STPS30150CG

STPS30150C High voltage power Schottky rectifier Datasheet - production data Features A1 K   A2    K  A2 K A1 A2 A1 K TO-220AB TO-220FPAB High junction temperature capability Good trade off between leakage current and forward voltage drop Low leakage current Avalanche capability specified Insulated package: TO-220FPAB  Insulating voltage = 2000 VRMS sine ECOPACK®2 compliant component for D²PAK on demand Description Dual center tap Schottky rectifier designed for high frequency switch mode power supply. Table 1: Device summary A2 TO-247 K A1 Symbol Value IF(AV) 2 x 15 A VRRM 150 V Tj (max) 175 °C VF (typ) 0.69 V K K A2 A2 A1 A1 D2PAK May 2017 DocID7757 Rev 9 This is information on a product in full production. 1/16 www.st.com Characteristics 1 STPS30150C Characteristics Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified) Symbo l Parameter Value Unit VRRM Repetitive peak reverse voltage 150 V IF(RMS) Forward rms current 30 A IF(AV) Average forward current δ = 0.5, square wave TC = 120 °C Per diode 15 TC = 90 °C Per device 30 TC = 155 °C Per diode 15 TC = 150 °C Per device 30 TO-220FPAB TO-220AB, D2PAK, TO-247 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 220 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 750 W -65 to +175 °C +175 °C Tstg Storage temperature range Maximum operating junction temperature Tj (1) Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameter Symbol Parameter Max. value TO-220AB, D2PAK 1.6 TO-220FPAB Per diode TO-247 Rth(j-c) Junction to case TO-220AB, °C/W 0.85 Total TO-247 TO-220AB, 3.3 0.8 D2PAK, TO-247 Coupling TO-220FPAB When the diodes 1 and 2 are used simultaneously: ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) 2/16 4 1.5 D2PAK TO-220FPAB Rth(c) Unit DocID7757 Rev 9 0.1 - °C/W 2.6 STPS30150C Characteristics Table 4: Static electrical characteristics (per diode) Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 125 °C VR = VRRM IF = 15 A IF = 30 A Min. Max. Unit - 6.5 µA - 8.0 mA - 0.92 - Typ. 0.69 - 0.75 1 0.8 V 0.86 Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.64 x IF(AV) + 0.0073 IF2(RMS) DocID7757 Rev 9 3/16 Characteristics 1.1 STPS30150C Characteristics (curves) Figure 2: Average forward current versus ambient temperature (δ = 0.5, per diode) Figure 1: Average forward power dissipation versus average forward current (per diode) IF(AV)(A) PF(AV) (W) 18 14 δ = 0.1 δ = 0.2 12 δ = 0.5 Rth(j-a)=Rth(j-c) 16 δ = 0.05 14 10 δ= 1 12 8 10 6 8 4 Rth(j-a)=Rth(j-c) T 4 IF(AV) (A) δ=tp/T 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 tp 16 17 2 18 δ=tp/T Figure 3: Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM(t p ) PARM(10 µs) Tamb (°C) tp 0 0 1 TO-220FP Rth(j-a)=15°C/W 6 T 2 2 TO-220AB / TO-247 / D PAK 25 50 75 100 125 150 175 Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, D²PAK, TO-247) Z th(j-c) /Rth(j-c) 1.0 0.9 0.8 0.1 0.7 0.6 δ = 0.5 0.5 0.01 0.4 δ = 0.2 0.3 δ = 0.1 T 0.2 t p (µs) Single pulse 0.1 0.001 1 10 100 1000 t p(s) 1.E-03 Figure 5: Relative variation of thermal impedance junction to case versus pulse duration (TO220FPAB) δ=tp/T tp 0.0 1.E-02 1.E-01 1.E+00 Figure 6: Reverse leakage current versus reverse voltage applied (typical values, per diode) IR(µA) Z th(j-c ) /Rth(j-c) 1E+5 1.0 Tj=175°C 0.9 1E+4 Tj=150°C 0.8 1E+3 0.7 0.6 Tj=125°C δ = 0.5 1E+2 0.5 Tj=100°C 0.4 0.3 0.2 1E+1 δ = 0.2 T δ = 0.1 0.1 t p(s) Single pulse δ=tp/T 1E+0 4/16 VR(V) 1E-1 tp 0 0.0 1.E-0 3 Tj=25°C 1.E-0 2 1.E-0 1 1.E+0 0 1.E+01 DocID7757 Rev 9 25 50 75 100 125 150 STPS30150C Characteristics Figure 8: Forward voltage drop versus forward current (per diode) Figure 7: Junction capacitance versus reverse voltage applied (typical values, per diode) IF (A) C(pF) 100.0 1000 F=1MHz V OS C =30mV T j=25°C Tj=125°C (maxi mum values) RMS 10.0 Tj=125°C (typical values) 100 Tj=25°C (maxi mum values) 1.0 VR(V) VF (V) 10 1 2 5 10 20 50 100 0.1 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Figure 9: Thermal resistance junction to ambient versus copper surface under tab for D²PAK (typical values) 80 Rth(j-a) (°C/W) 70 60 50 40 30 20 Epoxy printed board FR4, eCU= 35 µm 10 SCu(cm²) 0 0 5 10 15 20 DocID7757 Rev 9 25 30 35 40 5/16 1.6 Package information 2 STPS30150C Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     6/16 Cooling method: by conduction (C) Epoxy meets UL 94,V0 Torque values (TO-220AB and TO-220FPAB): 0.55 N·m recommended; 0.7 N·m maximum Torque values (TO-247): 0.55 N·m recommended; 1.0 N·m maximum DocID7757 Rev 9 STPS30150C 2.1 Package information D²PAK package information Figure 10: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID7757 Rev 9 7/16 Package information STPS30150C Table 5: D²PAK package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 8/16 Inches 0.4 typ. 0° 0.015 8° DocID7757 Rev 9 0° 8° STPS30150C Package information Figure 11: D²PAK recommended footprint (dimensions in mm) 2.2 TO-220AB package information Figure 12: TO-220AB package outline DocID7757 Rev 9 9/16 Package information STPS30150C Table 6: TO-220AB package mechanical data Dimensions Ref. Inches(1) Millimeters Min. Max. Min. Max. A 4.40 4.60 0.1732 0.1811 b 0.61 0.88 0.0240 0.0346 b1 1.14 1.70 0.0449 0.0669 c 0.48 0.70 0.0189 0.0276 D 15.25 15.75 0.6004 0.6201 D1 1.27 typ. 0.0500 typ. E 10.00 10.40 0.3937 0.4094 e 2.40 2.70 0.0945 0.1063 e1 4.95 5.15 0.1949 0.2028 F 1.23 1.32 0.0484 0.0520 H1 6.20 6.60 0.2441 0.2598 J1 2.40 2.72 0.0945 0.1071 L 13.00 14.00 0.5118 0.5512 L1 3.50 3.93 0.1378 0.1547 L20 16.40 typ. 0.6457 typ. L30 28.90 typ. 1.1378 typ. ØP 3.75 3.85 0.1476 0.1516 Q 2.65 2.95 0.1043 0.1161 Notes: (1)Inch 10/16 dimensions are for reference only. DocID7757 Rev 9 STPS30150C 2.3 Package information TO-220FPAB package information Figure 13: TO-220FPAB package outline DocID7757 Rev 9 11/16 Package information STPS30150C Table 7: TO-220FPAB package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.1739 0.1818 B 2.5 2.7 0.0988 0.1067 D 2.50 2.75 0.0988 0.1087 E 0.45 0.70 0.0178 0.0277 F 0.75 1.0 0.0296 0.0395 F1 1.15 1.70 0.0455 0.0672 F2 1.15 1.70 0.0455 0.0672 G 4.95 5.20 0.1957 0.2055 G1 2.40 2.70 0.0949 0.1067 H 10.00 10.40 0.3953 0.4111 L2 12/16 Inches 16.00 typ. 0.6324 typ. L3 28.60 30.60 1.1304 1.2095 L4 9.80 10.6 0.3874 0.4190 L5 2.90 3.60 0.1146 0.1423 L6 15.90 16.40 0.6285 0.6482 L7 9.00 9.30 0.3557 0.3676 Dia 3.0 3.20 0.1186 0.1265 DocID7757 Rev 9 STPS30150C 2.4 Package information TO-247 package information Figure 14: TO-247 package outline 0075325_8 DocID7757 Rev 9 13/16 Package information STPS30150C Table 8: TO-247 package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Typ. Max. A 4.85 5.15 0.191 0.203 A1 2.20 2.60 0.086 0.102 b 1.00 1.40 0.039 0.055 b1 2.00 2.40 0.078 0.094 b2 3.00 3.40 0.118 0.133 c 0.40 0.80 0.015 0.031 D(1) 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 0.620 e 5.30 5.60 0.209 L 14.20 14.80 0.559 0.582 L1 3.70 4.30 0.145 0.169 L2 5.45 18.50 0.215 0.220 0.728 ØP(2) 3.55 3.65 0.139 0.143 ØR 4.50 5.50 0.177 0.217 S 5.30 5.70 0.209 5.50 Notes: (1)Dimension (2)Resin 14/16 Min. D plus gate protusion does not exceed 20.5 mm thickness around the mounting hole is not less than 0.9 mm. DocID7757 Rev 9 0.216 0.224 STPS30150C 3 Ordering information Ordering information Table 9: Ordering information Order code Marking Weight Base qty Delivery mode STPS30150CT STPS30150CT TO-220AB 1.95g 50 Tube STPS30150CFP STPS30150CFP TO-220FPAB 1.9g 50 Tube STPS30150CW STPS30150CW TO-247 4.4g 30 Tube STPS30150CG D2PAK 1.38g 1000 Tape and reel STPS30150CG-TR 4 Package Revision history Table 10: Document revision history Date Revision Feb-2004 7 Previous release 26-Nov-2010 8 Added ECOPACK statement. Corrected package name in Figure 12. 9 Updated features and package silhouettes in cover page. Updated Section 1: "Characteristics", Section 1.1: "Characteristics (curves)", Section 2: "Package information" and Section 3: "Ordering information". Minor text changes. 16-May-2017 Changes DocID7757 Rev 9 15/16 STPS30150C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 16/16 DocID7757 Rev 9