STTH30RQ06GY-TR

STTH30RQ06-Y Datasheet Automotive turbo 2 ultrafast high voltage rectifier Features A K K K K A NC D²PAK D²PAK HV A A NC K A K A DO-247 K • • • • • • • • • AEC-Q101 qualified High junction temperature capability Ultrafast with soft recovery behavior Low reverse current Low thermal resistance Reduce switching and conduction losses PPAP capable D²PAK HV creepage distance (anode to cathode) = 5.38 mm min. (with top coating) VRRM guaranteed from -40 °C to 175 °C • ECOPACK®2 compliant (DO-247, TO-220AC) TO-220AC Applications • • • • • Output rectification PFC UPS Air conditioning Charging station Product status link Description STTH30RQ06-Y Product summary IF(AV) 30 A VRRM 600 V VF (typ.) 1.45 V trr (max.) 30 ns Tj -40 °C to +175 °C The STTH30RQ06-Y has been developed to be used in application requiring a highvoltage secondary rectification for LLC Full Bridge topology. It is also suited for use in switching power supplies and automotive applications, industrial applications, as rectification, freewheeling and clamping diode. DS12165 - Rev 3 - November 2018 For further information contact your local STMicroelectronics sales office. www.st.com STTH30RQ06-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Value Unit 600 V 50 A 30 A Tj = -40 °C to +175 °C IF(AV) Average forward current δ = 0.5, square wave TC = 125 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal Tstg Storage temperature range -65 to +175 °C Operating junction temperature range -40 to +175 °C Tj D²PAK, D²PAK HV 180 TO-220AC, DO-247 200 A Table 2. Thermal parameters Symbol Rth(j-c) Parameter Max. value Unit 0.7 °C/W Junction to case Table 3. Static electrical characteristics Symbol IR (1) Parameter Test conditions Tj = 25 °C Reverse leakage current Tj = 150 °C Tj = 25 °C VF (2) Tj = 150 °C Forward voltage drop Tj = 25 °C Tj = 150 °C VR = VRRM IF = 15 A IF = 30 A Min. Typ. Max. - 40 80 2.45 1.15 1.45 - µA 800 - Unit V 2.95 1.45 1.85 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 1.05 x IF(AV) + 0.026 x IF 2 (RMS) Table 4. Dynamic electrical characteristics Symbol Parameter trr IRM Reverse recovery current QRR Reverse recovery charge trr DS12165 - Rev 3 Reverse recovery time Reverse recovery time Tj = 25 °C Tj = 125 °C Test conditions Min. IF = 0.5 A, IR = 1 A, Irr = 0.25 A - IF = 1 A, VR = 30 V, dlF/dt = -50 A/µs - 40 55 - 8 11 - 485 nC - 95 ns IF = 30 A, VR = 400 V, dlF/dt = -200 A/µs Typ. Max. 30 Unit ns A page 2/17 STTH30RQ06-Y Characteristics (curves) For more information, please refer to the following application notes related to the power losses: • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses in a power diode 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current (square waveform) 100 PF( AV )(W) Figure 2. Average forward power dissipation versus average forward current (sinusoidal waveform) 100 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 PF( AV )(W) δ = 0.2 δ = 0.1 δ= 1 80 80 60 60 40 40 δ= 1 δ = 0.5 δ = 0.05 T 20 20 IF( AV ) (A) 0 0 0 5 10 15 20 25 30 35 0 40 Figure 3. Forward voltage drop versus forward current (typical values) 100.0 IF( AV ) (A) tp δ=tp/T 5 10 15 20 25 30 35 40 Figure 4. Forward voltage drop versus forward current (maximum values) I F (A) I F (A) 100.0 TjJ=150°C = 175°C TjJ=150°C = 175°C 150°C TjJ= =150°C TjJ= =150°C 150°C 10.0 TjJ=150°C = 25°C TjJ=150°C = 25°C 1.0 10.0 TjJ=150°C = -40 °C TjJ=150°C = -40 °C 1.0 VF (V) 0.1 0.0 DS12165 - Rev 3 0.5 1.0 1.5 2.0 2.5 3.0 VF (V) 3.5 0.1 0.0 1.0 2.0 3.0 4.0 page 3/17 STTH30RQ06-Y Characteristics (curves) Figure 5. Relative variation of thermal impedance junction to case versus pulse duration 1.0 Figure 6. Peak reverse recovery current versus dIF/dt (typical values) IRM(A) Zth (j-c)/Rt h(j-c) 20 0.9 VR = 400 V Tj = 125°C Single pulse 0.8 15 0.7 0.6 0.5 IF = 30 A 10 0.4 IF = 15 A 0.3 5 IF = 7.5 A 0.2 0.1 t p( s ) 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 7. Reverse recovery time versus dIF/dt (typical values) 240 dI F / dt(A/ µs) 0 tRR(ns) 0 50 150 200 250 300 350 400 450 500 Figure 8. Reverse recovery charges versus dIF/dt (typical values) 800 QRR(nC) VR = 400 V Tj = 125°C VR = 400 V Tj = 125°C 200 100 600 IF = 30 A 160 IF = 15 A IF = 30 A 400 120 80 IF = 7.5 A 200 IF = 15 A 40 IF = 7.5 A dI F /dt(A/µs) 0 50 100 150 200 250 300 350 400 450 dI F /dt(A/µs) 0 0 0 500 Figure 9. Reverse recovery softness factor versus dIF/dt (typical values) Sfactor 50 100 150 200 250 300 350 400 450 500 Figure 10. Relative variations of dynamic parameters versus junction temperature 2.0 IF = IF(AV) VR = 400 V Reference :Tj = 125 °C 2.0 VR = 400 V Tj = 125°C 1.6 1.6 1.2 SFACTOR 1.2 0.8 0.8 IRM 0.4 0.4 QRR dI F /dt(A/µs) 0 50 DS12165 - Rev 3 100 150 200 250 300 Tj(°C) 0.0 0.0 350 400 450 500 25 50 75 100 125 page 4/17 STTH30RQ06-Y Characteristics (curves) Figure 11. Junction capacitance versus reverse voltage applied (typical values) Figure 12. Thermal resistance junction to ambient versus copper surface under tab (typical values, epoxy printed board FR4, eCu = 35 µm)(D²PAK and D²PAK HV) C(pF) 1000 Rth(j-a) (°C/W) 80 F=1MHz VOSC=30mVRMS Tj=25°C 70 60 50 100 40 30 20 10 VR(V) SCu (cm²) 10 0 1 10 100 1000 Figure 13. Relative variation of non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) 4.0 IFSM(tp) / IFSM(10 ms) 0 1.2 1.0 3.0 0.8 2.5 0.6 2.0 0.4 1.5 0.2 tp(ms) 0.1 DS12165 - Rev 3 1.0 10 15 25 30 35 40 IFSM(Tj) / IFSM(25 °C) Tj(°C) 0.0 10.0 20 Figure 14. Relative variation of non-repetitive peak surge forward current versus initial junction temperature (sinusoidal waveform) 3.5 1.0 5 25 50 75 100 125 150 175 page 5/17 STTH30RQ06-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DO-247 package information • • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 N·m (DO-247) Maximum torque value: 1.0 N·m (DO-247) Figure 15. DO-247 package outline V Dia V A H 0.10 L5 L L2 L4 F2 L1 F3 L3 D V2 F G DS12165 - Rev 3 M E page 6/17 STTH30RQ06-Y DO-247 package information Table 5. DO-247 package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F2 F3 2.00 typ. 2.00 G 0.078 typ. 2.40 0.078 10.90 typ. 0.094 0.429 typ. H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.145 0.169 L2 L3 18.50 typ. 14.20 0.728 typ. 14.80 0.559 0.582 L4 34.60 typ. 1.362 typ. L5 5.50 typ. 0.216 typ. M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. DS12165 - Rev 3 Inches 3.55 3.65 0.139 0.143 page 7/17 STTH30RQ06-Y D²PAK package information 2.2 D²PAK package information • • Epoxy meets UL94, V0. Cooling method: by conduction (C) Figure 16. D²PAK package outline DS12165 - Rev 3 page 8/17 STTH30RQ06-Y D²PAK package information Table 6. D²PAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches (for reference only) Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A1 0.03 0.23 0.001 0.009 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 7.50 7.75 8.00 0.295 0.305 0.315 D2 1.10 1.30 1.50 0.043 0.051 0.060 E 10.00 10.40 0.394 E1 8.30 8.50 8.70 0.335 0.343 0.346 E2 6.85 7.05 7.25 0.266 0.278 0.282 e 0.409 2.54 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.69 0.097 0.106 L 2.29 2.79 0.090 0.110 L1 1.27 1.40 0.049 0.055 L2 1.30 1.75 0.050 0.069 R V2 0.40 0° 0.015 8° 0° 8° Figure 17. D²PAK recommended footprint (dimensions are in mm) Footprint DS12165 - Rev 3 page 9/17 STTH30RQ06-Y TO-220AC package information 2.3 TO-220AC package information • • • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.70 N·m Figure 18. TO-220AC package outline A H2 0.10 ØI C Gate note (1)(2) L5 L7 L6 L2 F1 D L9 Gate note (1)(2) L4 F M G E (1) :Max resin gate protusion 0.5 mm (2) :Resin gate position is accepted in each of the two positions shown on the drawings or their symmetrical DS12165 - Rev 3 page 10/17 STTH30RQ06-Y TO-220AC package information Table 7. TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam DS12165 - Rev 3 Inches (for reference only) 2.60 typ. 3.75 0.102 typ. 3.85 0.147 0.151 page 11/17 STTH30RQ06-Y D²PAK high voltage package information 2.4 D²PAK HV package information Figure 19. D²PAK high voltage package outline A H C L1 L R L4 R M L2 0.25 gauge plane F (x2) E e H1 L3 A1 V DS12165 - Rev 3 page 12/17 STTH30RQ06-Y D²PAK high voltage package information Table 8. D²PAK high voltage package mechanical data Ref. Dimensions Min. Typ. Max. A 4.30 4.70 A1 0.03 0.20 C 1.17 1.37 e 4.98 5.18 E 0.50 0.90 F 0.78 0.85 H 10.00 10.40 H1 7.40 7.80 L 15.30 15.80 L1 1.27 1.40 L2 4.93 5.23 L3 6.85 7.25 L4 1.5 1.7 M 2.6 2.9 R 0.20 0.60 V 0° 8° Figure 20. D²PAK High Voltage footprint in mm 10,58 7,46 15,95 5,10 3,40 1,20 5,08 DS12165 - Rev 3 page 13/17 STTH30RQ06-Y D²PAK high voltage package information 2.4.1 Creepage distance between anode and cathode Table 9. Creepage distance between anode and cathode Symbol Note: Parameter CdA-K1 Minimum creepage distance between A and K1 (with top coating) CdA-K2 Minimum creepage distance between A and K2 (without top coating) Value D²PAK HV 5.38 3.48 Unit mm D²PAK HV creepage distance (anode to cathode) = 5.38 mm min. (refer to IEC 60664-1) Figure 21. Creepage with top coating Figure 22. Creepage without top coating DS12165 - Rev 3 page 14/17 STTH30RQ06-Y Ordering information 3 Ordering information Table 10. Ordering information DS12165 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode STTH30RQ06GY-TR STTH30RQ06GY D²PAK 1.48 g 1000 Tape and reel STTH30RQ06DY STTH30RQ06DY TO-220AC 1.86 g 50 Tube STTH30RQ06WY STTH30RQ06WY DO-247 4.40 g 30 Tube STTH30RQ06G2Y-TR TH30RQ06G2Y D²PAK HV 1.48 g 1000 Tape and reel page 15/17 STTH30RQ06-Y Revision history Table 11. Document revision history Date Revision Changes 12-Jun-2017 1 Initial release. 09-Oct-2018 2 Added D²PAK HV package. 20-Nov-2018 3 Updated Features and Table 9. Creepage distance between anode and cathode. added Figure 22. Creepage without top coating. DS12165 - Rev 3 page 16/17 STTH30RQ06-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS12165 - Rev 3 page 17/17