TYN606RG

® TYN606 TYN1006 6A SCRS A STANDARD Table 1: Main Features Symbol IT(RMS) VDRM/VRRM IGT Value 6 600 and 1000 15 Unit A V mA G K A DESCRIPTION The TYN606 and TYN1006 family of Silicon Controlled Rectifiers are high performance glass passivated technology. This general purpose Family of Silicon Controlled Rectifiers is designed for power supply up to 400Hz on resistive or inductive load. K A G TO-220AB Table 2: Order Codes Part Numbers TYN606RG TYN1006RG Marking TYN606 TYN1006 Table 3: Absolute Ratings (limiting values) Symbol Parameter IT(RMS) IT(AV) ITSM I²t dI/dt IGM PG(AV) PGM VDRM VRRM Tstg Tj TL RMS on-state current (180° conduction angle) Average on-state current (180° conduction angle) Non repetitive surge peak on-state current I²t Value for fusing Critical rate of rise of on-state current IG = 100 mA , dIG/dt = 0.1 A/µs Peak gate current Average gate power dissipation Maximum gate power Repetitive peak off-state voltage Storage junction temperature range Operating junction temperature range Maximum lead temperature for soldering during 10s at 2mm from case REV. 2 Value Tc = 110°C Tc = 110°C Tj = 25°C Tj = 25°C Tj = 125°C tp = 20 µs tp = 20 µs TYN606 TYN1006 Tj = 125°C Tj = 125°C Tj = 125°C Tj = 125°C 6 3.8 73 70 24.5 50 4 1 10 600 1000 - 40 to + 150 - 40 to + 125 260 Unit A A A A2S A/µs A W W V °C °C 1/6 tp = 8.3 ms tp = 10 ms tp = 10 ms February 2006 TYN606 / TYN1006 Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified) Symbol IGT VGT VGD tgt IH IL dV/dt VTM IDRM IRRM tq VD = 12 V (D.C.) VD = VDRM IT = 100 mA IG = 1.2 x IGT Linear slope up to: VD = 67 % VDRM Gate open ITM = 12 A tp = 380 µs Tj = 25°C Tj = 110°C Tj = 110°C Test Conditions RL = 33 Ω Tj = 110°C MAX. MAX. MIN. TYP. MAX. TYP. MIN. MAX. MAX. TYP. Value 15 1.5 0.2 2 30 50 200 1.6 10 2 70 Unit mA V V µs mA mA V/µs V µA mA µs RL = 3.3 kΩ Gate open VD = VDRM IG = 40 mA dIG/dt = 0.5 A/µs VDRM = VRRM VD = 67 % VDRM ITM = 12 A VR = 25 V Tj = 110°C dITM/dt = 30 A/µs dVD/dt = 50 V/µs Table 5: Thermal Resistance Symbol Rth(j-c) Rth(j-a) Junction to case (D.C.) Junction to ambient Parameter Value 2.5 60 Unit °C/W °C/W Figure 1: Maximum average power dissipation versus average on-state current Figure 2: Correlation between maximum average power dissipation and maximum allowable temperature (Tamb and Tlead) P(W) 7 α = 180° Rth = 15°C/W Rth = 10°C/W Rth = 5°C/W P(W) 7 6 5 4 3 2 1 Tlead(°C) Rth = 0°C/W α = 120° α = 60° α = 30° α = 90° α = 180° DC 6 5 4 3 110 115 360° 2 1 120 IT(AV)(A) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 α 4.5 5.0 Tamb(°C) 0 0 20 40 60 80 100 120 140 125 2/6 TYN606 / TYN1006 Figure 3: Average on-state current versus case temperature IT(AV)(A) 7 D.C. Figure 4: Relative variation of impedance versus pulse duration K=[Zth(j-c)/Rth(j-c)] 1 Zth(j-c) thermal 6 5 4 3 2 1 α = 180° 0.1 Zth(j-a) Tcase(°C) 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 tp(s) 0.01 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Figure 5: Relative variation of gate trigger current versus junction temperature IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2.5 Figure 6: Surge peak on-state current versus number of cycles ITSM(A) 80 70 tp=10ms 2 60 One cycle 1.5 IGT 50 Tj initial=25°C 40 30 20 1 IH & IL 0.5 Tj(°C) 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 10 0 1 10 Number of cycles 100 1000 Figure 7: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of I²t ITSM(A), I2t (A2s) Tj initial = 25°C Figure 8: On-state characteristics (maximum values) ITM(A) 100 Tj=max ITSM 100 10 Tj=25°C I2t Tj max.: Vt0=1.0V Rd=46mΩ tp(ms) 10 1 2 5 10 1 1 2 VTM(V) 3 4 5 3/6 TYN606 / TYN1006 Figure 9: Ordering Information Scheme TYN Standard SCR series Voltage 6 = 600V 10 = 100V Current 06 = 6A Packing mode RG = Tube 6 06 RG Table 6: Product Selector Part Numbers TYN606RG TYN1006RG Voltage (xx) 600 V 1000 V X X Sensitivity 15 mA 15 mA Package TO-220AB TO-220AB Figure 10: TO-220AB Package Mechanical Data REF. B ØI L F A I4 l3 a1 l2 c2 b2 C a2 M b1 e c1 A a1 a2 B b1 b2 C c1 c2 e F ØI I4 L l2 l3 M DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 15.20 15.90 0.598 3.75 0.147 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 0.646 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 0.102 Max. 0.625 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.661 0.116 0.066 0.066 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 4/6 TYN606 / TYN1006 Table 7: Ordering Information Ordering type TYN606RG TYN1006RG Table 8: Revision History Date Sep-2001 13-Feb-2006 Revision 1A 2 Description of Changes First issue. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. Marking TYN606 TYN1006 Package TO-220AB Weight 2.3 g Base qty 50 Delivery mode Tube 5/6 TYN606 / TYN1006 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 6/6