TLMB3101-GS08

TLMB310. VISHAY Vishay Semiconductors SMD LED in PLCC-2 Package Description This device has been redesigned in 1998 replacing SiC by GaN technology to meet the increasing demand for high efficiency blue LEDs. The package of the TLMB310. is the PLCC-2 (equivalent to a size B tantalum capacitor). It consists of a lead frame which is embedded in a white thermoplast. All LEDs are categorized in luminous intensity groups. That allows users to assemble LEDs with uniform appearance. e3 Pb 19225 Pb-free Features Applications • GaN on SiC technology • EIA and ICE standard package • Compatible with infrared, vapor phase and wave solder processes according to CECC • Available in 8 mm tape • Non-diffused lens: excellent for coupling to light pipes and backlighting • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 1.6 • ESD class 1 • Lead-free device Automotive: Backlighting in dashboards and switches Telecommunication: Indicator and backlighting in telephone and fax Indicator and backlight for audio and video equipment Indicator and backlight in office equipment Flat backlight for LCDs, switches and symbols General use Parts Table Part Color, Luminous Intensity Angle of Half Intensity (±ϕ) Technology TLMB3100 Blue, IV > 4.0 mcd 60 ° GaN on SiC TLMB3101 Blue, IV = (4.0 to 12.5) 60 ° GaN on SiC TLMB3104 Blue, IV = (5.0 to 12.5) 60 ° GaN on SiC TLMB3106 Blue, IV = (5.0 to 20.0) 60 ° GaN on SiC Absolute Maximum Ratings Tamb = 25 °C, unless otherwise specified TLMB310. Parameter Test condition Reverse voltage DC Forward current Tamb ≤ 60 °C Surge forward current tp ≤ 10 µs Power dissipation Tamb ≤ 60 °C Junction temperature Operating temperature range Document Number 83034 Rev. 1.7, 31-Aug-04 Symbol Value Unit VR 5 V IF 20 mA IFSM 0.1 A PV 100 mW Tj 100 °C Tamb - 40 to + 100 °C www.vishay.com 1 TLMB310. VISHAY Vishay Semiconductors Parameter Test condition Symbol Value Tstg - 40 to + 100 °C Tsd 260 °C RthJA 400 K/W Storage temperature range Soldering temperature t≤5s Thermal resistance junction/ ambient mounted on PC board Unit (pad size > 16 mm2) Optical and Electrical Characteristics Tamb = 25 °C, unless otherwise specified Blue TLMB310. Parameter Test condition IF = 10 mA Luminous intensity 1) Part Symbol Min Typ. TLMB3100 IV 4.0 8.0 Max Unit TLMB3101 IV 4.0 12.5 mcd TLMB3104 IV 5.0 12.5 mcd TLMB3106 IV 5.0 20.0 mcd mcd Dominant wavelength IF = 10 mA λd Peak wavelength IF = 10 mA λp 428 nm Angle of half intensity IF = 10 mA ϕ ± 60 deg Forward voltage IF = 20 mA VF Reverse voltage IR = 10 µA VR 1) 466 3.9 nm 4.5 5 V V in one Packing Unit IVmax/IVmin ≤ 1.6 Typical Characteristics (Tamb = 25 °C unless otherwise specified) 60 IF - Forward Current ( mA ) PV - Power Dissipation ( mW ) 125 100 75 50 25 0 95 10904 40 30 20 10 0 20 40 60 80 Tamb - Ambient Temperature ( °C ) www.vishay.com 0 100 Figure 1. Power Dissipation vs. Ambient Temperature 2 50 15884 0 20 40 60 80 100 Tamb - Ambient Temperature ( °C ) Figure 2. Forward Current vs. Ambient Temperature for InGaN Document Number 83034 Rev. 1.7, 31-Aug-04 TLMB310. VISHAY Vishay Semiconductors 10° 20° 30° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° 0.6 0.4 0.2 0 0.2 95 10319 0.1 1 10 Figure 6. Relative Luminous Flux vs. Forward Current 120 I Vrel - Relative Luminous Intensity (%) 100 10 1 0 1 2 3 4 5 6 7 I F = 10 mA 100 80 60 40 20 0 350 8 V F - Forward Voltage ( V ) 15846 400 450 15847 600 1000 I F = 10 mA 1.2 1.0 0.8 0.6 0.4 0.2 0 -10 550 Figure 7. I FM - Forward Current ( mA ) I Vrel - Relative Luminous Intensity 1.4 500 λ - Wavelenght ( nm ) 15849 Figure 4. Forward Current vs. Forward Voltage 1.6 100 I F - Forward Current ( mA ) 15848 Figure 3. Rel. Luminous Intensity vs. Angular Displacement I F - Forward Current ( mA ) 1 0.01 0.6 0.4 10 I Vrel - Relative Luminous Intensity I V re l - Relative Luminous Intensity 0° Figure 5. Rel. Luminous Flux vs. Ambient Temperature Document Number 83034 Rev. 1.7, 31-Aug-04 18816 0.02 0.01 100 0.2 0.5 tp/T = 1 10 0.01 0.1 0 10 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature ( °C ) 0.05 0.1 1 10 100 tp - Pulse Length ( ms ) Figure 8. Forward Current vs. Pulse Length www.vishay.com 3 TLMB310. VISHAY Vishay Semiconductors Package Dimensions in mm 3.5 ± 0.2 0.85 + 0.10 1.65- 0.05 technical drawings according to DIN specifications Mounting Pad Layout Pin identification area covered with solder resist 4 2.6 (2.8) A 2.2 C 2.8 + 0.15 1.2 4 1.6 (1.9) ∅ 2.4 3 + 0.15 Dimensions: IR and Vaporphase (Wave Soldering) Drawing-No. : 6.541-5025.01-4 Issue: 7; 05.04.04 95 11314 www.vishay.com 4 Document Number 83034 Rev. 1.7, 31-Aug-04 TLMB310. VISHAY Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423 Document Number 83034 Rev. 1.7, 31-Aug-04 www.vishay.com 5 Legal Disclaimer Notice Vishay Notice Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale. Document Number: 91000 Revision: 08-Apr-05 www.vishay.com 1