TSSP77038TR

TSSP770.. www.vishay.com Vishay Semiconductors IR Sensor Module for Reflective Sensor, Light Barrier, and Fast Proximity Applications FEATURES • • • • • • • • • 4 3 2 1 20953 Up to 2 m for presence and proximity sensing Uses modulated bursts of infrared light PIN diode and sensor IC in one package Low supply current Shielding against EMI Visible light is suppressed by IR filter Insensitive to supply voltage ripple and noise Supply voltage: 2.5 V to 5.5 V Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION DESIGN SUPPORT TOOLS AVAILABLE Pinning: 1, 4 = GND, 2 = VS, 3 = OUT The TSSP770.. series are compact infrared detector modules for presence and fast proximity sensing applications. They provide an active low output in response to infrared bursts at 940 nm. The frequency of the burst should correspond to the carrier frequency shown in the parts table. This component has not been qualified according to automotive specifications. ORDERING CODE APPLICATIONS Taping: TSSP770..TT - top view taped TSSP770..TR - side view taped • Reflective sensors for hand dryers, towel or soap dispensers, water faucets, toilet flush • Vending machine fall detection • Security and pet gates • Person or object vicinity activation • Fast proximity sensors for toys, robotics, drones, and other consumer and industrial uses 3D 3D 3D Models MECHANICAL DATA PARTS TABLE Carrier frequency 38 kHz TSSP77038 56 kHz TSSP77056 Package Heimdall Pinning 1, 4 = GND, 2 = VS, 3 = OUT Dimensions (mm) 6.8 W x 3.0 H x 3.2 D Mounting SMD Application Presence sensors, fast proximity sensors BLOCK DIAGRAM PRESENCE SENSING +3 V 2 33 kΩ IR emitter VS 3 Input AMP Band pass Demodulator Envelope signal OUT 38 kHz +3 V 1, 4 PIN Out to μC GND 16833_17 Rev. 2.3, 10-Apr-2019 1 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP770.. www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS PARAMETER TEST CONDITION SYMBOL VALUE UNIT VS -0.3 to +6 V Supply voltage Supply current IS 5 mA Output voltage VO -0.3 to (VS + 0.3) V Output current IO 5 mA Tj 100 °C Storage temperature range Junction temperature Tstg -25 to +85 °C Operating temperature range Tamb -25 to +85 °C Ptot 10 mW Power consumption Tamb ≤ 85 °C Note • Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT VS 2.5 - 5.5 V VS = 5 V, Ev = 0 ISD 0.55 0.7 0.9 mA Ev = 40 klx, sunlight ISH - 0.8 - mA Ev = 0, IR diode TSAL6200, IF = 50 mA, test signal see Fig. 1 d - 8 - m Output voltage low IOSL = 0.5 mA, Ee = 0.7 mW/m2, test signal see Fig. 1 VOSL - - 100 mV Minimum irradiance Pulse width tolerance: tpi - 5/fo < tpo < tpi + 6/fo, test signal see Fig. 1 Ee min. - 0.7 1.2 mW/m2 Maximum irradiance tpi - 5/fo < tpo < tpi + 6/fo, test signal see Fig. 1 Ee max. 50 - - W/m2 Angle of half transmission distance ϕ1/2 - ± 50 - deg Supply voltage Supply current Transmission distance Directivity Rev. 2.3, 10-Apr-2019 2 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP770.. www.vishay.com Vishay Semiconductors TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Optical Test Signal (IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms) t tpi * T 10/f0 is recommended for optimal function * tpi VO Output Signal 1) VOH VOL 2) 0.8 ton, toff - Output Pulse Width (ms) Ee 16110 7/f0 < td < 15/f0 tpi - 5/f0 < tpo < tpi + 6/f0 ton 0.7 0.6 0.5 toff 0.4 0.3 0.2 λ = 950 nm, optical test signal, Fig. 3 0.1 0 0.1 td 1) tpo 2) t Fig. 1 - Output Active Low Ee min./Ee - Relative Responsivity tpo - Output Pulse Width (ms) 100 1000 10 000 1.2 Output pulse width 0.9 0.8 Input burst length 0.7 0.6 0.5 0.4 0.3 λ = 950 nm, optical test signal, Fig. 1 0.2 1.0 0.8 0.6 0.4 f = f0 ± 5 % Δf(3 dB) = f0/10 0.2 0.0 0.1 1 10 100 1000 10 000 100 000 0.7 Ee - Irradiance (mW/m2) Ee min. - Threshold Irradiance (mW/m2) t 600 µs t = 60 ms 94 8134 Output Signal, (see Fig. 4) VOH VOL t on t off t 1.3 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -30 -10 10 30 50 70 90 Tamb - Ambient Temperature (°C) Fig. 3 - Output Function Rev. 2.3, 10-Apr-2019 1.1 Fig. 5 - Frequency Dependence of Responsivity Optical Test Signal 600 µs 0.9 f/f0 - Relative Frequency 16925 Fig. 2 - Pulse Length and Sensitivity in Dark Ambient VO 10 Fig. 4 - Output Pulse Diagram 1.0 Ee 1 Ee - Irradiance (mW/m2) Fig. 6 - Sensitivity vs. Ambient Temperature 3 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP770.. www.vishay.com Vishay Semiconductors Axis Title Axis0° Title 10° 20° 30° 10000 0.9 0.8 0.6 0.4 2nd line Vertical 0.5 40° 1.0 1000 0.9 50° 0.8 60° 100 0.3 2nd line 2nd line 0.7 1st line 2nd line 2nd line S(λ)rel. - Relative Spectral Sensitivity 1.0 70° 0.7 0.2 80° 0.1 0 750 850 950 1050 10 1150 0.6 λ - Wavelength (nm) 21425 Fig. 7 - Relative Spectral Sensitivity vs. Wavelength Axis0° Title 10° 20° 0.4 0.2 0 0.2 0.4 0.6 drel. - Relative Transmission Distance 21428 Fig. 9 - Vertical Directivity 30° 0.9 50° 0.8 2nd line 2nd line 40° 1.0 2nd line Horizontal Ee min. - Sensitivity (mW/m2) 2.0 60° 70° 0.7 80° 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.6 21427 0.4 0.2 0 0.2 0.4 2 0.6 3 4 5 drel. - Relative Transmission Distance VS - Supply Voltage (V) Fig. 8 - Horizontal Directivity Fig. 10 - Sensitivity vs. Supply Voltage The typical application of these devices is a reflective or beam break sensor with active low “detect” or “no detect” information contained in its output. The TSSP77056 is also suitable for fast (~ 5 ms) proximity sensor applications for ranges between 10 cm and 2 m. Please see application note “Vishay’s TSSP4056 Sensor for Fast Proximity Sensing” (www.vishay.com/doc?82741). Example for a sensor hardware: IR Receiver TSSP6P38 Emitter TSAL6200 Separation to avoid crosstalk by stray light inside the housing There should be no common window in front of the emitter and detector in order to avoid crosstalk via guided light through the window. Rev. 2.3, 10-Apr-2019 4 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP770.. www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 6.8 6.6 ± 0.1 3.2 (3.4) Mold residue Mold residue 2.5 (1.8) 1.2 ± 0.2 3 0.8 2.2 (0.635) (1) 1.27 (3 x) 0.5 ± 0.1 (4 x) technical drawings according to DIN specifications 3 x 1.27 = 3.81 Marking area (2.2) 2.2 Not indicated tolerances ± 0.15 (1.65) Tool separation line Proposed pad layout from component side (for reference only) 3 x 1.27 = 3.81 1.27 Pick and place area 1.8 (R1.3) Drawing-No.: 6.550-5297.01-4 Issue: 4; 13.09.11 0.8 22608 ASSEMBLY INSTRUCTIONS Reflow Soldering Manual Soldering • Reflow soldering must be done within 72 h while stored under a max. temperature of 30 °C, 60 % RH after opening the dry pack envelope • Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 °C • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handle products only after the temperature has cooled off • Finish soldering within 3 s • Handling after reflow should be done only after the work surface has been cooled off Rev. 2.3, 10-Apr-2019 5 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP770.. www.vishay.com Vishay Semiconductors VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE Axis Title 300 10000 max. 260 °C 255 °C 240 °C 2nd line Temperature (°C) 250 245 °C 217 °C 1000 200 max. 20 s 150 max. 120 s max. 100 s 100 100 Max. ramp up 3 °C/s 50 Max. ramp down 6 °C/s Max. 2 cycles allowed 10 0 0 50 100 150 200 250 300 Time (s) 19800 0.3 3.6 TAPING VERSION TSSP..TR DIMENSIONS in millimeters 16 7.5 1.75 1.34 ref. Ø 1.5 4 Direction of feed 8 2 Ø 1.5 min. technical drawings according to DIN specifications Drawing-No.: 9.700-5337.01-4 Issue: 2; 06.10.15 Rev. 2.3, 10-Apr-2019 6 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP770.. www.vishay.com Vishay Semiconductors 3.65 0.3 TAPING VERSION TSSP..TT DIMENSIONS in millimeters 16 1.75 7.5 Ø 1.5 4 8 Direction of feed 2 Ø 1.5 technical drawings according to DIN specifications Drawing-No.: 9.700-5338.01-4 Issue: 4; 12.06.13 Rev. 2.3, 10-Apr-2019 7 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP770.. www.vishay.com Vishay Semiconductors REEL DIMENSIONS in millimeters 16734 LEADER AND TRAILER DIMENSIONS in millimeters Trailer no devices Leader devices no devices End Start min. 200 min. 400 96 11818 COVER TAPE REEL STRENGTH LABEL According to DIN EN 60286-3 Standard bar code labels for finished goods 0.1 N to 1.3 N The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data. 300 ± 10 mm/min. 165° to 180° peel angle Rev. 2.3, 10-Apr-2019 8 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP770.. www.vishay.com Vishay Semiconductors VISHAY SEMICONDUCTORS GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITING ABBREVIATION LENGTH - 18 Item-description Item-number INO 8 Selection-code SEL 3 BATCH 10 Data-code COD 3 (YWW) Plant-code PTC 2 Quantity QTY 8 Accepted by ACC - LOT-/serial-number Packed by Mixed code indicator Origin LONG BAR CODE TOP PCK - MIXED CODE - xxxxxxx+ Company logo TYPE LENGTH Item-number N 8 Plant-code N 2 Sequence-number X 3 Quantity N 8 Total length - 21 TYPE LENGTH Selection-code X 3 Data-code N 3 Batch-number X 10 Filter - 1 Total length - 17 SHORT BAR CODE BOTTOM DRY PACKING After more than 72 h under these conditions moisture content will be too high for reflow soldering. The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 125 °C + 5 °C not suitable for reel or tubes. Aluminum bag Label An EIA JEDEC® standard J-STD-020 level 4 label is included on all dry bags. Reel LEVEL CAUTION This bag contains MOISTURE-SENSITIVE DEVICES 15973 1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative humidity (RH) FINAL PACKING 2. After this bag is opened, devices that will be subjected to soldering reflow or equivalent processing (peak package body temp. 260 °C) must be 2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or 2b. Stored at < 5 % RH The sealed reel is packed into a cardboard box. 3. Devices require baking befor mounting if: Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or 2a. or 2b. are not met. RECOMMENDED METHOD OF STORAGE 4. If baking is required, devices may be baked for: 192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or 96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or 24 hours at 125 °C ± 5 °C not suitable for reels or tubes Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: Bag Seal Date: (If blank, see barcode label) Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020 22522 • Storage temperature 10 °C to 30 °C EIA JEDEC standard J-STD-020 level 4 label is included on all dry bags • Storage humidity ≤ 60 % RH max. Rev. 2.3, 10-Apr-2019 4 9 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP770.. www.vishay.com Vishay Semiconductors ESD PRECAUTION VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS (example) Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. 22178 Rev. 2.3, 10-Apr-2019 10 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2019 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2019 1 Document Number: 91000