TFM201208ALD-R47MTCA

SPEC. No. C519NAA00003 DATE June. 12. 2018 SPECIFICATION To Xiaomi CUSTOMER’S PRODUCT NAME TDK’S PRODUCT NAME THIN FILM INDUCTOR TFM201208ALD-TCA Series RECEIPT CONFIRMATION DATE: TDK Corporation Sales Electronic Components Sales & Marketing Group APPROVED Person in charge YEAR MONTH DAY Engineering TDK Corporation Magnetics Business Group APPROVED CHECKED Person in charge Scope This specifications applies to THIN FILM INDUCTOR TFM201208ALD-TCA Series to be delivered to Xiaomi. Product identification TFM 2012 (1) (2) 08 (3) ALD (4) - R47 (5) M (6) (1) Part Number (2) Product dimensions (Length x Width) (3) Product height (4) Product identification number T (7) CA (8) (5) Inductance value (6) Inductance tolerance (7) Packaging style designation (8) Control mark Mentioned item 1. Shapes and dimension and an equivalent circuit 2. Electrical characteristics 3. Storage temperature range 4. Operating temperature range 5. Structure and used material 6. Reliability test 7. Recommended footprint 8. Recommended reflow pattern 9. Packaging 10. Attention in case of using 11. Packaging form Others In case any matter other than stated in this specification should take place, it shall be decided upon on a case by case basis. Please return a copy of this specification document with your signature to us within 2 months after this document is issued. If a copy of this document with your signature is not received within the above mentioned period after its issue date, the product specification will be deemed to have been accepted by you. Change history No. DATE DRAWN MAGNETICS BUSINESS GROUP TDK Corporation CHANGE ITEM DATE ISSUED REF. No. PAGE. June. 12. 2018 C519NAA00003 1/7 1. Shapes and dimension and an equivalent circuit 0.8 Max Side view Bottom view Terminal view 1.25 +/-0.2 2.0 +/-0.2 0.5 +/-0.3 Terminal electrode Unit : mm 2. Electrical characteristics 2-1. Electrical spec. (Tentative SPEC) Part No. TDK Item name TFM201208ALD-R47MTCA Rdc [mΩ] Inductance Isat [A] Itemp [A] [µH] @1MHz Max Typ Max Typ Max Typ 0.47 ±20% 28 26 4.5 5.0 4.1 4.3 Isat : Current flows and the initial value of inductance has fallen by 30% Itemp : Current flows and the temperature has risen to 40°C Rated Current: The less value which is Isat Max or Itemp Max. Rated Voltage of these items: 20V Max. 2-2. Test Equipment Inductance : Agilent 4294A Impedance analyzer or suitable. (OSC=0.5V / Frequency=1MHz) Rdc : Digital Milliohm Meter 2-3. Measuring condition Unless otherwise specified, measurement should be performed at 5 to 35°C and 35 to 85%RH. However, for referee purpose at 25+/-5 °C and 40 to 70%RH. 2-4. MSL MSL Level 1 TDK Corporation REF. No. PAGE. C519NAA00003 2/7 3. Storage temperature range 3-1. Condition for storage before mounting. Store this product under the condition of 5 to 40°C ,20 to 75%RH and use within 6 months from the delivery date. 3-2. Condition for storage after mounting. -40°C to +85°C 4. Operating temperature range -40°C to +85°C Self temperature rise : 40°C max. (Room temperature measure) It’s less than 125 degrees, and please use product temperature by ambient temperature + self temperature-rise. 5. Product structure and used material Appearance Magnetic material Marking Terminal Item Magnetic material Terminal Marking TDK Corporation Material Metal alloy Base : Conductive resin Plating : Ni-Sn TiO2 REF. No. PAGE. C519NAA00003 3/7 6.Reliability test Item Specifications Solder ability The terminal electrodes should be covered by new solder over than 95%. Inductance variation to be within ±10% of the initial value. There shall be no mechanical damages. Soldering heat resistance Test conditions Apply cream solder to the printed PC board. Refer to clause 8 for Reflow profile. Reflow of the following profile is performed fours. Pre heat : 150~180°C 60~120sec. Peak : 260°Cmax. 10sec.max. 230°C zone 30~50sec Strength on PC board bending There shall be no mechanical damages. Reflow times 3 After the samples shall be soldered on PCB, the test shall be done. Apply the load in direction of the arrow until the bending reaches 2.0mm. (PCB thickness = 1.6mm) R10 Unit : mm 2.0 45 45 High temperature resistance with load Inductance variation to be within ±10% of the initial value. There shall be no mechanical damages. After the samples shall be soldered on PCB, the test shall be done. Temperature : 85±2°C Applied bias : Rated current Testing time : 500±12 hours Humidity resistance with load Inductance variation to be within ±10% of the initial value. There shall be no mechanical damages. After the samples shall be soldered on PCB, the test shall be done. Temperature : 60±2°C, Humidity : 90~95%RH Applied bias : Rated current : 1hr. on / 3hr. off Testing time : 500±12 hours Thermal shock Inductance variation to be within ±10% of the initial value. There shall be no mechanical damages. After the samples shall be soldered on PCB, the test shall be done. Temperature : -40±2°C / +85±2°C Stable time : 30min for each temperature. Test cycle : 100 Cycle Low temperature storage Inductance variation to be within ±10% of the initial value. There shall be no mechanical damages. Inductance variation to be within ±10% of the initial value. There shall be no mechanical damages. After the samples shall be soldered on PCB, the test shall be done. Temperature : -40±2°C Testing time : 500±12 hours After the samples shall be soldered on PCB, the test shall be done. Frequency : 10~500Hz Amplitude : 1.5mm Dimension and times : X, Y and Z directions for 2 hours each. After the samples shall be soldered on PCB, the test shall be done. Share force : 10 N After the samples shall be soldered on PCB and attach to the weight JIG, the test shall be done. Weight : 150g Drop height : 1.5m Direction : 6 directions / 1 cycle n of drop cycles : 15 cycles Vibration Share force There shall be no mechanical damages. Drop There shall be no remove to PC board. Mounting Condition : PCB Thickness : 1.6mm Reflow Profile, Land Pattern and Screen thickness : Refer to the 7.Recommended footprint and 8. Recommended reflow pattern on P5 Solder : Sn-3Ag-0.5Cu (M705) TDK Corporation REF. No. PAGE. C519NAA00003 4/7 7.Recommended footprint B Unit : mm A Mark A B C TDK Reference 0.6 1.2 1.2 Possible to replace 0.8 0.5 1.3 C A Screen thickness : 0.08 mm 8.Recommended reflow pattern (Please use this product by reflow soldering) 8-1. Profile for Pb-free solder Peak 245°C 230°C 180°C 30~50sec. 150°C 60 ~ 120sec. 9.Packaging The packaging must be done not to receive any damage transporting and storing. The following matters are mentioned on bar code label. 1) Your product part number 2) Our product identification 3) Shipment number* 4) Quantity 5) Shipment day *Shipment number[e.g.] OO OO O OOOOO OO (1) (2) (3) (4) (5) (1)Our control number (2)Last digit of A.D (3)Shipment month (A ~ H : Jan. ~ Aug. , J ~ M : Sep. ~ Dec.) (4)Sequence number (5)Control mark 10.Attention in case of using 1) In case of using this product, please avoid following matters. Splashing water or salt water Dew condenses Toxic gas (Hydrogen sulfide, Sulfurous acid, Chlorine, Ammonia, etc.) Vibrations or shocks which exceed the specified condition 2) Please be careful for the stress to this product by board flexure or something after the mounting. 3) This product is only for reflow soldering. (is not available for flow soldering) 4) Please do enough packaging test in case of using. TDK Corporation REF. No. PAGE. C519NAA00003 5/7 11.Packaging form 11-1.Tape dimensions Sprocket hole Cavity D E K B Career tape material : Polystyrene W F A Cover tape material : Polystyrene Q ｔ P G H Unit:mm Mark A B D E F G H Dim. 1.55+/-0.10 2.35+/-0.10 1.50+0.10/0 1.75+/-0.10 3.50+/-0.05 2.00+/-0.05 4.00+/-0.10 Mark K P Q t W Dim. 1.10+/-0.05 4.00+/-0.10 1.00 min 0.25+/-0.05 8.00+/-0.20 11-2.Reel dimensions Unit:mm W2 Label R B D Mark A B C D Dim. 180.0+/-2.0 60.0min. 13.0+/-0.2 21.0+/-0.8 Mark E W1 W2 R Dim. 2.0+/-0.5 8.4+2.0/0 14.4max. 1.0 * Shaded portion is hole C E * Reel material : Polystyrene Label A W1 11-3. Shape of packing 160mm MIN. Empty compartment Taping 300mm MIN. 200mm MIN Packing quantity: 3,000 pcs./ reel 11-4.Cover tape peel strength The force for tearing off cover tape is 0.1~0.7(N) in the arrow direction at the following conditions. 165~180° Top cover tape Carrier tape TDK Corporation REF. No. PAGE. C519NAA00003 6/7 Attachment INSTRUCTIONS IN USING THIS PRODUCT Please read the instructions here before you use this product. INSTRUCTIONS ON SAFETY When use the products, be careful to mention below for safety using. CAUTION! STORAGE * Store this product under the conditions which are defined in the catalogue or the instruction book. Confirm the soldering property before using if you have stored the product over the conditions which are defined in the catalogue or the instruction book. * Don’t store this product under the influence of the poisonous gases(such as hydrogen sulfide , sulfurous acid , chlorine and ammonia gas). * Avoid the direct rays of the sun and dew condensation. USING CONDITIONS * Use this product under the conditions which are defined in the catalogue or the instruction book. Temperature range and soldering property are especially to be noticed. * This product is designed for public welfare. If you are to use itfor other purposes and if it is beyond the conditions in the instruction book , you should make a good examination beforehand. * Don’t use this product in the place. ∙Exposed to water or seawater. ∙With dew condensation. ∙Under the influence of the poisonous gases (such as hydrogen sulfide ,Sulfurous acid , chlorine and ammonia gas). ∙With vibrations and impulses which are not defined in the instruction book. * When soldering is modified after it is located on a base plate , you should confirm the conditions which are defined in the catalogue or the instruction book. If it is heated excessively , the product may have troubles such as short circuit , rough contact , lowering of a property and shortening of its tenure. * Do the good washing after soldering and make sure there are no flukes left. * Dry up after washing * Don’t use the product if it is mechanically impacted by dropping and so on. * Pay attention to stresses to the product by flections after it is located on a base plate. APPLICATION The products listed on this specification sheet are intended for use in general electronic equipment (AV equipment, telecommunications equipment, home appliances, amusement equipment, computer equipment, personal equipment, office equipment, measurement equipment, industrial robots) under a normal operation and use condition. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage to society, person or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below or for any other use exceeding the range or conditions set forth in this specification sheet. 1) Aerospace/Aviation equipment 6) Transportation control equipment 2) Medical equipment which directly endanger human life 7) Military equipment 3) Power-generation control equipment 8) Power-generation control equipment 4) Atomic energy-related equipment 9) Other applications that are not considered 5) Seabed equipment general-purpose applications If you intend to use the products in the following applications, please contact our sales office. Transportation equipment (cars, electric trains, ships, etc.) , Public information-processing equipment, Electric heating apparatus / burning equipment , Disaster prevention/crime prevention equipment When using this product in general-purpose applications, you are kindly requested to take into consideration securing protection circuit/equipment or providing backup circuits, etc., to ensure higher safety. TDK Corporation