VS-ETU3006SHM3, VS-ETU3006-1HM3
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Vishay Semiconductors
Ultrafast Rectifier, 30 A FRED Pt®
FEATURES
• Low forward voltage drop
• Ultrafast recovery time
• 175 °C operating junction temperature
2
• Low leakage current
3
3
1
D2PAK (TO-263AB)
• AEC-Q101 qualified, meets JESD 201 class 1A whisker
test
2
1
TO-262AA
Base
cathode
2
• Meets MSL level 1, per J-STD-020, LF maximum peak of
260 °C
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
2
DESCRIPTION
1
N/C
VS-ETU3006SHM3
Ultralow VF, soft-switching ultrafast rectifiers optimized for
discontinuous (critical) mode (DCM) power factor correction
(PFC).
3
Anode
1
N/C
3
Anode
The minimized conduction loss, optimized stored charge
and low recovery current minimized the switching losses
and reduce over dissipation in the switching element and
snubbers.
VS-ETU3006-1HM3
PRIMARY CHARACTERISTICS
Package
D2PAK (TO-263AB), TO-262AA
IF(AV)
30 A
The device is also intended for use as a freewheeling diode
in power supplies and other power switching applications.
VR
600 V
VF at IF
1.15 V
APPLICATIONS
trr (typ.)
30 ns
TJ max.
175 °C
Circuit configuration
Single
AC/DC SMPS 70 W to 400 W
e.g. laptop and printer AC adaptors, desktop PC, TV and
monitor, games units, and DVD AC/DC power supplies.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
MAX.
UNITS
600
V
Repetitive peak reverse voltage
VRRM
Average rectified forward current
IF(AV)
TC = 113 °C
30
Non-repetitive peak surge current
IFSM
TC = 25 °C
200
Operating junction and storage temperatures
TJ, TStg
A
-65 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
Forward voltage
SYMBOL
VBR,
VR
VF
TEST CONDITIONS
IR = 100 μA
IF = 30 A
MIN.
TYP.
MAX.
600
-
-
-
1.4
2.0
1.35
IF = 30 A, TJ = 150 °C
-
1.15
VR = VR rated
-
0.02
30
TJ = 150 °C, VR = VR rated
-
30
250
UNITS
V
Reverse leakage current
IR
Junction capacitance
CT
VR = 600 V
-
20
-
pF
Series inductance
LS
Measured lead to lead 5 mm from package body
-
8.0
-
nH
μA
Revision: 03-Jul-2020
Document Number: 94702
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
IF = 1 A, dIF/dt = 50 A/μs, VR = 30 V
-
30
45
TJ = 25 °C
-
45
-
TJ = 125 °C
-
100
-
-
5.6
-
-
10
-
-
127
-
-
580
-
MIN.
TYP.
MAX.
UNITS
TJ, TStg
-65
-
175
°C
Thermal resistance,
junction-to-case
RthJC
-
0.95
1.4
°C/W
Thermal resistance,
junction-to-ambient
RthJA
Typical socket mount
-
-
70
Thermal resistance,
case-to-heatsink
RthCS
Mounting surface, flat, smooth and
greased
-
0.5
-
-
2.0
-
g
-
0.07
-
oz.
6
(5)
-
12
(10)
kgf · cm
(lbf · in)
Reverse recovery time
trr
Peak recovery current
TJ = 25 °C
IRRM
Reverse recovery charge
TEST CONDITIONS
TJ = 125 °C
TJ = 25 °C
Qrr
IF = 30 A
dIF/dt = 200 A/μs
VR = 200 V
TJ = 125 °C
UNITS
ns
A
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
Weight
Mounting torque
Case style D2PAK (TO-263AB)
ETU3006SH
Case style TO-262AA
ETU3006-1H
1000
1000
100
IR - Reverse Current (μA)
IF - Instantaneous Forward Current (A)
Marking device
TJ = 175 °C
TJ = 150 °C
10
TJ = 25 °C
175°C
100
150°C
10
125°C
100°C
1
75°C
0.1
50°C
25°C
0.01
0.001
1
0.0
0.5
1.0
1.5
2.0
2.5
0
100
200
300
400
500
600
VFM - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
Revision: 03-Jul-2020
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www.vishay.com
Vishay Semiconductors
CT - Capacitance (pF)
1000
100
10
1
0
100
200
300
400
500
600
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Thermal Impedance ZthJC (°C/W)
ZthJC - Thermal Impedance (°C/W)
10
D = 0.5
D = 0.2
D = 0.1
1
D = 0.05
D = 0.02
D = 0.01
0.1
0.01
1E-05
Single Pulse
(Thermal Resistance)
1E-04
1E-03
1E-02
1E-0
1E+00
t1 - Rectangular Pulse Duration (s)
60
180
170
Average Power Loss (W)
Allowable Case Temperature (°C)
Fig. 4 - Max. Thermal Impedance ZthJC Characteristics
160
150
140
130
DC
120
110
100
90
RMS Limit
50
40
D = 0.01
D = 0.02
D = 0.05
D = 0.1
D = 0.2
D = 0.5
DC
30
20
10
0
0
5
10
15
20
25
30
35
40
45
IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
0
5
10
15
20
25
30
35
40
45
IF(AV) - Average Forward Current (A)
Fig. 6 - Forward Power Loss Characteristics
Revision: 03-Jul-2020
Document Number: 94702
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Vishay Semiconductors
130
1800
120
110
1600
100
1400
IF = 30 A, 125 °C
1200
80
trr (nC)
trr (ns)
90
70
60
800
IF = 30 A, 25 °C
50
IF = 30 A, 125 °C
1000
600
40
400
30
20
IF = 30 A, 25 °C
200
typical value
10
100
typical value
0
100
1000
1000
dIFdt (A/μs)
dIFdt (A/μs)
Fig. 7 - Typical Reverse Recovery vs. dIF/dt
Fig. 8 - Typical Stored Charge vs. dIF/dt
VR = 200 V
0.01 Ω
L = 70 μH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Revision: 03-Jul-2020
Document Number: 94702
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
E
T
U
30
06
S
TRL
H
M3
1
2
3
4
5
6
7
8
9
10
1
-
Vishay Semiconductors product
2
-
3
-
Circuit configuration
E = single
T = TO-220
4
-
U = ultrafast recovery time
5
-
Current code (30 = 30 A)
6
-
Voltage code (06 = 600 V)
7
-
• S = D2PAK (TO-263AB)
-
• -1 = TO-262AA
-
• None = tube
-
• TRL = tape and reel (left oriented, for D2PAK (TO-263AB) package)
-
• TRR = tape and reel (right oriented, for D2PAK (TO-263AB) package)
9
-
H = AEC-Q101 qualified
10
-
Environmental digit:
8
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER TUBE
MINIMUM ORDER QUANTITY
VS-ETU3006SHM3
50
1000
PACKAGING DESCRIPTION
Antistatic plastic tube
VS-ETU3006-1HM3
50
1000
Antistatic plastic tube
VS-ETU3006STRRHM3
800
800
13" diameter reel
VS-ETU3006STRLHM3
800
800
13" diameter reel
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
Packaging information
SPICE model
D2PAK (TO-263AB)
www.vishay.com/doc?95046
TO-262AA
www.vishay.com/doc?95419
D2PAK (TO-263AB)
www.vishay.com/doc?95444
TO-262AA
www.vishay.com/doc?95443
D2PAK (TO-263AB)
www.vishay.com/doc?95032
www.vishay.com/doc?96775
Revision: 03-Jul-2020
Document Number: 94702
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
www.vishay.com
Vishay Semiconductors
D2PAK
DIMENSIONS in millimeters and inches
Conforms to JEDEC® outline D2 PAK (SMD-220)
(2)(3)
E
B
Pad layout
A
A
(E)
c2
11.00
MIN.
(0.43)
A
(3) L1
4
9.65
MIN.
(0.38)
(D1) (3)
Detail A
D
H
1
2
17.90 (0.70)
15.00 (0.625)
(2)
3
3.81
MIN.
(0.15)
L2
B
B
2.32
MIN.
(0.08)
A
2 x b2
c
2.64 (0.103)
2.41 (0.096)
(3)
E1
C
View A - A
2xb
± 0.004 M B
0.010 M A M B
Plating
Base
Metal
(4)
b1, b3
H
2x e
Gauge
plane
c1 (4)
(c)
B
0° to 8°
Seating
plane
L3
Lead tip
A1
L
(b, b2)
L4
Section B - B and C - C
Scale: None
Detail “A”
Rotated 90 °CW
Scale: 8:1
SYMBOL
MILLIMETERS
MIN.
MAX.
INCHES
MIN.
MAX.
NOTES
SYMBOL
MILLIMETERS
MIN.
MAX.
INCHES
MIN.
MAX.
NOTES
A
4.06
4.83
0.160
0.190
D1
6.86
8.00
0.270
0.315
3
A1
0.00
0.254
0.000
0.010
E
9.65
10.67
0.380
0.420
2, 3
E1
7.90
8.80
0.311
0.346
3
b
0.51
0.99
0.020
0.039
b1
0.51
0.89
0.020
0.035
b2
1.14
1.78
0.045
0.070
b3
1.14
1.73
0.045
0.068
c
0.38
0.74
0.015
0.029
c1
0.38
0.58
0.015
0.023
c2
1.14
1.65
0.045
0.065
D
8.51
9.65
0.335
0.380
4
e
2.54 BSC
0.100 BSC
H
14.61
15.88
0.575
0.625
4
L
1.78
2.79
0.070
0.110
L1
-
1.65
-
0.066
4
L2
1.27
1.78
0.050
0.070
2
L4
L3
0.25 BSC
4.78
5.28
3
0.010 BSC
0.188
0.208
Notes
(1) Dimensioning and tolerancing per ASME Y14.5 M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Datum A and B to be determined at datum plane H
(6) Controlling dimension: inch
(7) Outline conforms to JEDEC® outline TO-263AB
Revision: 08-Jul-15
Document Number: 95046
1
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Outline Dimensions
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Vishay Semiconductors
TO-262
DIMENSIONS in millimeters and inches
Modified JEDEC® outline TO-262
(Datum A) (2) (3)
E
A
A
c2
B
E
A
(3) L1
Seating
plane
D
1
2 3
C
L2
B
D1 (3)
B
C
L (2)
A
c
3 x b2
3xb
E1
A1
(3)
Section A - A
2xe
Plating
0.010 M A M B
(4)
b1, b3
Base
metal
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
Lead tip
SYMBOL
c1
c
(4)
(b, b2)
Section B - B and C - C
Scale: None
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
0.190
NOTES
A
4.06
4.83
0.160
A1
2.03
3.02
0.080
0.119
b
0.51
0.99
0.020
0.039
b1
0.51
0.89
0.020
0.035
b2
1.14
1.78
0.045
0.070
b3
1.14
1.73
0.045
0.068
c
0.38
0.74
0.015
0.029
c1
0.38
0.58
0.015
0.023
c2
1.14
1.65
0.045
0.065
D
8.51
9.65
0.335
0.380
D1
6.86
8.00
0.270
0.315
3
E
9.65
10.67
0.380
0.420
2, 3
E1
7.90
8.80
0.311
0.346
3
e
L
2.54 BSC
4
4
4
2
0.100 BSC
13.46
14.10
0.530
0.555
L1
-
L2
3.36
1.65
-
0.065
3.71
0.132
0.146
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall
not exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4)
(5)
(6)
3
Dimension b1 and c1 apply to base metal only
Controlling dimension: inches
Outline conform to JEDEC TO-262 except A1 (maximum),
b (minimum) , D1 (minimum) and L2 where dimensions derived
the actual package outline
Revision: 11-Jul-2019
Document Number: 95419
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