREC (refer
to timing diagram in later part of spec).
Upon power-up, the device switches from battery to VCC when VCC > Vbat. When VCC rises
above Vbat, it will recognize the inputs.
28/62
Doc ID 17576 Rev 1
STLED325
Functional description
Figure 11. Circuit
The minimum operating voltage of STLED325 is 2.5 V with a typical VBAT voltage of VCCVF (diode). Therefore, the typical delta voltage swing across the capacitor is
ΔV = VCC – VF – VCCmin
where VF is approximately 0.5 V. Therefore,
ΔV = 5 – 0.5 – 2.5 = 2 V
Since the typical battery current (IBAT) is limited to 7 µA, the capacitance and duration of
power-out time can be calculated using the formula:
I = CΔV/Δt
Where I = 7µA, ΔV=2V, C= capacitance in Farads and Δt is power-out time in seconds.
Using a 0.1F super-cap, for example, the equation would be:
7µA = 0.1F x 2V/Δt
Solving for Δt, the typical power-down time is about 28,571 seconds = 8 hours.
3.17.1
Switchover
During the period the VCC falls, in order for the battery switchover circuit to work reliably, the
fall time of VCC from 5V to 0V should be at least 100µs. This is to allow the comparator to
trigger and switch from VCC to VBAT mode should there be a need. During the VCC rise
period from 0V to 5V, the rise time of VCC is not critical. This is indicated by the Figure 12.
Figure 12. Battery switchover waveform
Also note that for battery operation, there will be a current spike of 5mA in 10us into the
battery when VCC to VBAT switchover happens. From VBAT to VCC switching, the current
Doc ID 17576 Rev 1
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Functional description
STLED325
spike is very low into the battery. The battery must be protected against such spikes. This is
not relevant for super-cap.
During the switching from VBAT to VCC, the I2C is active after a minimum of 5ms.
3.17.2
Battery low warning
The STLED325 automatically performs battery voltage monitoring upon power-up. If the
interrupt for this condition (ABE) is enabled, the RTC will generate an interrupt pulse if the
battery voltage is found to be less than a minimum of 2.5V. However, this condition is
unlikely to go away very quickly as time is needed for the battery to be replaced, and it is not
desirable to keep issuing an interrupt.
Therefore when this bit is set, this condition is checked once every week. If the condition is
still true, then interrupt is sent again.
The ABE bit is an enable bit for battery status check. If the ABE bit was set and the battery
low is generated during a power up sequence, this indicates that the battery is below
approximately 2.5 V and may not be able to maintain data integrity. At this point, a fresh
battery needs to be installed or the super-cap recharged.
This situation only occurs when a battery is used but not with a super-cap as the super-cap
re-charges when the supply is present.
3.17.3
Different power operation modes
The device is capable to support the different power modes as shown in the Table 8.
Table 8.
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Different power operation modes
VCC
VBAT
Condition
Operation
Present
Present
VCC > VBAT
Normal operation of
chip from VCC
Present
Absent (Float or 0V)
VCC > VBAT and
VCC > 3.5V
Normal operation of
chip from VCC until VCC
is 3.5V
Absent (Float or 0V)
Present
VBAT > 2.5V
Chip operations from
VBAT in a low power
mode of operation
VCC < 3.5V
VBAT > VCC
Absent (Float or 0V)
Absent (Float or 0V)
Doc ID 17576 Rev 1
Chip operations from
VBAT in a low power
mode of operation
VCC < 3.5V and
VBAT < 2.5V
Chip does not function.
Completely shutdown.
STLED325
3.18
Functional description
Bus characteristics
The bus is intended for communication between different ICs. It consists of two lines: a bidirectional data signal (SDA) and a clock signal (SCL). Both the SDA and SCL lines must be
connected to a positive supply voltage (typical voltage is 3.3 V) via a pull-up resistor (typical
value is 10 K). The following protocol has been defined.
- Data transfer may be initiated only when the bus is not busy.
- During data transfer, the data line must remain stable whenever the clock line is High.
- Changes in the data line, while the clock line is High, will be interpreted as control
signals.
Accordingly, the following bus conditions have been defined:
Bus not busy: Both data and clock lines remain High.
Start data transfer: A change in the state of the data line, from high to Low, while the clock
is High, defines the START condition.
Stop data transfer: A change in the state of the data line, from Low to High, while the clock
is High, defines the STOP condition.
Data valid: The state of the data line represents valid data when after a start condition, the
data line is stable for the duration of the high period of the clock signal. The data on the line
may be changed during the Low period of the clock signal. There is one clock pulse per bit
of data.
Each data transfer is initiated with a start condition and terminated with a stop condition.
The number of data bytes transferred between the start and stop conditions is not limited.
The information is transmitted byte-wide and each receiver acknowledges with a ninth bit.
By definition a device that gives out a message is called “transmitter,” the receiving device
that gets the message is called “receiver.” The device that controls the message is called
“master.” The devices that are controlled by the master are called “slaves.”
Acknowledge: Each byte of eight bits is followed by one Acknowledge Bit. This
Acknowledge Bit is a low level put on the bus by the receiver whereas the master generates
an extra acknowledge related clock pulse. A slave receiver which is addressed is obliged to
generate an acknowledge after the reception of each byte that has been clocked out of the
master transmitter.
The device that acknowledges has to pull down the SDA line during the acknowledge clock
pulse in such a way that the SDA line is a stable Low during the High period of the
acknowledge related clock pulse. Of course, setup and hold times must be taken into
account. A master receiver must signal an end of data to the slave transmitter by not
generating an acknowledge on the last byte that has been clocked out of the slave. In this
case the transmitter must leave the data line High to enable the master to generate the
STOP condition.
Note:
Refer to Philips I2C specification or contact STMicroelectronics for more information on I2C.
Doc ID 17576 Rev 1
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Functional description
Table 9.
Pin description
Pin number
Symbol
Type
Name and function
1
MUTE
OUT
Output from the STLED325 to gracefully mute the audio
before entering standby mode
2
IRQ_N
OUT
Interrupt output (active low level type) to interrupt the
MCU under various conditions
3
GPIO0
IN/OUT
GPIO0 that can be configured as an input or output
4
GPIO1
IN/OUT
GPIO1 that can be configured as an input or output
5
IR_IN
IN
6
SDA
IN/OUT
7
SCL
IN
8
WAKE_UP
Input
Wake-up pin (can be used for wake-up on detecting a low
to high transition). AV wake-up or CEC wake-up.
9
DIG5
OUT
Digit output pin. Can be used in conjunction with 8
segment outputs to control 8 discrete LEDs on the front
panel.
10 - 13
DIG4 –DIG1
OUT
Digit output pins
14
VCC
PWR
5.0 V ± 10% main supply voltage. Bypass to GND
through a 0.1 µF capacitor as close to the pin as
possible.
15, 16
KEY2-KEY1
IN
17 - 24
SEG8/KS8
to
SEG1/KS1
OUT
25
ISET
IN
26
VBAT
Input
27
VREG
Output
28
GND
PWR
29
XIN
IN
30
XOUT
OUT
Output of the external crystal. Open when external clock
31
STBY
OUT
Hardware pin to control the power to the Host
32
READY
IN
EPAD
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STLED325
Remote control data input
I2C compatible serial data I/O
I2C compatible serial clock input
Input data to these pins from external keyboard are
latched at end of the display cycle (maximum keyboard
size is 8 x 2). 5V digital input.
Segment output pins (dual function as key source)
Current sense input. Connect resistor to ground to set
constant current through LEDs. Connect to GND through
a resistor to set the peak segment current.
Battery power supply for the RTC when there is no
supply to the chip
1.8V regulator output. Connect to an external capacitor.
Connect this pin to system GND
Connect to an external crystal or apply external clock
Input to the device from the Host to indicate that Host is
ready
Exposed pad. Connect to PCB GND.
Doc ID 17576 Rev 1
STLED325
Electrical ratings
4
Electrical ratings
4.1
Absolute maximum ratings (TA = 25 °C, GND = 0 V)
Absolute maximum ratings are those values above which damage to the device may occur.
Functional operation under these conditions is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability. All voltages are
referenced to GND.
Table 10.
Symb
ol
Absolute maximum ratings (TA = 25 °C, GND = 0 V)
Value
Uni
t
Supply voltage to ground
-0.5 to +7.0
V
VI
Logic input voltage (KEY1, KEY2 inputs)
-0.5 to +7.0
V
VI
Logic input voltage (all input pins except KEY1, KEY2)
-0.5 to +3.6
V
PD
Power dissipation1
1200
mW
TA
Operating ambient temperature
-40 to 85
°C
TJ
Junction temperature
150
°C
TSTG
Storage temperature
-65 to +150
°C
300
°C
-2 to +2
kV
VCC
Parameter
Lead temperature (10 sec)
TL
VESD
Electrostatic discharge voltage on all
pins2
Table 11.
Human body model
Thermal data
Symbol
Parameter
QFN 32
Unit
RTj-c
Thermal resistance junction-case
TBD
°C/W
Doc ID 17576 Rev 1
33/62
Electrical ratings
STLED325
4.2
Recommended operating conditions
4.2.1
DC electrical characteristics
(TA = -40 to +85 °C, VCC = 5.0 V ± 10%, GND = 0 V)
Table 12.
DC electrical characteristics
Symbol
Parameter
Min
Typ
Max
Uni
t
VCC
External supply voltage
4.5
5.0
5.5
V
VREG
Internal logic supply voltage and
regulator output
1.62
1.8
1.98
V
VIH
HIGH level input voltage (all digital
pins except KEY1 and KEY2)
High level
guaranteed
1.35
1.98
V
VIL
LOW level input voltage (all digital
pins except KEY1 and KEY2)
Low level
guaranteed
0
0.45
V
VIH
HIGH level input voltage (KEY1 and
KEY2 pins)
High level
guaranteed
3
5.5
V
VIL
LOW level input voltage (KEY1 and
KEY2 pins)
Low level
guaranteed
0
2
V
VIN = VIH or VIL
-2
2
µA
IIH, IIL
Input current (all pins)
VHYS
Hysteresis voltage (digital pins)
VOL
Low level output voltage (Digital
output pins)
IOLEAK
0.2
Driver leakage current
V
IOL2 = 4 mA
0.4
V
Drivers off
-150
µA
ISEG
Segment drive LED sink current
VLED = VF = 2.5 V
VDIGIT = VCC – 1.0
-30
-40
-50
mA
IDIG
Digit drive LED source current
VDIGIT = VCC – 1.0
240
320
400
mA
±4.0
%
ITOLSEG
RSET
34/62
Test conditions
Segment drive current matching
VCC=5.0 V,
TA=25°C
VLED=2.5V; LED
current = 40 mA
External current setting reference
resistor (precision = ±1% tolerance)
Doc ID 17576 Rev 1
ISEG = 40 mA
360
Ω
STLED325
4.3
Electrical ratings
Power consumption estimation
Each port of the STLED325 can sink a maximum current of 40 mA into an LED with a 3.4 V
forward voltage drop when operated from a supply voltage of 5.0 V. The minimum voltage
drop across the internal LED drivers is thus 5.0 - 3.4 = 1.6 V. The STLED325 can sink
8 x 40 = 320 mA when all outputs are operating as LED segment drivers at full current. On a
5.0 V supply, a STLED325 dissipates (5.0 V-3.4 V) x 320 mA = 512 mW when driving 8 of
these 3.4 V forward voltage drop LEDs at full current. If the application requires high drive
current, consider adding a series resistor to each LED to drop excessive drive voltage offchip.
If the forward voltage of the LED is lesser than 4.4 V (say 2.4 V), then the maximum power
dissipation of STLED325 when all segments are turned on will be (5 - 2.4) V x 320 mA =
832 mW. To lower the power dissipation, consider adding a small series resistor in the
supply. Another alternative is to in-crease the value of the RSET to lower the current of the
LEDs from 40 mA to say 30 or 20 mA.
The efficiency will be the power consumption in the LEDs divided by the input power
consumed.
Equation 1 Efficiency = Vdiode x Idiode / VCC x ICC
As an example, consider LED with forward voltage of VF = 2.4 V, Ipeak = 40 mA, VCC (max)
= 5.5 V, N=number of segments=8(max), D=duty cycle=15/16,
Power dissipation, PD (max) = 5 mA x 5.5 V + (5.5-2.4) V x (15/16) x 40 mA x 8 = 27.5 + 780
= 807.5 mW. To lower this value, add a series resistor with the supply.
Table 13.
Voltage drop estimation with RGB LED
LED
Typical forward
voltage
VF
Typical
current
Red
2.2 V
40 mA
5V
Green
2.5 V
40 mA
Blue
3V
40 mA
External
VF
Segment
driver
drop
1V
2.2 V
1.8
5V
1V
2.5 V
1.5
5V
1V
3V
1V
Typical supply Digit driver
voltage
drop
Note that the above analysis is for a typical condition. If the VF is higher and the supply
voltage is lower than 5V, then it is recommended to operate the LED at a lower current than
40mA in order to have enough headroom for the digit and segment drivers so as not to affect
the brightness and matching.
Table 14.
Capacitance (TA = 25°C, f = 1 MHz)
Symbol
Parameter
Test conditions
CIN
Input capacitance
(all digital pins)
Doc ID 17576 Rev 1
Min
Typ
Max
Unit
15
pF
35/62
Electrical ratings
STLED325
Power supply characteristics (TA = -40 to 85°C)
Table 15.
Symbol
Parameter
Test conditions
ICC
Operating power supply
current
ICC(Q)
Quiescent supply current
)
Table 16.
36/62
Typ
Max
Unit
All blocks of chip ON except
that no display load
VCC = 5.5V
TBD
mA
Display OFF
VCC = 5.5V
2
mA
Dynamic switching characteristics (TA = -40 to +85 °C, VCC = 5.0V ± 10%,
GND=0.0V, Typical values are at 25°C)
Symbol
Note:
Min
Parameter
Min
Typ
Max
Units
400
kHz
fSCL
SCL clock frequency
tLOW
Clock low period
1.3
µs
tHIGH
Clock high period
600
ns
0
tR
SDA and SCL rise time
300
ns
tF
SDA and SCL fall time
300
ns
tHD:STA
START condition hold time
(after this period the first clock pulse is
generated)
600
ns
tSU:STA
START condition setup time
(only relevant for a repeated start condition)
600
ns
tSU:DAT
Data setup time*
100
ns
tHD:DAT
Data hold time
0
µs
tSU:STO
STOP condition setup time
600
ns
tBUF
Time the bus must be free before a new
transmission can start
1.3
µs
trec
Watchdog output pulse width
96
98
ms
The transmitter must internally provide a hold time to bridge the undefined region (300ns
max) of the falling edge of the SCL.
Doc ID 17576 Rev 1
STLED325
Electrical ratings
Table 17.
Timing characteristics (TA = -40 to +85 °C, VCC = 5.0 V ± 10%, GND=0.0 V,
typical values are at 25 °C)
Parameter
Propagation delay
time
Symbol
Min
Typ
Max
Unit
tPLZ
300
ns
tPZL
100
ns
tTZH1
2
µs
tTZH2
0.5
µs
tTHZ
120
µs
CI
15
pF
Rise time
Fall time
Input capacitance
Mute active to
standby active
TM-S
GPIO edge to
interrupt trigger
Tirq
2
Test conditions
CLK -> SDA
CL = 15 pF, RL = 10 kΩ
Seg1 to Seg12
CL =
300
pF
Grid1 to Grid8,
Seg13/Grid16 to
Seg20/Grid9
CL = 300 pF, Segn, Dign
µs
8
Doc ID 17576 Rev 1
µs
37/62
Electrical ratings
4.4
STLED325
Oscillator and crystal characteristics
Table 18.
Oscillator characteristics
Symbol
Parameter
Conditions
Min
VSTA
Oscillator start voltage
≤10 seconds
1.5
tSTA
Oscillator start time
VCC = 3.0 V
CL1
CL2
Typ
Max
Unit
V
1
s
XIN
25
pF
XOUT
25
pF
+20
Ppm
IC-to-IC frequency
variation(1)
-20
1. Reference value. TA = 25 deg C, VCC = 3.0 V, CFM-145 (CL = 6 pF, 32.768 KHz) manufactured by Citizen.
Table 19.
Crystal electrical characteristics
Symbol
Parameter
Conditions
Min
Typ
fo
Resonant
frequency(1)
32.768
Rs
Series resistance(2)
35
CL
Load capacitance
12.5
Max
Unit
KHz
40(3)
kΩ
pF
1. Externally supplied. ST recommends the Citizen CFS-145 (1.5 x 5 mm) and the KDS DT-38 (3 x 8 mm) for
thru-hole, or the KDS DMX-26S(3.2x8mm) for surface-mount, tuning fork-type quartz crystals. KDS can be
contacted at kouhou@kdsj.co.jp or http://www.kdsj.co.jp. Citizen can be contacted at csd@citizenamerical.com or http://www.citizencrystal.com
2. Circuit board layout considerations for the 32.768KHz crystal of minimum trace lengths and isolation from
RF generating signals should be taken into account.
Note:
38/62
1
Oscillator is not production tested.
2
Externally supplied. ST recommends the Citizen CFS-145 (1.5 x 5 mm) and the KDS DT-38
(3 x 8 mm) for thru-hole, or the KDS DMX-26S(3.2x8mm) for surface-mount, tuning forktype quartz crystals. KDS can be contacted at kouhou@kdsj.co.jp or http://www.kdsj.co.jp
Citizen can be contacted at csd@citizen-americal.com or http://www.citizencrystal.com
3
Circuit board layout considerations for the 32.768KHz crystal of minimum trace lengths and
isolation from RF generating signals should be taken into account.
4
Guaranteed by design.
Doc ID 17576 Rev 1
STLED325
4.5
Electrical ratings
ESD performance
Table 20.
ESD performance
Symbol
Parameter
Test conditions
ESD
MIL STD 883 method 3015
(all pins)
HBM
Table 21.
Typ
Max
±2
Unit
kV
Battery range and battery detect
Symbol
Parameter
VBAT(1)
Battery supply voltage
IBAT
Min
Conditions
Min
Typ
Max
Unit
2.5
3
3.5(2)
V
7
10
uA
TA= 25 C,
Battery supply current VCC= 0 V, Oscillator
ON, VBAT=3 V
1. STMicroelectronics recommends the RAYOVAC BR1225 or BR1632 (or equivalent) as the battery supply.
2. For rechargeable back-up, VBAT(max) may be considered VCC.
Figure 13. Power down/up mode ac waveforms
Table 22.
Power down/up AC characteristics
Symbol
Parameter (1)(2)
Min
tpD
SCL and SDA at VIH before power down
0
ns
trec
SCL and SDA at VIH after power-up
10
µs
Typ
Max
Unit
1. VCC fall time should not exceed 5mV/µs.
2. Valid for ambient operating temperature: TA=-40 to 85, VCC = 2.5V to 5.5V (except where noted)
Table 23.
Power down/up trip points DC characteristics
Symbol
Parameter(1)(2)
VSO
Battery back-up switchover voltage
(from VCC to VBAT)
VCC < 3.5V
and
VCC < VBAT
V
VSO
Battery back-up switchover voltage
(from VBAT to VCC)
VCC > VBAT
V
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Min
Typ
Max
Unit
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Electrical ratings
STLED325
1. All voltages are referenced to GND.
2. Valid for ambient operating temperature: TA=-40 to 85, VCC = 2.5V to 5.5V (except where noted)
Table 24.
Symbol
TSD
THYS
Thermal shutdown characteristics(1)
Parameter
Conditions
Typ
Max
Unit
Thermal shutdown
threshold
VCC=5V
140
Deg C
Hysteresis
VCC=5V
15
Deg C
1. Thermal shutdown is not production tested.
Figure 14. VCC characteristics
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Min
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STLED325
5
Display RAM address and display mode
Display RAM address and display mode
The display RAM stores the data transmitted from an external device to the STLED325
through the serial interface. The addresses are as follows, in 8-bits unit:
Table 25.
Bit map for segment 1 to segment 8
Seg1
Seg4
Seg8
10 HL
10 HU
Dig1
11 HL
11 HU
Dig2
12 HL
12 HU
Dig3
13 HL
13 HU
Dig4
14 HL
14 HU
Dig5
b0
b3
b4
XX HL
b7
XX HU
“0” in memory means GND on outpu; ‘1” in memory means VCC on output.
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KEY matrix and key-input data storage RAM
6
STLED325
KEY matrix and key-input data storage RAM
The key matrix is of 8x2 configuration, as shown below:
Figure 15. KEY matrix and key-input data storage RAM
The data of each key are stored as illustrated below, and are read by the appropriate read
command, starting from the least significant bit.
Key 1
Key 2
Key 1
Key 2
Key 1
Key 2
Key 1
Key 2
Seg1
KS1
Seg2
KS2
Seg3
KS3
Seg4
KS4
Seg5
KS5
Seg6
KS6
Seg7
KS7
Seg8
KS8
b0
b1
b2
b3
b4
b5
b6
b7
All the front panel keys can be configured as hot keys using the “configuration mode setting
command”. Alternatively, any number of keys out of 16 keys can be programmed for hot key
functions by using the hot-key setting command.
It is recommended to read the hot key values immediately upon STBY de-assertion. If they
are not read within the guard preset timer value, the hot key data are cleared.
It is recommended to have 10 KΩ pull down resistors on the KEY1 and KEY2 input pins and
the output SEG/KS pins can see a maximum load of 300pF. This load condition is important
for the key dis-charge cycle time.
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7
Commands
Commands
A command sets the display mode and status of the LED driver.
The first 1 byte input to the STLED325 through the SDA pin after the slave address is
regarded as a command. If slave address is not transmitted before the commands/data are
transmitted, the commands/data being transmitted are invalid (however, the commands/data
already transmitted remain valid).
7.1
Configuration mode setting command
This command initializes the STLED325 and performs any one of the following functions:
i) Selects the duty factor (1/8 to 1/16 duty factor). When this command is executed, display
is turned off. To resume display, the display ON command must be executed. If the same
mode is selected, nothing is performed.
ii) Selects the remote control protocol to use.
iii) Sets the guard timer. The guard timer is configurable from 1 to 15s or turned off
completely.
iv) Sets the guard timer action to perform when the guard timer counts. Two actions are
allowed: no action or set STBY to high level.
MSB
0
LSB
0
b5
b4
b3
b2
b1
b0
Bits b7-b6 = 00 is decoded as a configuration mode setting command. The subsequent bits
are de-coded as follows:
b5: enables wake-up from the external WAKE_UP pin
b4: enable for the display configuration setting change (number of digits)
b3: allows display of RTC (during normal or STBY modes)
b2: enables all RC keys as hot-keys
b1: enables all FPK keys as hot-keys
b0: enables the Guard Timer to issue STBY once the timer expires
Note:
When displaying the RTC during normal mode, if the µP is writing data to STLED325 using
I2C bus, the RTC display on LED momentarily turns off.
The first byte after the configuration command is in the following format:
MSB
b7
LSB
b6
b5
b4
B3
b2
b1
b0
Remote control protocol setting (bits b6-b4)
000: RC Disabled (default)
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Commands
STLED325
001: Philips RC-6 (optional only enabled for Philips)
010: Philips RC-5
011: Philips RCMM
100: NEC
101: R-STEP
110: Thomson R2000
111: Thomson RCA
When b7=‘0’, incoming RC data is output on SDA in decoded format where the Device
Address, Start Bit, Toggle Bit and Data Bits are sent. Note that the default location is 0x00
for the first device address. This order of the bits sent is in the same format as the incoming
RC data.
When b7=‘1’, incoming raw data (no header information) is output on SDA.
Address decoding is still performed to decode the corresponding RC protocol. The format of
the data on SDA corresponds to the format of the respective RC frame.
For details, refer to the RC protocol section of the datasheet.
GUARD TIMER SETTING (bits b3-b0)
0000: Turned off (guard timer disabled)
0001: 1 seconds
0010: 2 seconds
1111: 15 seconds
The second byte after the configuration command is in the following format:
MSB
b7
LSB
b6
b5
b4
b3
b2
b1
b0
7-Segment display mode setting (bits b1-b0)
00: 1 digit, 8 segments (Digit 1 pin output is enabled)
01: 2 digits, 8 segments (Digit 1 and Digit 2 pin outputs are enabled)
10: 3 digits, 8 segments (Digit 1, Digit 2 and Digit 3 outputs are enabled)
11: 4 digits, 8 segments (Digit 1, Digit 2, Digit 3 and Digit 4 outputs are enabled)
b2: configuration for the digital outputs of the chip
b2 = 1 will enable the outputs of the chip to be push pull type to 1.8V
b2 = 0 will enable the outputs of the chip to be open-drain (can be externally pulled up to
3.3V)
b3: configuration for the GPIO0
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Commands
b3 = 0 enables the GPIO0 as input
b3 = 1 enables the GPIO0 as output
b4: configuration for the GPIO1
b4 = 0 enables the GPIO1 as input
b4 = 1 enables the GPIO1 as output
b5 = interrupt enable register bit for GPIO (applies to both GPIO0 and GPIO1)
b5 = 0 disables the interrupt generation from any of the two GPIOs
b5 = 1 enables the interrupt generation from any of the two GPIOs inputs change
b6 = configuration of the edge trigger for GPIO0 (works only when b5 is enabled)
b6 = 0 sends interrupt when GPIO0 triggers from a high to a low
b6 = 1 sends interrupt when GPIO0 triggers from a low to a high
b7 = configuration of the edge trigger for GPIO1 (works only when b5 is enabled)
b7 = 0 sends interrupt when GPIO1 triggers from a high to a low
b7 = 1 sends interrupt when GPIO1 triggers from a low to a high
The minimum pulse width for a valid GPIO detection must be 8us minimum.
Upon power application, the following modes are selected:
Display mode setting: the 4-digit, 8-segment mode is selected (default: display off and
keyscan on).
Remote control protocol setting: RC-5.
Guard timer setting: turned on with 10s. After the first command is processed by STLED325,
the guard timer is turned off until it is turned on by the host.
Guard timer action: Issue Standby.
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Commands
7.2
STLED325
Data setting command
This command sets the data-write and data-read modes.
MSB
LSB
0
Description:
1
b5
b4
b3
b2
b1
b0
Bits b7-b6 = 01 is decoded as a data setting command. The subsequent bits are
decoded as follows:
b5 b4 = 00: data write command (see bits b1-b0)
b5 b4 = 01: data write 1 command (see bits b1-b0)
b5 b4 = 10: data read 1 command (see bits b1-b0)
b5 b4 = 11: data read 3 command (see bits b1-b0)
b3: clear the guard timer (no change in guard time)
b2: when set to a 1, the guard timer is forced to enable and starts the count again.
While in normal mode, the count starts
Table 26.
Data write command. b5 b4: 00
b1-b0
00
Write memory (display or RTC) – Address range: 0x00-0x0F. Start
address pointer location is 0x00.
01
Write memory (display). Address range: 0x10-0x13. Start ad-dress
pointer location is 0x10.
10
Write memory (discrete LED). Address: 0x14.
11
Write data into GPIOs if they are configured as outputs (see note 1)
Note 1: The following byte with MSB7 and MSB6 corresponds to GPIO[1:0] for data to be
written into GPIO1 and GPIO0 when they are configured as outputs.
Figure 16. Data write command (b7 b6) for GPIO
MSB
LSB
MSB7
MSB6
GPIO1
GPIO0
RSVD
RSVD
RSVD
RSVD
RSVD
RSVD
When b7 is 1, it drives logic 1 on GPIO1 output and when it is 0, it drives logic 0 on GPIO1
output.
When b6 is 1, it drives logic 1 on GPIO0 output and when it is 0, it drives logic 0 on GPIO0
output.
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Commands
Table 27.
Data Write 2 command. B5 b4: 01
B1-b0
00
Reserved
01
Reserved (RC6 disable)
10
Reserved (RC6 enable)
11
Enter standby mode
Any subsequent data bytes in this case will be ignored.
Table 28.
Data Read 1 command. b5 b4: 10
b1-b0
00
Read Key (following 2 bytes will contain key data)
01
Read GPIO register (following 1 byte will contain the GPIO data with
MSB7: GPIO1 data and MSB6: GPIO0 data). This is the input monitor for
GPIO[1:0] for reading purpose. When b7 of subsequent byte is low, it
means that GPIO1 input is low and when it is high, it means that GPIO1
input is high. When b6 of subsequent byte is low, it means that GPIO0
input is low and when it is high, it means that GPIO0 input is high.
10
Read RC data (following four bytes are the address + command bytes from
RC)
11
Read Interrupt status register (refer to the Interrupt Flag section for
detailed description)
Table 29.
Data Read 2 command. b5 b4: 11
b1-b0
00
Reserved
01
Read configuration byte values (see section on configuration bytes)
10
Read LED display memory
11
Read RTC memory. Address command must be issued prior to reading.
On power application, the normal operation mode and address increment mode is set with
the default display memory address set to 0x10 (start of display memory address location).
Refer to the display memory section.
In the auto increment address mode, the address command is sent once followed by the
data bytes.
Alternatively, the data command can be sent followed by the data bytes. In this case, when
new display data is to be written, the last value of the address will be used and then
incremented. Upon reaching the last display memory address, the address jumps to 0x10,
as it represents the first address location of the display memory.
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Commands
STLED325
In fixed address mode, the address command has to be sent followed by the display data.
When next byte of data is to be written, address command has to be sent again before new
display data byte.
When the user wants to read the RTC data from the specified memory location of RTC, the
user must first set the address of the RTC location using “Address Setting Command” after
which send the “Read RTC Register” command.
If the address pointer was located in the display memory location and user issues a “Read
RTC Register” command without sending the “Address Setting Command”, the RTC data is
read from the address location of the previous value of the RTC address pointer.
Thus before reading the RTC register data, the user must set the proper address for RTC
using “Address Setting Command”.
Prior to writing data to the RTC registers, the address of the RTC must be set using the
Address Setting command. Else, if the address pointer happens to be pointing at the LED
display memory, then the data will be written to the address location of the previous value in
the RTC address pointer. This is vice-versa true for the LED display memory.
7.3
Configuration data
Up to a maximum of 5-bytes are sent from LSB to MSB as configuration data. The 29-bytes
represent the following configuration information:
MSB (b7)
LSB (b0)
Byte1
B7
B6
Decoded/Raw
RC setting
B5
B4
B3
RC Protocol setting
B2
B1
B0
Guard timer setting
Byte 2
B7
Interrupt
config for
GPIO1
B6
Interrupt
config for
GPIO0
B5
B4
B3
B2
Interrupt
enable config
for GPIOs
GPIO1
configuration
(input or
output)
GPIO0
configuration
(input or
output)
Digit 5 discrete
LED config
B1
B0
7-segment LED display
configuration setting
Byte 3
B7
B6
Not used
B5
B4
B3
For display
enable
B2
B1
B0
For display dimming setting
Byte 4
Front Panel Hot Key Bank 1
Byte 5
Front Panel Hot Key Bank 2
On power application, the normal operation mode and address increment mode is set with
the default display memory address set to 0x10 (start of display memory address location).
Refer to the display memory section.
In the auto increment address mode, the address command is sent once followed by the
data bytes.
Alternatively, the data command can be sent followed by the data bytes. In this case, when
new display data is to be written, the last value of the address will be used and then
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Commands
incremented. Upon reaching the last display memory address, the address jumps to 0x10,
as it represents the first address location of the display memory.
In fixed address mode, the address command has to be sent followed by the display data.
When next byte of data is to be written, address command has to be sent again before new
display data byte.
When the user wants to read the RTC data from the specified memory location of RTC, the
user must first set the address of the RTC location using “Address Setting Command” after
which send the “Read RTC Register” command.
If the address pointer was located in the display memory location and user issues a “Read
RTC Register” command without sending the “Address Setting Command”, the RTC data is
read from the ad-dress location of the previous value of the RTC address pointer.
Thus before reading the RTC register data, the user must set the proper address for RTC
using “Address Setting Command”.
Prior to writing data to the RTC registers, the address of the RTC must be set using the
Address Setting command. Else, if the address pointer happens to be pointing at the LED
display memory, then the data will be written to the address location of the previous value in
the RTC address pointer. This is vice-versa true for the LED display memory.
7.3.1
Interrupt flags
The interrupt is sent on the IRQ_N pin when any one of the event occurs (FP key pressed,
RC key pressed or preset value of RTC/guard timer is triggered or activity on WAKE_UP pin
or GPIO pins). Simultaneously, the interrupt flags are set. The micro-processor can read the
interrupt flags by send-ing the read interrupt flag register command. The following 16-bit
data is read by the processor after sending this command. This enables the microprocessor
to know what caused the interrupt to occur. If the host sees an interrupt issued from first
byte, it is not necessary to read the second byte.
Figure 17. Interrupt bit mapping in Byte 1
Byte 1:
MSB
&0+
LSB
2#+
'0)/;=
'0)/;=
&0
HOTKEY
DURING
WAKE
UP
20
HOTKEY
DURING
WAKE
UP
4HERMAL
SHUT
DOWN
"ATTERYLOW
!-6
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Commands
STLED325
Figure 18. Interrupt bit mapping in Byte 2
Byte 2:
MSB
LSB
2ESERVED
24#
WATCHDOG
TIMER
24#
ALARM
24#
FAIL
7AKE
UP
PIN
7ATCHDOG
/SCILLATOR ,TO(
TIMER
OR(TO,
b7-b4 = Normal operation
24#ALARM
24#
FAIL
/SCILLATOR
b3-b0=Wake up operation
!-6
In the normal mode of operation, when any FP or RC key is pressed or when
alarm/watchdog is triggered, the STLED325 sets the flags in the above interrupt flag register
and asserts the IRQ_N pin. The data which caused the interrupt to assert remains in the
buffer until it is changed by another key-press. It is up to the micro processor to issue the
read interrupt command to ascertain what caused the interrupt. If the micro processor does
not issue the interrupt within a specific time, the old data is lost and only the latest data is
reflected in the Interrupt Flag register.
In the standby mode of operation, only the hot-key will cause the interrupt flag to be set and
the IRQ_N pin will be asserted. The micro processor should then read the interrupt to know
what caused the wake-up operation before proceeding with the normal data communication
or asserting STBY again if there is no action to be performed. Upon the first read of the hotkey data, the data in the buffer is cleared.
When the b4 of the above interrupt flag is set, then the µP should read the address 0x0F
from the RTC register space to determine if the alarm was triggered. Only after determining
this, the interrupt flag is cleared and the IRQ_N pin de-asserted.
The IRQ_N pin will only be de-asserted once the interrupt flags have been read. The chip
will continue to send the interrupt periodically (approximately every 40us) to the main Host
chip if the oscillator is down signifying to the Host chip that the frequency is out of spec.
7.4
Address setting command
This command sets an address of the display memory or the address of the RTC register
map.
MSB
1
LSB
1
x
b4
b3
b2
b1
b0
The address range from 00h-0Fh represents the RTC register map. For writing data to RTC
registers, initially the address command is sent followed by the RTC data.
10h-14h represents the 7-segment and discrete LED display correspondence. On power
application, the address is set to 10h. In the auto-increment mode, when the address
reached 0x14, the next ad-dress will be 0x10.
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7.5
Commands
Display control and hotkey setting command
1
0
b5
b4
b3
b2
b1
b0
Bits b7-b6 = 10 is decoded as a display control and hotkey setting command. The
subsequent bits are decoded as follows:
b5 = 0: sets display control for dimming setting as shown in the table below.
Display control and dimming setting when b5 = 0
b3.b0: sets dimming quantity.
0000: sets pulse width to 1/16.
0001: sets pulse width to 2/16.
0010: sets pulse width to 3/16.
0011: sets pulse width to 4/16.
0100: sets pulse width to 5/16.
0101: sets pulse width to 6/16.
0110: sets pulse width to 7/16.
0111: sets pulse width to 8/16.
1000: sets pulse width to 9/16.
1001: sets pulse width to 10/16 (default and recommended)
1010: sets pulse width to 11/16.
1011: sets pulse width to 12/16.
1100: sets pulse width to 13/16.
1101: sets pulse width to 14/16.
1110: sets pulse width to 15/16.
1111: sets pulse width to 16/16.
Figure 19. Blanking time
b4: Turns on/off display
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Commands
STLED325
0: Display off (keyscan continues)
1: Display on
When b5 = 1, the decoding is based on bits b1-b0 as illustrated below:
b1 b0 = 01: IR hot-key configuration of ADR and DATA. After this 3 bytes are sent which are
in the form ADR+DATA to configure the hot-key for a particular device address. A maximum
of 8 hot keys can be configured from a single device address or 4 hot-keys from two device
addresses and so on. If more than 24 bytes in the form of ADR+DATA are sent, then the
pointer moves back to the first ADR+DATA location.
b1 b0 = 10: FP hot-key configuration. Any of the 16 keys can be configured as hot-keys. 2
bytes of key data command are sent following this command to configure the front-panel
hotkeys.
b4, b3 b2: Reserved
b1b0: 00 or 11 are treated as invalid commands and subsequent data bytes are ignored.
Remote control hot keys when b5 = 1
b1 b0: 01
Following 8-bit is sent to indicate the address for RC and subsequent 16-bit indicates the RC
hot key value itself. So a total of 3 bytes are sent for one hot-key configuration. A total of 24
bytes are re-served for RC hot key configuration. Note that the customer code is
programmable for the RC hotkey for both RCMM and R-STEP RC protocol.
Front Panel Hot Keys when b5 = 1
b1 b0: 10
Front panel hot keys can be configured by sending 2 bytes of key data to configure any key
as hot-key from any of the 2 banks. Any number of keys can be configured as hot-keys.
When input key code matches any one of the predefined key codes stored in the internal
RAM, the STLED325 de-asserts the STBY output.
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7.6
Commands
Keyscanning and display timing
Figure 20. Keyscanning and display timing
Grid
Outputs
DIG1
DIG2
DIG3
DIGn
-----------
Key Scan
DIG1
tDISP=500us
SEG1
SEG2
t=1/16 of
tDISP
SEG3
SEGn
tFRAME=tDISP * (n+1)
n = number of digits
AM04168V1
The value is fixed by the internal clock from the oscillator.
One cycle of keyscanning consists of one frame, and data of 8x2 matrices are stored in the
RAM.
Note that the keyscan is only at the end of the frame when the display is ON. When the
display is OFF, the keyscan takes place continuously. The grid/digit is turned off during the
keyscan.
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State
STLED325
8
State
8.1
Default state upon power-up
Table below shows the default state of the STLED325 upon power-up.
Table 30.
Power-up defaults
Serial number
8.2
Function
Default state
1
Display
OFF
2
Key-scan
ON
3
IR
Disabled
4
Display mode
8 segment/1 digit
5
Display address
10H with address increment
mode
6
RC protocol
Disabled
7
Dimming
10/16 duty factor
8
Hot keys (IR and FP)
Disabled
9
Guard timer
10s
Initial state
On power application, the 10/16-pulse width is set and the display shows the value
configured in the LED display RAM before entering the standby mode. Thus if TUNE is
required to be shown on the LED upon wake-up, then the user must write the corresponding
digit and segments locations in the LED display memory before going into the standby mode
of operation. The value of the display changes only after user configuration.
If the user wishes to display the RTC value during standby, then the user must configure the
STLED325 by sending the appropriate command. If the user does not configure the
STLED325 to display the RTC in standby, the LED shows the same value as was written
previously in the LED display memory location.
Note that all the hot keys are disabled on power-up. Only the hot-keys (FP or RC) can be
detected to wake-up the system from standby condition.
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9
Remote control protocols
Remote control protocols
Contact STMicroelectronics for more information on RC protocols or refer to separate
document (TBD).
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Application information
STLED325
10
Application information
10.1
Power supply sequencing
Proper power-supply sequencing is advised for all CMOS devices. It is recommended to
always apply VCC before applying any signals to the input/output or control pins.
10.2
ISET variation with RSET
The graph of ISET variation with RSET is shown in Figure 21.
Figure 21. Rext versus Iseg curve
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Application diagram
C2
R3
GND
R2
R1
VBAT
VREG
C1
G P IO 2
Figure 22. Application schematic
G P IO 1
10.3
Application information
C reg
VCC
W A K E _U P
IR Q _N
D IG 5
S TB Y
READY
M ain C P U
SCL
SDA
M U TE
IR rem ote
control
sensor
C L1
LE D 4 -D igit 7 -segm ent
(+ dot -point)
S T LE D 325
IR _IN
XI
XO
IS E T
RSET
GND
C rystal
(32.768K H z)
4
D IG 1-D IG 4
D isplay panel
S E G 1/K S 1
-S E G 8/K S 8
W ith som e individual LE D s
D1
D2
D3
D4
D5
D6
D7
D8
K E Y 1-K E Y 2
R4
C L2
R5
K eyscan
(8x2 m atrix)
GND
AM08725V1
Resistors:
RSET = external resistor for current setting
R1 = 1-10 KO SDA external pull-up resistor
R2 = 1-10 KO SCL external pull-up resistor
R3 = 1-10 KO IRQ_N external pull-up resistor
R4-R5 = 10 KO external key-matrix pull-down resistors
Capacitors:
C1 = 33 µF (25 V) electrolytic
C2 = 0.01-0.1µF (25V) ceramic
Creg=0.1 uF
CL1 = CL2 = 25pF
Diodes
D1-D8 = 1N4148
Supply voltage
VCC = 5 V ± 10%
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Package mechanical data
11
STLED325
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com. ECOPACK
is an ST trademark.
Table 31.
QFN32 (5 x 5 mm) mechanical data
Millimeters
Symbol
Min
Typ
Max
A
0.80
0.90
1.00
A1
0
0.02
0.05
A3
0.20
b
0.18
0.25
0.30
D
4.85
5.00
5.15
D2
3.35
3.45
3.55
E
4.85
5.00
5.15
E2
3.35
3.45
3.55
e
L
0.50
0.30
ddd
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0.40
0.50
0.08
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Package mechanical data
Figure 23. QFN32 package dimensions
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Figure 24. QFN32 carrier tape
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Revision history
Revision history
Table 32.
Document revision history
Date
Revision
27-Apr-2011
1
Changes
Initial release.
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