MBKK2012TR47N

Notice for TAIYO YUDEN Products [ For General Electronic Equipment ] Please read this notice before using the TAIYO YUDEN products. REMINDERS ■ Product information in this catalog is as of October 2018. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or use of our products. Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or equipment incorporating our products, which are caused under the conditions other than those specified in this catalog or individual product specification sheets. ■ Please contact TAIYO YUDEN for further details of product specifications as the individual product specification sheets are available. ■ Please conduct validation and verification of our products in actual condition of mounting and operating environment before using our products. ■ The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office equipment, information and communication equipment including, without limitation, mobile phone, and PC) and medical equipment classified as Class I or II by IMDRF. Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which may directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation, automotive powertrain control system, train control system, and ship control system, traffic signal equipment, disaster prevention equipment, medical equipment classified as Class III by IMDRF, highly public information network equipment including, without limitation, telephone exchange, and base station). Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g., aerospace equipment, aviation equipment*, medical equipment classified as Class IV by IMDRF, nuclear control equipment, undersea equipment, military equipment). *Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN. Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment. When our products are used even for high safety and/or reliability-required devices or circuits of general electronic equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to install a protection circuit as necessary. Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above. ■ Information contained in this catalog is intended to convey examples of typical performances and/or applications of our products and is not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights. ■ Please note that the scope of warranty for our products is limited to the delivered our products themselves and TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products. Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in accordance with such agreement. ■ The contents of this catalog are applicable to our products which are purchased from our sales offices or authorized distributors (hereinafter“TAIYO YUDEN’ s official sales channel”). Please note that the contents of this catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’ s official sales channel. ■ Caution for Export Some of our products listed in this catalog may require specific procedures for export according to“U.S. Export Administration Regulations” ,“Foreign Exchange and Foreign Trade Control Law”of Japan, and other applicable regulations. Should you have any questions on this matter, please contact our sales staff. 19 METAL WIRE-WOUND CHIP POWER INDUCTORS(MCOILTM MB SERIES) METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MB SERIES） REFLOW REFLOW ■PARTS NUMBER M B ① K * Operating Temp.：-40～+105℃（Including self-generated heat） K 1 6 ② 0 ③ ①Series name Code MB 8 T ④ 1 R 0 ⑤ M △ ⑥ ⑦ ④Packaging Code T Series name Metal Wire-Wound chip power inductor ／ POWER INDUCTORS INDUCTORS ②Dimensions（T） Code KK MK ⑤Nominal inductance Code （example） R24 1R0 4R7 ※R＝Decimal point Dimensions（T）［mm］ 1.0 1.2 ③Dimensions（L×W） Code Type（inch） 1608 2012 2520 1608（0603） 2012（0805） 2520（1008） △＝Blank space Dimensions （L×W）［mm］ 1.6×0.8 2.0×1.25 2.5×2.0 ⑥Inductance tolerance Code M N Packaging Taping Nominal inductance［μH］ 0.24 1.0 4.7 Inductance tolerance ±20％ ±30％ ⑦Internal code ■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY Recommended Land Patterns Surface Mounting L W ・Mounting and soldering conditions should be checked beforehand. ・Applicable soldering process to these products is reflow soldering Type A T C 1608 0.55 2012 0.60 e 2520 0.60 B A A Type MBKK1608 MBKK2012 MBMK2520 only. B 0.70 1.00 1.50 C 1.00 1.45 2.00 Unit：mm Standard quantity［pcs］ Paper tape Embossed tape L W T e 1.6±0.2 （0.063±0.008） 2.0±0.2 （0.079±0.008） 2.5±0.2 （0.098±0.008） 0.8±0.2 （0.031±0.008） 1.25±0.2 （0.049±0.008） 2.0±0.2 （0.079±0.008） 1.0 max （0.040 max） 1.0 max （0.040 max） 1.2 max （0.047 max） 0.45±0.15 （0.016±0.006） 0.5±0.2 （0.020±0.008） 0.5±0.2 （0.020±0.008） － 3000 － 3000 － 3000 Unit：mm（inch） i_wound_MB_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 60 19 ■PARTS NUMBER ●MBKK1608（0603） type Parts number MBKK1608TR24N MBKK1608TR47N MBKK1608TR68N MBKK1608T1R0M MBKK1608T1R5M MBKK1608T2R2M MBKK1608T3R3M MBKK1608T4R7M EHS Nominal inductance ［μH］ Inductance tolerance Self-resonant frequency ［MHｚ］（min.） DC Resistance ［Ω］（max.） RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.24 0.47 0.68 1.0 1.5 2.2 3.3 4.7 ±30％ ±30％ ±30％ ±20％ ±20％ ±20％ ±20％ ±20％ - 0.049 0.104 0.120 0.150 0.200 0.345 0.512 0.730 ●MBKK2012（0805） type Parts number 【Thickness：1.0mm max.】 EHS Nominal inductance ［μH］ Inductance tolerance Self-resonant frequency ［MHｚ］（min.） DC Resistance ［Ω］（max.） RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.24 0.47 0.68 1.0 1.5 2.2 3.3 4.7 ±30％ ±30％ ±30％ ±20％ ±20％ ±20％ ±20％ ±20％ - 0.041 0.078 0.090 0.106 0.173 0.290 0.500 0.615 ●MBMK2520（1008） type Rated current　※）　［ｍA］（max.） Measuring Saturation current Temperature rise current frequency［MHz］ Idc1 Idc2 1,650 2,300 1.0 1,100 1,400 1.0 950 1,200 1.0 800 1,150 1.0 650 1,000 1.0 520 750 1.0 450 600 1.0 370 500 1.0 Rated current　※）　［ｍA］（max.） Measuring Saturation current Temperature rise current frequency［MHz］ Idc1 Idc2 3,000 2,400 1.0 2,000 1,650 1.0 1,800 1,500 1.0 1,500 1,450 1.0 1,200 1,100 1.0 900 850 1.0 700 650 1.0 600 600 1.0 【Thickness：1.2mm max.】 Parts number EHS Nominal inductance ［μH］ Inductance tolerance Self-resonant frequency ［MHｚ］（min.） DC Resistance ［Ω］（max.） MBMK2520TR24N MBMK2520TR47N MBMK2520TR68N MBMK2520T1R0M MBMK2520T1R5M MBMK2520T2R2M MBMK2520T3R3M MBMK2520T4R7M RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.24 0.47 0.68 1.0 1.5 2.2 3.3 4.7 ±30％ ±30％ ±30％ ±20％ ±20％ ±20％ ±20％ ±20％ - 0.026 0.042 0.058 0.072 0.106 0.159 0.260 0.380 Rated current　※）　［ｍA］（max.） Measuring Saturation current Temperature rise current frequency［MHz］ Idc1 Idc2 4,750 3,500 1.0 3,900 2,600 1.0 3,150 2,150 1.0 2,350 1,850 1.0 2,050 1,500 1.0 1,800 1,250 1.0 1,400 970 1.0 1,150 800 1.0 ※）The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃) ※）The temperature rise current value (Idc2) is the DC current value having temperature increase by 40℃. (at 20℃) ※）The rated current value is following either Idc1 or Idc2, which is the lower one. ／ POWER INDUCTORS INDUCTORS MBKK2012TR24N MBKK2012TR47N MBKK2012TR68N MBKK2012T1R0M MBKK2012T1R5M MBKK2012T2R2M MBKK2012T3R3M MBKK2012T4R7M 【Thickness：1.0mm max.】 i_wound_MB_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 61 METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MB SERIES／MCOILTM MB-H SERIES) ■PACKAGING ①Minimum Quantity Type MBKK1608／MBKK1608H MBKK2012 MBMK2520／MBMK2520H Standard Quantity [pcs] Tape ＆ Reel 3000 3000 3000 ②Tape Material ●Embossed Tape Top tape Chip Filled Sprocket hole Base tape Chip cavity Chip ③Taping dimensions ●Embossed tape 8mm wide (0.315 inches wide) 3.5±0.1 (0.138±0.004) A B F 1.75±0.1 (0.069±0.004） 8.0±0.2 (0.315±0.008) φ1.5＋0.1/－0 (φ0.059＋0.004/-0) Sprocket hole 4.0±0.1 (0.157±0.004) 2.0±0.05 (0.079±0.002) Type MBKK1608／MBKK1608H MBKK2012 MBMK2520／MBMK2520H Electrode（bottom view） Chip cavity A 1.1 (0.043) 1.45 (0.057) 2.3 (0.091) B 1.9 (0.075) 2.2 (0.087) 2.8 (0.110) Insertion pitch F 4.0±0.1 (0.157±0.004) 4.0±0.1 (0.157±0.004) 4.0±0.1 (0.157±0.004) Tape thickness T K 0.25±0.05 1.2 max (0.010±0.002) (0.047 max) 0.25±0.05 1.2 max (0.010±0.002) (0.047 max) 0.3±0.05 1.45 max (0.012±0.002) (0.057 max) Unit：mm（inch） ④Leader and Blank portion ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_pack_e-E06R01 ⑤Reel size Type MBKK1608／MBKK1608H MBKK2012 MBMK2520／MBMK2520H φD Reel size (Reference values) φd 180+0/-3 （7.087+0/-0.118） 60+1/-0 （2.36+0.039/0） W 10.0±1.5 （0.394±0.059） Unit：mm（inch） ⑥Top Tape Strength The top The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_pack_e-E06R01 METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MB SERIES／MCOILTM MB-H SERIES) ■RELIABILITY DATA 1. Operating Temperature Range Specified Value Test Methods and Remarks MB series －40～＋105℃ MB-H series －40～＋125℃ Including self-generated heat 2. Storage Temperature Range Specified Value Test Methods and Remarks MB series －40～＋85℃ MB-H series 0 to 40℃ for the product with taping. 3. Rated current Specified Value MB series MB-H series Within the specified tolerance 4. Inductance Specified Value Test Methods and Remarks MB series MB-H series Measuring equipment Measuring frequency Within the specified tolerance : LCR Meter （HP 4285A or equivalent） : 1MHz、1V 5. DC Resistance Specified Value Test Methods and Remarks MB series MB-H series Measuring equipment Within the specified tolerance : DC ohmmeter （HIOKI 3227 or equivalent） 6. Self resonance frequency Specified Value MB series MB-H series － 7. Temperature characteristic Specified Value Test Methods and Remarks MB series MB-H series Inductance change : Within ±15% MB series : Measurement of inductance shall be taken at temperature range within －40℃～＋105℃. With reference to inductance value at ＋20℃., change rate shall be calculated. MB-H series : Measurement of inductance shall be taken at temperature range within －40℃～＋125℃. With reference to inductance value at ＋20℃., change rate shall be calculated. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_reli_e-E06R01 8. Resistance to flexure of substrate Specified Value Test Methods and Remarks MB series MB-H series No damage The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating until deflection of the test board reaches to 2 mm. Test board size : 100×40×1.0 mm (1608：0.8mm) Test board material : Glass epoxy-resin Solder cream thickness : 0.1 mm 9. Insulation resistance : between wires Specified Value MB series MB-H series － 10. Insulation resistance : between wire and core Specified Value MB series DC25V 100kΩ min MB-H series DC50V 100kΩ min 11. Withstanding voltage : between wire and core Specified Value MB series MB-H series － 12. Adhesion of terminal electrode Specified Value Test Methods and Remarks MB series MB-H series No abnormality. The test samples shall be soldered to the test board by the reflow. Applied force : 10N (1608：5N) to X and Y directions. Duration : 5s. Solder cream thickness : 0.1mm. 13. Resistance to vibration Specified Value Test Methods and Remarks MB series MB-H series Inductance change : Within ±10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. Then it shall be submitted to below test conditions. Frequency Range 10～55Hz Total Amplitude 1.5mm (May not exceed acceleration 196m/s2) Sweeping Method 10Hz to 55Hz to 10Hz for 1min. X Time Y For 2 hours on each X, Y, and Z axis. Z Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 14. Solderability Specified Value Test Methods and Remarks MB series MB-H series At least 90％ of surface of terminal electrode is covered by new solder. The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table. Flux : Methanol solution containing rosin 25%. Solder Temperature 245±5℃ Immersing speed 25mm/s Time 5±0.5 sec. ※Immersion depth : All sides of mounting terminal shall be immersed. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_reli_e-E06R01 15. Resistance to soldering heat Specified Value Test Methods and Remarks MB series MB-H series Inductance change : Within ±10% No significant abnormality in appearance. The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3 times. Test board material : Glass epoxy-resin Test board thickness : 1.0mm Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 16. Thermal shock Specified Value Test Methods and Remarks MB series MB-H series Inductance change : Within ±10% No significant abnormality in appearance. MB series: The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles. Conditions of 1 cycle Step Temperature (℃) Duration (min) 1 －40±3 30±3 2 Room temperature Within 3 3 ＋85±2 30±3 4 Room temperature Within 3 Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. MB-H series: The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles. Conditions of 1 cycle Step Temperature (℃) Duration (min) 1 －40±3 30±3 2 Room temperature Within 3 3 ＋125±2 30±3 4 Room temperature Within 3 Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 17. Damp heat Specified Value Test Methods and Remarks MB series MB-H series Inductance change : Within ±10% No significant abnormality in appearance. MB series: The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table. Temperature 60±2℃ Humidity 90～95%RH Time 1000＋24/－0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. MB-H series: The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table. Temperature 85±2℃ Humidity 85%RH Time 1000＋24/－0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 18. Loading under damp heat Specified Value Test Methods and Remarks MB series MB-H series Inductance change : Within ±10% No significant abnormality in appearance. MB series: The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below table. Temperature 60±2℃ Humidity 90～95％RH Applied current Rated current Time 1000＋24/－0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. MB-H series: The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below table. Temperature 85±2℃ Humidity 85％RH Applied current Rated current Time 1000＋24/－0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 19. Low temperature life test Specified Value Test Methods and Remarks MB series MB-H series Inductance change : Within ±10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below table. Temperature －40±2℃ Time 1000＋24/－0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_reli_e-E06R01 20. High temperature life test Specified Value Test Methods and Remarks MB series MB-H series Inductance change : Within ±10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below table. Temperature 85±2℃ Time 1000＋24/－0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 21. Loading at high temperature life test Specified Value MB series MB-H series － 22. Standard condition MB series Specified Value MB-H series Standard test condition : Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity. When there is any question concerning measurement result: In order to provide correlation data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity. Inductance is in accordance with our measured value. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_reli_e-E06R01 METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MB SERIES／MCOILTM MB-H SERIES) ■PRECAUTIONS 1. Circuit Design Precautions ◆Operating environment 1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 2. PCB Design Precautions Technical considerations ◆Land pattern design 1. Please refer to a recommended land pattern. ◆Land pattern design Surface Mounting ・ Mounting and soldering conditions should be checked beforehand. ・ Applicable soldering process to this products is reflow soldering only. 3. Considerations for automatic placement Precautions Technical considerations ◆Adjustment of mounting machine 1. Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2. Mounting and soldering conditions should be checked beforehand. ◆Adjustment of mounting machine 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. 4. Soldering Precautions ◆Reflow soldering 1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 2. The product shall be used reflow soldering only. 3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering. ◆Lead free soldering 1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. Technical considerations Temperature［℃］ ◆Reflow soldering 1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. Recommended reflow condition (Pb free solder) 5sec max 300 Peak：260+0/-5℃ 150～180 200 100 40sec max 90±30sec 230℃ min 0 Heating Time［sec］ 5. Cleaning Precautions Technical considerations ◆Cleaning conditions 1. Washing by supersonic waves shall be avoided. ◆Cleaning conditions 1. If washed by supersonic waves, the products might be broken. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_prec_e-E06R01 6. Handling Precautions Technical considerations ◆Handling 1. Keep the product away from all magnets and magnetic objects. ◆Breakaway PC boards (splitting along perforations) 1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. ◆Mechanical considerations 1. Please do not give the product any excessive mechanical shocks. 2. Please do not add any shock and power to a product in transportation. ◆Pick-up pressure 1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part. ◆Packing 1. Please avoid accumulation of a packing box as much as possible. ◆Handling 1. There is a case that a characteristic varies with magnetic influence. ◆Breakaway PC boards (splitting along perforations) 1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs. ◆Mechanical considerations 1. There is a case to be damaged by a mechanical shock. 2. There is a case to be broken by the handling in transportation. ◆Pick-up pressure 1. Damage and a characteristic can vary with an excessive shock or stress. ◆Packing 1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products. 7. Storage conditions Precautions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled. ・ Recommended conditions Ambient temperature : 0～40℃ Humidity : Below 70% RH ・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, product should be used within 6 months from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage. Technical considerations ◆Storage 1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_prec_e-E06R01