STTH30RQ06G2-TR

STTH30RQ06 Datasheet 600 V, 30 A ultrafast high voltage rectifier Features A K K K D²PAK A A K A NC D²PAK HV NC K K A K A DO-247 K • • • • • • • High junction temperature capability Ultrafast with soft recovery behavior Low reverse current Low thermal resistance Reduce switching and conduction losses D²PAK HV creepage distance (anode to cathode) = 5.38 mm min. (with top coating) ECOPACK2 compliant (DO-247, TO-220AC, DO-247 LL) TO-220AC Applications K DO-247 LL A K • • • • • Output rectification PFC UPS Air conditioning Charging station Description The STTH30RQ06 has been developed to be used in application requiring a highvoltage secondary rectification for LLC full bridge topology. Product status link STTH30RQ06 It is also suited for use in switching power supplies, industrial applications, as rectification, freewheeling and clamping diode. Product summary IF(AV) 30 A VRRM 600 V VF (typ.) 1.45 V trr (max.) 30 ns Tj 175 °C DS12164 - Rev 5 - March 2020 For further information contact your local STMicroelectronics sales office. www.st.com STTH30RQ06 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Forward rms current 50 A 30 A IF(AV) Average forward current TC = 103 °C, δ = 0.5 square IFSM Surge non repetitive forward current tp = 10 ms sinusoidal Tstg Storage temperature range Tj D²PAK, D²PAK HV 180 TO-220AC, DO-247, DO-247 LL 200 Maximum operating junction temperature A -65 to +175 °C 175 °C Table 2. Thermal parameters Symbol Parameter Max. value Unit Rth(j-c) Junction to case 0.70 °C/W Rth(j-c) Junction to case DO-247 LL 0.90 °C/W Max. Unit For more information, please refer to the following application note: • AN5088: Rectifiers thermal management, handling and mounting recommendation Table 3. Static electrical characteristics Symbol IR (1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C VF (2) Forward voltage drop Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 15 A IF = 30 A Min. Typ. - 40 80 - µA 2.45 1.15 - 800 1.45 2.95 1.45 V 1.85 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 1.05 x IF(AV) + 0.026 x IF 2 (RMS) For more information, please refer to the following application notes related to the power losses: • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode • AN5028: Calculation of turn-off power losses generated by an ultrafast diode DS12164 - Rev 5 page 2/20 STTH30RQ06 Characteristics Table 4. Dynamic electrical characteristics Symbol trr Reverse recovery time IRM Reverse recovery current QRR Reverse recovery charge trr DS12164 - Rev 5 Parameter Reverse recovery time Test conditions Tj = 25 °C Min. Typ. Max. Unit IF = 0.5 A, IR = 1 A, Irr = 0.25 A - IF = 1 A, VR = 30 V, dlF/dt = -50 A/µs - 40 55 - 8 11 - 485 nC - 95 ns Tj = 125 °C IF = 30 A, VR = 400 V, dlF/dt = -200 A/µs 30 ns A page 3/20 STTH30RQ06 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current (square waveform) Figure 2. Average forward power dissipation versus average forward current (sinusoidal waveform) PF(AV) (W ) 100 100 δ = 0.05 δ = 0.1 PF( AV )(W) δ = 0.1 δ = 0.2 80 δ= 1 δ = 0.5 δ = 0.05 80 δ = 0.5 δ = 0.2 δ=1 60 60 40 40 T 20 20 IF(AV)(A) δ =tp/T IF( AV ) (A) tp 0 0 0 5 10 15 20 25 30 35 40 Figure 3. Average forward power dissipation versus average forward current (square waveform, DO-247 LL) 0 5 10 15 20 25 30 35 40 Figure 4. Average forward power dissipation versus average forward current (sinusoidal waveform, DO-247 LL) PF(AV) (W ) 100 δ = 0.1 100 δ = 0.2 δ = 0.1 δ = 0.5 δ = 0.05 80 PF( AV )(W) δ = 0.2 δ= 1 δ = 0.5 δ = 0.05 80 δ=1 60 60 40 40 T 20 20 IF(AV)(A) δ =tp/T IF( AV ) (A) tp 0 0 5 10 15 20 25 30 35 40 0 0 Figure 5. Forward voltage drop versus forward current (typical values) 100.0 I F (A) 10 15 20 25 30 35 40 Figure 6. Forward voltage drop versus forward current (maximum values) 100.0 TjJ=150°C = 175°C 5 I F(A) TjJ=150°C = 175°C = 150°C TJj =150°C TjJ=150°C = 150°C TjJ=150°C = 25°C 10.0 10.0 TjJ=150°C = 25°C 1.0 1.0 VF (V) VF (V) 0.1 0.0 DS12164 - Rev 5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.1 0.0 1.0 2.0 3.0 4.0 page 4/20 STTH30RQ06 Characteristics (curves) Figure 7. Relative variation of thermal impedance junction to case versus pulse duration 1.0 Figure 8. Peak reverse recovery current versus dIF/dt (typical values) IRM(A) Zth (j-c)/Rt h(j-c) 20 0.9 VR = 400 V Tj = 125°C Single pulse 0.8 15 0.7 0.6 0.5 IF = 30 A 10 0.4 IF = 15 A 0.3 5 IF = 7.5 A 0.2 0.1 t p( s ) 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 9. Reverse recovery time versus dIF/dt (typical values) 240 dI F / dt(A/ µs) 0 tRR(ns) 0 50 150 200 250 300 350 400 450 500 Figure 10. Reverse recovery charges versus dIF/dt (typical values) 800 QRR(nC) VR = 400 V Tj = 125°C VR = 400 V Tj = 125°C 200 100 600 IF = 30 A 160 IF = 15 A IF = 30 A 400 120 80 IF = 7.5 A 200 IF = 15 A 40 IF = 7.5 A dI F /dt(A/µs) 0 50 100 150 200 250 300 350 400 450 dI F /dt(A/µs) 0 0 0 500 Figure 11. Reverse recovery softness factor versus dIF/dt (typical values) Sfactor 50 100 150 200 250 300 350 400 450 500 Figure 12. Relative variations of dynamic parameters versus junction temperature 2.0 IF = IF(AV) VR = 400 V Reference :Tj = 125 °C 2.0 VR = 400 V Tj = 125°C 1.6 1.6 1.2 SFACTOR 1.2 0.8 0.8 IRM 0.4 0.4 QRR dI F /dt(A/µs) 0.0 0 50 DS12164 - Rev 5 100 150 200 250 300 Tj(°C) 0.0 350 400 450 500 25 50 75 100 125 page 5/20 STTH30RQ06 Characteristics (curves) Figure 13. Junction capacitance versus reverse voltage applied (typical values) Figure 14. Thermal resistance junction to ambient versus copper surface under tab (typical values, epoxy printed board FR4, eCu = 35 µm)(D²PAK and D²PAK HV) C(pF) Rth(j-a) (°C/W) 1000 80 F=1MHz VOSC=30mVRMS Tj=25°C 70 60 50 100 40 30 20 10 VR(V) SCu (cm²) 10 0 1 10 100 1000 Figure 15. Relative variation of non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) 4.0 IFSM(tp) / IFSM(10 ms) 0 1.2 1.0 3.0 0.8 2.5 0.6 2.0 0.4 1.5 0.2 tp(ms) 0.1 DS12164 - Rev 5 1.0 10 15 25 30 35 40 IFSM(Tj) / IFSM(25 °C) Tj(°C) 0.0 10.0 20 Figure 16. Relative variation of non-repetitive peak surge forward current versus initial junction temperature (sinusoidal waveform) 3.5 1.0 5 25 50 75 100 125 150 175 page 6/20 STTH30RQ06 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DO-247 package information • • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 N·m (DO-247) Maximum torque value: 1.0 N·m (DO-247) Figure 17. DO-247 package outline V Dia V A H 0.10 L5 L L2 L4 F2 L1 F3 L3 D V2 F G DS12164 - Rev 5 M E page 7/20 STTH30RQ06 DO-247 package information Table 5. DO-247 package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F2 F3 2.00 typ. 2.00 G 0.078 typ. 2.40 0.078 10.90 typ. 0.094 0.429 typ. H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.145 0.169 L2 L3 18.50 typ. 14.20 0.728 typ. 14.80 0.559 0.582 L4 34.60 typ. 1.362 typ. L5 5.50 typ. 0.216 typ. M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. DS12164 - Rev 5 Inches 3.55 3.65 0.139 0.143 page 8/20 STTH30RQ06 D²PAK package information 2.2 D²PAK package information • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Figure 18. D²PAK package outline Note: DS12164 - Rev 5 This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 9/20 STTH30RQ06 D²PAK package information Table 6. D²PAK package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R 0.4 typ. V2 0° 0.015 8° 0° 8° Figure 19. D²PAK recommended footprint (dimensions in mm) 16.90 12.20 5.08 2.54 1.60 9.75 DS12164 - Rev 5 3.50 page 10/20 STTH30RQ06 TO-220AC package information 2.3 TO-220AC package information • • • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.70 N·m Figure 20. TO-220AC package outline A H2 0.10 ØI C Gate note (1)(2) L5 L7 L6 L2 F1 D L9 Gate note (1)(2) L4 F M G E (1) :Max resin gate protusion 0.5 mm (2) :Resin gate position is accepted in each of the two positions shown on the drawings or their symmetrical DS12164 - Rev 5 page 11/20 STTH30RQ06 TO-220AC package information Table 7. TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam DS12164 - Rev 5 Inches (for reference only) 2.60 typ. 3.75 0.102 typ. 3.85 0.147 0.151 page 12/20 STTH30RQ06 D²PAK high voltage package information 2.4 D²PAK HV package information Figure 21. D²PAK high voltage package outline DS12164 - Rev 5 page 13/20 STTH30RQ06 D²PAK high voltage package information Table 8. D²PAK high voltage package mechanical data Ref. Dimensions Min. Typ. Max. A 4.30 4.70 A1 -0.05 0.08 C 1.17 1.37 D 8.95 9.35 e 4.98 5.18 E 0.50 0.90 F 0.78 0.85 F2 1.20 1.60 H 10.00 10.40 H1 7.40 7.80 J1 2.49 2.69 L 15.30 15.80 L1 1.27 1.40 L2 4.93 5.23 L3 6.85 7.25 L4 1.5 1.7 M 2.6 2.9 R 0.20 0.60 V 0° 8° Figure 22. D²PAK High Voltage footprint in mm 10,58 7,46 15,95 5,10 3,40 1,20 5,08 DS12164 - Rev 5 page 14/20 STTH30RQ06 D²PAK high voltage package information 2.4.1 Creepage distance between anode and cathode Table 9. Creepage distance between anode and cathode Symbol Note: Parameter CdA-K1 Minimum creepage distance between A and K1 (with top coating) CdA-K2 Minimum creepage distance between A and K2 (without top coating) Value D²PAK HV 5.38 3.48 Unit mm D²PAK HV creepage distance (anode to cathode) = 5.38 mm min. (refer to IEC 60664-1) Figure 23. Creepage with top coating Figure 24. Creepage without top coating DS12164 - Rev 5 page 15/20 STTH30RQ06 DO-247 LL package information 2.5 DO-247 LL package information • • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 N·m Maximum torque value: 1.0 N·m Figure 25. DO-247 LL package outline 10° 3° E A A2 E/2 Q E2 Ø P1 Ø P 20° S D1 D 3° L1 3° W L e DS12164 - Rev 5 2× b 2× b2 c A1 E1 page 16/20 STTH30RQ06 DO-247 LL package information Table 10. DO-247 LL package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.70 5.31 0.185 0.209 A1 2.21 2.59 0.087 0.102 A2 1.50 2.49 0.059 0.098 b 0.99 1.40 0.039 0.055 b2 1.65 2.39 0.065 0.094 c 0.38 0.89 0.015 0.035 D 20.80 21.46 0.819 0.845 D1 13.08 E 15.49 e 0.515 16.26 0.610 5.44 typ. 0.640 0.214 E1 13.46 0.530 E2 3.43 3.99 0.135 0.157 L 19.81 20.32 0.780 0.800 L1 4.50 0.177 P 3.56 3.66 0.140 0.144 P1 7.06 7.39 0.278 0.291 Q 5.38 6.20 0.219 0.244 S W DS12164 - Rev 5 Inches (for reference only) 6.17 typ. 0.243 0.15 0.006 page 17/20 STTH30RQ06 Ordering information 3 Ordering information Table 11. Ordering information DS12164 - Rev 5 Order code Marking Package Weight Base qty. Delivery mode STTH30RQ06G-TR STTH30RQ06G D²PAK 1.48 g 1000 Tape and reel STTH30RQ06D STTH30RQ06D TO-220AC 1.86 g 50 Tube STTH30RQ06W STTH30RQ06W DO-247 4.40 g 30 Tube STTH30RQ06G2-TR TH30RQ06G2 D²PAK HV 1.48 g 1000 Tape and reel STTH30RQ06WL STTH30RQ06WL DO-247 LL 5.9 g 30 Tube page 18/20 STTH30RQ06 Revision history Table 12. Document revision history Date Revision Changes 12-Jun-2017 1 Initial release. 11-Oct-2018 2 Added D²PAK HV package. 20-Nov-2018 3 Updated Features and Table 9. Creepage distance between anode and cathode. Added Figure 24. Creepage without top coating. DS12164 - Rev 5 02-Mar-2020 4 Added DO-247 LL package information. 30-Mar-2020 5 Updated Figure 1 and Figure 2. Added Figure 3 and Figure 4. page 19/20 STTH30RQ06 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS12164 - Rev 5 page 20/20