STPS120M

STPS120M Power Schottky rectifier Datasheet - production data Description Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. " Packaged in STmite, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package this device fits battery powered equipment (cellular, notebook, PDA’s, printers) as well chargers and PCMCIA cards. , 67PLWH '2$$ Table 1. Device summary Symbol Value Features IF(AV) 1A • Very small conduction losses VRRM 20 V • Negligible switching losses Tj (max) 150 °C • Extremely fast switching VF (typ) 0.36 V • Low forward voltage drop for higher efficiency and extented battery life • Low thermal resistance • Avalanche capability specified July 2015 This is information on a product in full production. DocID8632 Rev 5 1/8 www.st.com Characteristics 1 STPS120M Characteristics Table 2. Absolute ratings (limiting values at Tamb = 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 20 V IF(RMS) Forward rms current 2 A IF(AV) Average forward current, δ = 0.5, square wave Tc = 140 °C 1 A IFSM Surge non repetitive forward current tp = 8.3 ms sinusoidal 50 A Repetitive peak avalanche power Tj = 125 °C, tp = 10 µs 100 W -65 to +150 °C 150 °C PARM (1) Tstg Tj Storage temperature range Maximum operating junction temperature (2) 1. For pulse time duration deratings, please refer to Figure 3. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the STMicroelectronics Application notes AN1768, “Admissible avalanche power of Schottky diodes” and AN2025, “Converter improvement using Schottky rectifier avalanche specification”. 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj 2. Table 3. Thermal resistance Symbol Rth(j-c) Rth(j-a)(1) Parameter Value Unit Junction to case 20 °C/W Junction to ambient 250 °C/W Unit 1. Mounted with minimum recommended pad size, PC board FR4. Table 4. Static electrical characteristics Symbol Parameter Test conditions Tj = 25 °C Tj = 100 °C IR(1) Reverse leakage current Tj = 25 °C Tj = 100 °C Tj = 25 °C Tj = 100 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 100 °C Tj = 25 °C Tj = 100 °C VR = VRRM VR = 10 V VR = 5 V IF = 1 A IF = 2 A Min. Typ. Max. - 1.3 3.9 - 275 850 - 0.6 2.0 - 145 450 - 0.4 1.0 - 105 300 - 0.44 0.49 - 0.36 0.41 - 0.48 0.54 - 0.42 0.48 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.34 x IF(AV) + 0.07 x IF2(RMS) 2/8 DocID8632 Rev 5 µA V STPS120M Characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ = 0.5) PF(AV)(W) 0.6 δ = 0.2 δ = 0.1              δ = 0.5 0.5 δ = 0.05 0.4 δ=1 0.3 0.2 T 0.1 IF(AV)(A) δ=tp/T 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 tp 1.1 3$50W33$50—V 5 WKMD  5 WKMF 7 į WS7  1.2 Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C)  ,)$9 $  WS  7DPEƒ&     Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.9 0.8  0.7 0.6 δ = 0.5 0.5 0.4  0.3 0.2 W3—V    0.1 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) T δ = 0.1 Single pulse 0.0 1.E-04   δ = 0.2 tp(s) 1.E-03 δ=tp/T 1.E-02 tp 1.E-01 Figure 6. Junction capacitance versus reverse voltage applied (typical values) C(pF) IR(mA) 1000 1.E+01 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1.E+00 Tj=125°C 1.E-01 Tj=100°C 100 1.E-02 Tj=75°C Tj=50°C 1.E-03 Tj=25°C VR(V) VR(V) 10 1.E-04 0 2 4 6 8 10 12 14 16 18 20 1 DocID8632 Rev 5 10 100 3/8 8 Characteristics STPS120M Figure 7. Forward voltage drop versus forward Figure 8. Forward voltage drop versus forward current (low level) current (high level) IFM(A) IFM(A) 100.0 2.0 1.8 1.6 Tj=100°C (maximum values) Tj=100°C (maximum values) 1.4 10.0 1.2 Tj=100°C (typical values) 1.0 Tj=100°C (typical values) 0.8 Tj=25°C (maximum values) 1.0 0.6 Tj=25°C (maximum values) 0.4 0.2 VFM(V) VFM(V) 0.1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.0 0.6 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Figure 9. Thermal resistance junction to ambient versus copper surface under tab (typical values)  5 WKMD ƒ&: (SR[\SULQWHGERDUG)5H&X —P       4/8 6FXFPð        DocID8632 Rev 5     STPS120M 2 Package information Package information • Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 STmite package information Figure 10. STmite package outline L3 D b2 b H L2 L E R C A A1 0° to 6° R1 DocID8632 Rev 5 5/8 8 Package information STPS120M Table 5. STmite package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.85 1.00 1.15 0.033 0.039 0.045 A1 -0.05 0.05 -0.002 0.002 b 0.40 0.65 0.016 0.025 b2 0.70 1.00 0.027 0.039 c 0.10 0.25 0.004 0.010 D 1.75 1.90 2.05 0.069 0.007 0.081 E 1.75 1.90 2.05 0.069 0.007 0.081 H 3.60 3.75 3.90 0.142 0.148 0.154 L 0.50 0.63 0.80 0.020 0.025 0.031 L2 1.20 1.35 1.50 0.047 0.053 0.059 L3 0.50 0.019 R 0.07 0.003 R1 0.07 0.03 Figure 11. Footprint 1.82 1.38 2.03 0.75 1.10 0.50 6/8 0.71 DocID8632 Rev 5 STPS120M 3 Ordering information Ordering information Table 6. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STPS120M 120 STmite 15.5 mg 12000 Tape and reel Revision history Table 7. Document revision history Date Revision Changes Jul-2003 2A 13-Sep-2004 3 STmite package dimensions reference A1 change: from blank (min) to -0.05mm and from 0.10 (max) to 0.05mm. 16-Feb-2011 4 Migrated from EDOCS. 20-Jul-2015 5 Updated Table 4 and reformatted to current standard. Last update. DocID8632 Rev 5 7/8 8 STPS120M IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 8/8 DocID8632 Rev 5