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STPS30L60CTN

STPS30L60CTN

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO-220-3

  • 描述:

    Diode Array 1 Pair Common Cathode Schottky 60V 15A Through Hole TO-220-3

  • 数据手册
  • 价格&库存
STPS30L60CTN 数据手册
STPS30L60C Power Schottky rectifier Datasheet − production data Features ■ Low forward voltage drop ■ Negligible switching losses ■ Low thermal resistance ■ Avalanche capability specified A1 K A2 K Description A2 A2 K A1 A1 These dual center tap Schottky rectifiers are suited for switched mode power supplies and high frequency DC to DC converters. D2PAK STPS30L60CG TO-220FPAB STPS30L60CFP Packaged in TO-220FPAB, TO-220AB narrow leads, TO-220AB, D2PAK, I2PAK and TO-247, this device is intended for use in high frequency inverters. A2 K A1 A1 I2PAK STPS30L60CR TO-220AB STPS30L60CT I V A2 K Electrical characteristics (a) Figure 1. "Forward" I 2 x IO K X IF VRRM VR VAR IO X A2 A2 V A1 IR VTo VF(Io) VF VF(2xIo) "Reverse" IAR K K TO-220AB narrow leads STPS30L100CTN Table 1. A1 TO-247 STPS30L60CW Device summary Symbol Value IF(AV) 2 x 15 A VRRM 60 V Tj (max) 150 °C VF (max) 0.56 V a. VARM and IARM must respect the reverse safe operating area defined in Figure 12 VAR and IAR are pulse measurements (tp < 1 µs). VR, IR, VRRM and VF, are static characteristics June 2012 This is information on a product in full production. Doc ID 6479 Rev 10 1/13 www.st.com 13 Characteristics STPS30L60C 1 Characteristics Table 2. Absolute ratings (limiting values, per diode) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 30 A IF(AV) TO-220AB narrow leads, TO-220AB, I2PAK, D2PAK, Average forward current TO-247, δ = 0.5 TO-220FPAB, δ = 0.5 Tc = 130 °C Per diode Per device 15 30 Tc = 110 °C Per diode Per device 15 30 A IFSM Surge non repetitive forward current tp = 10 ms, sinusoidal 230 A IRRM Repetitive peak reverse current tp = 2 µs square, F = 1 kHz 2 A 7800 W PARM(1) Repetitive peak avalanche power tp = 1 µs, Tj = 25 °C VARM (2) Maximum repetitive peak avalanche voltage tp < 1 µs, Tj < 150 °C, IAR < 29 A 80 V VASM (2) Maximum single pulse peak avalanche voltage tp < 1 µs, Tj < 150 °C, IAR < 29 A 80 V -65 to + 175 °C 150 °C 10000 V/µs Tstg Tj dV/dt Storage temperature range Maximum operating junction temperature(3) Critical rate of rise reverse voltage 1. For temperature or pulse time duration deratings, refer to Figure 4 and Figure 5. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the application notes AN1768 and AN2025. 2. Refer to Figure 12. 3. 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistances Symbol Rth(j-c) Parameter Junction to case Per diode TO-220AB narrow leads, TO-220AB, I2PAK, D2PAK, TO-247 Total 1.5 Per diode 4.7 Total 3.95 TO-220FPAB Rth(c) Coupling 0.1 TO-220FPAB 3.2 Doc ID 6479 Rev 10 Unit 0.8 TO-220AB narrow leads, TO-220AB, I2PAK, D2PAK, TO-247 When the diodes 1 and 2 are used simultaneously: ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode2) x Rth(c) 2/13 Value °C/W STPS30L60C Table 4. Characteristics Static electrical characteristics (per diode) Symbol IR (1) Parameter Tests conditions Tj = 25 °C Reverse leakage current VF (1) Typ. VR = VRRM Tj = 125 °C Forward voltage drop Min. Tj = 25 °C IF = 15 A Tj = 125 °C IF = 15 A Tj = 25 °C IF = 30 A Tj = 125 °C IF = 30 A 77 Max. Unit 480 µA 130 mA 0.6 0.5 0.56 0.75 0.65 V 0.7 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.009x IF2(RMS) Figure 2. 12 Average forward power dissipation Figure 3. versus average forward current (per diode) 18 PF(av)(W) δ = 0.1 10 IF(av)(A) Rth(j-a)=Rth(j-c) 16 δ=1 δ = 0.5 δ = 0.2 Average forward current versus ambient temperature (δ = 0.5, per diode) TO-220AB, TO-220AB narrow leads, I2PAK, D2PAK, TO-247 14 δ = 0.05 12 TO-220FPAB 8 10 8 6 Rth(j-a)=15 °C/W 6 4 2 2 IF(av) (A) 0 T 4 T δ=tp/T δ=tp/T 0 0 2 Figure 4. 4 6 8 10 12 14 16 18 Tamb(°C) tp 0 tp 25 50 75 100 125 150 20 Normalized avalanche power derating versus pulse duration Figure 5. PARM(tp) PARM(1 µs) Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 Tj(°C) tp(µs) 0.1 1 0 10 100 1000 25 Doc ID 6479 Rev 10 50 75 100 125 150 3/13 Characteristics Figure 6. STPS30L60C Relative variation of thermal Figure 7. impedance junction to case versus pulse duration Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) 1.0 0.8 Zth(j-c)/Rth(j-c) 1.0 0.9 TO-220AB, TO-220 narrow leads TO-247, D2PAK, I2PAK 0.8 0.7 0.6 δ = 0.5 δ=0.5 0.6 0.5 0.4 δ = 0.2 0.4 δ = 0.1 0.3 0.2 δ=0.2 0.2 Single pulse tp(s) 0.0 1E-4 1E-3 1E-2 0.1 1E-1 1E+0 Single pulse 5E+2 Reverse leakage current versus reverse voltage applied (typical values, per diode) tp(s) Figure 9. 1.E-02 1.E-01 1.E+00 1.E+01 Junction capacitance versus reverse voltage applied (typical values, per diode) 2.0 F=1MHz Tj=25°C Tj=150°C Tj=125°C 1E+1 tp C(nF) IR(mA) 1E+2 δ=tp/T 0.0 1.E-03 Figure 8. T δ=0.1 1.0 Tj=100°C 0.5 Tj=75°C 1E+0 Tj=50°C 1E-1 1E-2 4/13 0.2 Tj=25°C VR(V) VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 60 0.1 1 Doc ID 6479 Rev 10 10 100 STPS30L60C Characteristics Figure 10. Forward voltage drop versus forward current (maximum values, per diode) Figure 11. Thermal resistance junction to ambient versus copper surface under tab for D2PAK Rth(j-a)(°C/W) 200 IFM(A) 80 Epoxy printed circuit board copper thickness = 35 µm 70 100 Typical values Tj=150°C Tj=25°C 60 50 40 10 30 Tj=125°C 20 VFM(V) 10 1 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 S(cm²) 0 0 5 10 15 20 25 30 35 40 Figure 12. Reverse safe operating area (tp < 1 µs, Tj < 150 °C) 40 38 36 34 32 30 28 26 24 22 20 IARM (A) Forbidden area Operating area VARM (V) 60 65 70 75 80 Doc ID 6479 Rev 10 85 90 5/13 Package information 2 STPS30L60C Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque values: TO-220AB, TO-220AB narrow leads, and TO-220FPAB 0.4 to 0.6 N·m, TO-247 0.55 N·m (1.0 N·m maximum) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. TO-220FPAB dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 A B H Dia L6 L2 L7 L3 L5 F1 L4 D F2 F L2 E G1 G 6/13 Doc ID 6479 Rev 10 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 STPS30L60C Package information Table 6. TO-220AB dimensions Dimensions Ref. A H2 Dia C L5 L7 L6 L2 F2 F1 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.06è G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 D L9 L4 F L2 M G1 E G 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. Doc ID 6479 Rev 10 16.4 typ. 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 7/13 Package information STPS30L60C Table 7. TO-220AB narrow leads dimensions Dimensions Ref. Millimeters Min. A P E F Q H1 D1 L20 L30 L1 b1(x3) L 1 2 C b (x3) e1 8/13 Min. Typ. Max. 4.40 4.60 0.17 0.18 b 0.61 0.88 0.024 0.034 b1 0.95 1.20 0.037 0.047 c 0.48 0.70 0.019 0.027 D 15.25 15.75 0.60 0.62 1.27 0.05 E 10.00 10.40 0.39 0.41 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.19 0.20 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.24 0.26 J1 2.40 2.72 0.095 0.107 L 13.00 14.00 0.51 0.55 L1 2.60 2.90 0.102 0.114 J1 3 e Max. A D1 D Typ. Inches L20 15.40 0.61 L30 28.90 1.14 ∅P 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 Doc ID 6479 Rev 10 STPS30L60C Package information Table 8. D2PAK dimensions Dimensions Ref. A E C2 L2 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R 0.40 typ. V2 0° 0.016 typ. 8° 0° 8° Figure 13. Footprint (dimensions in millimeters) 16.90 10.30 5.08 1.30 8.90 Doc ID 6479 Rev 10 3.70 9/13 Package information STPS30L60C Devices in I2PAK with nickel-plated back frame must NOT be mounted by frame soldering like SMDs. Such devices are intended to be through-hole mounted ONLY and in no circumstances shall ST be held liable for any lack of performance or damage arising out of soldering of nickel-plated back frames. Table 9. I2PAK dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 A E c2 L2 D L1 A1 b1 L b c e e1 10/13 Doc ID 6479 Rev 10 STPS30L60C Package information Table 10. TO-247 dimensions Dimensions Ref. Millimeters Min. V V Dia A H L5 L2 Max. Min. Typ. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F1 3.00 0.118 F2 2.00 0.078 F3 2.00 2.40 0.078 0.094 F4 3.00 3.40 0.118 0.133 G L Typ. Inches 10.90 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.169 L4 F2 F1 L3 L1 F3 V2 D F4 F(x3) M G L2 E L3 0.145 18.50 14.20 0.728 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. Doc ID 6479 Rev 10 3.55 3.65 0.139 0.143 11/13 Ordering information 3 STPS30L60C Ordering information Table 11. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS30L60CW STPS30L60CW TO-247 4.4 g 30 Tube STPS30L60CT STPS30L60CT TO-220AB 2.3 g 50 Tube STPS30L60CG 4 STPS30L60CG D PAK 1.5 g 50 Tube STPS30L60CG-TR STPS30L60CG D2 PAK 1.5 g 1000 Tape and reel STPS30L60CR STPS30L60CR I2PAK 1.49 g 50 Tube STPS30L60CFP STPS30L60CFP TO-220FPAB 2.0 g 50 Tube STPS30L60CTN STPS30L60CTN TO-220AB narrow leads 1.9 g 50 Tube Revision history Table 12. 12/13 2 Document revision history Date Revision Description of changes July-2003 3B 16-Oct-2006 4 Reformatted to current standards. Corrected dimensions for I2PAK in Table 5. 28-Nov-2006 5 Added TO-220FPAB package. Added STPS30L60CG-TR to ordering information. 07-Mar-2007 6 Updated thermal parameters in Table 2. 31-Mar-2007 7 Updated TC = 110 °C in Table 1. 25-Aug-2008 8 Reformatted to current standards. Updated ECOPACK statement. Updated torque values and dimension illustration for TO-247 in Section 2. 07-Feb-2011 9 Added electrical diagram on first page. Added parameters VARM and VASM to Table 2. Added Figure 12. Updated and added warning paragraph above Table 9. Updated Table 11. 15-Jun-2012 10 Added TO-220AB narrow leads package. Initial release Doc ID 6479 Rev 10 STPS30L60C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 6479 Rev 10 13/13
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