STTH16L06CGY-TR

STTH16L06C-Y Automotive Turbo 2 ultrafast high voltage rectifier Datasheet - production data Description A1 The STTH16L06C-Y is specially suited for use in switching power supplies as rectifier and discontinuous mode PFC boost diode for automotive applications. K A2 K Table 1: Device summary A2 A1 K TO-220AB Symbol Value IF(AV) 2x8A VRRM 600 V Tj +175 °C VF (typ.) 1.05 V trr (max.) 35 ns K K A2 A1 D²PAK Features        AEC-Q101 qualified Low reverse recovery current Reduce switching and conduction losses Low thermal resistance Ultrafast switching PPAP capable ECOPACK®2 compliant component September 2017 DocID026936 Rev 3 This is information on a product in full production. 1/12 www.st.com Characteristics 1 STTH16L06C-Y Characteristics Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Tj = -40 °C to +175 °C Average forward current δ = 0.5, square wave IF(AV) IFSM Surge non repetitive forward current Tstg Tj Value Unit 600 V 30 A TC = 140 °C Per diode 8 TC = 135 °C Per device 16 TC = 130 °C Per diode 10 TC = 120 °C Per device 20 A tp = 10 ms sinusoidal 120 A Storage temperature range -65 to +175 °C Operating junction temperature range -40 to +175 °C Table 3: Thermal parameters Symbol Rth(j-c) Parameter Max. value Per diode 2.5 Total 1.6 Junction to case TO-220AB, D²PAK °C/W Coupling Rth(c) Unit 0.7 °C/W When the diodes 1 and 2 are used simultaneously: ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) Table 4: Static electrical characteristics (per diode) Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 150 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 8 A IF = 16 A Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 1.06 x IF(AV) + 0.036 x IF2(RMS) 2/12 DocID026936 Rev 3 Min. Typ. - 8 25 - 240 Unit µA 1.80 1.05 - Max. 1.35 2.08 1.28 1.64 V STTH16L06C-Y Characteristics Table 5: Dynamic electrical characteristics (per diode) Symbol trr IRM tfr VFP Parameter Test conditions Reverse recovery time Reverse recovery current Typ. Max. Unit IF = 0.5 A IR = 1 A Irr = 0.25 A - IF = 1 A VR = 30 V dlF/dt = 50 A/µs - 40 55 Tj = 125 °C IF = 8 A VR = 400 V dlF/dt = 100 A/µs - 4.5 6.5 A IF = 8 A VFR = 1.1 x VFmax., dlF/dt = 100 A/µs 200 ns Tj = 25 °C Tj = 25 °C Forward recovery time Forward recovery voltage Min. DocID026936 Rev 3 35 ns - 3.5 V 3/12 Characteristics 1.1 STTH16L06C-Y Characteristics (curves) Figure 2: Forward voltage drop versus forward current (per diode) Figure 1: Conduction losses versus average forward current (per diode) P(W) 15 δ = 0.1 δ = 0.05 δ = 0.2 δ = 0.5 10 δ= 1 5 T δ =tp/T IF (AV) (A) tp 0 0 2 4 6 8 10 Figure 3: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, D²PAK) Figure 4: Peak reverse recovery current versus dIF/dt (typical values, per diode) IRM(A) Zth (j-c) /Rth (j-c ) 1.0 18 0.9 16 0.8 14 0.7 12 0.6 10 0.5 8 0.4 6 0.3 V R =400V T j =125°C IF =2 x I F(AV ) IF =I F(AV ) IF =0 .5 x I F(AV ) 4 0.2 2 0.1 S in gle puls e dIF /dt(A/µs) t p (s ) 0 0.0 0 1.E -03 1.E -02 1.E -01 50 100 150 200 250 300 350 400 450 500 1.E +00 Figure 5: Reverse recovery time versus dlF/dt (typical values, per diode) Figure 6: Reverse recovery charges versus dlF/dt (typical values, per diode) Qrr (nC) t rr(ns) 800 400 750 V R =400V T j =125°C V R =400V T j =125°C 700 350 IF =2 x I F(AV ) 650 600 300 550 IF =2 x I F(AV ) 500 250 IF =I F(AV ) 450 400 200 IF =0.5 x I F(AV ) 350 IF =I F(AV ) 300 IF =0.5 x I F(AV ) 150 250 200 100 150 100 50 0 0 0 4/12 50 100 150 200 250 300 dIF /dt(A/µs) 50 dIF /dt(A/µs) 350 400 450 500 DocID026936 Rev 3 0 100 200 300 400 500 STTH16L06C-Y Characteristics Figure 7: Relative variations of dynamic parameters versus junction temperature Figure 8: Reverse recovery softness factor versus dlF/dt (typical values, per diode) Sfactor 1.6 IF < 2 x I F(AV ) V R =400V T j =125°C 1.4 1.2 1.0 0.8 0.6 0.4 0.2 dIF /dt(A/µs) 0.0 0 Figure 9: Forward recovery time versus dlF/dt (typical values, per diode) 50 100 150 200 250 300 350 400 450 500 Figure 10: Transient peak forward voltage versus dlF/dt (typical values, per diode) t fr(ns) VF P (V) 180 16 15 IF =I F(AV ) V F R =1.1 x VF max. T j =125°C 160 IF =I F(AV ) T j =125°C 14 13 140 12 11 120 10 9 100 8 80 7 6 60 5 4 40 3 2 20 dIF /dt(A/µs) dIF /dt(A/µs) 1 0 0 0 100 200 300 400 0 500 Figure 11: Junction capacitance versus reverse voltage applied (typical values, per diode) 50 100 150 200 250 300 350 400 450 500 Figure 12: Thermal resistance, junction to ambient, versus copper surface under tab (epoxy FR4, coper thickness = 35 µm)(D2PAK) C(pF) Rth (j-a) (°C/W) 100 80 F =1MH z V O SC =30mV RMS T j =25°C 70 60 50 10 40 30 20 10 VR (V) SC U (c m²) 1 1 10 100 1000 0 0 DocID026936 Rev 3 5 10 15 20 25 30 35 5/12 40 Package information 2 STTH16L06C-Y Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     2.1 Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N·m (for TO-220AB) Maximum torque value: 0.7 N·m (for TO-220AB) D²PAK package information Figure 13: D²PAK package outline 6/12 DocID026936 Rev 3 Package information STTH16L06C-Y Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A1 0.03 0.23 0.001 0.009 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 7.50 7.75 8.00 0.295 0.305 0.315 D2 1.10 1.30 0.051 0.060 E 10 E1 8.50 E2 6.85 e 1.50 0.043 10.40 0.394 8.70 8.90 0.335 0.343 0.346 7.05 7.25 0.266 0.278 0.282 2.54 0.409 0.100 e1 4.88 5.28 0.190 0.205 H 15 15.85 0.591 0.624 J1 2.49 2.69 0.097 0.106 L 2.29 2.79 0.090 0.110 L1 1.27 1.40 0.049 0.055 L2 1.30 1.75 0.050 0.069 R V2 0.4 0° 0.015 8° DocID026936 Rev 3 0° 8° 7/12 Package information STTH16L06C-Y Figure 14: D²PAK recommended footprint (dimensions are in mm) 8/12 DocID026936 Rev 3 Package information STTH16L06C-Y 2.2 TO-220AB package information Figure 15: TO-220AB package outline DocID026936 Rev 3 9/12 Package information STTH16L06C-Y Table 7: TO-220AB package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.240 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 0.620 D1 10/12 Inches 1.27 typ. 0.050 typ. E 10.00 10.40 0.394 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.260 J1 2.40 2.72 0.094 0.107 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 typ. θP 3.75 3.85 0.148 0.152 Q 2.65 2.95 0.104 0.116 DocID026936 Rev 3 Ordering information STTH16L06C-Y 3 Ordering information Table 8: Ordering information Order code 4 Marking Package Weight Base qty. Delivery mode STTH16L06CTY STTH16L06CTY TO-220AB 2.23 g 50 Tube STTH16L06CGY-TR STTH16L06CGY D2PAK 1.48 g 1000 Tape and reel Revision history Table 9: Document revision history Date Revision Changes 19-Nov-2014 1 Initial release. 12-Dec-2014 2 Removed TO-220FPAB and D²PAK package information. 20-Sep-2017 3 Added D²PAK package information. DocID026936 Rev 3 11/12 STTH16L06C-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 12/12 DocID026936 Rev 3