FCHP0402E1000BST1

FCHP www.vishay.com Vishay Dale Thin Film High Frequency 60 GHz High Power 1 W Thin Film Surface Mount Chip Resistor FEATURES • • • • • • • • • • LINKS TO ADDITIONAL RESOURCES • • • 3D 3D S-Parameters 3D Models FCHP series chip resistors are designed with low internal reactance. They function as almost pure resistors on a very high range of frequencies. The specialized laser edge trimming allows for precision tolerances to 0.1 %. Thin film microwave resistors Operating frequency to 60 GHz Available Small standard case size (0402) Available High power (1 W) Small internal reactance (< 10 m) Available Edge sense trimmed block resistors High thermal conductivity aluminum nitride Available substrate Ohmic range (50  and 100 ) Low TCR (down to ± 25 ppm/°C) Epoxy bondable, wire bondable, and solderable termination styles Modelithics® library available Flame retardant per AEC-Q200-001 Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details Aluminum nitride substrate allows for higher power capability versus standard frequency chip resistor. APPLICATIONS Modelithics and Vishay have partnered to offer free access of highly accurate, scalable advanced simulation models. Request the Modelithics Vishay model library: www.modelithics.com/mvp/vishay • • • • 5G base stations and small cells RF and microwave test systems Connected car Internet of things (IoT) STANDARD ELECTRICAL SPECIFICATIONS TEST Material Resistance Range TCR: Absolute Tolerance: Absolute Stability: Absolute Stability: Ratio Voltage Coefficient Working Voltage SPECIFICATIONS TEST CONDITIONS Passivated nichrome - 50  / 100  - ± 25 ppm/°C to ± 100 ppm/°C -55 °C to +125 °C ± 0.1 % to ± 5.0 % +25 °C R ± 0.50 % 1000 h at 100 °C - - 0.1 ppm/V - 30 V - Operating Temperature Range -55 °C to +155 °C - Storage Temperature Range -55 °C to +155 °C - < -35 dB - R ± 0.01 % 1 year at +25 °C Noise Shelf Life Stability: Absolute Revision: 06-Sep-2021 Document Number: 60162 1 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 FCHP www.vishay.com Vishay Dale Thin Film COMPONENT RATINGS CASE SIZE POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE () 1000 (1) 30 50 / 100 0402 Note (1) Dependent on component mounting by user DIMENSIONS in inches (millimeters) D T E L D T W L CASE SIZE 0402 LENGTH WIDTH W (± 0.005) THICKNESS T (± 0.0015) TOP PAD D (± 0.005) BOTTOM PAD E (± 0.005) 0.042 ± 0.008 (1.067 ± 0.203) 0.022 (0.559) 0.015 (0.381) 0.010 (0.254) 0.010 (0.254) MECHANICAL SPECIFICATIONS Resistive Element Passivated nichrome Substrate Material Aluminum nitride Terminations Lead (Pb)-free Option Tin/Lead Option Lead (Pb)-free Finish and Tin / Lead Revision: 06-Sep-2021 Pre-soldered or gold 100 % matte tin Tin lead solder Electroplated Document Number: 60162 2 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 FCHP www.vishay.com Vishay Dale Thin Film GLOBAL PART NUMBER INFORMATION New Global Part Numbering: FCHP0402E1000BSTS F C H P 0 GLOBAL MODEL CASE SIZE TCR CHARACTERISTIC FCHP 0402 E = 25 ppm/°C H = 50 ppm/°C K = 100 ppm/°C 4 0 2 E 1 RESISTANCE TOLERANCE The first 3 digits are significant figures and the last digit specifies the number of zeros to follow. “R” designates the decimal point. B = 0.1 % D = 0.5 % F = 1 % G = 2 % J=5% Example: 10R0 = 10  1000 = 100  0 0 0 B TERMINATION (1, 2, or 3 digits) S T S PACKAGING T = top sided Au (gold) term Au over Ni epoxy  bond only RoHS- compliant - e4 B = wraparound Sn/Pb solder nickel barrier G = wraparound Au over Ni (gold) termination epoxy bondable RoHS- compliant - e4 S = wraparound lead (Pb)-free  solder RoHS- compliant - e3 BS = BULK 100 min., 1 mult. W0 = WAFFLE 100 min., 100 mult. WS = WAFFLE 100 min., 1 mult. WI = 100 min., 1 mult. (item single lot date code) WP = 100 min., 1 mult. (package unit single lot date code)  TAPE AND REEL T0 = 100 min., 100 mult. T1 = 1000 min., 1000 mult. (1) T3 = 300 min., 300 mult. T5 = 500 min., 500 mult. TF = full reel TS = 100 min., 1 mult. TI = 100 min., 1 mult. (item single lot date code) TP = 100 min., 1 mult. (package unit single lot date code) Historical Part Number Example: FCHP0402E1000BST1 (for reference purposes only) FCHP 0402 E 1000 B S T SERIES CASE SIZE TCR CHARACTERISTIC RESISTANCE TOLERANCE TERMINATION PACKAGING Note (1) Preferred packaging code TYPICAL HIGH FREQUENCY PERFORMANCE ELECTRICAL MODEL AND TESTING C: Internal shunt capacitance L : Internal inductance R: Resistance LC: External connection inductance Cg: External capacitance to ground C LC R L Cg LC Cg Lumped Equivalent Circuit Reference plane is at the resistor-bonding pad interface. The lumped circuit above was used to model the data at the bonding pad-resistor reference plane. High frequency testing was performed by Modelithics, Inc. on parts mounted to quartz test boards. Quartz test boards were chosen to minimize the contribution of the board effects at high frequencies. Revision: 06-Sep-2021 Document Number: 60162 3 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 FCHP www.vishay.com Vishay Dale Thin Film INTERNAL IMPEDANCE VSWR Axis Title Axis Title 10000 ▬▬▬ ▬▬▬ 2.0 ▬▬▬ ▬▬▬ Wraparound, 50 Ω Wraparound, 100 Ω Flip chip, 50 Ω Flip chip, 100 Ω 1.0 2nd line VSWR 1st line 2nd line 2nd line |Z|/R 1000 1.5 100 0.5 0 0.01 10 0.1 1 10 10000 2.5 2.4 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 ▬▬▬ ▬▬▬ ▬▬▬ ▬▬▬ 1000 100 10 0 100 Wraparound, 50 Ω Wraparound, 100 Ω Flip chip, 50 Ω Flip chip, 100 Ω 1st line 2nd line 2.5 2 4 6 8 SINGLE PULSE LOAD TESTING 6 ▬▬▬ 10 4 3 100 100 2 Wraparound, 50 Ω Flip chip, 50 Ω Wraparound, 100 Ω Flip chip, 100 Ω 1 0.1 1 10 0 10 0.01 1000 1st line 2nd line 2nd line Power (W) 1000 0.001 (1) Wraparound, 50 Ω Flip chip, 50 Ω Wraparound, 100 Ω Flip chip, 100 Ω 5 1st line 2nd line 2nd line Peak Power (W) ▬▬▬ ▬▬▬ 100 0.1 0.0001 20 10000 ▬▬▬ ▬▬▬ 18 7 10000 ▬▬▬ 16 Axis Title 1000 ▬▬▬ 14 TEMPERATURE VS. APPLIED POWER Axis Title ▬▬▬ 12 Frequency (GHz) Frequency (GHz) 1 10 70 10 150 200 Temperature (°C) Pulse Duration (s) Note (1) Chip surface temperature measured using FLIR SC645 thermal imaging system. Thermal imaging and load life testing conducted by mounting device to a 1.6" x 3.7" test card with 3.5 mil copper plating on both sides. Thermal vias on 50 mil centers were utilized for heat transfer between surfaces DERATING Axis Title 10000 100 1000 60 1st line 2nd line 2nd line Rated Power (%) 80 40 100 20 10 0 0 20 40 60 80 100 125 140 155 Ambient Temperature (°C) Revision: 06-Sep-2021 Document Number: 60162 4 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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