CGA3EAC0G2A472JT000E

AUT-ESD-002 DELIVERY SPECIFICATION SPEC. No. A-ESD-d D A T E : Feb, 2020 To Non-Controlled Copy Upon the acceptance of this spec. previous spec. (C2012-0629) shall be abolished. CUSTOMER’S PRODUCT NAME TDK PRODUCT NAME MULTILAYER CERAMIC CHIP CAPACITORS Bulk and Tape packaging 【RoHS compliant】 CGA3EA ESD Protection Series Please return this specification to TDK representatives with your signature. If orders are placed without returned specification, please allow us to judge that specification is accepted by your side. RECEIPT CONFIRMATION DATE: YEAR MONTH DAY Test conditions in this specification based on AEC-Q200 for automotive application. TDK Corporation Sales Electronic Components Sales & Marketing Group APPROVED Person in charge Engineering Electronic Components Business Company Ceramic Capacitors Business Group APPROVED CHECKED Person in charge AUT-ESD-002 ■CATALOG NUMBER CONSTRUCTION CGA (1) 3 (2) E A (3) (4) NP0 2A (5) (6) (1) Series (7) J (8) 080 (9) A (10) C (11) (7) Nominal capacitance (pF) (2) Dimensions L x W (mm) Dimensions EIA Length code 3 103 CC0603 1.60 Width Terminal width 0.80 0.20 The capacitance is expressed in three digit codes and in units of pico Farads (pF). The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. R designates a decimal point. (3) Thickness code Code Thickness E 0.80mm (Example) (4) Function identification code Symbol Condition A ESD protection (8) Capacitance tolerance Code Tolerance J ±5% (5) Temperature characteristics Temperature Capacitance characteristics change C0G 0±30 ppm/°C NP0 0±30 ppm/°C 0R5 = 0.5pF 101 = 100pF 225 = 2,200,000pF = 2.2μF (9) Thickness Code Thickness 080 0.80mm Temperature range -55 to +125℃ -55 to +150℃ (10) Packaging style Code Style A 178mm reel, 4mm pitch (6) Rated voltage (DC) Code Voltage (DC) 2A 100V (11) Special reserved code Code Tolerance A,C TDK internal code —1— AUT-ESD-002 SCOPE This delivery specification shall be applied to Multilayer ceramic chip capacitors to be delivered to . PRODUCTION PLACES Production places defined in this specification shall be TDK Corporation, TDK(Suzhou)Co.,Ltd and TDK Components U.S.A.,Inc. PRODUCT NAME The name of the product to be defined in this specifications shall be CGA3EA○○○2A□□□×. REFERENCE STANDARD JIS C 5101－1：2010 C 5101－21：2014 Fixed capacitors for use in electronic equipment-Part 1: Generic specification Fixed capacitors for use in electronic equipment-Part21 : Sectional specification : Fixed surface mount multilayer capacitors of ceramic dielectric,Class1 C 0806－3：2014 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes JEITA RCR－2335 C 2014 Safety application guide for fixed ceramic capacitors for use in electronic equipment CONTENTS 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. CODE CONSTRUCTION OPERATING TEMPERATURE RANGE STORING CONDITION AND TERM INDUSTRIAL WASTE DISPOSAL PERFORMANCE INSIDE STRUCTURE AND MATERIAL PACKAGING SETTING UP FOR ESD TEST CAUTION TAPE PACKAGING SPECIFICATION When the mistrust in the spec arises, this specification is given priority. And it will be confirmed by written spec change after conference of both posts involved. This specification warrants the quality of the ceramic chip capacitor. Capacitors should be evaluated or confirmed a state of mounted on your product. If the use of the capacitors goes beyond the bounds of this specification, we can not afford to guarantee. Division Date SPEC. No. Ceramic Capacitors Business Group Feb, 2020 A-ESD-d —2— AUT-ESD-002 1. CODE CONSTRUCTION (Example) CGA (1) 3 (2) E (3) A (4) C0G (5) 2 A (6) 103 (7) (1) Series J (8) Symbol T (9) 〇〇〇〇 (10) Series Ceramic chip capacitor for automotive application CGA Terminal electrode (2) Case size L B W G B T Internal electrode Ceramic dielectric Symbol 3 Case size Dimensions (Unit : mm) TDK(EIA style) L W T B G CGA3(CC0603) 1.60±0.10 0.80±0.10 0.80±0.10 0.20 min. 0.30 min. (3) Thickness (4) Identification for ESD capacitor * Details are shown in Table 1 No.16 at 5.PERFORMANCE. Symbol Dimension(mm) E 0.80 Symbol Identification A ESD capacitor Symbol Rated Voltage 2A DC 100 V ※ As for applied ESD level, please refer to detail page on TDK Web. (5) Temperature Characteristics * Details are shown in Table 1 No.6 at 5.PERFORMANCE. (6) Rated Voltage (Example) (7) Rated Capacitance Stated in three digits and in units of pico farads (pF). The first and Second digits identify the first and second significant figures of the capacitance, the third digit identifies the multiplier. (8) Capacitance tolerance (9) Packaging (10) TDK internal code ―3― Symbol 1 03 Rated Capacitance 10,000 pF Symbol Tolerance J ± 5% Symbol Packaging B Bulk T Taping AUT-ESD-002 2. OPERATING TEMPERATURE RANGE T.C. Min. operating Temperature Max. operating Temperature Reference Temperature C0G -55°C 125°C 25°C NP0 -55°C 150°C 25°C 3. STORING CONDITION AND TERM Storing temperature Storing humidity Storing term 5~40°C 20~70%RH Within 6 months upon receipt. 4. INDUSTRIAL WASTE DISPOSAL Dispose this product as industrial waste in accordance with the Industrial Waste Law. ―4― AUT-ESD-002 5. PERFORMANCE Table 1 Item No. Performance Test or inspection method 1 External Appearance No defects which may affect performance. Inspect with magnifying glass(3×) 2 Insulation Resistance 10,000MΩ min. Measuring voltage：Rated voltage Voltage application time：60s. 3 Voltage Proof Withstand test voltage without insulation breakdown or other damage. Apply voltage : 3 × rated voltage Voltage application time : 1s. Charge/discharge current : 50mA or lower 4 Capacitance Within the specified tolerance. 5 Q 6 Temperature Characteristics of Capacitance Please refer to detail page on TDK Web. T.C. Temperature Coefficient (ppm/°C) C0G 0 ± 30 NP0 0 ± 30 Rated Capacitance Measuring frequency 1000pF 1MHz±10% Over 1000pF 1kHz±10% Measuring voltage 0.5 ~ 5V rms. See No.4 in this table for measuring condition. Temperature coefficient shall be calculated based on values at 25°C and 85°C temperature. Measuring temperature below 25°C shall be -10°C and -25°C. Capacitance Within ± 0.2% or ± 0.05pF, drift whichever larger. 7 Robustness of Terminations No sign of termination coming off, breakage of ceramic, or other abnormal signs. Reflow solder the capacitors on a P.C.Board shown in Appendix 2. Apply a pushing force gradually at the center of a specimen in a horizontal direction of P.C.board. Pushing force : 17.7N Holding time : 10±1s. 17.7N Capacitor ―5― P.C.Board AUT-ESD-002 (continued) Item No. 8 Bending Performance No mechanical damage. Test or inspection method Reflow solder the capacitor on a P.C.Board shown in Appendix1. 20 50 F R230 2 45 45 （Unit：mm） 9 10 Solderability Resistance to solder heat New solder to cover over 75% Solder : Sn-3.0Ag-0.5Cu or of termination. Sn-37Pb 25% may have pin holes or rough spots but not concentrated Flux : Isopropyl alcohol (JIS K in one spot. 8839) Rosin (JIS K 5902) Ceramic surface of A sections 25% solid solution. shall not be exposed due to melting or shifting of termination Solder temp. : 245±5°C (Sn-3.0Ag-0.5Cu) material. 235±5°C (Sn-37Pb) A section No cracks are allowed and External appearance terminations shall be covered at least 60% with new solder. Capacitance Dwell time : 3±0.3s.(Sn-3.0Ag-0.5Cu) 2±0.2s.(Sn-37Pb) Solder position : Until both terminations are completely soaked. Solder : Sn-3.0Ag-0.5Cu or Sn-37Pb Flux : Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. Change from the Characteristics value before test C0G NP0 ±2.5% Solder temp. : 260±5°C Q Meet the initial spec. Dwell time : 10±1s. Insulation Resistance Meet the initial spec. Solder position : Until both terminations are completely soaked. Voltage proof No insulation breakdown or other damage. ―6― Pre-heating : Temp. ― 110~140°C Time ― 30～60s. Leave the capacitors in ambient condition for 6~24h before measurement. AUT-ESD-002 (continued) No. 11 Item Vibration Performance No mechanical damage. External appearance Capacitance Q 12 Characteristics Change from the value before test C0G NP0 ±2.5% Meet the initial spec. Temperature External No mechanical damage. cycle appearance Capacitance Characteristics C0G NP0 Q Change from the value before test Please contact with our sales representative. Meet the initial spec. Test or inspection method Applied force : 5G max. Frequency : 10~2,000Hz Reciprocating sweep time : 20 min. Cycle : 12 cycles in each 3 mutually perpendicular directions. Reflow solder the capacitors on a P.C.Board shown in Appendix 2 before testing. Expose the capacitors in the condition step1 through step 4 listed in the following table. Temp. cycle：1,000 cycles Step Temperature(°C) Time (min.) 1 Min. operating temp. ±3 30 ± 3 2 Ambient Temp. 2~5 3 Max. operating temp. ±2 30 ± 2 4 Ambient Temp. 2~5 Insulation Resistance Meet the initial spec. Voltage proof No insulation breakdown or other Leave the capacitors in ambient condition damage. for 6~24h before measurement. As for Min./ Max. operating temp., please refer to "3.OPERATING TEMPERATURE RANGE". Reflow solder the capacitors on a P.C.Board shown in Appendix 2 before testing. 13 Moisture Resistance (Steady State) No mechanical damage. External appearance Capacitance Characteristics C0G NP0 Q Change from the value before test Please contact with our sales representative. 350 min. Insulation 1,000MΩ min. Resistance ―7― Test temp.：40±2°C Test humidity：90~95%RH Test time：500 +24,0h Leave the capacitors in ambient condition for 6~24h before measurement. Reflow solder the capacitors on a P.C.Board shown in Appendix2 before testing. AUT-ESD-002 (continued) Item No. 14 Moisture Resistance Performance Test or inspection method No mechanical damage. External appearance Capacitance Characteristics C0G NP0 Q Insulation Resistance 15 Life Change from the value before test Please contact with our sales representative. Leave the capacitors in ambient condition for 6~24h before measurement. Reflow solder the capacitors on a P.C.Board shown in Appendix2 before testing. 500MΩ min. No mechanical damage. External appearance Characteristics C0G NP0 Change from the value before test Please contact with our sales representative. Test temp.：Maximum operating temperature±2°C Applied voltage：Please contact with our sales representative. Test time：1,000 +48,0h Charge/discharge current：50mA or lower Leave the capacitors in ambient condition for 6~24h before measurement. Q 350 min. Insulation Resistance 1,000MΩ min. ESD Charge/discharge current：50mA or lower 200 min. Capacitance 16 Test temp.：85±2°C Test humidity：85%RH Applied voltage：Rated voltage Test time：1,000 +48,0h Reflow solder the capacitors on a P.C.Board shown in Appendix2 before testing. Withstand ESD voltage without insulation Reflow Solder the capacitors on a breakdown. P.C.Board shown in Appendix3 before testing. Rc Voltage Source Rd Cs Test specimen Rc：Charge current limit resistor Rd：Discharge resistor Cs：Energy storage capacitor ESD gun ―8― Circuit condition：IEC 61000-4-2 (Cs：150pF / Rd：330Ω) Test method：Direct contact Number of ESD pulse：±10 times As for applied ESD level, please refer to detail page on TDK Web. After each ESD pulse, dissipation of residual charge shall be done with applying 1MΩ resistance for 1 sec min. AUT-ESD-002 Appendix1 Appendix2 P.C.Board for bending test P.C. Board for reliability test 100 100 c b 40 b a Solder resist a Solder resist 40 Copper 1.0 c Copper Appendix3 P.C. Board for ESD test b a 100.5 c 36 Copper Solder resist 30.5 Copper Appendix 1, 2 Case size 1. Material : Glass Epoxy (As per JIS C6484 GE4) TDK(EIA style) 2. Thickness：1.6mm CGA3(CC0603) Copper(Thickness:0.035mm) Solder resist (Unit : mm) a b c 1.0 3.0 1.2 Appendix 3 (ESD TEST) Case size a TDK(EIA style) CGA3(CC0603) ―9― 1.0 (Unit : mm) b c 3.0 0.75 AUT-ESD-002 6. INSIDE STRUCTURE AND MATERIAL 3 4 5 2 1 No. NAME MATERIAL 1 Dielectric CaZrO 3 2 Electrode Nickel (Ni) 3 Copper (Cu) Termination 4 Nickel (Ni) 5 Tin (Sn) 7. PACKAGING Packaging shall be done to protect the components from the damage during transportation and storing, and a label which has the following information shall be attached. 7.1 Each plastic bag for bulk packaging contains 1000pcs. And the minimum quantity for Bulk packaging is 1000pcs. 7.2 Tape packaging is as per 11. TAPE PACKAGING SPECIFICATION. 1) 2) 3) 4) Inspection No. TDK P/N Customer's P/N Quantity *Composition of Inspection No. F 9 A – 23 – 001 (a) (b) (c) (d) (e) Line code Last digit of the year Month and A for January and B for February and so on. (Skip I) Inspection Date of the month. Serial No. of the day Example (a) (b) (c) (d) (e) *Composition of new Inspection No. (Will be implemented on and after May 1, 2019) Example I F 9 E (a) (b) (c) (d) 2 3 A 0 0 1 (e) (f) (g) (a) Prefix (b) Line code (c) Last digit of the year (d) Month and A for January and B for February and so on. (Skip I) (e) Inspection Date of the month. (f) Serial No. of the day(00 ~ ZZ) (g) Suffix(00 ~ ZZ) * It is planned to shift to the new inspection No. on and after May 2019, but the implementation timing may be different depending on shipment bases. Until the shift is completed, either current or new composition of inspection No. will be applied. ― 10 ― AUT-ESD-002 8. SETTING UP FOR ESD TEST ESD Gun (150pF/ 330Ω) Horizontal coupling plane (HCP) Non-conductive table (Wooden) Cable for dissipation of residual charge (1MΩ) Test board 470kΩ 470kΩ Power supply Ground reference plane (GRP) ― 11 ― Resistor AUT-ESD-002 9. CAUTION No. 1 Process Operating Condition (Storage, Use, Transportation) Condition 1-1. Storage, Use 1) The capacitors must be stored in an ambient temperature of 5 to 40°C with a relative humidity of 20 to 70%RH. The products should be used within 6 months upon receipt. 2) The capacitors must be operated and stored in an environment free of dew condensation and these gases such as Hydrogen Sulphide, Hydrogen Sulphate, Chlorine, Ammonia and sulfur. 3) Avoid storing in sun light and falling of dew. 4) Do not use capacitors under high humidity and high and low atmospheric pressure which may affect capacitors reliability. 5) Capacitors should be tested for the solderability when they are stored for long time. 2 Circuit design △Caution ! E A 1-2. Handling in transportation In case of the transportation of the capacitors, the performance of the capacitors may be deteriorated depending on the transportation condition. (Refer to JEITA RCR-2335C 9.2 Handling in transportation) 2-1. Operating temperature Operating temperature should be followed strictly within this specification, especially be careful with maximum temperature. 1) Do not use capacitors above the maximum allowable operating temperature. 2) Surface temperature including self heating should be below maximum operating temperature. (Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at high frequencies around its SRF, the heat might be so extreme that it may damage itself or the product mounted on. Please design the circuit so that the maximum temperature of the capacitors including the self heating to be below the maximum allowable operating temperature. Temperature rise at capacitor surface shall be below 20°C) 3) The electrical characteristics of the capacitors will vary depending on the temperature. The capacitors should be selected and designed in taking the temperature into consideration. 2-2. Operating voltage 1) Operating voltage across the terminals should be below the rated voltage. When AC and DC are super imposed, V 0-P must be below the rated voltage. ――― (1) and (2) AC or pulse with overshooting, V P-P must be below the rated voltage. ――― (3), (4) and (5) When the voltage is started to apply to the circuit or it is stopped applying, the irregular voltage may be generated for a transit period because of resonance or switching. Be sure to use the capacitors within rated voltage containing these Irregular voltage. R R Voltage (1) DC voltage Positional Measurement V 0-P (Rated voltage) R R (2) DC+AC voltage V P-P R R V 0-P R 0 0 Voltage (3) AC voltage (4) Pulse voltage (A) (5) Pulse voltage (B) Positional V Measurement P-P (Rated voltage) V P-P R R 0 0 — 12 — 0 AUT-ESD-002 No. 2 Process Circuit design ! Caution △ A E Condition 2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the reliability of the capacitors may be reduced. A 3) The effective capacitance will vary depending on applied DC and AC voltages. The capacitors should be selected and designed in taking the voltages into consideration. 2-3. Frequency When the capacitors (Class 2) are used in AC and/or pulse voltages, the capacitors may vibrate themselves and generate audible sound. 3 Designing P.C.board The amount of solder at the terminations has a direct effect on the reliability of the capacitors. 1) The greater the amount of solder, the higher the stress on the chip capacitors, and the more likely that it will break. When designing a P.C.board, determine the shape and size of the solder lands to have proper amount of solder on the terminations. 2) Avoid using common solder land for multiple terminations and provide individual solder land for each terminations. 3) Size and recommended land dimensions. Chip capacitors C Solder land Solder resist A B Flow soldering(mm) Case size Symbol A CGA3 (CC0603) B 0.8 ~ 1.0 C 0.6 ~ 0.8 0.7 ~ 1.0 Reflow soldering (mm) Case size CGA3 (CC0603) Symbol A 0.6 ~ 0.8 B 0.6 ~ 0.8 C 0.6 ~ 0.8 — 13 — AUT-ESD-002 No. 3 Process Designing P.C.board Condition 4) Recommended chip capacitors layout is as following. Disadvantage against bending stress Advantage against bending stress Perforation or slit Perforation or slit Break P.C.board with mounted side up. Break P.C.board with mounted side down. Mount perpendicularly to perforation or slit Mount in parallel with perforation or slit Mounting face Perforation or slit Perforation or slit Chip arrangement (Direction) Closer to slit is higher stress ℓ1 Away from slit is less stress ℓ R 2 R Distance from slit ( ℓ1 < ℓ2 ) R — 14 — R R R R R ( ℓ 1< ℓ 2 ) R R R R R R AUT-ESD-002 No. Process 3 Designing P.C.board Condition 5) Mechanical stress varies according to location of chip capacitors on the P.C.board. E D Perforation C B A Slit The stress in capacitors is in the following order. A>B=C>D>E 6) Layout recommendation Example Use of common solder land Soldering with chassis Use of common solder land with other SMD Lead wire Chassis Chip Solder land Excessive solder Solder Need to avoid Excessive solder PCB Adhesive Solder land ℓ1 Missing solder Lead wire Solder land Solder resist Solder resist Recommendation Solder resist ℓ2 ℓ 2 >ℓ 1 — 15 — AUT-ESD-002 No. 4 Process Mounting Condition 4-1. Stress from mounting head If the mounting head is adjusted too low, it may induce excessive stress in the chip capacitors to result in cracking. Please take following precautions. 1) Adjust the bottom dead center of the mounting head to reach on the P.C.board surface and not press it. 2) Adjust the mounting head pressure to be 1 to 3N of static weight. 3) To minimize the impact energy from mounting head, it is important to provide support from the bottom side of the P.C.board. See following examples. Not recommended Recommended Crack Single sided mounting Support pin Double-sides mounting Solder peeling Crack Support pin When the centering jaw is worn out, it may give mechanical impact on the capacitors to cause crack. Please control the close up dimension of the centering jaw and provide sufficient preventive maintenance and replacement of it. — 16 — AUT-ESD-002 Condition 5-1. Flux selection Flux can seriously affect the performance of capacitors. Confirm the following to select the appropriate flux. 1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine). Strong flux is not recommended. 2) Excessive flux must be avoided. Please provide proper amount of flux. 3) When water-soluble flux is used, enough washing is necessary. 5-2. Recommended soldering profile by various methods Reflow soldering Wave soldering Soldering Natural cooling Soldering Preheating Natural cooling Peak Temp Temp..(°C) ΔT 0 Preheating Peak Temp Temp.(°C) Process Soldering Over 60 sec. 0 Over 60 sec. ΔT Over 60 sec. Peak Temp time Peak Temp time Manual soldering (Solder iron) Peak Temp Temp..(°C) No. 5 ΔT Preheating 0 3sec. (As short as possible) ※ As for peak temperature of manual soldering, please refer“5-6. Solder repair by solder iron”. 5-3. Recommended soldering peak temp and peak temp duration Temp./Duration Wave soldering Reflow soldering Peak temp(°C) Duration(sec.) Peak temp(°C) Duration(sec.) Sn-Pb Solder 250 max. 3 max. 230 max. 20 max. Lead Free Solder 260 max. 5 max. 260 max. 10 max. Solder Recommended solder compositions Lead Free Solder : Sn-3.0Ag-0.5Cu Sn-Pb solder : Sn-37Pb — 17 — AUT-ESD-002 No. 5 Process Soldering Condition 5-4. Avoiding thermal shock 1) 2) Preheating condition Soldering Temp. (°C) Wave soldering ΔT ≦ 150 Reflow soldering ΔT ≦ 150 Manual soldering ΔT ≦ 150 Cooling condition Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temperature difference (ΔT) must be less than 100°C. 5-5. Amount of solder Excessive solder will induce higher tensile force in chip capacitors when temperature changes and it may result in chip cracking. In sufficient solder may detach the capacitors from the P.C.board. Higher tensile force in chip capacitors to cause crack Excessive solder Maximum amount Minimum amount Adequate Low robustness may cause contact failure or chip capacitors come off the P.C.board. Insufficient solder 5-6. Solder repair by solder iron 1) Selection of the soldering iron tip Tip temperature of solder iron varies by its type, P.C.board material and solder land size. The higher the tip temperature, the quicker the operation. However, heat shock may cause a crack in the chip capacitors. Please make sure the tip temp. before soldering and keep the peak temp and time in accordance with following recommended condition. Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder) Temp. (°C) Duration (sec.) Wattage (W) Shape (mm) 350 max. 3 max. 20 max. φ3.0 max. * Please preheat the chip capacitors with the condition in 5-4 to avoid the thermal shock. 2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors may cause crack. Do not touch the ceramic dielectric and the terminations by solder iron. — 18 — AUT-ESD-002 No. Process 5 Soldering Condition 5-7.Soldering rework using spot heater Heat stress during rework may possibly be reduced by using a spot heater (also called a “blower”) rather than a soldering iron. It is applied only to adding solder in the case of insufficient solder amount. 1) Reworking using a spot heater may suppress the occurrence of cracks in the capacitor compared to using a soldering iron. A spot heater can heat up a capacitor uniformly with a small heat gradient which leads to lower thermal stress caused by quick heating and cooling or localized heating. Moreover, where ultra-small capacitors are mounted close together on a printed circuit board, reworking with a spot heater can eliminate the risk of direct contact between the tip of a soldering iron and a capacitor. 2) Rework condition If the blower nozzle of a spot heater is too close to a capacitor, a crack in the capacitor may occur due to heat stress. Below are recommendations for avoiding such an occurrence. Keep more than 5mm between a capacitor and a spot heater nozzle. The blower temperature of the spot heater shall be lower than 400°C. The airflow shall be set as weak as possible. The diameter of the nozzle is recommended to be 2mm(one-outlet type).The size is standard and common. Duration of blowing hot air is recommended to be 10s or less, considering surface area of the capacitor and melting temperature of solder. The angle between the nozzle and the capacitor is recommended to be 45degrees in order to work easily and to avoid partial area heating. As is the case when using a soldering iron, preheating reduces thermal stress on capacitors and improves operating efficiency. ・Recommended rework condition（Consult the component manufactures for details.） Distance from nozzle 5mm and over Nozzle angle 45degrees Nozzle temp. 400°C and less Set as weak as possible (The airflow shall be the minimum value necessary for solder to melt in the conditions mentioned above.) Airflow Nozzle diameter φ2mm（one-outlet type） Blowing duration 10s and less ・Example of recommended spot heater use One-outlet type nozzle Angle : 45degrees 3) Amount of solder should be suitable to from a proper fillet shape. Excess solder causes mechanical and thermal stress on a capacitor and results in cracks. Insufficient solder causes weak adherence of the capacitor to the substrate and may result in detachment of a capacitor and deteriorate reliability of the printed wiring board. See the example of appropriate solder fillet shape for 5-5.Amount of solder. — 19 — AUT-ESD-002 No. Process 5 Soldering Condition 5-8. Sn-Zn solder Sn-Zn solder affects product reliability. Please contact TDK in advance when utilize Sn-Zn solder. 5-9. Countermeasure for tombstone The misalignment between the mounted positions of the capacitors and the land patterns should be minimized. The tombstone phenomenon may occur especially the capacitors are mounted (in longitudinal direction) in the same direction of the reflow soldering. (Refer to JEITA RCR-2335C Annex A (Informative) Recommendations to prevent the tombstone phenomenon) 6 Cleaning 1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may stick to chip capacitors surface to deteriorate especially the insulation resistance. 2) If cleaning condition is not suitable, it may damage the chip capacitors. 2)-1. Insufficient washing (1) Terminal electrodes may corrode by Halogen in the flux. (2) Halogen in the flux may adhere on the surface of capacitors, and lower the insulation resistance. (3) Water soluble flux has higher tendency to have above mentioned problems (1) and (2). 2)-2. Excessive washing When ultrasonic cleaning is used, excessively high ultrasonic energy output can affect the connection between the ceramic chip capacitor's body and the terminal electrode. To avoid this, following is the recommended condition. Power : 20W/ ℓ max. Frequency : 40kHz max. Washing time : 5 minutes max. 2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may bring the same result as insufficient cleaning. 7 Coating and 1) When the P.C.board is coated, please verify the quality influence on the product. molding of the P.C.board 2) Please verify carefully that there is no harmful decomposing or reaction gas emission during curing which may damage the chip capacitors. 3) Please verify the curing temperature. 8 Handling after chip mounted ! Caution △ A E A 1) Please pay attention not to bend or distort the P.C.board after soldering in handling otherwise the chip capacitors may crack. Bend — 20 — Twist AUT-ESD-002 No. 8 Process Handling after chip mounted ! Caution △ A E A Condition 2) Printed circuit board cropping should not be carried out by hand, but by using the proper tooling. Printed circuit board cropping should be carried out using a board cropping jig as shown in the following figure or a board cropping apparatus to prevent inducing mechanical stress on the board. (1)Example of a board cropping jig Recommended example: The board should be pushed from the back side, close to the cropping jig so that the board is not bent and the stress applied to the capacitor is compressive. Unrecommended example: If the pushing point is far from the cropping jig and the pushing direction is from the front side of the board, large tensile stress is applied to the capacitor, which may cause cracks. Outline of jig Recommended V-groove Printed circuit board Unrecommended Direction of load Printed circuit board Direction of load Load point Components Printed circuit board Components Load point Slot Board cropping jig V-groove V-groove Slot Slot (2)Example of a board cropping machine An outline of a printed circuit board cropping machine is shown below. The top and bottom blades are aligned with one another along the lines with the V-grooves on printed circuit board when cropping the board. Unrecommended example: Misalignment of blade position between top and bottom, right and left, or front and rear blades may cause a crack in the capacitor. Outline of machine Principle of operation Top blade Top blade Printed circuit board Bottom blade V-groove Printed circuit board Cross-section diagram Top blade Printed circuit board Bottom blade V-groove Unrecommended Recommended Top-bottom misalignment Left-right misalignment Front-rear misalignment Top blade Top blade Top blade Bottom blade Bottom blade Bottom blade Top blade Board Bottom blade — 21 — AUT-ESD-002 No. 8 Process Handling after chip mounted △Caution A ! E A Condition 3) When functional check of the P.C.board is performed, check pin pressure tends to be adjusted higher for fear of loose contact. But if the pressure is excessive and bend the P.C.board, it may crack the chip capacitors or peel the terminations off. Please adjust the check pins not to bend the P.C.board. Item Not recommended Recommended Termination peeling Support pin Board bending Check pin Check pin 9 Handling of loose chip capacitors 1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially, the large case sized chip capacitors are tendency to have cracks easily, so please handle with care. Crack Floor 2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C. board may hit the chip capacitors of another board to cause crack. P.C.board Crack 10 Capacitance aging The capacitors have aging in the capacitance. They may not be used in precision time constant circuit. In case of the time constant circuit, the evaluation should be done well. 11 Estimated life and estimated failure rate of capacitors As per the estimated life and the estimated failure rate depend on the temperature and the voltage. This can be calculated by the equation described in JEITA RCR-2335C Annex F(Informative) Calculation of the estimated lifetime and the estimated failure rate (Voltage acceleration coefficient : 3 multiplication rule, Temperature acceleration coefficient : 10°C rule) The failure rate can be decreased by reducing the temperature and the voltage but they will not be guaranteed. — 22 — AUT-ESD-002 No. 12 Process Caution during operation of equipment Condition 1) A capacitor shall not be touched directly with bare hands during operation in order to avoid electric shock. Electric energy held by the capacitor may be discharged through the human body when touched with a bare hand. Even when the equipment is off, a capacitor may stay charged. The capacitor should be handled after being completely discharged using a resistor. 2) The terminals of a capacitor shall not be short-circuited by any accidental contact with a conductive object. A capacitor shall not be exposed to a conductive liquid such as an acid or alkali solution. A conductive object or liquid, such as acid and alkali, between the terminals may lead to the breakdown of a capacitor due to short circuit 3) Confirm that the environment to which the equipment will be exposed during transportation and operation meets the specified conditions. Do not to use the equipment in the following environments. (1) Environment where a capacitor is spattered with water or oil (2) Environment where a capacitor is exposed to direct sunlight (3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or radiation (4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen sulfide, sulfur dioxide, chlorine. ammonia gas etc.) (5) Environment where a capacitor exposed to vibration or mechanical shock exceeding the specified limits. (6) Atmosphere change with causes condensation 13 Others △Caution A ! E The product listed in this specification is intended for use in automotive applications under normal operation and usage conditions. S S A The product is not designed or warranted to meet the requirements of application listed below, whose performance and/or quality requires a more stringent level of safety or reliability, or whose failure, malfunction or defect could cause serious damage to society, person or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below or for any other use exceeding the range or conditions set forth in this specification sheet. If you intend to use the products in the applications listed below or if you have special requirements exceeding the range or conditions set forth in this specification, please contact us. (1) Aerospace/Aviation equipment (2) Transportation equipment (electric trains, ships etc.) (3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2) (4) Power-generation control equipment (5) Atomic energy-related equipment (6) Seabed equipment (7) Transportation control equipment (8) Public information-processing equipment (9) Military equipment (10) Electric heating apparatus, burning equipment (11) Disaster prevention/crime prevention equipment (12) Safety equipment (13) Other applications that are not considered general-purpose applications When designing your equipment even for general-purpose applications, you are kindly requested to take into consideration securing protection circuit/device or providing backup circuits in your equipment. In addition, although the products listed in this specification is intended for use in automotive application as described above, it is not prohibited to use for general electronic equipment, whose performance and/or quality doesn’t require a more stringent level of safety or reliability, or whose failure, malfunction or defect could not cause serious damage to society, person or property. Therefore, the description of this caution will be applied, when the products are used in general electronic equipment under a normal operation and usage conditions. — 23 — AUT-ESD-002 10. TAPE PACKAGING SPECIFICATION 1. CONSTRUCTION AND DIMENSION OF TAPING 1-1. Dimensions of carrier tape Dimensions of paper tape shall be according to Appendix 4. 1-2. Bulk part and leader of taping Trailer(Empty) Chips Empty 160mm min 160mm min Leader Drawing direction 400mm min 1-3. Dimensions of reel Dimensions of φ178 reel shall be according to Appendix 5. Dimensions of φ330 reel shall be according to Appendix 6. 1-4. Structure of taping Top cover tape Pitch hole Cavity (Chip insert) Bottom cover tape 2. CHIP QUANTITY Please refer to detail page on TDK web. ― 24 ― Paper carrier tape AUT-ESD-002 3. PERFORMANCE SPECIFICATIONS 3-1. Fixing peeling strength (top tape) 0.05N < Peeling strength < 0.7N Direction of cover tape pulling Top cover tape Carrier tape 0～15° Direction of pulling Paper tape should not adhere to top cover tape when pull the cover tape. 3-2. Carrier tape shall be flexible enough to be wound around a minimum radius of 30mm with components in tape. 3-3. The missing of components shall be less than 0.1% 3-4. Components shall not stick to fixing tape. 3-5. When removing the cover tape, there shall not be difficulties by unfitting clearance gap, burrs and crushes of cavities. Also the sprocket holes shall not be covered by absorbing dust into the suction nozzle. ― 25 ― AUT-ESD-002 Appendix 4 Paper Tape U Pitch hole Cavity (Chip insert) J E A D B T H G C F (Unit：mm) Symbol Case size CGA3 (CC0603) Symbol Case size CGA3 (CC0603) A B C D E F ( 1.10 ) ( 1.90 ) 8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 4.00 ± 0.10 G H J T 2.00 ± 0.05 4.00 ± 0.10 φ1.50 +0.10 0 1.20 max. ( ― 26 ― ) Reference value. AUT-ESD-002 Appendix 5 Dimensions of reel (Material : Polystyrene) U U W2 E C B D R W1 A (Unit：mm) Symbol Dimension A φ178±2.0 B C D E W1 φ60±2.0 φ13±0.5 φ21±0.8 2.0±0.5 9.0±0.3 Symbol W2 R Dimension 13.0±1.4 1.0 Appendix 6 Dimensions of reel (Material : Polystyrene) U U E C B D R W A Symbol A φ382 max. Dimension (Nominalφ330) t B C D E φ50 min. φ13±0.5 φ21±0.8 2.0±0.5 Symbol t R Dimension 2.0±0.5 1.0 ― 27 ― (Unit：mm) W 10.0±1.5