TS922IN

TS922 Rail-to-rail high output current dual operational amplifier Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Rail-to-rail input and output Low noise: 9nV/√ Hz Low distortion High output current: 80mA (able to drive 32Ω loads) High-speed: 4MHz, 1V/μs Operating from 2.7V to 12V Low input offset voltage: 900μV max (TS922A) ESD Internal protection: 2kV Latch-up immunity Macromodel included in this specification Dual version available in flip-chip package D SO-8 (Plastic micropackage) N DIP8 (Plastic package) J (Flip-chip) Description The TS922 is a rail-to-rail dual BiCMOS operational amplifier optimized and fully specified for 3V and 5V operation. The device’s high output current allows low-load impedances to be driven. Very low noise, low distortion, low offset and a high output current capability make this device an excellent choice for high quality, low voltage or battery operated audio systems. The device is stable for capacitive loads up to 500pF. P TSSOP8 (Thin shrink small outline package) Applications ■ ■ ■ ■ ■ ■ ■ Headphone amplifier Sound cards, multimedia systems Line driver, actuator driver Servo amplifier Mobile phone and portable equipment Instrumentation with low noise as key factor Piezoelectric speaker driver January 2007 Rev 6 1/21 www.st.com 21 Contents TS922 Contents 1 2 3 4 Pin diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Macromodel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1 4.2 4.3 Important note concerning this macromodel . . . . . . . . . . . . . . . . . . . . . . 11 Electrical characteristics from macromodelization . . . . . . . . . . . . . . . . . . 11 Macromodel code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1 5.2 5.3 5.4 Flip-chip package (8 bumps) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 DIP8 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 SO-8 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 TSSOP8 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6 7 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2/21 TS922 Pin diagrams 1 Pin diagrams Figure 1. Pin connections (top view) Output 1 Inverting Input 1 Non-inverting Input 1 V CC 1 2 3 4 + + + 8V CC 7 Output 2 6 Inverting Input 2 5 Non-inverting Input 2 Figure 2. Pin-out for flip-chip package (top view) OUT2 -IN2 +IN2 + VCC+ GND + OUT1 -IN1 +IN1 3/21 Absolute maximum ratings and operating conditions TS922 2 Absolute maximum ratings and operating conditions Table 1. Symbol VCC Vid Vin Tstg Supply voltage (1) Differential input voltage Input voltage (3) (2) Absolute maximum ratings (AMR) Parameter Value 14 ±1 VDD-0.3 to VCC+0.3 -65 to +150 (4) Unit V V V °C Storage temperature Thermal resistance junction to ambient SO8 TSSOP8 DIP8 Flip-chip Thermal resistance junction to case SO8 TSSOP8 DIP8 Maximum junction temperature HBM: human body model(5) MM: machine model(6) CDM: charged device model Output short circuit duration Latch-up immunity Soldering temperature (10sec), leaded version Soldering temperature (10sec), unleaded version Rthja 125 120 85 90 40 37 41 150 2 100 1.5 see note 200 250 260 (7) °C/W Rthjc °C/W Tj °C kV V kV ESD mA °C 1. All voltage values, except differential voltage are with respect to network ground terminal. 2. Differential voltages are the non-inverting input terminal with respect to the inverting input terminal. If Vid > ±1V, the maximum input current must not exceed ±1mA. In this case (Vid > ±1V) an input series resistor must be added to limit input current. 3. Do not exceed 14V. 4. Rth are typical values. 5. Human body model, 100pF discharged through a 1.5kΩ resistor into pin of device. 6. Machine model ESD, a 200pF cap is charged to the specified voltage, then discharged directly into the IC with no external series resistor (internal resistor < 5Ω), into pin of device. 7. There is no short-circuit protection inside the device: short-circuits from the output to VCC can cause excessive heating. The maximum output current is approximately 80mA, independent of the magnitude of VCC. Destructive dissipation can result from simultaneous short-circuits on all amplifiers. Table 2. Symbol VCC Vicm Toper Operating conditions Parameter Supply voltage Common mode input voltage range Operating free air temperature range Value 2.7 to 12 VDD -0.2 to VCC +0.2 -40 to +125 Unit V V °C 4/21 TS922 Electrical characteristics 3 Table 3. Symbol Electrical characteristics Electrical characteristics measured at VCC = +3V, VDD = 0V, Vicm = VCC/2, Tamb = 25°C, and RL connected to VCC/2 (unless otherwise specified) Parameter Test conditions TS922, T=25°C TS922A, T=25°C TS922IJ (flip-chip), T=25°C Vio Input offset voltage Tmin ≤ Tamb ≤ Tmax TS922 Tmin ≤ Tamb ≤ Tmax TS922A Tmin ≤ Tamb ≤ Tmax TS922IJ (flip-chip) 2 T=25°C Tmin ≤ Tamb ≤ Tmax T=25°C Tmin ≤ Tamb ≤ Tmax RL= 10k, T=25°C Tmin ≤ Tamb ≤ Tmax VOH High level output voltage , RL = 600Ω T=25°C Tmin ≤ Tamb ≤ Tmax RL = 32Ω T=25°C , RL= 10k, T=25°C Tmin ≤ Tamb ≤ Tmax VOL Low level output voltage RL = 600Ω T=25°C , Tmin ≤ Tamb ≤ Tmax , RL = 32Ω T=25°C RL= 10k, T=25°C RL= 10k, Tmin ≤ Tamb ≤ Tmax Avd Large signal voltage gain (Vout = 2Vp-p) RL = 600Ω, T=25°C RL = 600Ω, Tmin ≤ Tamb ≤ Tmax RL = 32Ω, T=25°C ICC GBP CMR SVR Io SR φm Total supply current No load, Vout = VCC/2, Gain bandwidth product Common mode rejection ratio Supply voltage rejection ratio VCC = 2.7 to 3.3V Output short circuit current Slew rate Phase margin at unit gain RL = 600Ω, CL =100pF T=25°C Tmin ≤ Tamb ≤ Tmax RL = 600Ω T=25°C Tmin ≤ Tamb ≤ Tmax T=25°C Tmin ≤ Tamb ≤ Tmax 60 56 60 60 50 0.7 70 35 15 16 2 4 80 85 80 1.3 68 3 3.2 mA MHz dB dB mA V/μs Degrees V/mV 180 200 2.90 2.90 2.87 2.87 2.63 50 50 100 100 1 15 30 30 100 100 Min. Typ. Max. 3 0.9 1.5 mV 5 1.8 2.5 μV/°C nA nA V V V mV mV mV Unit DVio Iio Iib Input offset voltage drift Input offset current Vout = VCC/2 Input bias current Vout = VCC/2 5/21 Electrical characteristics Table 3. Symbol Gm en THD Cs TS922 Electrical characteristics measured at VCC = +3V, VDD = 0V, Vicm = VCC/2, Tamb = 25°C, and RL connected to VCC/2 (unless otherwise specified) (continued) Parameter Gain margin Test conditions RL = 600Ω, CL =100pF Min. Typ. 12 9 0.005 120 Max. Unit dB nV ----------Hz Equivalent input noise voltage f = 1kHz Total harmonic distortion Channel separation Vout= 2Vp-p, F= 1kHz, Av= 1, RL=600Ω % dB 6/21 TS922 Table 4. Symbol Electrical characteristics Electrical characteristics measured at VCC = 5V, VDD = 0V, Vicm = Vcc/2, Tamb = 25°C, and RL connected to Vcc/2 (unless otherwise specified) Parameter Conditions TS922, T=25°C TS922A, T=25°C TS922IJ (flip-chip), T=25°C Min. Typ. Max. 3 0.9 1.5 mV 5 1.8 2.5 2 T=25°C Tmin ≤ Tamb ≤ Tmax T=25°C Tmin ≤ Tamb ≤ Tmax RL= 10k, T=25°C Tmin ≤ Tamb ≤ Tmax 4.9 4.9 4.85 4.85 4.4 50 50 120 120 300 200 70 35 20 16 2 4 60 56 60 60 50 0.7 RL = 600Ω, CL =100pF RL = 600Ω, CL =100pF f = 1kHz 80 85 80 1.3 68 12 9 3 3.2 mA MHz dB dB mA V/μs Degrees dB nV ----------Hz Unit Vio Input offset voltage Tmin ≤ Tamb ≤ Tmax TS922 Tmin ≤ Tamb ≤ Tmax TS922A Tmin ≤ Tamb ≤ Tmax TS922IJ (flip-chip) DVio Iio Iib Input offset voltage drift Input offset current Vout = VCC/2 Input bias current Vout = VCC/2 μV/°C 30 30 100 100 nA nA 1 15 VOH High level output voltage , RL = 600Ω T=25°C Tmin ≤ Tamb ≤ Tmax RL = 32Ω T=25°C , RL= 10k, T=25°C Tmin ≤ Tamb ≤ Tmax V VOL Low level output voltage RL = 600Ω T=25°C , Tmin ≤ Tamb ≤ Tmax , RL = 32Ω T=25°C RL= 10k, T=25°C RL= 10k, Tmin ≤ Tamb ≤ Tmax mV V/mV Avd Large signal voltage gain (Vout = 2Vp-p) RL = 600Ω, T=25°C RL = 600Ω, Tmin ≤ Tamb ≤ Tmax RL = 32Ω, T=25°C Icc GBP CMR SVR Io SR φm Gm en Total supply current No load, Vout = VCC/2, Gain bandwidth product Common mode rejection ratio T=25°C Tmin ≤ Tamb ≤ Tmax RL = 600Ω T=25°C Tmin ≤ Tamb ≤ Tmax Supply voltage rejection ratio T=25°C VCC = 4.5 to 5.5V Tmin ≤ Tamb ≤ Tmax Output short circuit current Slew rate Phase margin at unit gain Gain margin Equivalent input noise voltage 7/21 Electrical characteristics Table 4. Symbol THD Cs TS922 Electrical characteristics measured at VCC = 5V, VDD = 0V, Vicm = Vcc/2, Tamb = 25°C, and RL connected to Vcc/2 (unless otherwise specified) (continued) Parameter Total harmonic distortion Channel separation Conditions Vout= 2Vp-p, F= 1kHz, Av= 1, RL=600Ω Min. Typ. 0.005 120 Max. Unit % dB 8/21 TS922 Electrical characteristics Figure 3. Output short circuit current vs. output voltage Figure 4. Total supply current vs. supply voltage 100 80 O u tp u t S h o rt- C ircu it C u rre n t ( mA) 60 40 20 0 -20 -40 -60 -80 -100 0 0,5 1 1,5 O utput Volta g e (V) 2 2,5 3 Sink Vcc=0/3V Source Figure 5. 60 Voltage gain and phase vs. frequency 180 Figure 6. Equivalent input noise voltage vs. frequency phase 30 Equivalent Input Noise (nV/sqrt(Hz) 40 120 25 gain G ain ( d B ) Rl=10k Cl=100pF Ph a se (De g ) 20 VCC=±1.5V RL=100Ω 20 60 15 10 0 0 5 0 0.01 -20 1E+02 1E+03 1E+04 1E+05 Frequency (Hz) 1E+06 1E+07 -60 1E+08 0.1 1 Frequency (kHz) 10 100 Figure 7. THD + noise vs. frequency Figure 8. 0.04 THD + noise vs. frequency 0.02 0.032 0.015 THD+Noise (%) THD+Noise (%) 0.024 0.01 RL=2k Vo=10Vpp VCC=±6V Av= 1 RL=32Ω Vo=4Vpp VCC=±2.5V Av= 1 0.016 0.005 0.008 0 0.01 0.1 1 Frequency (kHz) 10 100 0 0.01 0.1 1 Frequency (kHz) 10 100 9/21 Electrical characteristics TS922 Figure 9. 0.7 THD + noise vs. frequency Figure 10. THD + noise vs. output voltage 10,000 0.6 1,000 0.5 THD+Noise (%) 0.4 0.3 0.2 RL=32Ω Vo=2Vpp VCC=±1.5V Av= 10 THD+No ise ( %) 0,100 RL=600Ω f=1kHz VCC=0/3V Av= -1 0,010 0.1 0 0.01 0.1 1 Frequency (kHz) 10 100 0,001 0 0,2 0,4 0,6 Vout ( V rm s ) 0,8 1 1,2 Figure 11. THD + noise vs. output voltage Figure 12. THD + noise vs. output voltage 10 10 1 THD+Noise (%) RL=32Ω f=1kHz VCC=±1.5V Av= -1 0.1 THD+Noise (%) 1 0.1 RL=2kΩ f=1kHz VCC=±1.5V Av= -1 0.01 0.01 0 0.2 0.4 Vout (Vrms) 0.6 0.8 1 0.001 0 0.2 0.4 0.6 Vout (Vrms) 0.8 1 1.2 Figure 13. Open loop gain and phase vs. frequency 50 180 40 120 Phase (Deg) 60 0 1E+2 1E+3 1E+4 1E+5 Frequency (Hz) 1E+6 1E+7 1E+8 Gain (dB) 30 20 CL=500pF 10 0 10/21 TS922 Macromodel 4 4.1 Macromodel Important note concerning this macromodel Please consider the following remarks before using this macromodel. ● ● ● All models are a trade-off between accuracy and complexity (i.e. simulation time). Macromodels are not a substitute to breadboarding; rather, they confirm the validity of a design approach and help to select surrounding component values. A macromodel emulates the nominal performance of a typical device within specified operating conditions (temperature, supply voltage, for example). Thus the macromodel is often not as exhaustive as the datasheet, its purpose is to illustrate the main parameters of the product. Data derived from macromodels used outside of the specified conditions (VCC, temperature, for example) or even worse, outside of the device operating conditions (VCC, Vicm, for example), is not reliable in any way. Section 4.2 presents the electrical characteristics resulting from the use of these macromodels. 4.2 Electrical characteristics from macromodelization Table 5. Electrical characteristics resulting from macromodel simulation at VCC = 3V, VDD = 0V, RL, CL connected to VCC/2, Tamb = 25°C (unless otherwise specified) Conditions Value 0 RL = 10kΩ No load, per operator 200 1.2 -0.2 to 3.2 RL = 10kΩ RL = 10kΩ VO = 3V VO = 0V RL = 600kΩ , RL = 10kΩ CL = 100pF RL = 600kΩ 2.95 25 80 80 4 1.3 68 Unit mV V/mV mA V V mV mA mA MHz V/μs Degrees Symbol Vio Avd ICC Vicm VOH VOL Isink Isource GBP SR φm 11/21 Macromodel TS922 4.3 Macromodel code ** Standard Linear Ics Macromodels, 1996. ** CONNECTIONS: * 1 INVERTING INPUT * 2 NON-INVERTING INPUT * 3 OUTPUT * 4 POSITIVE POWER SUPPLY * 5 NEGATIVE POWER SUPPLY * .SUBCKT TS92X 1 2 3 4 5 * .MODEL MDTH D IS=1E-8 KF=2.664234E-16 CJO=10F * * INPUT STAGE CIP 2 5 1.000000E-12 CIN 1 5 1.000000E-12 EIP 10 5 2 5 1 EIN 16 5 1 5 1 RIP 10 11 8.125000E+00 RIN 15 16 8.125000E+00 RIS 11 15 2.238465E+02 DIP 11 12 MDTH 400E-12 DIN 15 14 MDTH 400E-12 VOFP 12 13 DC 153.5u VOFN 13 14 DC 0 IPOL 13 5 3.200000E-05 CPS 11 15 1e-9 DINN 17 13 MDTH 400E-12 VIN 17 5 -0.100000e+00 DINR 15 18 MDTH 400E-12 VIP 4 18 0.400000E+00 FCP 4 5 VOFP 1.865000E+02 FCN 5 4 VOFN 1.865000E+02 FIBP 2 5 VOFP 6.250000E-03 FIBN 5 1 VOFN 6.250000E-03 * GM1 STAGE *************** FGM1P 119 5 VOFP 1.1 FGM1N 119 5 VOFN 1.1 RAP 119 4 2.6E+06 RAN 119 5 2.6E+06 * GM2 STAGE *************** G2P 19 5 119 5 1.92E-02 G2N 19 5 119 4 1.92E-02 R2P 19 4 1E+07 R2N 19 5 1E+07 ************************** VINT1 500 0 5 GCONVP 500 501 119 4 19.38 VP 501 0 0 GCONVN 500 502 119 5 19.38 VN 502 0 0 12/21 TS922 ********* orientation isink isource VINT2 503 0 5 FCOPY 503 504 VOUT 1 DCOPYP 504 505 MDTH 400E-9 VCOPYP 505 0 0 DCOPYN 506 504 MDTH 400E-9 VCOPYN 0 506 0 *************************** F2PP 19 5 poly(2) VCOPYP VP 0 0 0 0 F2PN 19 5 poly(2) VCOPYP VN 0 0 0 0 F2NP 19 5 poly(2) VCOPYN VP 0 0 0 0 F2NN 19 5 poly(2) VCOPYN VN 0 0 0 0 * COMPENSATION ************ CC 19 119 25p * OUTPUT *********** DOPM 19 22 MDTH 400E-12 DONM 21 19 MDTH 400E-12 HOPM 22 28 VOUT 6.250000E+02 VIPM 28 4 5.000000E+01 HONM 21 27 VOUT 6.250000E+02 VINM 5 27 5.000000E+01 VOUT 3 23 0 ROUT 23 19 6 COUT 3 5 1.300000E-10 DOP 19 25 MDTH 400E-12 VOP 4 25 1.052 DON 24 19 MDTH 400E-12 VON 24 5 1.052 .ENDS;TS92X ******* Macromodel 0.5 0.5 1.75 1.75 13/21 Package mechanical data TS922 5 Package mechanical data In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. 5.1 Flip-chip package (8 bumps) Figure 14. Top view and dimensions of 8-bump flip-chip 1600 µm ■ 1600 µm 500µm Die size: 1600µm x 1600µm ±30µm Die height: 350µm ±20µm Die height (including bumps): 600µm Bumps diameter: 315µm ±50µm Bumps height: 250µm ±40µm Pitch: 500µm ±10µm ■ ■ ■ ■ 500µm ∅ 315µm ■ 600 µm Figure 15. Flip-chip footprint recommendation TS922IJ Footprint 5 00 μm Φ =250μ m 500 μ m 75µm min. 100 μ m max. Track Solder mask opening 500μm 500μm Φ =400μ m 150μ m min. Pad in Cu 18μ m with Flash NiAu (6μm, 0.15 μ m) 14/21 TS922 Figure 16. Flip-chip marking (top view) BUMP 1A CORNER Package mechanical data n n n n E LEADFREE Logo: ST Part Number: 922 Date Code: YWW The dot is for marking the bump 1A corner 922 YWW 1 1 A A User direction of feed Note: Device orientation: the devices are oriented in the carrier pocket with bump number A1 adjacent to the sprocket holes. 15/21 Package mechanical data TS922 5.2 DIP8 package Dimensions Ref. Min. A a1 B B1 b b1 D E e e3 e4 F I L Z 0.44 3.3 1.6 0.017 8.8 2.54 7.62 7.62 7.1 4.8 0.130 0.063 0.38 0.7 1.39 0.91 0.5 0.5 9.8 0.346 0.100 0.300 0.300 0.280 0.189 0.015 1.65 1.04 Millimeters Typ. 3.3 0.028 0.055 0.036 0.020 0.020 0.386 0.065 0.041 Max. Min. Inches Typ. 0.130 Max. 16/21 TS922 Package mechanical data 5.3 SO-8 package Dimensions Ref. Min. A A1 A2 B C D E e H h L k ddd 0.1 5.80 0.25 0.40 1.35 0.10 1.10 0.33 0.19 4.80 3.80 1.27 6.20 0.50 1.27 0.228 0.010 0.016 8° (max.) 0.04 Millimeters Typ. Max. 1.75 0.25 1.65 0.51 0.25 5.00 4.00 Min. 0.053 0.04 0.043 0.013 0.007 0.189 0.150 0.050 0.244 0.020 0.050 Inches Typ. Max. 0.069 0.010 0.065 0.020 0.010 0.197 0.157 17/21 Package mechanical data TS922 5.4 TSSOP8 package Dimensions Ref. Min. A A1 A2 b c D E E1 e K L L1 0° 0.45 0.60 1 0.05 0.80 0.19 0.09 2.90 6.20 4.30 3.00 6.40 4.40 0.65 8° 0.75 0° 0.018 0.024 0.039 1.00 Millimeters Typ. Max. 1.2 0.15 1.05 0.30 0.20 3.10 6.60 4.50 0.002 0.031 0.007 0.004 0.114 0.244 0.169 0.118 0.252 0.173 0.0256 8° 0.030 0.039 Min. Inches Typ. Max. 0.047 0.006 0.041 0.012 0.008 0.122 0.260 0.177 18/21 TS922 Ordering information 6 Ordering information Table 6. Order codes Temperature range Package Packaging Marking TS922IN DIP8 TS922AIN TS922ID/IDT SO-8 TS922AID/AIDT TS922IPT TS922AIPT TS922IJT/EIJT TS922IYD/IYDT TS922AIYD/AIYDT TS922IYPT TS922AIYPT -40°C, +125°C TSSOP8 (Thin shrink outline package) Flip-chip SO-8 (automotive grade level) TSSOP8 (automotive grade level) Tube or tape & reel Tape & reel 922AI Tape & reel Tube or tape & reel Tape & reel 922AY 922 922IY 922AIY 922IY Tube TS922AIN 922I 922AI 922I Part number TS922IN 19/21 Revision history TS922 7 Revision history Table 7. Date 1-Feb-2001 1-Jul-2004 2-May-2005 1-Aug-2005 1-Mar-2006 Document revision history Revision 1 2 3 4 5 First release. Flip-chip package inserted in the document. Modifications in AMR Table 1 on page 4 (explanation of Vid and Vi limits, ESD MM and CDM values added, Rthja added). PPAP references inserted in the datasheet, see Table 6 on page 19. TS922EIJT part number inserted in the datasheet, see Table 6 on page 19. Modifications in AMR Table 1 on page 4 (Rthjc added), parameter limits on full temperature range added in Table 3 on page 5 and Table 4 on page 7. Changes 26-Jan-2007 6 20/21 TS922 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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