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STS15N4LLF5

STS15N4LLF5

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOT96-1

  • 描述:

    MOSFET N-CH 40V 15A 8SOIC

  • 数据手册
  • 价格&库存
STS15N4LLF5 数据手册
STS15N4LLF5 N-channel 40 V, 0.00625 Ω, 15 A, SO-8 STripFET™ Power MOSFET Features Type VDSS RDS(on) max. ID STS15N4LLF5 40 V < 0.0076 Ω 15 A ■ Optimal RDS(on)x Qg trade-off @ 4.5 V ■ Conduction losses reduced ■ Switching losses reduced ) s ( ct u d o r P e SO-8 Applications ■ t e l o Switching application Description This STripFET™V Power MOSFET technology is among the latest improvements, which have been especially tailored to achieve very low on-state resistance providing also one of the best-in-class figure of merit (FOM). ) (s s b O Figure 1. Internal schematic diagram t c u d o r P e t e l o s b O Table 1. Device summary Order code Marking Package Packaging STS15N4LLF5 15C4L SO-8 Tape and reel April 2010 Doc ID 17339 Rev 1 1/12 www.st.com 12 Contents STS15N4LLF5 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 2/12 Doc ID 17339 Rev 1 STS15N4LLF5 1 Electrical ratings Electrical ratings Table 2. Absolute maximim ratings Symbol Parameter Unit 40 V VDS Drain-source voltage (VGS = 0) VGS Gate-source voltage ± 16 V Gate- source voltage ±18 V ID Drain current (continuous) at TC = 25 °C 15 A ID Drain current (continuous) at TC = 100 °C 10 (1) VGS IDM (2) Drain current (pulsed) PTOT Total dissipation at TC = 25 °C 3 EAS (3) Single pulse avalanche energy 1090 P e Thermal resistance Symbol Rthj-pcb(1) Tl Tstg Parameter A W mJ t e l o 3. Starting Tj = 25 °C, ID = 7.5 A, VDD = 25 V Table 3. ct du ro 2. Pulse width limited by Tjmax (s) A 63.6 1. Guaranteed for test time < 15ms 1. Value s b O Value Unit 47 °C/W Maximum lead temperature for soldering -55 to 150 °C Storage temperature -55 to 150 °C )- Thermal resistance junction-pcb max u d o s ( t c 2 When mounted of FR-4 board with 1 inch pad, 2oz of Cu and t < 10 sec r P e t e l o s b O Doc ID 17339 Rev 1 3/12 Electrical characteristics 2 STS15N4LLF5 Electrical characteristics (TJ = 25 °C unless otherwise specified) Table 4. On/off states Symbol Parameter Drain-source breakdown voltage ID = 250 µA, VGS= 0 IDSS Zero gate voltage drain current (VGS = 0) VDS = max rating, VDS =max rating @125°C IGSS Gate body leakage Current (VDS = 0) VGS = ±16 V VGS(th) Gate threshold voltage VDS= VGS, ID = 250 µA RDS(on) Static drain-source on resistance VGS= 10 V, ID= 7.5 A VGS= 4.5 V, ID= 7.5 A V(BR)DSS Table 5. s b O Test conditions Typ. Max. 40 Unit V 10 100 µA µA ±200 nA ) s ( ct u d o 1 Pr V 0.00625 0.0067 0.0076 0.0083 Ω Ω Min. Typ. Max. Unit VDS = 25 V, f=1 MHz, VGS= 0 - 1570 257 32 - pF pF pF Input capacitance Output capacitance Reverse transfer capacitance Qg Qgs Qgd Total gate charge Gate-source charge Gate-drain charge VDD = 15 V, ID = 18 A VGS = 4.5 V (see Figure 14) - 12.9 3.9 5.3 - nC nC nC Gate input resistance f=1 MHz Gate DC Bias = 0 Test signal level = 20 mV open drain - 1.5 - Ω Test conditions Min. Typ. Max. Unit - 14 42 - ns ns - 37 5.2 - ns ns e t e l 4/12 Parameter Min. Ciss Coss Crss RG O e t e ol Dynamic Symbol o s b Test conditions )- s ( t c du o r P Table 6. Symbol Switching times Parameter td(on) tr Turn-on delay time Rise time td(off) tf Turn-off delay time Fall time VDD = 15 V, ID = 9 A, RG = 4.7 Ω, VGS = 10 V (see Figure 16) Doc ID 17339 Rev 1 STS15N4LLF5 Electrical characteristics Table 7. Source drain diode Symbol Parameter ISD ISDM(1) Source-drain current Source-drain current (pulsed) VSD (2) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current trr Qrr IRRM Test conditions Min. Typ. Max. Unit - 18 72 A A ISD = 18 A, VGS = 0 - 1.2 V ISD = 18 A, VDD = 25 V, di/dt = 100 A/µs, Tj = 150 °C (see Figure 15) - 27.2 24.5 1.8 ns nC A ) s ( ct 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration = 300µs, duty cycle 1.5% u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Doc ID 17339 Rev 1 5/12 Electrical characteristics STS15N4LLF5 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Thermal impedance !-V )$ !  Figure 3. 4J # 4C # 3INGLEPULSE AIS ARE IS $3ON TH IN X2 ION MA T A ER BY /P ITED ,IM  MS  MS ) s ( ct S  Figure 4.    Output characterisics Figure 5. !-V )$ ! t e l o   6  O )  s ( t c   du  ro  P e     6        6$36 Normalized BVDSS vs temperature !-V "6$33 NORM s b O   t e l o Figure 6. !-V 6$36 bs    r P e Transfer characteristics )$ ! 6'36  u d o 6$36 Figure 7.     6'36  Static drain-source on resistance !-V 2$3ON M/HM 6'36         6/12       4* #   Doc ID 17339 Rev 1       )$! STS15N4LLF5 Figure 8. Electrical characteristics Gate charge vs gate-source voltage Figure 9. Capacitance variations v !-V 6'3 6 6$$6 )$!  !-V # P& #ISS    #OSS    #RSS ) s ( ct           1GN# Figure 10. Normalized gate threshold voltage vs temperature  u d o 6$36 Figure 11. Normalized on resistance vs temperature !-V 6'3TH  NORM r P e 2$3ON NORM !-V t e l o     s b O  ) (s  t c u     e t e ol Pr od          4* #        4* # Figure 12. Source-drain diode forward characteristics s b O 63$ 6  !-V 4*  #   4* #  4* #           )3$! Doc ID 17339 Rev 1 7/12 Test circuits 3 STS15N4LLF5 Test circuits Figure 13. Switching times test circuit for resistive load Figure 14. Gate charge test circuit VDD 12V 47kΩ 1kΩ 100nF 3.3 µF 2200 RL µF IG=CONST VDD VGS 100Ω Vi=20V=VGMAX VD RG 2200 µF D.U.T. ) s ( t VG 2.7kΩ c u d PW 47kΩ 1kΩ PW D.U.T. AM01468v1 e t e ol o r P AM01469v1 Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test switching and diode recovery times circuit A A D.U.T. FAST DIODE B B A D G S s ( t c 3.3 µF B 25 Ω D 1000 µF RG S r P e 2200 µF 3.3 µF VDD ID Vi D.U.T. Pw let AM01470v1 Figure 17. Unclamped inductive waveform b O L VD VDD u d o G so )- L=100µH s b O AM01471v1 Figure 18. Switching time waveform ton V(BR)DSS tdon VD toff tr tdoff tf 90% 90% IDM 10% ID VDD 10% 0 VDD VDS 90% VGS AM01472v1 8/12 0 Doc ID 17339 Rev 1 10% AM01473v1 STS15N4LLF5 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Doc ID 17339 Rev 1 9/12 Package mechanical data STS15N4LLF5 Table 1. SO-8 mechanical data mm. Dim. Min Typ inch Max Min Typ Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.10 1.65 0.043 0.065 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D (1) 4.80 5.00 0.189 E 3.80 4.00 0.15 e u d o 1.27 0.050 H 5.80 6.20 0.228 h 0.25 0.50 0.010 L 0.40 1.27 k t e l o r P e 0.016 ) s ( ct 0.197 0.157 0.244 0.020 0.050 0° (min.), 8° (max.) ddd s b O 0.10 0.004 1. Dimensions D does not include mold flash, protru-sions or gate burrs. Mold flash, potrusions or gate burrs shall not exceed 0.15mm (.006inch) in total (both side). ) (s Figure 19. Package dimensions t c u d o r P e t e l o s b O 10/12 Doc ID 17339 Rev 1 STS15N4LLF5 5 Revision history Revision history Table 8. Revision history Date Revision 07-Apr-2010 1 Changes First release ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Doc ID 17339 Rev 1 11/12 STS15N4LLF5 ) s ( ct Please Read Carefully: u d o Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. r P e All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. t e l o No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. ) (s s b O UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. t c u UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. d o r P e t e l o Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. s b O ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12 Doc ID 17339 Rev 1
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