ES07B-M-08

ES07B-M, ES07D-M www.vishay.com Vishay Semiconductors Ultrafast Rectifier Surface-Mount FEATURES eSMP® Series • • • • • 2 1 23020 • • • • 23019 SMF (DO-219AB) • LINKS TO ADDITIONAL RESOURCES 3D 3D For surface mounted applications Low profile package Ideal for automated placement Glass passivated pellet chip junction Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Meets JESD 201 class 2 whisker test Wave and reflow solderable AEC-Q101 qualified Compatible to SOD-123W package case outline or SOD-123F and SOD-123FL Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 MECHANICAL DATA 3D Models Case: SMF (DO-219AB) Polarity: band denotes cathode end Weight: approx. 15 mg Packaging codes / options: 18/10K per 13" reel (8 mm tape) 08/3K per 7" reel (8 mm tape) Circuit configuration: single PARTS TABLE PART ORDERING CODE MARKING REMARKS ES07B-M ES07B-M-18 or ES07B-M-08 GB Tape and reel ES07D-M ES07D-M-18 or ES07D-M-08 GD Tape and reel ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) ^TRPARAMETER TEST CONDITION PART SYMBOL VALUE UNIT ES07B-M VRRM 100 V ES07D-M VRRM 200 V ES07B-M VRMS 70 V ES07D-M VRMS 140 V ES07B-M VDC 100 V ES07D-M VDC 200 V TL = 109 °C IF(AV) 1.2 A TA = 65 °C (1) IF(AV) 0.5 A TL = 25 °C IFSM 30 A Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3 ms single half sine-wave Note (1) Mounted on epoxy glass PCB with 3 mm x 3 mm Cu pads (≥ 40 μm thick) THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION Thermal resistance junction to ambient air (1) Operating junction and storage temperature range SYMBOL VALUE UNIT RthJA 180 K/W Tj, Tstg -55 to 150 °C Note (1) Mounted on epoxy glass PCB with 3 mm x 3 mm Cu pads (≥ 40 μm thick) Rev. 1.7, 26-Feb-2021 Document Number: 85192 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 ES07B-M, ES07D-M www.vishay.com Vishay Semiconductors ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION IF = 1 A (1) Instantaneous forward voltage TA = 25 °C Maximum DC reverse current at rated DC blocking voltage TA = 100 °C IF = 0.5 A, IR = 1 A, Irr = 0.25 A Reverse recovery time Typical capacitance 4 V, 1 MHz PART SYMBOL MIN. TYP. MAX. UNIT V ES07B-M VF 0.98 ES07D-M VF 0.98 V ES07B-M IR 10 μA ES07D-M IR 10 μA ES07B-M IR 50 μA ES07D-M IR 50 μA ES07B-M trr 25 ns ES07D-M trr 25 ES07B-M Cj 4 pF ES07D-M Cj 4 pF ns Note (1) Pulse test: 300 μs pulse width, 1 % duty cycle TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 7 10 f = 1 MHz 6 5 CD (pF) IF (A) 1 0.1 Typical at 150 °C 0.01 4 3 2 Typical at 100 °C 1 Typical at 25 °C 0.001 0 0.2 0.4 18242 0.6 0.8 1.0 1.2 0 0.1 1.4 1 18244 VF (V) Fig. 1 - Typical Forward Characteristics 10 100 VR (V) Fig. 3 - Typical Diode Capacitance vs. Reverse Voltage 1000 1.4 1.2 Tj = 150 °C 100 Tj = 125 °C 1.0 IR (µA) Average Forward Current (A) Lead temperature 0.8 0.6 Tj = 100 °C 10 Tj = 75 °C 1 Tj = 50 °C 0.4 Tj = 25 °C 0.1 Ambient temperature 0.2 0 18243 Tj = 0 °C Tj = - 50 °C 0.01 0 25 50 75 100 125 Temperature (Ambient or Lead) (°C) Fig. 2 - Forward Current Derating Curve 0 150 18245 40 80 120 160 200 VR (V) Fig. 4 - Typical Reverse Characteristics Rev. 1.7, 26-Feb-2021 Document Number: 85192 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 ES07B-M, ES07D-M www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters (inches): SMF (DO-219AB) 0.85 [0.033] 0.35 [0.014] 0.1 [0.004] 0 [0.000] 5° 5° 1.2 [0.047] 1.7 [0.067] 1.9 [0.075] 0.8 [0.031] Detail Z enlarged 0.1 [0.004] 0.25 [0.010] 1.8 [0.071] min. 1.08 [0.043] 0.88 [0.035] 2.9 [0.114] 2.7 [0.106] 3.9 [0.154] 3.5 [0.138] foot print recommendation: Reflow soldering 1.3 [0.051] 1.4 [0.055] 1.3 [0.051] 2.9 [0.114] Created - Date: 15. February 2005 Rev. 6 - Date: 24.Feb.2021 Document no.: S8-V-3915.01-001 (4) 22989 Rev. 1.7, 26-Feb-2021 Document Number: 85192 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 ES07B-M, ES07D-M www.vishay.com Vishay Semiconductors ORIENTATION IN CARRIER TAPE - SMF (DO-219AB) Unreeling direction SMF cathode Top view Document no.: S8-V-3717.02-003 (4) Created - Date: 09. Feb. 2010 22670 Rev. 1.7, 26-Feb-2021 Document Number: 85192 4 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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