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STTS751-1DP3F

STTS751-1DP3F

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    UDFN6

  • 描述:

    SENSOR TEMPERATURE SMBUS 6UDFN

  • 数据手册
  • 价格&库存
STTS751-1DP3F 数据手册
STTS751 2.25 V low-voltage local digital temperature sensor Features ■ ■ ■ Operating voltage 2.25 V to 3.6 V Operating temperature –40 °C to +125 °C Programmable – 10 different conversion rates 0.0625 to 32 conversions/sec. 1 conversion/sec. - default – 4 different resolutions 9-bit (0.5 °C/LSB) to12-bit (0.0625 °C/LSB) 10-bit (0.25 °C/LSB) - default Low supply current – 50 µA (typ) for 8 conversions/sec. – 20 µA (typ) for 1 conversion/sec. – 3 µA (typ) standby Accuracy – ±1.0 °C (typ) 0 °C to +85 °C – ±2.0 °C (typ) –40 °C to +125 °C One-shot mode for power saving Fast conversion time 21 ms (typ) 10-bit Pull-up resistor value allows single pin to select one of four slave addresses Supports 400 kHz serial clock ■ UDFN-6L SOT23-6L ■ SMBus 2.0 compatible – SMBus ALERT (ARA) support – SMBus timeout RoHS/green ■ ■ Applications ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Solid state drives Portable electronics Notebook computers Smart batteries Servers Telecom Table 1. Device summary Pull-up resistor value 7.5 K ±5% SMBus address 1001 000 b 1001 001 b 0111 000 b 0111 001 b 1001 010 b 1001 011 b 0111 010 b 0111 011 b Address selection via resistor pull-up on Addr/Therm pin Address selection via resistor pull-up on Addr/Therm pin Comments Order code STTS751-0DP3F STTS751-0WB3F 12 K ±5% 20 K ±5% 33 K ±5% 7.5 K ±5% STTS751-1DP3F STTS751-1WB3F 12 K ±5% 20 K ±5% 33 K ±5% July 2010 Doc ID 16483 Rev 5 1/36 www.st.com 1 Contents STTS751 Contents 1 2 3 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 SMBus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 SMBus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 WRITE byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 READ byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 SEND byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 RECEIVE byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 SMBus addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 SMBus timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Alert response address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 STTS751 register summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 4.10 4.11 4.12 4.13 4.14 STTS751 register formats and details . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Temperature register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Temperature limit register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Temperature examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Configuration register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Conversion rate register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 One-shot register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Therm limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Therm hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SMBus timeout register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 STTS751 product ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 STTS751 manufacturer’s ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 STTS751 revision ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5 EVENT output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2/36 Doc ID 16483 Rev 5 STTS751 Contents 6 7 8 9 10 11 Addr/Therm output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Doc ID 16483 Rev 5 3/36 List of tables STTS751 List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 SMBus WRITE byte protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 SMBus READ byte protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 SMBus SEND byte protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 SMBus RECEIVE byte protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 SMBus protocol response to ARA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Registers/pointers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Pointer register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Temperature register (two’s complement) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Temperature limit register (two’s complement format) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Temperature examples (two’s complement format) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Status register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Configuration register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Conversion resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Conversion rate register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Conversion rates. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 One-shot register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Therm limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Therm hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SMBus timeout register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Product ID register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Manufacturer’s ID register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Revision ID register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 UDFN-6L (2 mm x 2 mm x 0.5 mm) package mechanical data . . . . . . . . . . . . . . . . . . . . . 29 SOT23-6L (2.90 mm x 2.80 mm) package mechanical data . . . . . . . . . . . . . . . . . . . . . . . 30 Carrier tape dimensions for UDFN-6L and SOT23-6L packages . . . . . . . . . . . . . . . . . . . . 32 Reel dimensions for 8 mm carrier tape - UDFN-6L and SOT23-6L packages . . . . . . . . . . 33 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4/36 Doc ID 16483 Rev 5 STTS751 List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Pinout - SOT23-6L and UDFN-6L. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Application hardware hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 SMBus timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 EVENT output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Therm output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 UDFN-6L (2 mm x 2 mm x 0.5 mm) package mechanical drawing . . . . . . . . . . . . . . . . . . 29 SOT23-6L (2.90 mm x 2.80 mm) package mechanical drawing. . . . . . . . . . . . . . . . . . . . . 30 UDFN-6L package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 SOT23-6L package footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Carrier tape for UDFN-6L and SOT23-6L packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Reel schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Doc ID 16483 Rev 5 5/36 Description STTS751 1 Description The STTS751 is a digital temperature sensor which communicates over a 2-wire SMBus 2.0 compatible bus. The temperature is measured with a user-configurable resolution between 9 and 12 bits. At 9 bits, the smallest step size is 0.5 °C, and at 12 bits, it is 0.0625 °C. At the default resolution (10 bits, 0.25 °C/LSB), the conversion time is nominally 21 milliseconds. The open-drain EVENT output is used to indicate an alarm condition in which the measured temperature has exceeded the user-programmed high limit or fallen below the low limit. When the EVENT pin is asserted, the host can respond using the SMBus Alert Response Address (ARA) protocol to which the STTS751 will respond by sending its slave address. The STTS751 is a 6-pin device that supports user-configurable slave addresses. Via the pull-up resistor on the Addr/Therm pin, one of four different slave addresses can be specified. Two order numbers (STTS751-0 and STTS751-1) provide two different sets of slave addresses bringing the total available to eight. Thus, up to eight devices can share the same 2-wire SMBus without ambiguity, thereby allowing monitoring of multiple temperature zones in an application. The two-wire interface can support transfer rates up to 400 kHz. Two small footprint packages are available: a UDFN-6L and a standard SOT23-6L package. Figure 1. Logic diagram VDD (1) SDA STTS751-0 STTS751-1 SCL EVENT Addr/Therm GND 1. This pin may not float. AM03028v1 Table 2. Signal names Type Output Output I/O Input Power Ground Description Address selection pin / thermal status pin Event (alert) output SMBus interface data I/O SMBus interface clock input Device power supply Device ground Symbol Addr/Therm EVENT SDA SCL VDD GND 6/36 Doc ID 16483 Rev 5 STTS751 Figure 2. Pinout - SOT23-6L and UDFN-6L SOT23-6L UDFN-6L Description Addr/Therm GND VDD 1 2 3 6 5 4 SDA EVENT SCL SCL EVENT VDD 1 2 3 6 5 4 SDA GND Addr/Therm AM03029v1 Table 3. Pin Pin descriptions Name Description SOT23-6L UDFN-6L Open-drain output that can be used to turn on/off a fan or throttle a CPU clock in the event of an overtemperature condition. The pin at power-up determines the SMBus slave address according to the pull-up resistor value as shown in Table 1. Addr/Therm This pin must have a pull-up resistor connected to the same voltage as VDD or tied to GND (pin cannot float). Total capacitance on this pin must be high limit). THIGH is cleared when the status register is read, provided the condition no longer exists. TLOW: [5] Bit = 1 indicates the is at or below the low limit (TA ≤ low limit). TLOW is cleared when the status register is read, provided the condition no longer exists. RFU: [4:1] Not used - reserved. THRM: [0] Bit = 1 indicates the measured temperature has crossed the Therm limit. The THRM bit will go low when the temperature falls below the Therm limit minus the Therm Hysteresis. When the THRM bit is high, the Addr/Therm output will be asserted low. 16/36 Doc ID 16483 Rev 5 STTS751 STTS751 register summary 4.6 Configuration register The STTS751 configuration register is read/write and controls the functionality of temperature measurements. It is located at address 03h. The configuration register bits function as described below. Table 15. ADDR (hex) Configuration register Register b7 b6 b5 b4 b3 b2 b1 b0 Power-up default (hex) 00 R/W 03 R/W Configuration MASK1 RUN/STOP 0 RFU Tres1 Tres0 RFU RFU Description MASK1: [bit 7] 0: EVENT is enabled. Any out-of-limit condition asserts the EVENT pin (active low). 1: EVENT is disabled. RUN/STOP: [bit 6] 0: Device is running in continuous conversion mode. 1: Device is in standby mode drawing minimum power. The RUN/STOP bit controls temperature conversions by the ADC. When this bit is 0, the ADC converts temperatures in continuous mode, at a rate as selected by the Conversion Rate register (Section 4.7). When the RUN/STOP bit is 1, the ADC will be in standby mode, thus reducing current supply significantly. Note: The device can still be accessed via the SMBus while in standby mode. When RUN/STOP is 1 and the one-shot register is written to, the ADC will execute a temperature measurement and then return to standby mode. [bit 5]: This bit must always be 0. RFU: [bit 4] Not used - reserved. Doc ID 16483 Rev 5 17/36 STTS751 register summary Tres1:Tres0 [bits 3 and 2] STTS751 These bits select one of the four programmable resolutions for temperature data on the STTS751 providing resolutions down to 0.0625 °C/LSB. The default resolution is 10 bits, 0.25 °C/LSB. Table 16. Conversion resolution Tres1:Tres0 00 01 11 10 Temperature resolution 10 bits (default) 11 bits 12 bits 9 bits LSB step size (°C) 0.25 0.125 0.0625 0.5 RFU [bits 1 and 0] Not used - reserved. 4.7 Conversion rate register The STTS751 conversion rate register is read/write and controls the number of times the temperature value will be updated each second. Table 17. ADDR (hex) 04 Conversion rate register Register Conversion rate b7 0 b6 0 b5 0 b4 0 b3 b2 b1 b0 Power-up default (hex) 04 (1/sec) R/W R/W CONV[3:0] The upper four bits of the register are reserved and default to 0 on power-up. The lower four bits control the conversion rate as shown in the table below. The power-up default is 1 conversion per second. The current draw is proportional to the conversion rate, and goes up at higher rates. 18/36 Doc ID 16483 Rev 5 STTS751 STTS751 register summary Table 18. Conversion rates Conversions per second 0.0625 0.125 0.25 0.5 1 2 4 8 16 32 reserved 125 50 9, 10, or 11-bit resolutions only 9 or 10-bit resolutions only 20 Typical current (µA) 15 Comment CONV[3:0] (hex) 0 1 2 3 4 5 6 7 8 9 A-F Note: The user must program the conversion rate and resolution bits (Tres1:Tres0 in the configuration register, address 03h) to be consistent with this table. For a sampling rate of 32 conversions per second, the maximum resolution is 10 bits. For 16 conversions per second, the maximum is 11 bits. 4.8 One-shot register The STTS751 can be configured to perform a single temperature conversion on demand. When the device is placed in standby mode (by setting RUN/STOP to 1 in the configuration register) a write to the one-shot register will invoke a temperature conversion. The device will set the busy bit while the conversion is in progress. The conversion is complete when the busy bit is cleared. The STTS751 returns to standby mode upon completion of the conversion. The one-shot register is write-only and is located at address 0Fh. The value written to invoke the one-shot conversion is a don't care. The device responds only to the write at address 0Fh and ignores the value written. Note: Writes to the one-shot register will be ignored when the STTS751 is in continuous conversion mode (ie. when RUN/STOP=0). One-shot register Register One shot b7 X b6 X b5 X b4 X b3 X b2 X b1 X b0 X Power-up default (hex) n/a Table 19. ADDR (hex) 0F R/W W Doc ID 16483 Rev 5 19/36 STTS751 register summary STTS751 4.9 Therm limit The Therm limit is a read/write register located at address 20h. The power-on default value is 85 °C (55h). The format is 8-bit, two's complement integer. This is the same format as the upper byte of the temperature register (Section 4.2: Temperature register format). Whenever the temperature exceeds the value of the therm limit, the Addr/Therm output will be asserted (low). See Section 6 for more information. Table 20. ADDR (hex) 20 Therm limit Register Therm b7 sign b6 64 °C b5 32 °C b4 16 °C b3 8 °C b2 4 °C b1 b0 Power-up default (hex) 55 (85 °C, dec) R/W R/W 2 °C 1 °C 4.10 Therm hysteresis The Therm hysteresis values controls the hysteresis for Addr/Therm output. Once Therm output has asserted, it will not de-assert until the temperature has fallen below the respective therm limit minus the therm hysteresis value. See Section 5 for more information. The therm hysteresis register is read/write and is located at address 21h. The power-up default value is 10 °C (0Ah). The format is 8-bit, two's complement integer. Table 21. ADDR (hex) 21 Therm hysteresis Register Therm hysteresis b7 sign b6 64 °C b5 32 °C b4 16 °C b3 8 °C b2 4 °C b1 b0 Power-up default (hex) 0A (10 °C, dec) R/W R/W 2 °C 1 °C 4.11 SMBus timeout register At power-up, the STTS751 is configured with an SMBus timeout of 25 to 35 milliseconds (tTIMEOUT). See Section 3.7 for more information. Table 22. ADDR (hex) 22 SMBus timeout register Register b7 b6 0 b5 0 b4 0 b3 0 b2 0 b1 0 b0 0 Power-up default (hex) 80 R/W R/W SMBus timeout TIMEOUT TIMEOUT: [bit 7] 1: SMBus timeout is enabled. Default condition. 0: SMBus timeout is disabled. [bits 6:0] Not used - reserved. 20/36 Doc ID 16483 Rev 5 STTS751 STTS751 register summary 4.12 STTS751 product ID The two versions of the STTS751 as shown in Table 1 can be identified via the read-only Product ID register at address FDh. The STTS751-0 has a Product ID of 00h. The STTS751-1 has a Product ID of 01h. Table 23. ADDR (hex) FD Product ID register R/W R Register Product ID b7 0 0 b6 0 0 b5 0 0 b4 0 0 b3 0 0 b2 0 0 b1 0 0 b0 0 1 hex 00: STTS751-0 01: STTS751-1 4.13 STTS751 manufacturer’s ID The read-only manufacturer's ID is located at address FEh. For the STTS751, the value is 53h. Table 24. ADDR (hex) FE Manufacturer’s ID register R/W R Register Mfg ID b7 0 b6 1 b5 0 b4 1 b3 0 b2 0 b1 1 b0 1 hex 53 4.14 STTS751 revision ID The STTS751 revision ID register pointer is read-only and can be accessed at address FFh. The value is formatted as an unsigned, 8-bit integer. Table 25. ADDR (hex) FF Revision ID register R/W R Register Revision ID b7 0 b6 0 b5 0 b4 0 b3 0 b2 0 b1 0 b0 1 Doc ID 16483 Rev 5 21/36 EVENT output STTS751 5 EVENT output The STTS751 EVENT output is open drain and requires a pull-up resistor. The EVENT pin is asserted (low) whenever the temperature exceeds the high limit or is equal to or below the low limit. Once asserted, the output will remain asserted until the STTS751 receives an SMBus Alert Response Address (ARA) from the host and acknowledges with its slave address. The output will be deasserted when the ARA is acknowledged. If the triggering condition is still true, the output will be reasserted at the next temperature conversion. Figure 6 below shows how the EVENT output functions. Figure 6. EVENT output Temperature Temperature high limit Temperature low limit Time EVENT SMBus ARA acknowledged AM03032v1 22/36 Doc ID 16483 Rev 5 STTS751 Addr/Therm output 6 Addr/Therm output The Addr/Therm pin functions normally as an output to alert the system of an over temperature condition. It is open drain and requires a pull-up resistor. During power-up, the pull-up value is sensed by the STTS751 to determine what its slave address will be as depicted in Table 1. The Therm output is asserted low whenever the temperature exceeds the Therm limit (address 20h). Only the upper 8 bits of the temperature register are used in the comparison with the Therm limit. Once asserted, Therm will remain asserted until temperature falls below the Therm limit minus the therm hysteresis value. For example, if the Therm limit is 25 °C, and the therm hysteresis value is 10 °C, the Therm output will assert when the temperature exceeds 25 °C. It will remain asserted until the temperature falls down to or below 15 °C (25 – 10). This pin can be used to control a fan or other failsafe device as shown in Figure 4 on page 8. Figure 7 below shows how the Therm output functions. Figure 7. Therm output Temperature Therm limit Therm Limit minus Therm Hysteresis Therm Hysteresis Time Addr/Therm AM03033v1 Doc ID 16483 Rev 5 23/36 Maximum ratings STTS751 7 Maximum ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 26. Symbol TSTG TSLD(1) VIO VDD IO θJA Absolute maximum ratings Parameter Storage temperature (VDD off) Lead solder temperature Input or output voltage Supply voltage Output current UDFN-6L Thermal resistance (junction to ambient) SOT23-6L 191 Value –55 to 150 260 –0.3 to VDD + 0.3 5.0 20 78 °C/W Unit °C °C V V mA 1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds. 24/36 Doc ID 16483 Rev 5 STTS751 DC and AC parameters 8 DC and AC parameters This section summarizes the operating measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC characteristics tables that follow, are derived from tests performed under the measurement conditions summarized in Table 27: Operating and AC measurement conditions. Designers should check that the operating conditions in their circuit match the operating conditions when relying on the quoted parameters. Table 27. Operating and AC measurement conditions Parameter Conditions 2.25 to 3.6 –40 to +125 5 0.2 VDD to 0.8 VDD 0.3 VDD to 0.7 VDD Unit V °C ns V V VDD supply voltage - temperature sensor Ambient operating temperature (TA) Input rise and fall times Input pulse voltages Input and output timing reference voltages Figure 8. AC measurement I/O waveform Input levels 0.8 * VDD 0.2 * VDD Input and output timing reference levels 0.7 * VDD 0.3 * VDD AM04731v1 Doc ID 16483 Rev 5 25/36 DC and AC parameters Table 28. Symbol VDD STTS751 DC and AC characteristics Description Supply voltage 0.0625 conversions/second(3) Test condition(1) Min 2.25 15 20 50 125 3 Typ(2) Max 3.6 35 40 85 250 8 Unit V µA µA µA µA µA IDD Operating current dependent upon conversion rate 1 conversion/second(3) 8 conversions/second 32 conversions/second ISB Standby current Temperature measurement Accuracy(4) 0 °C to 85 °C 2.25 V to 3.6 V –40 °C to +125 °C 9-bit temperature data 10-bit temperature data (default) 11-bit temperature data 11 0.0625 12-bit temperature data 12 9-bit 10-bit (default) tCONV Conversion time 11-bit 12-bit VOL IOH Low level output voltage Addr/Therm, EVENT High level output leakage current EVENT, SDA, Addr/Therm IOL = 4 mA VOH = VDD 42 84 56 112 0.4 1 ms ms V µA 10.5 21 14 28 bits ms ms bits °C/LSB ±1.0 ±2.0 0.5 9 0.25 10 0.125 ±1.5 ±2.5 °C °C °C/LSB bits °C/LSB bits °C/LSB Resolution STTS751 is programmable from 9 bits to 12 bits (0.5 °C/LSB to 0.0625 °C) SMBus interface inputs (SDA, SCL) VIH VIL IHI ILI CIN ISINK Input logic high (SCL, SDA) Input logic low (SCL, SDA) Logical "1" input current Logical "0" input current Input capacitance (SDA) SMBus output low sink current SDA forced to 0.6 V 6 2.3 V ≤ VDD ≤ 3.6 V 2.3 V ≤ VDD ≤ 3.6 V 0 V ≤ VIN ≤ VDD 0 V ≤ VIN ≤ VDD –1 –1 5 0.7 x VDD 0.3 x VDD 1 1 V V µA µA pF mA 26/36 Doc ID 16483 Rev 5 STTS751 Table 28. Symbol VPV VPOR tTIMEOUT tSP DC and AC parameters DC and AC characteristics (continued) Description Pull-up supply voltage (open drain) Power On Reset threshold (POR) - TS SMBus timeout(5) Spike suppression Pulse width of spikes that must be suppressed by the input filter Input filter on SCL and SDA Test condition(1) (Addr/Therm) EVENT, SDA, SCL VDD falling edge 25 Min –0.3 –0.3 1.75 35 50 Typ(2) Max 3.6 5.5 Unit V V V ms ns 1. Valid for ambient operating temperature: TA = –40 to +125 °C; VDD = 2.25 V to 3.6 V (except where noted). 2. Typical numbers are for TA = +25 °C; VDD = 3.0 V 3. Not tested, guaranteed by design. 4. Accuracy measurements made at resolutions > 10 bits. 5. SMBus timeout min and max are valid for TA = –30 to +125 °C. Table 29. Symbol fSCL tHIGH tLOW tR tF tSU:DAT tHD:DI tHD:DAT tSU:STA tHD:STA tSU:STO tBUF AC characteristics Description SMBus/I2C clock frequency Clock high period Clock low period Clock/data rise time Clock/data fall time Data setup time Data in hold time Data out hold time Start condition setup time Hold time after (repeated) start condition. After this period, the first clock cycle is generated. Stop condition setup time Bus free time between stop (P) and start (S) conditions 100 0 300 600 600 600 1.3 Min 10 600 1.3 300 300 Typ Max 400 Unit kHz ns µs ns ns ns ns ns ns ns ns µs Doc ID 16483 Rev 5 27/36 Package mechanical data STTS751 9 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 28/36 Doc ID 16483 Rev 5 STTS751 Figure 9. Package mechanical data UDFN-6L (2 mm x 2 mm x 0.5 mm) package mechanical drawing 8187820_A Table 30. Sym UDFN-6L (2 mm x 2 mm x 0.5 mm) package mechanical data mm Min Typ 0.50 Max 0.55 0.05 0.065 0.20 1.95 1.95 0.25 2.00 2.00 0.65 0.50 0.60 0.70 0.020 0.30 2.05 2.05 0.008 0.077 0.077 Min 0.018 0.000 0.003 0.010 0.079 0.079 0.026 0.024 0.028 0.012 0.081 0.081 inches Typ 0.020 Max 0.022 0.002 A A1 A3 b D E e L 0.45 0.00 Doc ID 16483 Rev 5 29/36 Package mechanical data Figure 10. SOT23-6L (2.90 mm x 2.80 mm) package mechanical drawing STTS751 7049717_G Table 31. Sym SOT23-6L (2.90 mm x 2.80 mm) package mechanical data mm Min Typ Max 1.45 0.00 0.90 0.30 0.08 2.90 2.80 1.60 0.95 1.90 0.30 0° 0.45 4° 6 0.60 8° 0.012 0° 1.15 0.15 1.30 0.50 0.22 0.000 0.035 0.012 0.003 0.114 0.110 0.063 0.037 0.075 0.018 4° 6 0.024 8° 0.045 Min inches Typ Max 0.057 0.006 0.051 0.020 0.009 A A1 A2 b c D E E1 e e1 L θ N 30/36 Doc ID 16483 Rev 5 STTS751 Figure 11. UDFN-6L package footprint Package mechanical data 8187820_A(LP) Figure 12. SOT23-6L package footprint 7049714_G(LP) Doc ID 16483 Rev 5 31/36 Package mechanical data Figure 13. Carrier tape for UDFN-6L and SOT23-6L packages STTS751 P0 D T P2 E A0 TOP COVER TAPE B0 F W K0 CENTER LINES OF CAVITY P1 USER DIRECTION OF FEED AM03073v1 Table 32. Package UDFN-6L Carrier tape dimensions for UDFN-6L and SOT23-6L packages W 8.00 ±0.30 8.00 +0.30/ –0.10 D 1.50 +0.10/ –0.00 1.50 +0.10/ –0.00 E 1.75 ±0.10 1.75 ±0.10 P0 4.00 ±0.10 4.00 ±0.10 P2 2.00 ±0.05 2.00 ±0.10 F 3.50 ±0.05 3.50 ±0.05 A0 2.20 ±0.10 3.23 ±0.10 B0 2.20 ±0.10 3.17 ±0.10 K0 0.75 ±0.10 1.37 ±0.10 P1 4.00 ±0.10 T 0.25 ±0.05 Unit mm SOT23-6L 4.00 0.254 mm ±0.10 ±0.013 32/36 Doc ID 16483 Rev 5 STTS751 Figure 14. Reel schematic Package mechanical data T 40mm min. Access hole A t s lot loc ation B D C A N T ape slot In core for Full ra dius T ape s tart 2.5mm min.width G measured At hub AM04928v1 Table 33. A (max) 180 mm (7 inch) Reel dimensions for 8 mm carrier tape - UDFN-6L and SOT23-6L packages B (min) 1.5 mm C 13 mm ± 0.2 mm D (min) 20.2 mm N (min) 60 mm G 8.4 mm + 2/–0 mm T (max) 14.4 mm Note: The dimensions given in Table 33 incorporate tolerances that cover all variations on critical parameters. Doc ID 16483 Rev 5 33/36 Part numbering STTS751 10 Part numbering Table 34. Example: Ordering information scheme STTS751-0 DP 3 F Device type STTS751-0 STTS751-1 Package DP = UDFN-6L WB = SOT23-6L Temperature range 3 = –40 °C to 125 °C Shipping method F = ECOPACK® package, tape & reel E = ECOPACK® package, tubes For other options, or for more information on any aspect of this device, please contact the ST sales office nearest you. 34/36 Doc ID 16483 Rev 5 STTS751 Revision history 11 Revision history Table 35. Date 06-Nov-2009 Document revision history Revision 1 Initial release. Updated Features; removed Therm2 throughout document (from Section 1, 2, 3.8, 4.6, 4.10, 5, Figure 1, 2, 3, 4, 6, Table 2, 3, 15, 28); updated Figure 3, Section 3.4, Section 4.6, Section 4.8, Section 4.10, Table 10, 11, 12, 13, 14, 15, 17, 18, 19, 20, 21, 22, 23, 24, 25; added package footprints (Figure 11 and 12); minor textual changes. Updated Section 3.7, Section 4.11, Section 5; Figure 6, 7, 11, 12; Table 3, 9, 25, 28, Table 31; added tape and reel information (Figure 13, 14 and Table 32, 33); minor textual changes in title and document. Document status upgraded to full datasheet; updated cover page; added footnote to Table 28; minor textual changes. Removed footnote from Table 28. Changes 21-Jan-2010 2 12-May-2010 3 01-Jul-2010 20-Jul-2010 4 5 Doc ID 16483 Rev 5 35/36 STTS751 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 36/36 Doc ID 16483 Rev 5
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STTS751-1DP3F
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