TSH93
High-speed low power triple operational amplifier
Features
■
Low supply current: 4.5 mA
■
High-speed: 150 MHz - 110 V/µs
■
Unity gain stability
■
Low offset voltage: 4 mV
■
Low noise: 4.2 nV/√Hz
■
Low cost
■
Specified for 600 Ω and 150 Ω loads
■
High video performance:
Differential gain: 0.03%
Differential phase: 0.07°
Gain flatness: 6 MHz, 0.1 dB max. at 10 dB
gain
■
■
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SO-14
(Plastic micropackage)
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High audio performance
)-
ESD tolerance: 2 kV
Applications
■
Set-top boxes
■
TVs
■
DVD players
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Pin connections
(top view)
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N.C.
1
N.C.
2
-
13 Inverting Input 3
+
12 Non-inverting Input 3
14 Output 3
N.C.
3
VCC +
4
Non-inverting Input 1
5
+
+
10 Non-inverting Input 2
Inverting Input 1
6
-
-
9
Inverting Input 2
Output 1
7
8
Output 2
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11 VCC -
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Description
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The TSH93 is a triple low-power high-frequency
op-amp, designed for high quality video signal
processing. The device offers an excellent speed
consumption ratio with 4.5 mA per amplifier for a
150 MHz bandwidth.
A high slew rate and low noise make it also
suitable for high-quality audio applications.
May 2009
Doc ID 5274 Rev 4
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www.st.com
15
Absolute maximum ratings and operating conditions
1
TSH93
Absolute maximum ratings and operating conditions
Table 1.
Absolute maximum ratings (AMR)
Symbol
Parameter
Value
Unit
14
V
±5
V
-0.3 to 12
V
Supply voltage (1)
VCC
Vid
Differential input voltage
Input voltage
Vi
(2)
(3)
Toper
Operating free-air temperature range
-40 to +125
°C
Tstg
Storage temperature range
-65 to +150
°C
CDM: charged device model
HBM: human body model(5)
MM: machine model(6)
ESD
(4)
1.5
2
200
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kV
kV
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1. All voltage values, except differential voltage, are with respect to network ground terminal.
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2. Differential voltages are the non-inverting input terminal with respect to the inverting input terminal.
3. The magnitude of input and output voltages must never exceed VCC+ +0.3 V.
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4. Charged device model: all pins and package are charged together to the specified voltage and then
discharged directly to the ground through only one pin. This is done for all pins.
5. Human body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a
1.5 kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations
while the other pins are floating.
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6. Machine model: a 200 pF capacitor is charged to the specified voltage, then discharged directly between
two pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of
connected pin combinations while the other pins are floating.
Table 2.
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Operating conditions
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Symbol
VCC
Vic
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Parameter
od
Supply voltage
Pr
Unit
7 to 12
Common mode input voltage range
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2/15
Value
Doc ID 5274 Rev 4
-
V
+
VCC +2 to VCC -1
V
TSH93
2
Schematic diagram
Schematic diagram
Figure 1.
Schematic diagram (one channel only)
V CC+
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non inverting
input
Internal
Vref
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output
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inverting
input
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Electrical characteristics
TSH93
3
Electrical characteristics
Table 3.
VCC+ = 5 V, VCC- = -5 V, Tamb = 25° C (unless otherwise specified)
Symbol
Parameter
Max.
Unit
4
6
mV
Input offset voltage
Tmin ≤ Tamb ≤ Tmax
Iio
Input offset current
Tmin ≤ Tamb ≤ Tmax
1
2
5
μA
Iib
Input bias current.
Tmin ≤ Tamb ≤ Tmax
5
15
20
μA
ICC
Supply current (per amplifier, no load)
Tmin ≤ Tamb ≤ Tmax
4.5
6
8
mA
CMR
Common-mode rejection ratio Vic = -3 V to +4 V, Vo = 0 V
Tmin ≤ Tamb ≤ Tmax
80
70
SVR
Supply voltage rejection ratio VCC = ±5 V to ±3 V
Tmin ≤ Tamb ≤ Tmax
60
50
Avd
Large signal voltage gain RL = 100 Ω, Vo = ±2.5 V
Tmin ≤ Tamb ≤ Tmax
VOH
High level output voltage Vid = 1 V
RL = 600 Ω
RL = 150 Ω
Tmin ≤ Tamb ≤ Tmax - RL = 150 Ω
VOL
Low level output voltage Vid = 11 V
RL = 600 Ω
RL = 150 Ω
Tmin ≤ Tamb ≤ Tmax - RL = 150 Ω
GBP
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54
3
2.5
2.4
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Output short circuit current - Vid = ±1 V
Source
Sink
Tmin ≤ Tamb ≤ Tmax
Source
Sink
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Gain bandwidth product
AVCL = 100, RL = 600 Ω, CL = 15 pF, f = 7.5 MHz
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100
Pr
75
70
dB
dB
dB
3.5
3
-3.5
-2.8
20
20
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V
-3
-2.5
-2.4
36
40
V
mA
15
15
90
Transition frequency
150
MHz
90
MHz
110
V/μs
SR
Slew rate
Vin = -2 to +2 V, AVCL = +1, RL = 600 Ω, CL = 15 pF
en
Equivalent input voltage noise Rs = 50 Ω, f = 1 kHz
4.2
nV/√Hz
φm
Phase margin AVM = +1
35
Degrees
Channel separation f = 1 MHz to 10 MHz
65
dB
VO1/VO2
Gf
THD
4/15
Typ.
Vio
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Min.
62
Gain flatness f = DC to 6 MHz, AVCL = 10 dB
Total harmonic distortion
f = 1 kHz, Vo = ±2.5 V, RL = 600 Ω
0.1
0.01
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dB
%
TSH93
Electrical characteristics
Table 3.
VCC+ = 5 V, VCC- = -5 V, Tamb = 25° C (unless otherwise specified) (continued)
Symbol
Parameter
Min.
Typ.
Max.
Unit
ΔG
Differential gain f = 3.58 MHz, AVCL = +2, RL = 150 Ω
0.03
%
Δϕ
Differential phase f = 3.58 MHz, AVCL = +2, RL = 150 Ω
0.07
Degrees
Table 4.
VCC+ = ±15 V, Tamb = 25° C (unless otherwise specified)
Symbol
Conditions
Vio
Value
Unit
0
mV
V/mV
Avd
RL = 600 Ω
3.2
ICC
No load / ampli
5.2
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mA
-3 to 4
Vicm
VOH
RL = 600 Ω
+3.6
VOL
RL = 600 Ω
-3.6
Isink
Vo = 0 V
Isource
Vo = 0 V
GBP
RL = 600 Ω, CL = 15 pF
SR
RL = 600 Ω, CL = 15 pF
φm
RL = 600 Ω, CL = 15 pF
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Pr
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V
V
V
mA
40
mA
147
MHz
110
V/μs
42
Degrees
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Electrical characteristics
Figure 2.
TSH93
Input offset voltage drift vs.
temperature
Figure 3.
Static open-loop voltage gain
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Figure 4.
Large signal follower response
Figure 5.
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Small signal follower response
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let
Figure 6.
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Open-loop frequency response &
phase shift
Figure 7.
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Closed-loop frequency response
TSH93
Electrical characteristics
Figure 8.
Audio bandwidth frequency Figure 9.
Response & phase shift (TSH93 vs.
standard 15 MHz audio op-amp)
Gain flatness & phase shift vs.
frequency
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Figure 10. Cross talk isolation vs. frequency
(SO-14 package)
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Figure 11. Cross talk isolation vs. frequency
(SO-14 package)
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Figure 12. Differential input impedance vs.
frequency
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Figure 13. Common input impedance vs.
frequency
4.5
120
4.0
100
3.5
Zin-com (MW)
Zin-diff (kW)
3.0
2.5
2.0
80
60
40
1.5
1.0
20
0.5
1k
10k
100k
1M
10M
100M
1k
10k
100k
1M
10M
100M
Frequency (Hz)
Frequency (Hz)
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Printed circuit layout
4
TSH93
Printed circuit layout
As for any high-frequency device, a few rules must be observed when designing the PCB to
get the best performance from this high speed op-amp.
From the most important to the least important point.
●
Each power supply lead must be bypassed to ground with a 10 nF ceramic capacitor
very close to the device and a 10 μF capacitor.
●
To provide low inductance and low resistance common return, use a ground plane or
common point return for power and signal.
●
All leads must be wide and as short as possible especially for op-amp inputs. This is in
order to decrease parasitic capacitance and inductance.
●
Use small resistor values to decrease the time constant with parasitic capacitance.
●
Choose component sizes as small as possible (SMD).
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At the output, decrease the capacitor load to avoid degradation in circuit stability which may
cause oscillation. You can also add a serial resistor in order to minimize its influence.
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TSH93
5
Macromodel
Macromodel
Consider the following remarks before using this macromodel.
●
All models are a trade-off between accuracy and complexity (that is, simulation time).
●
Macromodels are not a substitute to breadboarding; rather, they confirm the validity of
a design approach and help to select surrounding component values.
●
A macromodel emulates the nominal performance of a typical device within specified
operating conditions (temperature, supply voltage, for example). Thus the
macromodel is often not as exhaustive as the datasheet, its purpose is to illustrate the
main parameters of the product.
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Data derived from macromodels used outside of the specified conditions (VCC, temperature,
for example) or even worse, outside of the device operating conditions (VCC, Vicm, for
example), is not reliable in any way.
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This macromodel applies to: TSH93I
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** Standard Linear Ics Macromodels, 1997.
** CONNECTIONS :
* 1 INVERTING INPUT
* 2 NON-INVERTING INPUT
* 3 OUTPUT
* 4 POSITIVEPOWER SUPPLY
* 5 NEGATIVE POWER SUPPLY
.SUBCKT TSH93 1 3 2 4 5(analog)
********************************************************
.MODEL MDTH D IS=1E-8 KF=1.809064E-15 CJO=10F
* INPUT STAGE
CIP 2 5 1.000000E-12
CIN 1 5 1.000000E-12
EIP 10 5 2 5 1
EIN 16 5 1 5 1
RIP 10 11 2.600000E-01
RIN 15 16 2.600000E-01
RIS 11 15 3.645298E-01
DIP 11 12 MDTH 400E-12
DIN 15 14 MDTH 400E-12
VOFP 12 13 DC 0.000000E+00
VOFN 13 14 DC 0
IPOL 13 5 1.000000E-03
CPS 11 15 2.986990E-10
DINN 17 13 MDTH 400E-12
VIN 17 5 2.000000e+00
DINR 15 18 MDTH 400E-12
VIP 4 18 1.000000E+00
FCP 4 5 VOFP 3.500000E+00
FCN 5 4 VOFN 3.500000E+00
FIBP 2 5 VOFP 1.000000E-02
FIBN 5 1 VOFN 1.000000E-02
* AMPLIFYING STAGE
FIP 5 19 VOFP 2.530000E+02
FIN 5 19 VOFN 2.530000E+02
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Macromodel
TSH93
RG1 19 5 3.160721E+03
RG2 19 4 3.160721E+03
CC 19 5 2.00000E-09
DOPM 19 22 MDTH 400E-12
DONM 21 19 MDTH 400E-12
HOPM 22 28 VOUT 1.504000E+03
VIPM 28 4 5.000000E+01
HONM 21 27 VOUT 1.400000E+03
VINM 5 27 5.000000E+01
***********************
RZP1 5 80 1E+06
RZP2 4 80 1E+06
GZP 5 82 19 80 2.5E-05
RZP2H 83 4 10000
RZP1H 83 82 80000
RZP2B 84 5 10000
RZP1B 82 84 80000
LZPH 4 83 3.535e-02
LZPB 84 5 3.535e-02
EOUT 26 23 82 5 1
VOUT 23 5 0
ROUT 26 3 35
COUT 3 5 30.000000E-12
DOP 19 25 MDTH 400E-12
VOP 4 25 2.361965E+00
DON 24 19 MDTH 400E-12
VON 24 5 2.361965E+00
.ENDS
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TSH93
6
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
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Package information
6.1
TSH93
SO-14 package information
Figure 14. SO-14 package mechanical drawing
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Table 5.
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SO-14 package mechanical data
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Dimensions
)-
Millimeters
Ref.
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Min.
Max.
Min.
1.75
0.05
0.068
0.25
0.004
0.009
1.10
1.65
0.04
0.06
0.33
0.51
0.01
0.02
C
0.19
0.25
0.007
0.009
D
8.55
8.75
0.33
0.34
E
3.80
4.0
0.15
0.15
A
1.35
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A2
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Typ.
0.10
Pr
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1.27
Typ.
Max.
0.05
H
5.80
6.20
0.22
0.24
h
0.25
0.50
0.009
0.02
L
0.40
1.27
0.015
0.05
k
ddd
12/15
Inches
8° (max.)
0.10
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0.004
TSH93
7
Ordering information
Ordering information
Table 6.
Order codes
Order code
Temperature range
Package
Packaging
Marking
-40° C, +125° C
SO-14
Tube or
Tape & reel
H93
TSH93ID
TSH93IDT
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Revision history
8
TSH93
Revision history
Table 7.
Document revision history
Date
Revision
31-Oct-2000
1
First release.
01-Aug- 2005
3
PPAP references inserted in the datasheet see Order Codes table on
page 1.
3
Added ESD parameters in Table 1: Absolute maximum ratings
(AMR).
PPAP footnote inserted in the datasheet see Table 6: Order codes on
page 13.
4
Removed TSH93IYD-IYDT from Table 6: Order codes.
Updated SO-14 package information in Chapter 6.
24-Oct-2007
11-May-2009
Changes
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TSH93
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Please Read Carefully:
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Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
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ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
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