VN5E010MH-E
Single-channel high-side driver with analog current sense
for automotive applications
Features
Max supply voltage
VCC
Operating voltage range
VCC 4.5 V to 28 V
Typ. ON-state resistance
RON
10 m
Current limitation (typ)
ILIMH
85 A
IS
2 µA(1)
OFF-state supply current
41 V
– Reverse battery protection with self switch
on of the Power MOSFET
– Electrostatic discharge protection
1. Typical value with all loads connected.
■
■
■
General
– Inrush current active management by
power limitation
– Very low standby current
– 3 V CMOS compatible inputs
– Optimized electromagnetic emissions
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC
european directive
– Very low current sense leakage
Diagnostic functions
– Proportional load current sense
– High current sense precision for wide
current range
– Current sense disable
– Output short to ground indication
– Overload and short to ground (power
limitation) indication
– Thermal shutdown indication
Protections
– Undervoltage shutdown
– Overvoltage clamp
– Load current limitation
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
of VCC
– Overtemperature shutdown with
autorestart (thermal shutdown)
September 2013
Application
■
All types of resistive, inductive and capacitive
loads
Description
The VN5E010MH-E is a single-channel high-side
driver manufactured in the ST proprietary
VIPower M0-5 technology and housed in the tiny
HPAK package. The VN5E010MH-E is designed
to drive 12 V automotive grounded loads
delivering protection, diagnostics and easy 3 V
and 5 V CMOS compatible interface with any
microcontroller.
The device integrates advanced protective
functions such as load current limitation, inrush
and overload active management by power
limitation, overtemperature shut-off with auto
restart and overvoltage active clamp.
A dedicated analog current sense pin is
associated with every output channel in order to
provide enhanced diagnostic functions including
fast detection of overload and short-circuit to
ground through power limitation indication and
overtemperature indication.
The current sensing and diagnostic feedback of
the whole device can be disabled by pulling the
CS_DIS pin high to allow sharing of the external
sense resistor with other similar devices.
Doc ID 15681 Rev 6
1/34
www.st.com
1
Contents
VN5E010MH-E
Contents
1
Block diagram and pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.5
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.6
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.7
Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.8
MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.9
Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.10
Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 24
Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.1
4
HPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.1
ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.2
HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.3
HPAK suggested land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.4
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5
Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2/34
Doc ID 15681 Rev 6
VN5E010MH-E
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Switching (VCC = 13 V, Tj = 25 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Current sense (8 V < VCC < 18 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Doc ID 15681 Rev 6
3/34
List of figures
VN5E010MH-E
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
4/34
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (top view) not in scale. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Delay response time between rising edge of ouput current and rising edge of current sense
(CS enabled). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Output voltage drop limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
IOUT/ISENSE vs. IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Maximum current sense ratio drift vs. load current(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Intermittent overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
TJ evolution in overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
OFF-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
High-level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Low-level input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
High-level input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
ON-state resistance vs. Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
ON-state resistance vs. VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
ILIMH vs. Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
High-level CS_DIS voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Low-level CS_DIS voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Maximum turn-off current versus inductance(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Rthj-amb vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 25
HPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Thermal fitting model of a single-channel HSD in HPAK(1) . . . . . . . . . . . . . . . . . . . . . . . . 26
HPAK package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
HPAK suggested pad layout(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
HPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
HPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Doc ID 15681 Rev 6
VN5E010MH-E
1
Block diagram and pin configuration
Block diagram and pin configuration
Figure 1.
Block diagram
Table 1.
Pin functions
Name
Function
VCC
Battery connection
OUT
Power output (1)
GND
Ground connection
IN
Voltage controlled input pin with hysteresis, CMOS compatible. Controls output
switch state
CS
Analog current sense pin, delivers a current proportional to the load current
CS_DIS
Active high CMOS compatible pin, to disable the current sense pin
1. Pins 1 and 7 must be externally tied together.
Doc ID 15681 Rev 6
5/34
Block diagram and pin configuration
Figure 2.
Table 2.
6/34
VN5E010MH-E
Configuration diagram (top view) not in scale
1
2
3
4
OUT
GND
IN
Vcc
5
6
7
CS CS_DIS OUT
Suggested connections for unused and not connected pins
Connection / pin
CS
OUT
IN
CS_DIS
Floating
Not allowed
X
X
X
To ground
Through 1k
resistor
Through 22 k
resistor
Through 10 k
resistor
Through 10 k
resistor
Doc ID 15681 Rev 6
VN5E010MH-E
2
Electrical specifications
Electrical specifications
Figure 3.
Current and voltage conventions
IS
VCC
IOUT
ICSD
VCSD
VCC
CS_DIS
OUT
IN
CS
ISENSE
IIN
VIN
VOUT
VSENSE
GND
IGND
2.1
Absolute maximum ratings
Stressing the device above the rating listed in the Table 3: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
program and other relevant quality document.
Table 3.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
VCC
DC supply voltage
41
V
-VCC
Reverse DC supply voltage
16
V
IOUT
DC output current
Internally limited
A
-IOUT
Reverse DC output current
20
A
DC input current
-1 to 10
mA
DC current sense disable input current
-1 to 10
mA
VCC - 41
+VCC
V
V
645
mJ
IIN
ICSD
VCSENSE Current sense maximum voltage (VCC > 0)
EMAX
Maximum switching energy (single pulse)
(L = 2.2 mH; RL = 0; VBAT = 13.5 V; Tjstart = 150 °C;
IOUT = IlimL(Typ.))
Doc ID 15681 Rev 6
7/34
Electrical specifications
Table 3.
VN5E010MH-E
Absolute maximum ratings (continued)
Symbol
Value
Unit
VESD
Electrostatic discharge
(human body model: R= 1.5 K C= 100 pF)
– IN
– CS
– CS_DIS
– OUT
– VCC
4000
2000
4000
5000
5000
V
V
V
V
V
VESD
Charge device model (CDM-AEC-Q100-011)
750
V
Junction operating temperature
-40 to 150
°C
Storage temperature
-55 to 150
°C
Tj
Tstg
2.2
Thermal data
Table 4.
Symbol
8/34
Parameter
Thermal data
Parameter
Max. value
Unit
Rthj-case
Thermal resistance junction-case
0.55
°C/W
Rthj-amb
Thermal resistance junction-ambient
67.7
°C/W
Doc ID 15681 Rev 6
VN5E010MH-E
2.3
Electrical specifications
Electrical characteristics
Values specified in this section are for 8 V < VCC < 28 V, -40 °C < Tj < 150 °C, unless
otherwise specified.
Table 5.
Power section
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
VCC
Operating supply voltage
4.5
13
28
V
VUSD
Undervoltage shutdown
3.5
4.5
V
VUSDhyst
Undervoltage shutdown
hysteresis
0.5
IOUT = 6 A; Tj = 25 °C
RON
RON-Rev
Vclamp
IS
IL(off)
ON-state resistance
10
IOUT = 6 A; Tj = 150 °C
20
IOUT = 6 A; VCC = 5 V; Tj = 25 °C
13
RDSON in reverse battery
condition
VCC = -13 V; IOUT = -6 A;
Tj = 25 °C
Clamp voltage
ICC = 20 mA; IOUT = 0 A
10
41
ON-state: VCC = 13 V; VIN = 5 V;
IOUT = 0 A
OFF-state output current
Table 6.
m
m
46
52
V
2
5
µA
1.5
3
mA
0.01
3
µA
OFF-state: VCC = 13 V; Tj = 25 °C;
VIN = VOUT = VSENSE = 0 V
Supply current
V
VIN = VOUT = 0 V; VCC = 13 V;
Tj = 25 °C
0
VIN = VOUT = 0 V; VCC = 13 V;
Tj = 125 °C
0
5
Min.
Typ.
Max.
Unit
Switching (VCC = 13 V, Tj = 25 °C)
Symbol
Parameter
Test conditions
td(on)
Turn-on delay time
RL = 2.2
(see Figure 5)
-
40
-
µs
td(off)
Turn-off delay time
RL = 2.2
(see Figure 5)
-
28
-
µs
(dVOUT/dt)on
Turn-on voltage
slope
RL = 2.2
-
(see Figure 23)
-
Vµs
(dVOUT/dt)off
Turn-off voltage
slope
RL = 2.2
-
(see Figure 25)
-
Vµs
WON
Switching energy
losses at turn-on
(twon)
RL = 2.2
(see Figure 5)
-
2
-
mJ
WOFF
Switching energy
losses at turn-off
(twoff)
RL = 2.2
(see Figure 5)
-
0.6
-
mJ
Doc ID 15681 Rev 6
9/34
Electrical specifications
Table 7.
Symbol
VN5E010MH-E
Logic inputs
Parameter
Test conditions
VIL
Low-level input voltage
IIL
Low-level input current
VIH
High-level input voltage
IIH
High-level input current
VI(hyst)
Input hysteresis voltage
VICL
Min.
VIN = 0.9 V
Low-level CS_DIS voltage
ICSDL
Low-level CS_DIS current
VCSDH
High-level CS_DIS voltage
ICSDH
High-level CS_DIS current
a
Table 8.
Symbol
CS_DIS clamp voltage
V
7
V
-0.7
µA
2.1
V
VCSD = 2.1 V
10
0.25
ICSD = 1 mA
V
1
µA
V
5.5
7
V
ICSD = -1 mA
-0.7
Protection and diagnostics(1)
Parameter
Test conditions
VCC = 13 V
Short-circuit current
VCC = 13 V; TR < Tj < TTSD
during thermal cycling
TTSD
Shutdown
temperature
Min.
Typ.
Max.
60
85
120
TR
Reset temperature
TRS
Thermal reset of
status
Turn-off output voltage IOUT = 2 A; VIN = 0;
clamp
L = 6 mH
Output voltage drop
limitation
120
21
150
175
TRS + 1
TRS + 5
A
200
135
Thermal hysteresis
(TTSD-TR)
IOUT = 0.5 A;
Tj = -40 °C to 150 °C
Doc ID 15681 Rev 6
Unit
A
5 V < VCC < 28 V
°C
°C
°C
7
°C
VCC - 41 VCC - 46 VCC - 52
V
25
mV
1. To ensure long term reliability under heavy overload or short-circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
10/34
µA
V
5.5
VCSD = 0.9 V
IlimL
VON
2.1
0.9
Short-circuit current
VDEMAG
V
0.25
IlimH
THYST
0.9
10
VCSD(hyst) CS_DIS hysteresis voltage
VCSCL
Unit
µA
IIN = -1 mA
VCSDL
Max.
1
VIN = 2.1 V
IIN = 1 mA
Input clamp voltage
Typ.
VN5E010MH-E
Electrical specifications
Table 9.
Symbol
Current sense (8 V < VCC < 18 V)
Parameter
Test conditions
Min.
Typ.
Max.
K0
IOUT/ISENSE
IOUT = 0.25 A; VSENSE = 0.5 V
Tj = -40 °C to 150 °C
Tj = 25 °C to 150 °C
3000
3000
7410 12000
7410 11600
K1
IOUT/ISENSE
IOUT = 6 A; VSENSE = 0.5 V
Tj = -40 °C to 150 °C
Tj = 25 °C to 150 °C
5350
5510
6740
6740
dK1/K1(1)
K2
dK2/K2(1)
K3
dK3/K3(1)
ISENSE0
IOUT = 6 A; VSENSE = 0.5 V;
Current sense ratio drift VCSD = 0 V;
Tj = -40 °C to 150 °C
IOUT = 10 A; VSENSE = 4 V
Tj = -40 °C to 150 °C
Tj = 25 °C to 150 °C
IOUT/ISENSE
IOUT = 10 A; VSENSE = 4 V;
Current sense ratio drift VCSD = 0 V;
Tj = -40 °C to 150 °C
IOUT = 25 A; VSENSE = 4 V
Tj = -40 °C to 150 °C
Tj = 25 °C to 150 °C
IOUT/ISENSE
IOUT = 25 A; VSENSE = 4 V;
Current sense ratio drift VCSD = 0 V;
Tj = -40 °C to 150 °C
Analog sense leakage
current
-15
5850
5800
-11
5915
5850
6420
6420
VSENSE
%
7690
7195
11
%
7000
6755
-8
8
IOUT = 0 A; VSENSE = 0 V;
VCSD = 5 V; VIN = 0 V;
Tj = -40 °C to 150 °C
0
1
IOUT = 0 A; VSENSE = 0 V;
VCSD = 0 V; VIN= 5 V;
Tj = -40 °C to 150 °C
0
2
IOUT = 2 A; VSENSE = 0 V;
VCSD = 5 V; VIN = 5 V;
Tj = -40 °C to 150 °C
IOL
8500
7745
15
6570
6570
Unit
%
µA
1
Open load ON-state
current detection
threshold
VIN = 5 V, 8 V < VCC < 18 V
ISENSE = 5 µA
5
Max analog sense
output voltage
IOUT = 18 A; RSENSE = 3.9 k
5
80
mA
V
VSENSEH(2)
Analog sense output
V = 13 V; RSENSE = 3.9 k
voltage in fault condition CC
8
V
ISENSEH(2)
Analog sense output
V = 13 V; VSENSE = 5 V
current in fault condition CC
9
mA
Doc ID 15681 Rev 6
11/34
Electrical specifications
Table 9.
VN5E010MH-E
Current sense (8 V < VCC < 18 V) (continued)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
tDSENSE1H
Delay response time
from falling edge of
CS_DIS pin
VSENSE < 4 V,
1.5 A < IOUT < 25 A
ISENSE = 90% of ISENSE MAX
(see Figure 4)
50
100
µs
tDSENSE1L
Delay response time
from rising edge of
CS_DIS pin
VSENSE < 4 V,
1.5 A
Power Limitation
Thermal cycling
ILimL >
IOUT
VSENSE
VCS_DIS
Doc ID 15681 Rev 6
17/34
Electrical specifications
VN5E010MH-E
Figure 12. Intermittent overload
INPUT
Overload
ILimH >
ILimL >
Nominal load
IOUT
VSENSEH>
VSENSE
VCS_DIS
Figure 13. TJ evolution in overload or short to GND
INPUT
Self-limitation of fast thermal transients
TTSD
THYST
TR
TJ_START
TJ
ILimH >
Power Limitation
< ILimL
IOUT
18/34
Doc ID 15681 Rev 6
VN5E010MH-E
2.5
Electrical specifications
Electrical characteristics curves
Figure 14. OFF-state output current
Figure 15. High-level input current
Iih [uA]
Iloff [nA]
5
6000
4.5
5000
Vin= 2.1V
4
3.5
4000
3
2.5
3000
2
2000
1.5
1
1000
0.5
0
-50
-25
0
25
50
75
100
125
150
175
0
-50
-25
0
25
Tc [°C]
125
150
175
Vil [V]
7
2
6.8
1.8
1.6
Iin= 1m A
6.4
1.4
6.2
1.2
6
1
5.8
0.8
5.6
0.6
5.4
0.4
5.2
0.2
-25
0
25
50
75
100
125
150
175
0
-50
-25
0
25
50
75
100
125
150
175
Tc [°C]
Tc [°C]
Figure 18. High-level input voltage
Figure 19. Input hysteresis voltage
Vihyst [V]
Vih [V]
1
4
0.9
3.5
0.8
3
0.7
2.5
0.6
2
0.5
1.5
0.4
0.3
1
0.2
0.5
0
-50
100
Figure 17. Low-level input voltage
Vicl [V]
5
-50
75
Tc [°C]
Figure 16. Input clamp voltage
6.6
50
0.1
-25
0
25
50
75
100
125
150
175
0
-50
Tc [°C]
-25
0
25
50
75
100
125
150
175
Tc [°C]
Doc ID 15681 Rev 6
19/34
Electrical specifications
VN5E010MH-E
Figure 20. ON-state resistance vs. Tcase
Figure 21. ON-state resistance vs. VCC
Ron [m Ohm ]
Ron [m Ohm ]
80
30
70
25
60
50
20
Iout= 6A
Vcc= 13V
40
30
Tc= 150°C
15
Tc= 125°C
10
Tc= 25°C
20
0
-50
Tc= -40°C
5
10
0
-25
0
25
50
75
100
125
150
175
0
5
10
15
Tc [°C]
20
25
30
35
40
Vcc [V]
Figure 22. Undervoltage shutdown
Figure 23. Turn-on voltage slope
(dVout/dt)On [V/m s]
Vusd [V]
1000
16
900
14
800
12
Vcc= 13V
Rl= 13Ω
700
10
600
8
500
400
6
300
4
200
2
0
-50
100
-25
0
25
50
75
100
125
150
175
0
-50
-25
0
25
50
75
100
125
150
175
Tc [°C]
Tc [°C]
Figure 24. ILIMH vs. Tcase
Figure 25. Turn-off voltage slope
Ilim h [A]
(dVout/dt)Off [V/m s]
100
1000
900
Vcc= 13V
90
800
Vcc= 13V
Rl= 13Ω
700
80
600
70
500
400
60
300
50
200
100
40
-50
-25
0
25
50
75
Tc [°C]
20/34
100
125
150
175
0
-50
-25
0
25
50
75
Tc [°C]
Doc ID 15681 Rev 6
100
125
150
175
VN5E010MH-E
Electrical specifications
Figure 26. High-level CS_DIS voltage
Figure 27. CS_DIS clamp voltage
Vcsdh [V]
Vcsdcl [V]
4
10
3.5
9
Iin= 1m A
8
3
7
2.5
6
2
5
1.5
4
3
1
2
0.5
0
-50
1
-25
0
25
50
75
100
125
150
175
0
-50
Tc [°C]
-25
0
25
50
75
100
125
150
175
Tc [°C]
Figure 28. Low-level CS_DIS voltage
Vcsdl [V]
4
3.5
3
2.5
2
1.5
1
0.5
0
-50
-25
0
25
50
75
100
125
150
175
Tc [°C]
Doc ID 15681 Rev 6
21/34
Electrical specifications
2.6
VN5E010MH-E
Application information
Figure 29. Application schematic
+5V
VCC
20V
Rprot
CS_DIS
Dld
MCU
Rprot
IN
OUT
CS
Rprot
45V
RSENSE
GND
Cext
2.7
Load dump protection
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
VCC max DC rating. The same applies if the device is subject to transients on the VCC line
that are greater than the ones shown in the ISO 7637-2 2004 (E) table.
2.8
MCU I/Os protection
When negative transients are present on the VCC line, the control pins are pulled negative to
approximatly -1.5 V. ST suggests to insert a resistor (Rprot) in line to prevent the
microcontroller I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of microcontroller
and the current required by the HSD I/Os (input levels compatibility) with the latch-up limit of
microcontroller I/Os.
Equation 1
-VCCpeak / Ilatchup Rprot (VOHC - VIH ) / IIHmax
Calculation example:
For VCCpeak = - 1.5 V; Ilatchup 20 mA; VOHC 4.5 V
75 Rprot 240 k.
Recommended values: Rprot =10 kCEXT = 10 nF.
22/34
Doc ID 15681 Rev 6
VN5E010MH-E
2.9
Electrical specifications
Current sense and diagnostic
The current sense pin performs a double function (see Figure 30: Current sense and
diagnostic):
●
Current mirror of the load current in normal operation, delivering a current
proportional to the load one according to a know ratio KX.
The current ISENSE can be easily converted to a voltage VSENSE by means of an
external resistor RSENSE. Linearity between IOUT and VSENSE is ensured up to 5 V
minimum (see parameter VSENSE in Table 9: Current sense (8 V < VCC < 18 V)). The
current sense accuracy depends on the output current (refer to current sense electrical
characteristics Table 9: Current sense (8 V < VCC < 18 V)).
●
Diagnostic flag in fault conditions, delivering a fixed voltage VSENSEH up to a
maximum current ISENSEH in case of the following fault conditions (refer to
Table 10: Truth table):
–
Power limitation activation
–
Overtemperature
A logic level high on CS_DIS pin sets at the same time all the current sense pins of the
device in a high-impedance state, thus disabling the current monitoring and diagnostic
detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of
sense resistance and ADC line among different devices.
Figure 30. Current sense and diagnostic
VBAT
VCC
Main MOSn
41V
Overtemperature
IOUT/KX
ISENSEH
Pwr_Lim
OUTn
VSENSEH
CS_DIS
CURRENT
SENSEn
GND
Load
RPROT
To uC ADC
RSENSE
VSENSE
Doc ID 15681 Rev 6
23/34
Electrical specifications
2.10
VN5E010MH-E
Maximum demagnetization energy (VCC = 13.5 V)
Figure 31. Maximum turn-off current versus inductance(1)
100
A
B
C
I (A)
10
1
0,1
1
L (mH)
10
100
A: Tjstart = 150 °C (single pulse)
B: Tjstart = 100 °C (repetitive pulse)
C: Tjstart = 125 °C (repetitive pulse)
VIN, IL
Demagnetization
Demagnetization
Demagnetization
t
1. Values are generated with RL = 0
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves A and B.
24/34
Doc ID 15681 Rev 6
VN5E010MH-E
Package and PC board thermal data
3
Package and PC board thermal data
3.1
HPAK thermal data
Figure 32. PC board(1)
1. Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm,
PCB thickness =1.8 mm, Cu thickness = 70 µm, Copper areas: from minimum pad lay-out to 8 cm2).
Figure 33. Rthj-amb vs. PCB copper area in open box free air condition
RTHj_amb(°C/W)
70
65
60
55
50
45
40
35
30
0
2
4
6
8
10
PCB Cu heatsink area (cm^2)
Doc ID 15681 Rev 6
25/34
Package and PC board thermal data
VN5E010MH-E
Figure 34. HPAK thermal impedance junction ambient single pulse
ZTH (°C/W)
100
Cu=8 cm2
Cu=2 cm2
Cu=foot print
10
1
0.1
0.001
0.01
0.1
1
Time (s)
10
100
Figure 35. Thermal fitting model of a single-channel HSD in HPAK(1)
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
Equation 2: pulse calculation formula
Z TH = R TH + Z THtp 1 –
where = tP/T
26/34
Doc ID 15681 Rev 6
1000
VN5E010MH-E
Package and PC board thermal data
Table 14.
Thermal parameter
Area/island (cm2)
Footprint
R1 (°C/W)
0.01
R2 (°C/W)
0.15
R3 (°C/W)
0.5
R4 (°C/W)
8
R5 (°C/W)
4
8
28
22
12
R6 (°C/W)
31
25
16
C1 (W.s/°C)
0.005
C2 (W.s/°C)
0.05
C3 (W.s/°C)
0.1
C4 (W.s/°C)
0.4
C5 (W.s/°C)
0.8
1.4
3
C6 (W.s/°C)
3
6
9
Doc ID 15681 Rev 6
27/34
Package and packing information
VN5E010MH-E
4
Package and packing information
4.1
ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
4.2
HPAK mechanical data
Figure 36. HPAK package dimension
28/34
Doc ID 15681 Rev 6
VN5E010MH-E
Package and packing information
Table 15.
HPAK mechanical data
Data book mm
Ref. dim
Nom.
Min.
Max.
A
2.20
2.40
A1
0.90
1.10
A2
0.03
0.23
b
0.45
0.60
b4
5.20
5.40
c
0.45
0.60
c2
0.48
0.60
D
6.00
6.20
6.40
6.60
e1
1.60
1.80
e2
3.30
3.50
e3
5.00
5.20
H
9.35
10.10
L
1
D1
5.10
E
E1
5.20
e
0.85
(L1)
2.80
L2
0.80
L4
R
0.60
1.00
0°
8°
0.20
V2
Doc ID 15681 Rev 6
29/34
Package and packing information
4.3
VN5E010MH-E
HPAK suggested land pattern
Figure 37. HPAK suggested pad layout(1)
All dimensions are in mm.
1. The land pattern proposed is not intended to overrule User's PCB design, manufacturing and soldering
process rules
30/34
Doc ID 15681 Rev 6
VN5E010MH-E
4.4
Package and packing information
Packing information
The devices can be packed in tube or tape and reel shipments (see Table 16: Device
summary).
Figure 38. HPAK tube shipment (no suffix)
A
Base q.ty
Bulk q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
C
B
75
3000
532
6
21.3
0.6
All dimensions are in mm.
Figure 39. HPAK tape and reel (suffix “TR”)
REEL DIMENSIONS
All dimensions are in mm.
Base q.ty
Bulk q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
2500
2500
330
1.5
13
20.2
16.4
60
22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape hole spacing
Component spacing
Hole diameter
Hole diameter
Hole position
Compartment depth
Hole spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
All dimensions are in mm.
16
4
8
1.5
1.5
7.5
2.75
2
End
Start
Top
cover
tape
No components
Components
No components
500mm min
Empty components pockets
saled with cover tape.
500mm min
User direction of feed
Doc ID 15681 Rev 6
31/34
Order codes
5
VN5E010MH-E
Order codes
Table 16.
Device summary
Order codes
Package
6 pins HPAK
32/34
Tube
Tape and reel
VN5E010MH-E
VN5E010MHTR-E
Doc ID 15681 Rev 6
VN5E010MH-E
6
Revision history
Revision history
Table 17.
Document revision history
Date
Revision
Changes
28-May-2009
1
Initial release.
18-Jun-2009
2
Figure 32: PC board(1)
– Changed footnote
15-Dec-2009
3
Updated Table 7: Logic inputs
25-Jan-2010
4
Updated Table 9: Current sense (8 V < VCC < 18 V)
27-May-2010
5
Updated Table 15: HPAK mechanical data.
18-Sep-2013
6
Updated Disclaimer.
Doc ID 15681 Rev 6
33/34
VN5E010MH-E
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