NTCC300E4123FT

NTCC200E4, NTCC300E4 www.vishay.com Vishay BCcomponents Leadless NTC Thermistor Die Suitable for Wire Bonding FEATURES • Flat chip contacted top and bottom (gold: NTCC300E4 series or silver: NTCC200E4 series) • Green thermistor - does not use RoHS exemptions • Wide temperature range from -55 °C to +175 °C • Highly resistant to thermal shocks • Ideal for wire bonding (aluminum or gold depending on metalization type) • Resistance to leaching • Delivered on blister tape • AEC-Q200 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 QUICK REFERENCE DATA PARAMETER VALUE UNIT 4.7K to 20K Ω ± 1; ± 2; ± 3; ± 5 % APPLICATIONS 3435 to 3865 K ±1 % Operating temperature range -55 to +175 °C Response time (63.2 %) 25 °C to 85 °C still air (for info) 3 s • High temperature sensing, control and compensation. E.g. IGBT modules (inverters in EV and HEV vehicles) • IC and semiconductor protecting • DC/AC power inverters and HIC overheat protecting Dissipation factor δ in still air (for info, non-mounted die) 3 mW Maximum power dissipation 50 mW Weight 3 mg Resistance value at 25 °C Tolerance on R25-value B25/85-value Tolerance on B25/85-value DESIGN-IN SUPPORT For complete curve computation, please visit: www.vishay.com/thermistors/ntc-curve-list/ MARKING The thermistors have no marking and have electrode termination design without orientation. MOUNTING The thermistors are primarily intended for wire bonding. The parameters of the assembly process should be chosen in accordance with the lead-wire material. The mounting process should be in compliance with the following guidelines and recommendations: Die bonding: • Gold electrode: silver epoxy gluing • Silver electrode: (vacuum) reflow soldering - silver epoxy gluing - nano silver sintering Soldering process under reducing atmosphere (e.g. forming or formic gases) and ultrasonic cleaning processes can be applied under the condition that NTC die is not damaged. Consult Vishay for further assistance. Wire bonding: • The gold electrode has been tested for gold wire bonding with a wire diameter of max. 32 μm • The silver electrode has been tested for aluminum wire bonding with a wire diameter of max. 300 μm Encapsulation: • In order to preserve the characteristics of the bonded die at long term an encapsulation is mandatory • The encapsulation is defined by the user. Silicon and epoxy encapsulations have been tested. For recommendations on compatible encapsulants contact Vishay ELECTRICAL DATA AND ORDERING INFORMATION R25 (Ω) R25-TOL. (± %) B25/85 (K) B25/85-TOL. (± %) DESCRIPTION SAP MATERIAL AND ORDERING NUMBER (1) 4700 1, 2, 3, 5 3435 1 Bare die with top / bottom silver terminations NTCC200E4472*T 12 000 1, 2, 3, 5 3740 1 Bare die with top / bottom silver terminations NTCC200E4123*T 20 000 1, 2, 3, 5 3865 1 Bare die with top / bottom silver terminations NTCC200E4203*T 4700 1, 2, 3, 5 3435 1 Bare die with top / bottom gold terminations NTCC300E4472*T 12 000 1, 2, 3, 5 3740 1 Bare die with top / bottom gold terminations NTCC300E4123*T 20 000 1, 2, 3, 5 3865 1 Bare die with top / bottom gold terminations NTCC300E4203*T Note (1) In order to define R -tolerance, replace * in SAP part number by F (± 1 %), G (± 2 %), H (± 3 %), or J (± 5 %) 25 Revision: 09-Dec-2020 Document Number: 29153 1 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 NTCC200E4, NTCC300E4 www.vishay.com Vishay BCcomponents DIMENSIONS in millimeters W T Wire bondable surface PARAMETER VALUE W 2 ± 0.1 T 0.7 max. Note • Non-dimensioned details do not affect the performance of the thermistors PACKAGING The components are delivered on 8 mm embossed blister tape (0.3 mm conductive PS) conforming to EIA-481 and IEC 60286-3, with 2000 parts per reel. K0 P0 D0 P2 T F B0 T2 Revision: 09-Dec-2020 E1 W A0 PARAMETER VALUE A0 2.2 ± 0.1 B0 2.2 ± 0.1 K0 1.0 ± 0.1 W 8 ± 0.3 F 3.5 ± 0.05 E1 1.75 ± 0.1 P0 4.0 ± 0.1 P2 2.0 ± 0.05 D0 1.5 ± 0.1 T 0.35 max. T2 0.50 max. Document Number: 29153 2 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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