TS972IYPT

TS971-TS972-TS974 Output rail-to-rail very low noise operational amplifier Features ■ ■ ■ ■ ■ ■ ■ TS971ILT (SOT23-5L) Output VDD 1 5 V CC Rail-to-rail output voltage swing ±2.4V @ VCC = ±2.5V Very low noise level: 4nV/√ Hz Ultra low distortion: 0.003% High dynamic features: 12MHz, 4V/µs Operating range: 2.7V to 10V ESD protection (2kV) Latch-up immunity (class A) 2 Non-inverting input 3 4 Inverting input TS971ID-TS971IDT (SO-8) N.C. 1 + 8 N.C. 7 VCC 6 Output 2 5 N.C. Inverting Input 1 2 Non-inverting Input 1 3 Applications ■ ■ ■ ■ V DD 4 Portable equipment (CD players, PDA) Portable communications (cell phones, pagers) Instrumentation & sensoring Professional audio circuits TS972IN (DIP8) TS972ID-TS972IDT (SO-8) TS972IPT (TSSOP8) Output 1 Inverting Input 1 Non-inverting Input 1 1 2 3 4 + + 8 VCC 7 Output 2 6 Inverting Input 2 5 Non-inverting Input 2 Description The TS97x family of operational amplifiers operates with voltages as low as ±1.35V and features output rail-to-rail signal swing. The TS97x are particularly well suited for portable and battery-supplied equipment. Very low noise and low distortion characteristics make them ideal for audio pre-amplification. The TS971 is available in a variety of packages to suit all types of applications. For applications where space-saving is critical, the SOT23 package (2.8 x 2.9mm) or the DFN package (3 x 3mm) simplify the board design because they can be placed everywhere. VDD TS972IQT (DFN8) Output 1 1 2 3 4 8 7 6 5 VCC Output 2 Inverting Input 2 Non Inverting Input 2 Inverting Input 1 Non Inverting Input 1 VDD TS974IN (DIP14) TS974ID-TS974IDT (SO-14) TS974IPT (TSSOP14) Output 1 1 Inverting Input 1 2 Non-inverting Input 1 3 VCC 4 Non-inverting Input 2 5 Inverting Input 2 6 Output 2 7 + + + + 14 Output 4 13 Inverting Input 4 12 Non-inverting Input 4 11 VDD 10 Non-inverting Input 3 9 8 Inverting Input 3 Output 3 December 2007 Rev 6 1/17 www.st.com 17 Absolute maximum ratings and operating conditions TS971-TS972-TS974 1 Absolute maximum ratings and operating conditions Table 1. Symbol VCC Vid Vin Tstg Tj Supply voltage (1) Differential input voltage Input voltage (3) (2) Absolute maximum ratings AMR Parameter Value 12 ±1 VDD -0.3 to VCC +0.3 -65 to +150 150 (4) Unit V V V Storage temperature range Maximum junction temperature Thermal resistance junction to ambient SOT23-5 DFN8 SO-8 SO-14 TSSOP8 TSSOP14 DIP8 DIP14 Thermal resistance junction to case(4) SOT23-5 DFN8 SO-8 SO-14 TSSOP8 TSSOP14 DIP8 DIP14 HBM: human body model(5) °C Rthja 250 40 125 105 120 100 85 80 81 5.2 40 31 37 32 41 33 2 200 1.5 260 °C/W Rthjc °C/W kV V kV °C ESD MM: machine model (6) CDM: charged device model(7) Lead temperature (soldering, 10sec) 1. All voltage values, except differential voltage are with respect to network ground terminal. 2. Differential voltages are the non-inverting input terminal with respect to the inverting input terminal. 3. The magnitude of input and output voltages must never exceed VCC +0.3V. 4. Short-circuits can cause excessive heating and destructive dissipation. Values are typical. 5. Human body model: A 100pF capacitor is charged to the specified voltage, then discharged through a 1.5kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. 6. Machine model: A 200pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5Ω). This is done for all couples of connected pin combinations while the other pins are floating. 7. Charged device model: all pins and the package are charged together to the specified voltage and then discharged directly to the ground through only one pin. This is done for all pins. No value specified for CDM on SOT23-5 package. 2/17 TS971-TS972-TS974 Table 2. Symbol VCC Vicm Toper Supply voltage Absolute maximum ratings and operating conditions Operating conditions Parameter Value 2.7 to 10 VDD +1.15 to VCC -1.15 -40 to +125 Unit V V °C Common mode input voltage range Operating free air temperature range 3/17 Electrical characteristics TS971-TS972-TS974 2 Table 3. Symbol Vio DVio Iio Iib Vicm CMR SVR Avd VOH VOL Isource Isink ICC GBP SR ∅m Gm en THD Electrical characteristics VCC = +2.5V, VDD = -2.5V, Tamb = 25°C (unless otherwise specified) Parameter Input offset voltage Input offset voltage drift Input offset current Input bias current Common mode input voltage range Common mode rejection ratio Supply voltage rejection ratio Large signal voltage gain High level output voltage Low level output voltage Output source current Output sink current Supply current per amplifier Gain bandwidth product Slew rate Phase margin at unit gain Gain margin Equivalent input noise voltage Total harmonic distortion Unity gain - No load f = 100kHz, RL = 2kΩ, CL = 100pF AV = 1, Vin = ±1V RL = 2kΩ, CL =100pF RL = 2kΩ, CL =100pF f = 100kHz f = 1kHz, AV = -1, RL =10kΩ 8.5 2.8 Vicm = ±1.35V VCC = ±2V to ±3V RL = 2kΩ RL = 2kΩ RL = 2kΩ Conditions Tmin ≤ Tamb ≤ Tmax Vicm = 0V, Vo = 0V Vicm = 0V, Vo = 0V Vicm = 0V, Vo = 0V Tmin ≤ Tamb ≤ Tmax -1.35 60 60 70 2 85 70 80 2.4 -2.4 1.5 100 2 12 4 60 10 4 0.003 2.8 -2 5 10 200 200 150 750 1000 1.35 Min. Typ. 1 Max. 5 7 Unit mV µV/°C nA nA V dB dB dB V V mA mA mA MHz V/µs Degrees dB nV/√ Hz % 4/17 TS971-TS972-TS974 Electrical characteristics Figure 1. Input offset voltage distribution Figure 2. Voltage gain & phase vs. frequency Figure 3. Voltage gain & phase vs. frequency Figure 4. THS vs. Vout Figure 5. THD vs. Vout Figure 6. THD vs. frequency 5/17 Electrical characteristics TS971-TS972-TS974 Figure 7. Noise voltage vs. frequency Figure 8. Gain bandwidth product vs. Iout Figure 9. Phase margin vs. Iout Figure 10. Phase margin vs. VCC Figure 11. Phase margin vs. VCC Figure 12. Gain margin vs. VCC 6/17 TS971-TS972-TS974 Package information 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 3.1 SOT23-5 package information Figure 13. SOT23-5 package mechanical drawing Table 4. Ref. SOT23-5 package mechanical data Millimeters Min. Typ. Max. 1.45 0.15 1.30 0.50 0.20 3.00 3.00 1.75 0.95 1.9 0.35 0.55 13.7 Min. 35.4 0.00 35.4 13.7 3.5 110.2 102.3 59.0 37.4 74.8 21.6 Mils Typ. Max. 57.1 5.9 51.2 19.7 7.8 118.1 118.1 68.8 A A1 A2 b C D E E1 e e1 L 0.90 0.00 0.90 0.35 0.09 2.80 2.60 1.50 7/17 Package information TS971-TS972-TS974 3.2 DIP8 package information Figure 14. DIP8 package mechanical drawing Table 5. DIP8 package mechanical data Dimensions Ref. Min. A A1 A2 b b2 c D E E1 e eA eB L 2.92 0.38 2.92 0.36 1.14 0.20 9.02 7.62 6.10 Millimeters Typ. Max. 5.33 0.015 3.30 0.46 1.52 0.25 9.27 7.87 6.35 2.54 7.62 10.92 3.30 3.81 0.115 4.95 0.56 1.78 0.36 10.16 8.26 7.11 0.115 0.014 0.045 0.008 0.355 0.300 0.240 Min. Inches Typ. Max. 0.210 0.130 0.018 0.060 0.010 0.365 0.310 0.250 0.100 0.300 0.195 0.022 0.070 0.014 0.400 0.325 0.280 0.430 0.130 0.150 8/17 TS971-TS972-TS974 Package information 3.3 SO-8 package information Figure 15. SO-8 package mechanical drawing Table 6. SO-8 package mechanical data Dimensions Ref. Min. A A1 A2 b c D H E1 e h L k ccc 0.25 0.40 1° 0.10 1.25 0.28 0.17 4.80 5.80 3.80 Millimeters Typ. Max. 1.75 0.25 0.004 0.049 0.48 0.23 4.90 6.00 3.90 1.27 0.50 1.27 8° 0.10 0.010 0.016 1° 5.00 6.20 4.00 0.011 0.007 0.189 0.228 0.150 Min. Inches Typ. Max. 0.069 0.010 0.019 0.010 0.193 0.236 0.154 0.050 0.020 0.050 8° 0.004 0.197 0.244 0.157 9/17 Package information TS971-TS972-TS974 3.4 TSSOP8 package information Figure 16. TSSOP8 package mechanical drawing Table 7. TSSOP8 package mechanical data Dimensions Ref. Min. A A1 A2 b c D E E1 e k L L1 aaa 0° 0.45 0.05 0.80 0.19 0.09 2.90 6.20 4.30 Millimeters Typ. Max. 1.2 0.15 1.00 1.05 0.30 0.20 3.00 6.40 4.40 0.65 8° 0.60 1 0.1 0.75 0° 0.018 3.10 6.60 4.50 0.002 0.031 0.007 0.004 0.114 0.244 0.169 Min. Inches Typ. Max. 0.047 0.006 0.039 0.041 0.012 0.008 0.118 0.252 0.173 0.0256 8° 0.024 0.039 0.004 0.030 0.122 0.260 0.177 10/17 TS971-TS972-TS974 Package information 3.5 DIP14 package information Figure 17. DIP14 package mechanical drawing Table 8. DIP14 package mechanical data Dimensions Ref. Min. a1 B b b1 D E e e3 F I L Z 1.27 0.51 1.39 Millimeters Typ. Max. Min. 0.020 1.65 0.5 0.25 20 8.5 2.54 15.24 7.1 5.1 3.3 2.54 0.050 0.055 Inches Typ. Max. 0.065 0.020 0.010 0.787 0.335 0.100 0.600 0.280 0.201 0.130 0.100 11/17 Package information TS971-TS972-TS974 3.6 SO-14 package information Figure 18. SO-14 package mechanical drawing Table 9. SO-14 package mechanical data Dimensions Ref. Min. A a1 a2 b b1 C c1 D E e e3 F G L M S 3.8 4.6 0.5 8.55 5.8 0.35 0.19 0.1 Millimeters Typ. Max. 1.75 0.2 1.65 0.46 0.25 0.5 45° (typ.) 8.75 6.2 1.27 7.62 4.0 5.3 1.27 0.68 8° (max.) 0.149 0.181 0.019 0.336 0.228 0.013 0.007 0.003 Min. Inches Typ. Max. 0.068 0.007 0.064 0.018 0.010 0.019 0.344 0.244 0.050 0.300 0.157 0.208 0.050 0.026 12/17 TS971-TS972-TS974 Package information 3.7 TSSOP14 package information Figure 19. TSSOP14 package mechanical drawing A A2 A1 b e K c L E D E1 PIN 1 IDENTIFICATION 1 Table 10. TSSOP14 package mechanical data Dimensions Ref. Min. A A1 A2 b c D E E1 e K L 0° 0.45 0.05 0.8 0.19 0.09 4.9 6.2 4.3 Millimeters Typ. Max. 1.2 0.15 1 1.05 0.30 0.20 5 6.4 4.4 0.65 BSC 8° 0.60 0.75 0° 0.018 5.1 6.6 4.48 0.002 0.031 0.007 0.004 0.193 0.244 0.169 Min. Inches Typ. Max. 0.047 0.004 0.039 0.006 0.041 0.012 0.0089 0.197 0.252 0.173 0.0256 BSC 8° 0.024 0.030 0.201 0.260 0.176 13/17 Package information TS971-TS972-TS974 3.8 DFN8 exposed pad package information Figure 20. DFN8 3x3 exposed pad package mechanical drawing Table 11. DFN8 3x3 exposed pad package mechanical data Dimensions Ref. Min. A A1 A2 A3 b D D2 E E2 e L 0.30 0.18 2.875 2.23 2.875 1.49 0.80 Millimeters Typ. 0.90 0.02 0.70 0.20 0.23 3.00 2. 3.00 1.64 0.65 0.40 0.50 11.8 0.30 3.125 2.48 3.125 1.74 58.7 87.8 7.1 Max. 1.00 0.05 Min. 31.5 Mils Typ. 35.4 0.8 25.6 7.9 9.1 118.1 90.7 118.1 64.6 25.6 15.7 19.7 68.5 97.7 11.8 Max. 39.4 2.0 14/17 TS971-TS972-TS974 Ordering information 4 Table 12. Ordering information Order codes Temperature range Package Packing Tube or Tape & reel Marking Order code TS971ID TS971IDT TS971ILT TS971IYD TS971IYDT(1) TS971IYLT(2) TS972IN TS972ID TS972IDT TS972IPT TS972IQT TS972IYD(1) TS972IYDT(1) TS972IYPT(2) TS974IN TS974ID TS974IDT TS974IPT TS974IYD(1) TS974IYDT(1) TS974IYPT(2) (1) SO-8 SOT23-5L SO-8 (Automotive grade level) SOT23-5L (Automotive grade level) DIP8 SO-8 TSSOP8 (Thin shrink outline package) 971I K120 Tape & reel 971IY K121 Tube Tube or Tape & reel TS972IN 972I Tape & Reel -40°C, +125°C DFN8 (Dual micro lead frame package) SO-8 (Automotive grade level) TSSOP8 (Automotive grade level) DIP14 SO-14 TSSOP14 (Thin shrink outline package) SO-14 (Automotive grade level) TSSOP14 (Automotive grade level) Tape & reel 974IY 974IY Tube or Tape & reel Tape & reel Tube Tube or Tape & reel 974I 972IY 972IY TS974IN 1. Qualified and characterized according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001 & Q 002 or equivalent. 2. Qualification and characterization according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001 & Q 002 or equivalent are on-going. 15/17 Revision history TS971-TS972-TS974 5 Revision history Table 13. Date 15-Nov- 2002 9-May- 2005 31-Aug-2005 9-Dec-2005 Document revision history Revision 1 2 3 4 First release. Modifications on AMR table (explanation of Vid and Vi limits) PPAP references inserted in the datasheet, see Table 1 on page 2. Thermal resistance junction to case data added in Table 1. on page 2 Missing PPAP references inserted in the datasheet, see Table 12: Order codes. Added Rthja and Rthjc values for DIP8 and DIP14 packages in Table 1. ESD footnotes updated in Table 1: Absolute maximum ratings AMR. Description section updated on cover page. Markings for automotive grade parts corrected in Table 12: Order codes. Reformatted package information in Section 3: Package information. Footnotes for automotive grade parts corrected in Table 12: Order codes. Changes 3-Oct-2007 5 20-Dec-2007 6 16/17 TS971-TS972-TS974 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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