SUD35N05-26L
Vishay Siliconix
N-Channel 55 V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
55
a
RDS(on) ()
ID (A)
0.0200 at VGS = 10 V
35
0.0260 at VGS = 4.5 V
30
•
•
•
•
TrenchFET® Power MOSFETS
175 °C Rated Maximum Junction Temperature
Low Input Capacitance
Material categorization: For definitions of
compliance please see www.vishay.com/doc?99912
TO-252
D
G
Drain Connected to Tab
G
D
S
S
Top View
N-Channel MOSFET
Ordering Information:
SUD35N05-26L-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
55
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 175 °C)b
TC = 25 °C
TC = 100 °C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
TC = 25 °C
Maximum Power Dissipation
TA = 25 °C
V
35
ID
25
IDM
80
IS
35
A
50c
PD
W
7.5b
TJ, Tstg
Operating Junction and Storage Temperature Range
Unit
- 55 to 175
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t 10 s
Junction-to-Ambientb
Steady State
RthJA
Typical
Maximum
17
20
50
60
Junction-to-Case
RthJC
2.5
3
Junction-to-Lead
RthJL
5
6
Unit
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x1" FR4 board, t 10 s.
c. See SOA curve for voltage derating.
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 71443
S12-1360-Rev. C, 11-Jun-12
For more information please contact: pmostechsupport@vishay.com
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUD35N05-26L
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
Typa
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
VBR
VGS = 0 V, ID = 250 µA
55
VGS(th)
VDS = VGS, ID = 250 µA
1
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
VDS = 44 V, VGS = 0 V
1
VDS = 44 V, VGS = 0 V, TJ = 125 °C
50
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currentb
ID(on)
VDS =5 V, VGS = 5 V
35
VGS = 10 V, ID = 20 A
Drain-Source On-State Resistanceb
Forward Transconductanceb
V
gfs
µA
A
0.0165
VGS = 10 V, ID = 10 A, TJ = 125 °C
RDS(on)
nA
0.0200
0.0350
VGS = 4.5 V, ID = 15 A
0.0215
VDS = 15 V, ID = 20 A
25
VGS = 0 V, VDS = 25 V, f = 1 MHz
185
0.0260
S
Dynamica
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
80
Total Gate Chargec
Qg
10.5
c
885
Qgs
Gate-Source Charge
c
Gate-Drain Charge
Qgd
Turn-On Delay Timec
td(on)
c
tr
Turn-Off Delay Timec
td(off)
Rise Time
Fall Timec
VDS = 25 V, VGS = 5 V, ID = 35 A
pF
13
nC
4
4.8
VDD = 25 V, RL = 0.3
ID 35 A, VGEN = 10 V, RG = 2.5
tf
5
8
18
30
20
30
100
150
ns
Source-Drain Diode Ratings and Characteristic (TC = 25 °C)
IS
35
Pulsed Current
ISM
80
Diode Forward Voltageb
VSD
IF = 80 A, VGS = 0 V
trr
IF = 35 A, di/dt = 100 A/µs
Continuous Current
Source-Drain Reverse Recovery Time
25
A
1.5
V
40
ns
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width 300 µs, duty cycle 2 %.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Document Number: 71443
S12-1360-Rev. C, 11-Jun-12
For more information please contact: pmostechsupport@vishay.com
www.vishay.com
2
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUD35N05-26L
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C unless noted)
100
100
VGS = 10 thru 6 V
5V
80
I D - Drain Current (A)
I D - Drain Current (A)
80
TC = - 55 °C
60
4V
40
20
25 °C
125 °C
60
40
20
2V
3V
0
0
0
2
4
6
8
10
VDS - Drain-to-Source Voltage (V)
0
2
3
4
5
6
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
60
1
7
8
0.04
TC = - 55 °C
0.03
40
25 °C
30
125 °C
VGS = 4.5 V
VGS = 10 V
0.02
R DS(on) -
g fs - Transconductance (S)
50
20
0.01
10
0
0.00
0
20
40
60
ID - Drain Current (A)
80
100
0
Transconductance
40
60
I D - Drain Current (A)
80
100
On-Resistance vs. Drain Current
20
VGS - Gate-to-Source Voltage (V)
1500
1200
C - Capacitance (pF)
20
Ciss
900
600
300
Coss
Crss
0
0
VDS = 25 V
ID = 35 A
16
12
8
4
0
11
22
33
44
VDS - Drain-to-Source Voltage (V)
Capacitance
Document Number: 71443
S12-1360-Rev. C, 11-Jun-12
55
0
10
20
30
40
Qg - Total Gate Charge (nC)
Gate Charge
For more information please contact: pmostechsupport@vishay.com
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUD35N05-26L
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C unless noted)
100
2.0
R DS(on) - On-Resistance (Normalized)
VGS = 10 V
ID = 20 A
I S - Source Current (A)
1.6
1.2
0.8
TJ = 175 °C
10
TJ = 25 °C
0.4
1
0.0
- 50
- 25
0
25
50
75 100 125
TJ - Junction Temperature (°C)
150
175
0
0.2
0.4
0.6
0.8
1.0
1.2
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
THERMAL RATINGS
500
40
Limited
by R DS(on)*
100
I D - Drain Current (A)
I D - Drain Current (A)
30
20
10 µs
100 µs
10
10 ms
100 ms
1s
DC
1
10
TC = 25 °C
Single Pulse
0
0
25
50
75
100
125
TC - Case Temperature (°C)
150
175
0.1
0.1
Max. Avalanche and Drain Current vs. Case Temperature
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (s)
1
10
30
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71443.
Document Number: 71443
S12-1360-Rev. C, 11-Jun-12
For more information please contact: pmostechsupport@vishay.com
www.vishay.com
4
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2022
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Document Number: 91000