2SK3019

TAK CHEONG ® SEM IC O N DU C TO R Plastic Package N-Channel MOSFET Absolute Maximum Ratings Symbol Green Product 3 TA = 25°C unless otherwise noted Parameter VDS Drain-Source Voltage VGS Continuous Gate-Source Voltage Value Units 30 V ±20V V ID Continuous Drain Current 100 mA PD Power Dissipation 150 mW RθJA Thermal Resistance from Junction to Ambient 833 °C /W TSTG Storage Temperature Range -55 to +150 °C +150 °C TJ 2SK3019 150mW SOT-523 SURFACE MOUNT Operating Junction Temperature 2 1. Gate 2. Source 3. Drain 1 SOT-523 These ratings are limiting values above which the serviceability of the device may be impaired. Specification Features: ƒ ƒ ƒ Electrical Symbol: Device Marking Code: Low On-resistance Fast Switching Speed Low Voltage Drive Makes This Device KN Ideal for Portable Equipment ƒ ƒ ƒ ƒ ƒ Easily Designed Drive Circuits Easy to Parallel RoHS Compliant & Green EMC Matte Tin(Sn) Lead Finish Weight: approx. 0.002g DB Number: DB-248 October 2015, Revision A Page 1 TAK CHEONG ® SEM IC O N DU C TO R Electrical Characteristics (TA = 25°C unless otherwise noted) Off Characteristics Symbol BVDSS Parameter Test Condition Drain-Source Breakdown Voltage VGS=0V, ID=10uA IGSS Gate-Body Leakage VDS=0V, VGS=±20V IDSS Zero Gate Voltage Drain Current VDS=30V, VGS=0V Limits Min Typ Max 30 Unit Volts ±1 uA 1 µA On Characteristics Symbol Parameter Test Condition Vth(GS) Gate-Threshold Voltage VDS= 3V, ID=100uA RDS(on) Drain-Source On-Resistance Limits Min Typ Unit 1.5 Volts VGS=4V, ID=10mA 8 Ω VGS=2.5V, ID=1mA 13 Ω gfs Forward Trans Conductance VDS=3V, ID=10mA VSD Drain-Source Diode Forward Voltage IS=115mA, VGS=0V 0.8 Max 20 ms 1.2 V Dynamic Characteristics Symbol Parameter Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Test Condition Limits Min VDS = 5V VGS = 0V f = 1.0MHz Typ Max Unit 13 pF 9 pF 4 pF Switching Characteristics Parameter Symbol tD(on) tD(off) Turn-on Time Turn-off Time Test Condition VDD=5V, RL=500Ω, ID=10mA, VGs=5V, RG = 10Ω Limits Min Typ Max Unit 15 nS 80 nS DB Number: DB-248 October 2015, Revision A Page 2 TAK CHEONG ® SEM IC O N DU C TO R SOT-523 Package Outline DIM Typical Soldering Pattern: MILLIMETERS INCHES MIN MAX MIN MAX A 0.70 0.90 0.028 0.035 A1 0.00 0.10 0.000 0.004 A2 0.70 0.80 0.028 0.031 b1 0.15 0.25 0.006 0.010 b2 0.25 0.35 0.010 0.014 c 0.10 0.20 0.004 0.008 D 1.50 1.70 0.059 0.067 E 0.70 0.90 0.028 0.035 E1 1.45 1.75 0.057 0.069 e e1 0.50 TYP. 0.90 L 0.020 TYP. 1.10 0.035 0.40 REF. L1 0.10 θ 0 O 0.043 0.016 REF. 0.30 8 O 0.004 0 O 0.012 8 O NOTES: 1. Above package outline conforms to JEITA EAIJ ED-7500A SC-75A. 2. Dimensions are exclusive of Burrs, Mold Flash & Tie Bar extrusions. DB Number: DB-248 October 2015, Revision A Page 3 TAK CHEONG ® DISC LA I MER NOTIC E NOTICE The information presented in this document is for reference only. Tak Cheong reserves the right to make changes without notice for the specification of the products displayed herein. The product listed herein is designed to be used with ordinary electronic equipment or devices, and not designed to be used with equipment or devices which require high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), Tak Cheong Semiconductor Co., Ltd., or anyone on its behalf, assumes no responsibility or liability for any damagers resulting from such improper use of sale. This publication supersedes & replaces all information reviously supplied. For additional information, please visit our website http://www.takcheong.com, or consult your nearest Tak Cheong’s sales office for further assistance. Number: DB-100 April 14, 2008 / A