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TSH93IDT

TSH93IDT

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOIC16

  • 描述:

    IC OPAMP VFB 3 CIRCUIT 14SO

  • 数据手册
  • 价格&库存
TSH93IDT 数据手册
TSH93 High-speed low power triple operational amplifier Features ■ Low supply current: 4.5 mA ■ High-speed: 150 MHz - 110 V/µs ■ Unity gain stability ■ Low offset voltage: 4 mV ■ Low noise: 4.2 nV/√Hz ■ Low cost ■ Specified for 600 Ω and 150 Ω loads ■ High video performance: Differential gain: 0.03% Differential phase: 0.07° Gain flatness: 6 MHz, 0.1 dB max. at 10 dB gain ■ ■ ) s ( ct D SO-14 (Plastic micropackage) u d o High audio performance )- ESD tolerance: 2 kV Applications ■ Set-top boxes ■ TVs ■ DVD players s ( t c r P e Pin connections (top view) t e l o s b O N.C. 1 N.C. 2 - 13 Inverting Input 3 + 12 Non-inverting Input 3 14 Output 3 N.C. 3 VCC + 4 Non-inverting Input 1 5 + + 10 Non-inverting Input 2 Inverting Input 1 6 - - 9 Inverting Input 2 Output 1 7 8 Output 2 u d o 11 VCC - r P e t e l o Description s b O The TSH93 is a triple low-power high-frequency op-amp, designed for high quality video signal processing. The device offers an excellent speed consumption ratio with 4.5 mA per amplifier for a 150 MHz bandwidth. A high slew rate and low noise make it also suitable for high-quality audio applications. May 2009 Doc ID 5274 Rev 4 1/15 www.st.com 15 Absolute maximum ratings and operating conditions 1 TSH93 Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings (AMR) Symbol Parameter Value Unit 14 V ±5 V -0.3 to 12 V Supply voltage (1) VCC Vid Differential input voltage Input voltage Vi (2) (3) Toper Operating free-air temperature range -40 to +125 °C Tstg Storage temperature range -65 to +150 °C CDM: charged device model HBM: human body model(5) MM: machine model(6) ESD (4) 1.5 2 200 ) s ( ct u d o kV kV V 1. All voltage values, except differential voltage, are with respect to network ground terminal. r P e 2. Differential voltages are the non-inverting input terminal with respect to the inverting input terminal. 3. The magnitude of input and output voltages must never exceed VCC+ +0.3 V. t e l o 4. Charged device model: all pins and package are charged together to the specified voltage and then discharged directly to the ground through only one pin. This is done for all pins. 5. Human body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5 kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. s b O 6. Machine model: a 200 pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of connected pin combinations while the other pins are floating. Table 2. ) (s Operating conditions t c u Symbol VCC Vic e t e ol Parameter od Supply voltage Pr Unit 7 to 12 Common mode input voltage range s b O 2/15 Value Doc ID 5274 Rev 4 - V + VCC +2 to VCC -1 V TSH93 2 Schematic diagram Schematic diagram Figure 1. Schematic diagram (one channel only) V CC+ ) s ( ct non inverting input Internal Vref u d o output r P e inverting input Cc t e l o ) (s s b O VCC- t c u d o r P e t e l o s b O Doc ID 5274 Rev 4 3/15 Electrical characteristics TSH93 3 Electrical characteristics Table 3. VCC+ = 5 V, VCC- = -5 V, Tamb = 25° C (unless otherwise specified) Symbol Parameter Max. Unit 4 6 mV Input offset voltage Tmin ≤ Tamb ≤ Tmax Iio Input offset current Tmin ≤ Tamb ≤ Tmax 1 2 5 μA Iib Input bias current. Tmin ≤ Tamb ≤ Tmax 5 15 20 μA ICC Supply current (per amplifier, no load) Tmin ≤ Tamb ≤ Tmax 4.5 6 8 mA CMR Common-mode rejection ratio Vic = -3 V to +4 V, Vo = 0 V Tmin ≤ Tamb ≤ Tmax 80 70 SVR Supply voltage rejection ratio VCC = ±5 V to ±3 V Tmin ≤ Tamb ≤ Tmax 60 50 Avd Large signal voltage gain RL = 100 Ω, Vo = ±2.5 V Tmin ≤ Tamb ≤ Tmax VOH High level output voltage Vid = 1 V RL = 600 Ω RL = 150 Ω Tmin ≤ Tamb ≤ Tmax - RL = 150 Ω VOL Low level output voltage Vid = 11 V RL = 600 Ω RL = 150 Ω Tmin ≤ Tamb ≤ Tmax - RL = 150 Ω GBP fT o s b e t e l O ) 57 54 3 2.5 2.4 s ( t c u d o r P e Output short circuit current - Vid = ±1 V Source Sink Tmin ≤ Tamb ≤ Tmax Source Sink let o s b Gain bandwidth product AVCL = 100, RL = 600 Ω, CL = 15 pF, f = 7.5 MHz u d o 100 Pr 75 70 dB dB dB 3.5 3 -3.5 -2.8 20 20 ) s ( ct V -3 -2.5 -2.4 36 40 V mA 15 15 90 Transition frequency 150 MHz 90 MHz 110 V/μs SR Slew rate Vin = -2 to +2 V, AVCL = +1, RL = 600 Ω, CL = 15 pF en Equivalent input voltage noise Rs = 50 Ω, f = 1 kHz 4.2 nV/√Hz φm Phase margin AVM = +1 35 Degrees Channel separation f = 1 MHz to 10 MHz 65 dB VO1/VO2 Gf THD 4/15 Typ. Vio Io O Min. 62 Gain flatness f = DC to 6 MHz, AVCL = 10 dB Total harmonic distortion f = 1 kHz, Vo = ±2.5 V, RL = 600 Ω 0.1 0.01 Doc ID 5274 Rev 4 dB % TSH93 Electrical characteristics Table 3. VCC+ = 5 V, VCC- = -5 V, Tamb = 25° C (unless otherwise specified) (continued) Symbol Parameter Min. Typ. Max. Unit ΔG Differential gain f = 3.58 MHz, AVCL = +2, RL = 150 Ω 0.03 % Δϕ Differential phase f = 3.58 MHz, AVCL = +2, RL = 150 Ω 0.07 Degrees Table 4. VCC+ = ±15 V, Tamb = 25° C (unless otherwise specified) Symbol Conditions Vio Value Unit 0 mV V/mV Avd RL = 600 Ω 3.2 ICC No load / ampli 5.2 ) s ( ct mA -3 to 4 Vicm VOH RL = 600 Ω +3.6 VOL RL = 600 Ω -3.6 Isink Vo = 0 V Isource Vo = 0 V GBP RL = 600 Ω, CL = 15 pF SR RL = 600 Ω, CL = 15 pF φm RL = 600 Ω, CL = 15 pF ) (s s b O u d o Pr 40 e t e ol V V V mA 40 mA 147 MHz 110 V/μs 42 Degrees t c u d o r P e t e l o s b O Doc ID 5274 Rev 4 5/15 Electrical characteristics Figure 2. TSH93 Input offset voltage drift vs. temperature Figure 3. Static open-loop voltage gain ) s ( ct Figure 4. Large signal follower response Figure 5. u d o r P e Small signal follower response t e l o ) (s s b O t c u d o r P e let Figure 6. o s b Open-loop frequency response & phase shift Figure 7. O 6/15 Doc ID 5274 Rev 4 Closed-loop frequency response TSH93 Electrical characteristics Figure 8. Audio bandwidth frequency Figure 9. Response & phase shift (TSH93 vs. standard 15 MHz audio op-amp) Gain flatness & phase shift vs. frequency ) s ( ct Figure 10. Cross talk isolation vs. frequency (SO-14 package) ) (s u d o r P e Figure 11. Cross talk isolation vs. frequency (SO-14 package) t e l o s b O t c u d o r P e t e l o Figure 12. Differential input impedance vs. frequency s b O Figure 13. Common input impedance vs. frequency 4.5 120 4.0 100 3.5 Zin-com (MW) Zin-diff (kW) 3.0 2.5 2.0 80 60 40 1.5 1.0 20 0.5 1k 10k 100k 1M 10M 100M 1k 10k 100k 1M 10M 100M Frequency (Hz) Frequency (Hz) Doc ID 5274 Rev 4 7/15 Printed circuit layout 4 TSH93 Printed circuit layout As for any high-frequency device, a few rules must be observed when designing the PCB to get the best performance from this high speed op-amp. From the most important to the least important point. ● Each power supply lead must be bypassed to ground with a 10 nF ceramic capacitor very close to the device and a 10 μF capacitor. ● To provide low inductance and low resistance common return, use a ground plane or common point return for power and signal. ● All leads must be wide and as short as possible especially for op-amp inputs. This is in order to decrease parasitic capacitance and inductance. ● Use small resistor values to decrease the time constant with parasitic capacitance. ● Choose component sizes as small as possible (SMD). u d o ) s ( ct At the output, decrease the capacitor load to avoid degradation in circuit stability which may cause oscillation. You can also add a serial resistor in order to minimize its influence. r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 8/15 Doc ID 5274 Rev 4 TSH93 5 Macromodel Macromodel Consider the following remarks before using this macromodel. ● All models are a trade-off between accuracy and complexity (that is, simulation time). ● Macromodels are not a substitute to breadboarding; rather, they confirm the validity of a design approach and help to select surrounding component values. ● A macromodel emulates the nominal performance of a typical device within specified operating conditions (temperature, supply voltage, for example). Thus the macromodel is often not as exhaustive as the datasheet, its purpose is to illustrate the main parameters of the product. ) s ( ct Data derived from macromodels used outside of the specified conditions (VCC, temperature, for example) or even worse, outside of the device operating conditions (VCC, Vicm, for example), is not reliable in any way. u d o This macromodel applies to: TSH93I r P e ** Standard Linear Ics Macromodels, 1997. ** CONNECTIONS : * 1 INVERTING INPUT * 2 NON-INVERTING INPUT * 3 OUTPUT * 4 POSITIVEPOWER SUPPLY * 5 NEGATIVE POWER SUPPLY .SUBCKT TSH93 1 3 2 4 5(analog) ******************************************************** .MODEL MDTH D IS=1E-8 KF=1.809064E-15 CJO=10F * INPUT STAGE CIP 2 5 1.000000E-12 CIN 1 5 1.000000E-12 EIP 10 5 2 5 1 EIN 16 5 1 5 1 RIP 10 11 2.600000E-01 RIN 15 16 2.600000E-01 RIS 11 15 3.645298E-01 DIP 11 12 MDTH 400E-12 DIN 15 14 MDTH 400E-12 VOFP 12 13 DC 0.000000E+00 VOFN 13 14 DC 0 IPOL 13 5 1.000000E-03 CPS 11 15 2.986990E-10 DINN 17 13 MDTH 400E-12 VIN 17 5 2.000000e+00 DINR 15 18 MDTH 400E-12 VIP 4 18 1.000000E+00 FCP 4 5 VOFP 3.500000E+00 FCN 5 4 VOFN 3.500000E+00 FIBP 2 5 VOFP 1.000000E-02 FIBN 5 1 VOFN 1.000000E-02 * AMPLIFYING STAGE FIP 5 19 VOFP 2.530000E+02 FIN 5 19 VOFN 2.530000E+02 t e l o ) (s s b O t c u d o r P e s b O t e l o Doc ID 5274 Rev 4 9/15 Macromodel TSH93 RG1 19 5 3.160721E+03 RG2 19 4 3.160721E+03 CC 19 5 2.00000E-09 DOPM 19 22 MDTH 400E-12 DONM 21 19 MDTH 400E-12 HOPM 22 28 VOUT 1.504000E+03 VIPM 28 4 5.000000E+01 HONM 21 27 VOUT 1.400000E+03 VINM 5 27 5.000000E+01 *********************** RZP1 5 80 1E+06 RZP2 4 80 1E+06 GZP 5 82 19 80 2.5E-05 RZP2H 83 4 10000 RZP1H 83 82 80000 RZP2B 84 5 10000 RZP1B 82 84 80000 LZPH 4 83 3.535e-02 LZPB 84 5 3.535e-02 EOUT 26 23 82 5 1 VOUT 23 5 0 ROUT 26 3 35 COUT 3 5 30.000000E-12 DOP 19 25 MDTH 400E-12 VOP 4 25 2.361965E+00 DON 24 19 MDTH 400E-12 VON 24 5 2.361965E+00 .ENDS ) (s ) s ( ct u d o r P e s b O t c u d o r P e t e l o s b O 10/15 t e l o Doc ID 5274 Rev 4 TSH93 6 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Doc ID 5274 Rev 4 11/15 Package information 6.1 TSH93 SO-14 package information Figure 14. SO-14 package mechanical drawing ) s ( ct u d o r P e Table 5. t e l o SO-14 package mechanical data s b O Dimensions )- Millimeters Ref. s ( t c Min. Max. Min. 1.75 0.05 0.068 0.25 0.004 0.009 1.10 1.65 0.04 0.06 0.33 0.51 0.01 0.02 C 0.19 0.25 0.007 0.009 D 8.55 8.75 0.33 0.34 E 3.80 4.0 0.15 0.15 A 1.35 u d o A1 A2 B so e t e l b O Typ. 0.10 Pr e 1.27 Typ. Max. 0.05 H 5.80 6.20 0.22 0.24 h 0.25 0.50 0.009 0.02 L 0.40 1.27 0.015 0.05 k ddd 12/15 Inches 8° (max.) 0.10 Doc ID 5274 Rev 4 0.004 TSH93 7 Ordering information Ordering information Table 6. Order codes Order code Temperature range Package Packaging Marking -40° C, +125° C SO-14 Tube or Tape & reel H93 TSH93ID TSH93IDT ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Doc ID 5274 Rev 4 13/15 Revision history 8 TSH93 Revision history Table 7. Document revision history Date Revision 31-Oct-2000 1 First release. 01-Aug- 2005 3 PPAP references inserted in the datasheet see Order Codes table on page 1. 3 Added ESD parameters in Table 1: Absolute maximum ratings (AMR). PPAP footnote inserted in the datasheet see Table 6: Order codes on page 13. 4 Removed TSH93IYD-IYDT from Table 6: Order codes. Updated SO-14 package information in Chapter 6. 24-Oct-2007 11-May-2009 Changes ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 14/15 Doc ID 5274 Rev 4 TSH93 ) s ( ct Please Read Carefully: u d o Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. r P e All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. t e l o No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. ) (s s b O UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. t c u UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. d o r P e t e l o Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. s b O ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 5274 Rev 4 15/15
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