STPS1L40AY

STPS1L40-Y Automotive low drop power Schottky rectifier Datasheet - production data Description A K Single chip Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. A A K Packaged in SOD123Flat, SMA and SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free-wheeling and polarity protection in automotive applications. K SMA SMB A K Table 1: Device summary SOD123Flat Features        AEC-Q101 qualified Very small conduction losses Negligible switching losses Low forward voltage drop Surface mount miniature packages Avalanche capability specified PPAP capable October 2016 Symbol Value IF(AV) 1A VRRM 40 V VF (typ.) 0.37 V Tj (max.) 175 °C DocID018247 Rev 2 This is information on a product in full production. 1/13 www.st.com Characteristics 1 STPS1L40-Y Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol VRRM Parameter Value Unit 40 V 1 A Repetitive peak reverse voltage Tj = -40 °C to +175 °C IF(AV) Average forward current δ = 0.5, square wave SMA/SMB: TL = 155 °C IFSM Surge non repetitive forward current, tp = 10 ms sinusoidal SMA/SMB 60 SOD123Flat 50 PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 65 Tstg SOD123Flat: TL = 160 °C Storage temperature range Tj A W -65 to +175 Operating junction temperature range(1) °C -40 to +175 Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Symbol Rth(j-l) Parameter Junction to lead Max. value SMA 30 SMB 25 SOD123Flat 20 Unit °C/W Table 4: Static electrical characteristics Symbol IR(1) VF(2) Parameter Test conditions Reverse leakage current Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 1 A Typ. - 6 - Max. Unit 35 µA 10 mA 0.50 0.37 0.42 Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.23 x IF(AV) + 0.19 x IF2(RMS) For more information, please refer to the following application notes related to the power losses.   2/13 AN604 (Calculation of conduction losses in a power rectifier) AN4021 (Calculation of reverse losses in a power diode) DocID018247 Rev 2 V STPS1L40-Y 1.1 Characteristics Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current 0.8 Figure 2: Average forward current versus ambient temperature (δ = 0.5) PF(AV) (W) 4.0 IF(AV) (A) SMA δ = 0.05 0.7 δ = 0.1 δ = 0.2 δ = 0.5 3.5 δ= 1 0.6 3.0 0.5 2.5 0.4 2.0 1.5 0.3 1.0 0.2 T T 0.5 0.1 IF(AV) (A) 0.0 0.0 δ = tp /T δ = tp /T tp 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Tamb(°C) tp 0.0 25 50 75 100 125 150 175 1.6 Figure 3: Average forward current versus ambient temperature (δ = 0.5) 4.0 Rth(j-a) = Rth(j-l) Figure 4: Average forward current versus ambient temperature (δ = 0.5) 5 IF(AV) (A) IF(AV)(A) SOD123 flat SMB Rth(j-a) = Rth(j-l) Rth(j-a) = Rth(j-l) 3.5 4 3.0 2.5 3 2.0 1.5 2 1.0 T 0.5 δ = tp /T T 1 Tamb(°C) tp 0.0 0 25 50 75 100 125 150 δ = tp/T 175 Tamb(°C) tp 0 0 Figure 5: Normalized avalanche power derating versus pulse duration (Tj = 125 °C) 1 PARM (t p ) PARM (10 µs) 25 50 75 100 125 150 175 Figure 6: Relative variation of thermal impedance junction to ambient versus pulse duration 1.0 Zth(j-a)/Rth(j-a) SMA 0.9 0.8 0.7 0.1 0.6 Epoxy printed circuit board, copper thickness = 35 µm, recommended pad layout 0.5 0.4 0.3 0.01 0.2 0.1 t p (µs) 0.001 1 10 100 Single pulse 0.0 1.E-02 t P (s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1000 DocID018247 Rev 2 3/13 Characteristics STPS1L40-Y Figure 7: Relative variation of thermal impedance junction to ambient versus pulse duration 1.0 0.8 0.8 0.7 0.7 0.6 0.6 Epoxy printed circuit board, copper thickness = 35 µm, recommended pad layout 0.4 0.5 0.4 0.3 0.3 0.2 0.1 SOD123Flat 0.9 SMB 0.5 Zth(j-l)/Rth(j-l) 1.0 Zth(j-a)/Rth(j-a) 0.9 Figure 8: Relative variation of thermal impedance junction to lead versus pulse duration Single pulse 0.0 1.E-02 0.2 t P (s) Single pulse 0.1 1.E-01 1.E+00 1.E+01 1.E+02 tp(s) 1.E+03 0.0 1.E-04 Figure 9: Reverse leakage current versus reverse voltage applied (typical values) 1.E+02 IR(mA) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 10: Junction capacitance versus reverse voltage applied (typical values) 1000 C(pF) F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+01 Tj = 125 °C Tj = 100 °C 1.E+00 100 Tj = 75 °C 1.E-01 Tj = 50 °C 1.E-02 Tj = 25 °C VR(V) VR(V) 10 1.E-03 0 5 10 15 20 25 30 35 Figure 11: Forward voltage drop versus forward current (typical values) 1 40 10 100 Figure 12: Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 Rth(j-a)(°C/W) SMA 150 100 Epoxy printed board FR4, eCu = 35 µm 50 SCu (cm²) 0 0.0 4/13 DocID018247 Rev 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 STPS1L40-Y Characteristics Figure 13: Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 Figure 14: Thermal resistance junction to ambient versus copper surface under each lead (typical values) 250 Rth(j-a)(°C/W) Rth(j-a)(C/W) SOD123Flat SMB 200 150 150 100 100 Epoxy printed board FR4, eCu = 35 µm Epoxy printed board FR4, eCu = 35 µm 50 50 SCu (cm²) SCu (cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DocID018247 Rev 2 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5/13 5.0 Package information 2 STPS1L40-Y Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   2.1 Epoxy meets UL94, V0 Cooling method: by conduction (C) SMA package information Figure 15: SMA package outline E1 D E A1 A2 C L b Table 5: SMA package mechanical data Dimensions Ref. 6/13 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.097 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 DocID018247 Rev 2 Package information STPS1L40-Y Figure 16: SMA recommended footprint in mm (inches) 1.4 (0.055) 2.63 1.4 (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) DocID018247 Rev 2 7/13 Package information 2.2 STPS1L40-Y SMB package information Figure 17: SMB package outline Table 6: SMB package mechanical data Dimensions Ref. 8/13 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 1.95 2.20 0.0768 0.0867 c 0.15 0.40 0.0059 0.0157 D 3.30 3.95 0.1299 0.1556 E 5.10 5.60 0.2008 0.2205 E1 4.05 4.60 0.1594 0.1811 L 0.75 1.50 0.0295 0.0591 DocID018247 Rev 2 Package information STPS1L40-Y Figure 18: SMB recommended footprint 1.62 0.064 2.60 (0.102) 1.62 0.064 2.18 (0.086) 5.84 (0.230) millimeters (inches) DocID018247 Rev 2 9/13 Package information 2.3 STPS1L40-Y SOD123Flat package information Figure 19: SOD123Flat package outline A C1 L HD D L C b E Table 7: SOD123Flat package mechanical data Dimensions Ref. 10/13 Millimeters Min. Typ. Max. A 0.86 0.98 1.10 b 0.80 0.90 1.00 c 0.08 0.15 0.25 c1 0.00 D 2.50 2.60 2.70 E 1.50 1.60 1.80 HD 3.30 3.50 3.70 L 0.45 0.65 0.85 DocID018247 Rev 2 0.10 Package information STPS1L40-Y Figure 20: SOD123Flat footprint dimensions (mm) 1.60 1.40 1.30 DocID018247 Rev 2 11/13 Ordering information 3 STPS1L40-Y Ordering information Table 8: Ordering information Order code 4 Marking Package Weight Base qty. Delivery mode STPS1L40AY GB4Y SMA 68 mg 5000 Tape and reel STPS1L40UY GC4Y SMB 107 mg 2500 Tape and reel STPS1L40ZFY 1Y4 SOD123Flat 12.5 mg 3000 Tape and reel Revision history Table 9: Document revision history 12/13 Date Revision Changes 21-Oct-2011 1 First issue. 01-Oct-2016 2 Added SOD123Flat package. DocID018247 Rev 2 STPS1L40-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID018247 Rev 2 13/13