DK-10125

Document Number: AN-DK-10125 DK-10125 Board Application Note Revision: 01 Release Date: 4/13/2021 DK-10125 SmartMotion Platform Hardware User Guide Revision 1.0 DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 CONTENTS REVISION HISTORY ...................................................................................................................................3 INTRODUCTION ..........................................................................................................................................4 OVERVIEW ..................................................................................................................................................5 FEATURES ···················································································································· 5 PLATFORM OVERVIEW ······································································································ 5 HARDWARE USER GUIDE ........................................................................................................................6 SYSTEM BLOCK DIAGRAM ·································································································· 6 MAIN MCU SAMG55 RESOURCE ALLOCATION ········································································· 6 CONNECTORS ················································································································ 7 TDK SENSOR TO SAMG55 MCU CONNECTION ········································································ 8 AUXILIARY SENSORS CONNECTION ························································································ 8 JUMPER SETTINGS ··········································································································· 9 SCHEMATICS AND PCB ..........................................................................................................................10 THE SCHEMATICS VERSION IS VER-H. ··················································································· 10 VER-H BOARD PCB ········································································································ 14 InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 2 AN-DK-10125 ©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 Revision History Date Revision Description 4/13/2021 1.0 Initial release InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 3 AN-DK-10125 ©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 Introduction The DK-10125 TDK SmartMotion Platform is a comprehensive development system for TDK InvenSense Motion and Pressure Sensor devices. The platform designed around the Microchip SAMG55 MCU can be used by customers for rapid evaluation and development of InvenSense sensor-based solutions. The platform integrates an on-board Embedded Debugger so external tools are not required to program or debug with the SAMG55 MCU. Each InvenSense motion and pressure sensor has its own unique development kit. The DK-10125 SmartMotion platform comes with the necessary software including InvenSense Motion Link, a GUI based development tool and embedded Motion Drivers (eMD) for InvenSense motion and Pressure sensors. Embedded Motion Drivers (eMD) consists of a set of APIs to configure various aspects of the platform including pressure sensor parameters such as output data rate (ODR), low-power or low-noise mode, and sensor interface to host (I2C, SPI). Motion Link is a GUI based development tool included with the platform. It can be used to capture and visualize the sensor data from the motion sensor. The platform supports Atmel Studio and is compatible with Microchip Xplained Pro Extension boards. Xplained Pro extension series evaluation kits offer additional peripherals to extend the features of the board and ease the development of customer designs. DK-10125 SmartMotion Development Kit InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 4 AN-DK-10125 ©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 Overview Features • • • • • • Integrated TDK InvenSense pressure sensor Microchip SAMG55 microcontroller with 512KB Flash On-board Embedded debugger (EDBG) for Programming and debugging Built in FTDI USB to UART interface for fast sensor data transfer. USB Connectors for host interface to software debug and data logging Board Power Supply through USB Platform Overview DK-10125 SmartMotion Platform is a hardware unit for TDK sensor product evaluation and algorithm software development. The platform offers flexibilities for many different application developments. Figure 1. Platform Overview InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 5 AN-DK-10125 ©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 Hardware User Guide DK-10125 SmartMotion Platform is compatible with Microchip’s SAM G55 Xplained Pro. The link to the Atmel Xplained-Pro user guide is here: http://www.atmel.com/Images/Atmel-42389-SAM-G55-Xplained-Pro_User-Guide.pdf System Block Diagram On board EDBG MCU AT32UC3A4256HHB-C1UR allows user to do main MCU SAMG55 debug, trace and programming without using external tools. The Figure 2 shows system block diagram. Figure 2 System Block Diagram Main MCU SAMG55 resource allocation Table 1 SAMG55 Resource Allocation SAMG55 resource UART 0 (PA9/10/25/26) Usage The UART0 is connected to FTDI input by default. In the use case of Extension-1 on J200, the UART0 to FTDI connection can be disconnected through jumper J3. InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 6 AN-DK-10125 ©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 TW6 (I2C) TDK sensor is connected to this master I2C. On board sensor slave address = 0x69. Sensors on DB and EVB have slave address = 0x68. (PB8/9) SPI5 The SPI5 master is connected to TDK IMU sensor. (PA11/12/13/14) On board IMU sensor /CS = PNCS0 GPIO (INTs) The GPIOs are used for sensor interrupt inputs and other intelligent functions. Referring to the table in Figure 2. PA17/18/20/30 and PB15 TW4 (I2C) The master I2C communicates with EDBG MCU slave I2C. UART6 The UART6 is used for EDBG DGI-UART interface. UART7 The UART7 is used for EDBG CDC-UART interface. Connectors Table 2 details the DK-10125 SmartMotion Platform connector and header reference names and descriptions. Table 2 Connectors Connector Ref Name Connector Function descriptions CN1 (Not loaded) External TDK sensor EVB connector CN2/CN3 Daughter board connector for Aux. sensor. I2C interface only. CN4/CN5 (Not loaded) Daughter board connector for TDK sensor. I2C and SPI interfaces. CN6 USB connector for FTDI USB to serial UART interface J1 Select host I2C connections, for IMU / Pressure sensor and Auxiliary mag. sensor, or Auxiliary mag. Sensor only. J2 Board power source selection. J3 Select VDDIO voltage level, 3V0 or 1V8. J4 Digital signal test pins InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 7 AN-DK-10125 ©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 J200 (Not loaded) Extension header 1. Has same function as J200 on Microchip’s Xplained-Pro board. J301 MCU SAMG55 USB connector J500 EDBG MCU USB connector SW300 User button SW301 RESET button. TDK Sensor to SAMG55 MCU connection TDK ICP-10125 sensor is connected to SAMG55 MCU I2C only. The sensor I2C slave address is 0x63. Auxiliary sensors connection 3rd party sensors can be connected to the same SAMG55 MCU I2C bus with TDK Pressure sensor through DB, assuming it has a different slave address. CN2/3 are designed for the auxiliary sensor DB plug in. It supports I2C only. InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 8 AN-DK-10125 ©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 Jumper settings Table 3 Jumper setting Jumper Description J1 J1 is used to select input source for SAMG55 master I2C. Only two jumper shunts are allowed. Jumper shunts on pin-1/2 and 3/4: ICP-10125 Pressure Sensor primary I2C is connected to SAMG55 I2C master Jumper shunts on pin-5/6 and 7/8: Auxiliary Sensor I2C is connected to SAMG55 I2C master. J2 The J2 is for board power source selection. Only one jumper shunt is allowed. Jumper shunt on pin-1/2: board power is from EDBG USB on J500. Jumper shunt on pin-3/4: board power is from FTDI USB on CN6 Jumper shunt on pin-5/6: board power is from SAMG55 USB on J301 J3 J3 is for system VDDIO level selection. Jumper shunts on pin-1/2: VDDIO=3V0 Jumper shunts on pin-3/2: VDDIO=1V8 (Use only this for ICP-1025) J4 J4 have digital signals as test points. Pin-1: SPI /CS Pin-2: SPI SCLK, I2C SCL Pin-3: SPI MOSI, I2C SDA Pin-4: SPI MISO, I2C AD0 Pin-5: INT1 Pin-6: INT2 Pin-7: GND InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 9 AN-DK-10125 ©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 Schematics and PCB The schematics version is Ver-H. InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA 10125 Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 10 AN-DK©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA 10125 Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 11 AN-DK©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA 10125 Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 12 AN-DK©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA 10125 Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 13 AN-DK©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 Ver-H Board PCB InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA 10125 Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 14 AN-DK©2010 InvenSense, Inc. All rights reserved. DK-10125 Board Application Note Document Number: AN-DK-10125 Revision: 01 Release Date: 4/13/2021 This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. InvenSense® is a registered trademark of InvenSense, Inc. ICP-10125™ is a trademarks of InvenSense, Inc. ©2011 InvenSense, Inc. All rights reserved. InvenSense, Inc., 1745 Technology Dr. San Jose, Ca 95110, USA 10125 Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: http//www.invensense.com 15 AN-DK©2010 InvenSense, Inc. All rights reserved.