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STPSC806D

STPSC806D

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO220-2

  • 描述:

    DIODE SCHOTTKY 600V 8A TO220AC

  • 数据手册
  • 价格&库存
STPSC806D 数据手册
STPSC806 600 V power Schottky silicon carbide diode Features ■ No or negligible reverse recovery ■ Switching behavior independent of temperature ■ Particularly suitable in PFC boost diode function A K TO-220AC STPSC806D Description The SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide band gap material allows the design of a Schottky diode structure with a 600 V rating. Due to the Schottky construction no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. ST SiC diodes will boost the performance of PFC operations in hard switching conditions. November 2010 K A NC D2PAK STPSC806G Table 1. Doc ID 16286 Rev 3 Device summary IF(AV) 8A VRRM 600 V Tj (max) 175 °C QC (typ) 10 nC 1/8 www.st.com 8 Characteristics 1 STPSC806 Characteristics Table 2. Absolute ratings (limiting values at 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Forward rms current 18 A 8 A 30 24 120 A Average forward current Tc = 115 °C, δ = 0.5 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal, Tc = 25 °C tp = 10 ms sinusoidal, Tc = 125 °C tp = 10 µs square, Tc = 25 °C IFRM Repetitive peak forward current Tc = 115 °C, Tj = 150 °C, δ = 0.1, 30 A Tstg Storage temperature range -55 to +175 °C Operating junction temperature -40 to +175 °C IF(AV) Tj Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Symbol Parameter Maximum value Unit 2.4 °C/W Junction to case Static electrical characteristics Parameter IR (1) Reverse leakage current VF (2) Forward voltage drop Tests conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 8 A Min. Typ. Max. - 20 100 - 150 1000 - 1.4 1.7 - 1.6 2.1 Unit µA V 1. tp = 10 ms, δ < 2% 2. tp = 500 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.2 x IF(AV) + 0.113 x IF2(RMS) Table 5. Symbol 2/8 Other parameters Parameter Test conditions Qc Total capacitive charge C Total capacitance Typ. Unit Vr = 400 V, IF = 8 A dIF/dt = -200 A/µs Tj = 150 °C 10 nC Vr = 0 V, Tc = 25 °C, F = 1 Mhz 450 Vr = 400 V, Tc = 25 °C, F = 1 Mhz 35 Doc ID 16286 Rev 3 pF STPSC806 Characteristics Figure 1. Forward voltage drop versus forward current (typical values) Figure 2. IFM(A) 16 1.E+04 Reverse leakage current versus reverse voltage applied (maximum values) IR(µA) 14 Tj=175 °C 1.E+03 12 Tj=25 °C Tj=150 °C 10 Tj=150 °C 1.E+02 8 Tj=175 °C 1.E+01 6 4 1.E+00 Tj=25 °C 2 VR(V) VFM(V) 1.E-01 0 0.0 0.5 Figure 3. 1.0 1.5 2.0 2.5 0 3.0 Peak forward current versus case temperature Figure 4. IM(A) 100 150 200 250 300 350 400 450 500 550 600 Junction capacitance versus reverse voltage applied (typical values) C(pF) 70 350 T δ=0.1 60 50 δ=tp/T F=1 MHz VOSC=30 mVRMS Tj=25 °C 300 tp 50 250 40 200 δ=0.3 30 150 δ=0.5 100 20 δ=1 10 δ=0.7 50 VR(V) TC(°C) 0 0 0 25 50 75 100 125 150 175 1 Doc ID 16286 Rev 3 10 100 1000 3/8 Characteristics Figure 5. 1.0 STPSC806 Relative variation of thermal impedance junction to case versus pulse duration Figure 6. Non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) IFSM(A) Zth(j-c)/Rth(j-c) 1.E+03 0.9 0.8 0.7 1.E+02 0.6 Tc=25 °C 0.5 Tc =125 °C 0.4 1.E+01 0.3 0.2 0.1 Single pulse tp(s) tp(s) 0.0 1.E-05 Figure 7. 1.E+00 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E-05 1.E-04 1.E-03 Total capacitive charge versus dIF/dt (typical values) 16 QC(nC) IF=8A VR=400 V Tj=150 °C 14 12 10 8 6 4 2 dIF/dt(A/µs) 0 0 4/8 50 100 150 200 250 300 350 Doc ID 16286 Rev 3 400 450 500 1.E-02 1.E-01 1.E+00 STPSC806 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: convection (C) ● Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. TO-220AC dimensions Dimensions Ref. A H2 ØI C L5 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L7 L6 L2 F1 D L9 L2 L4 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 F M E G M Diam. l Doc ID 16286 Rev 3 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 5/8 Package information Table 7. STPSC806 D2PAK dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R V2 Figure 8. 0.40 typ. 0° 8° Footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 6/8 Doc ID 16286 Rev 3 3.70 0.016 typ. 0° 8° STPSC806 3 Ordering information Ordering information Table 8. Ordering information Order code Marking Package Weight Base qty Delivery mode STPSC806D STPSC806D TO-220AC 1.86 g 50 Tube 1.48 g 1000 Tape and reel STPSC806G-TR 4 STPSC806G 2 D PAK Revision history Table 9. Document revision history Date Revision Changes 24-Sep-2009 1 First issue 16-June-2010 2 Added D2PAK package. 03-Nov-2010 3 Updated Table 8. Doc ID 16286 Rev 3 7/8 STPSC806 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 Doc ID 16286 Rev 3
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