STP04CM05
4-bit constant current power-LED sink driver
Datasheet - production data
Description
The STP04CM05 is a high-power LED driver and
4-bit shift register designed for Power-LED
applications.
The STP04CM05 contains a 4-bit serial IN,
parallel OUT shift register that feeds a 4-bit Dtype storage register. In the output stage, four
regulated current sources were designed to
provide 80-400 mA constant current to drive high
power LEDs.
Features
4 constant current output channels
Adjustable output current through one
external resistor
Can be driven by a 3.3 V microcontroller
Serial data IN/parallel data OUT
Output current: 80-400 mA
20 V of output driving capability
30 MHz clock frequency
UVLO (under voltage lockout) and POR
(power ON reset)
TSD, thermal shutdown, output off when
junction temperature exceeds limit
Operating free-air temperature range -40° to
125 °C
ESD protection 2.5 kV HBM, 200 V MM
Available in high thermal TSSOP exposed
pad
The STP04CM05 guarantees 20 V output driving
capability, allowing users to connect more LEDs
in series. The high clock frequency, 30 MHz, also
satisfies the system requirements which include
high volume data transmission.
The STP04CM05 is well suited for very high
brightness displays and special lighting
applications.
The STP04CM05 is offered in TSSOP16
exposed pad packages.
Table 1: Device summary
Order code
Package
Packing
STP04CM05XTTR
TSSOP16 exposed pad (tape and reel)
2500 parts per reel
January 2016
DocID14191 Rev 6
This is information on a product in full production.
1/22
www.st.com
Contents
STP04CM05
Contents
1
Internal schematic ........................................................................... 3
2
Pin settings ...................................................................................... 4
3
2.1
Pin connection................................................................................... 4
2.2
Pin description................................................................................... 4
Maximum rating ............................................................................... 5
3.1
Thermal data ..................................................................................... 5
3.2
Recommended operating conditions ................................................. 6
4
Electrical characteristics ................................................................ 7
5
Equivalent circuit and outputs ....................................................... 9
6
Timing diagrams ............................................................................ 11
7
Test circuit ..................................................................................... 14
8
9
Typical characteristics .................................................................. 15
Package information ..................................................................... 17
10
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9.1
TSSOP16 exposed pad package information ................................. 18
9.2
TSSOP16 exposed pad packing information .................................. 20
Revision history ............................................................................ 21
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STP04CM05
1
Internal schematic
Internal schematic
Figure 1: Block diagram
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Pin settings
STP04CM05
2
Pin settings
2.1
Pin connection
Figure 2: Pin connection
The exposed pad should be attached to a metal land electrically isolated or
connected to ground.
2.2
Pin description
Table 2: Pin description
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TSSOP16 exposed pad pin N°
Symbol
Name and function
1, 2
GND
Ground terminal
3
SDI
Serial data input terminal
4
CLK
Clock input terminal
5
LE
Latch input terminal
6
OUT 0
Output terminal
7
OUT 1
Output terminal
8, 9, 12
N.C.
Not connected
10
OUT 2
Output terminal
11
OUT 3
Output terminal
13
OE
Output enable input terminal (active low)
14
SDO
Serial data out terminal
15
R-EXT
16
VDD
Constant current programming
5 V supply voltage terminal
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STP04CM05
3
Maximum rating
Maximum rating
Stressing the device above the rating listed in the “absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 3: Absolute maximum ratings
Symbol
3.1
Parameter
Value
Unit
VDD
Supply voltage
0 to 7
V
VO
Output voltage
-0.5 to 20
V
IO
Output current
500
mA
VI
Input voltage
-0.4 to VDD+0.4
V
2000
mA
50
MHz
IGND
GND terminal current
fCLK
Clock frequency
TOPR
Operating temperature range
-40 to +125
°C
TSTG
Storage temperature range
-55 to +150
°C
Thermal data
Table 4: Thermal data
Symbol
RthJA
Parameter
Thermal resistance junction-ambient
TSSOP16 exposed pad
37.5
(1)
Unit
°C/W
Notes:
(1)
Using the PCB multi-layer JEDEC Standard test boards.
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Maximum rating
3.2
STP04CM05
Recommended operating conditions
Table 5: Recommended operating conditions
Symbol
Parameter
Test condition
Min.
Typ.
Max.
Unit
3.3
5.0
5.5
V
19
V
400
mA
VDD
Supply voltage
VO
Output voltage
IO
Output current
OUTn VDD = 5 V
IOH
Output current
Serial-OUT
+1
mA
IOL
Output current
Serial-OUT
-1
mA
VIH
Input voltage
0.7
VDD
VDD+0.3
V
VIL
Input voltage
-0.3
0.3 VDD
V
twEN
OE pulse width
twLAT
LE pulse width
twCLK
CLK pulse width
tSETUP(D)
Setup time for DATA
tHOLD(D)
Hold time for DATA
tSETUP(L)
Setup time for LATCH
tHOLD(E)
Hold time for ENABLE
80
VDD = 5 V, IO = 350 mA
80
50
VDD = 3.3 V, IO = 350 mA
250
150
8
4
ns
8.5
7.5
ns
8.5
7.5
ns
8.5
7.5
ns
8.5
7.0
ns
8.5
7.0
ns
VDD = 3.0 to 3.6 V
Cascade operation
fCLK
Clock frequency
TOPR
Operating temperature
range
(1)
-40
ns
30
MHz
+125
°C
Notes:
(1)
If multiple devices are cascaded, it may not be possible achieve the maximum data transfer. Please consider
the timing conditions carefully.
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STP04CM05
4
Electrical characteristics
Electrical characteristics
TA = 25 °C, unless otherwise specified.
Table 6: Current accuracy
Current accuracy
Output voltage
Output current
≥ 1.4 V
Between bits
Between ICs
Typ. ± 1%
± 6%
80 to 400 mA
Table 7: Electrical characteristics (VDD = 3.3 to 5 V)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
VIH
Input voltage high
level
0.7
VDD
VDD
V
VIL
Input voltage low
level
GND
0.3
VDD
V
IOH
Output leakage
current
VOH = 19 V
10
μA
VOL
Output voltage
(serial-OUT)
IOL = 1 mA
0.4
V
VOH
Output voltage
(serial-OUT)
IOH = -1 mA
VDD0.4 V
VO = 0.3 VREXT = 980 Ω
75.2
80
84.8
mA
VO = 1.2 VREXT = 190 kΩ
376
400
424
mA
VO = 0.3 VREXT = 980 Ω
IO = 80 mA
1
1.5
%
VO = 1.2 VREXT = 190 Ω
IO = 400 mA
1
1.5
%
IOL1
Output current
IOL2
ΔIOL1
ΔIOL2
RSIN(up)
RSIN(down)
Output current error
between bit
(all output ON)
Pull-up resistor
150
300
600
kΩ
Pull-down resistor
100
200
400
kΩ
REXT = OPEN OUT 0 to 3 = OFF
1
1.5
REXT = 980 Ω OUT 0 to 3 = OFF
3.8
6
REXT = 190 Ω OUT 0 to 3 = OFF
14
18.5
REXT = 980 Ω OUT 0 to 3 = ON
4.0
6.0
REXT = 190 Ω OUT 0 to 3 = ON
14.5
19
IDD(OFF1)
IDD(OFF2)
Supply current
(OFF)
IDD(OFF3)
IDD(ON1)
IDD(ON2)
V
Supply current (ON)
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Electrical characteristics
STP04CM05
Table 8: Switching characteristics (VDD = 3.3 to 5 V)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
VDD = 3.3 V
-
290
377
VDD = 5 V
-
200
260
Propagation delay time,
VDD = 3.3 V
-
200
260
LE- OUTn , / OE = L
VDD = 5 V
-
140
180
ns
Propagation delay time,
VDD = 3.3 V
-
240
310
ns
/ OE - OUTn , LE = H
VDD = 5 V
-
170
220
Propagation delay time,
CLK-SDO
VDD = 3.3 V
-
25
35
VDD = 5 V
-
15
20
VDD = 3.3 V
-
49
64
VDD = 5 V
-
36
47
VDD = 3.3 V
-
39
51
VDD = 5 V
-
26
34
VDD = 3.3 V
-
48
62
VDD = 5 V
-
32
42
Propagation delay time,
CLK-SDO
VDD = 3.3 V
-
30
39
VDD = 5 V
-
19
25
Output rise time 10~90% of
voltage waveform
VDD = 3.3 V
-
880
1150
VDD = 5 V
-
616
800
Output fall time 90~10% of
voltage waveform
VDD = 3.3 V
-
18
24
VDD = 5 V
-
14
18
ns
-
5000
ns
-
5000
ns
Propagation delay time,
tPLH1
CLK- OUTn
LE = H,
/ OE = L
tPLH2
tPLH3
tPLH
Propagation delay time,
tPHL1
CLK- OUTn
LE = H,
/ OE = L
Propagation delay time,
tPHL2
RL = 5.0 Ω
CL = 10 pF
IO = 350 mA
REXT = 224 Ω
VL = 3.0 V
LE - OUTn , / OE = L
Propagation delay time,
tPHL3
tPHL
tON
tOFF
/ OE - OUTn
(1)
tr
CLK rise time
tf
CLK fall time (1)
8/22
ns
ns
ns
ns
ns
LE = H
VO = 5.0 V
REXT = 224 Ω
Notes:
(1)
Unit
In order to achieve high cascade data transfer, please consider tr/tf timings carefully.
DocID14191 Rev 6
ns
ns
STP04CM05
5
Equivalent circuit and outputs
Equivalent circuit and outputs
Figure 3: OE terminal
Figure 4: LE terminal
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Equivalent circuit and outputs
STP04CM05
Figure 5: CLK, SDI terminal
Figure 6: SDO terminal
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STP04CM05
6
Timing diagrams
Timing diagrams
Figure 7: Timing diagram
1 Latch and output enable are level sensitive and are not synchronized with risingor-falling edge of CLK signal.
2 When LE terminal is low level, the latch circuit hold previous set of data.
3 When LE terminal is high level, the latch circuit refresh new set of data from SDI
chain.
4 When OE terminal is at low level, the output terminal - Out 0 to Out 03 respond
to data in the latch circuits, either ‘1’ for ON or ‘0’ for OFF.
5 When OE terminal is at high level, all output terminals will be switched OFF.
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Timing diagrams
STP04CM05
Figure 8: Clock, serial-in, serial-out
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STP04CM05
Timing diagrams
Figure 9: Clock, serial-in, latch, enable, outputs
Figure 10: Outputs
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Test circuit
7
STP04CM05
Test circuit
Figure 11: DC characteristic
Figure 12: AC characteristic
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STP04CM05
8
Typical characteristics
Typical characteristics
Figure 13: Output current-REXT resistor
Figure 14: Output current vs dropout voltage
Figure 15: Output current vs ± ΔIOL(%)
Figure 16: Four power-LED typ. application circuit
VL will be determined by the VF of the LEDs.
Condition: TA = 25 °C, Vdd = 5 V,VL = 3 V, Rext = 227 Ω.
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Typical characteristics
STP04CM05
Figure 17: tON
16/22
Figure 18: tOFF
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STP04CM05
9
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
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Package information
9.1
STP04CM05
TSSOP16 exposed pad package information
Figure 19: TSSOP16 exposed pad package outline
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STP04CM05
Package information
Table 9: TSSOP16 exposed pad package mechanical data
mm
Dim.
Min.
Typ.
A
Max.
1.10
A1
0.05
0.15
A2
0.85
b
0.19
0.30
c
0.09
0.20
0.90
D
5.00
D1
ACCORDING TO PAD SIZE
E
E1
6.40
4.30
E2
4.40
4.50
ACCORDING TO PAD SIZE
e
L
0.95
0.65
0.50
L1
0.60
0.70
1.00
k
8
aaa
0.076
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Package information
9.2
STP04CM05
TSSOP16 exposed pad packing information
Figure 20: TSSOP16 exposed pad tape and reel outline
Table 10: TSSOP16 exposed pad packing mechanical data
mm
inch
Dim.
Min.
A
Max.
Min.
330
12.8
D
20.2
0.795
N
60
2.362
13.2
Typ.
Max.
12.992
C
T
20/22
Typ.
0.504
22.4
0.519
0.882
Ao
6.7
6.9
0.264
0.272
Bo
5.3
5.5
0.209
0.217
Ko
1.6
1.8
0.063
0.071
Po
3.9
4.1
0.153
0.161
P
7.9
8.1
0.311
0.319
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STP04CM05
10
Revision history
Revision history
Table 11: Document revision history
Date
Revision
26-Nov-2007
1
Initial release
16-Jan-2008
2
Added: Figure 15 on page 15 and Figure 19 on page 17,
Updated: Table 8 on page 8.
12-Mar-2008
3
Updated: Figure 8 on page 12.
23-Jun-2008
4
Updated: Table 1 on page 1, Figure 21 on page 20.
07-Jun-2010
5
Updated: Note: on page 4, Table 10 on page 19.
6
Removed SO-14 package.
Updated Figure 5: "CLK, SDI terminal".
Minor text changes.
07-Jan-2016
Changes
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STP04CM05
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