XC8107AD05MR-G

XC8107 Series ETR33003-006 85mΩ High Function Power Switch ■GENERAL DESCRIPTION The XC8107 series is a P-channel MOSFET power switch IC with a low ON resistance. A current limit, reverse current prevention (prevents reverse current from VOUT to VIN), soft start, thermal shutdown, and an under voltage lockout (UVLO) are incorporated as protective functions. A flag function monitors the power switch status. The flag output has N-channel open drain configuration, and it outputs Low level signal when over-current or overheating is detected, or when the reverse current prevention is operated. The voltage level which is fed to CE pin determines the status of XC8107. The logic level of CE pin is selectable between either one of active high or active low. ■FEATURES ■APPLICATIONS : 2.5V ~ 5.5V : 2A : 85mΩ@VIN=5.0V (TYP.) *USP-6C 100mΩ@VIN=5.0V (TYP.)*SOT-25 (XC8107A,B) 95mΩ@VIN=5.0V (TYP.) *SOT-25 (XC8107X,Y) : 40μA@ VIN=5.0V : 0.1μA (MAX.) : 7.5ms (TYP.) * At over-current detection : 4ms(TYP.) * At reverse voltage detection : Reverse Current Prevention Thermal Shutdown Under Voltage Lockout(UVLO） Soft-start : Flag Output CE Pin Input Logic Selectable : 2μs(TYP.) *Reference value : -40℃ ~ +105℃ : USP-6C, SOT-25(Au wire or Cu wire) : EU RoHS Compliant, Pb Free Input Voltage Maximum Output Current ON Resistance ●Set Top Boxes ●Digital TVs ●PCs ●USB Ports/USB Hubs Supply Current Stand-by Current Flag Delay Time ●HDMI Protection Circuit Functions Current Limit Response Time Operating Ambient Temperature Packages Environmentally Friendly ■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE CHARACTERISTICS XC8107xCxxxR CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 6.0 USB Port 100kΩ USB Control VIN VOUT 1.0μF 1.0μF FLG CE VSS + 120μF VBUS GND Output Voltage : VOUT [V] 0.5A type 5V Input 1.0A type 5.0 1.5A type 2.0A type 4.0 3.0 2.0 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Output Current : IOUT [A] 1/24 XC8107 Series ■BLOCK DIAGRAM XC8107 Series Reverse Current Prevention VOUT VIN CURRENT SENSE UVLO CE ON/OFF Control each circuit CURRENT LIMIT CONTROL 4ms Delay 7.5ms Delay THERMAL SHUTDOWN VSS * Diodes inside the circuit are an ESD protection diode and a parasitic diode. 2/24 FLG XC8107 Series ■PRODUCT CLASSIFICATION ●Ordering Information XC8107①②③④⑤⑥-⑦ DESIGNATOR ITEM ① CE Logic A X B Y C ② Protection Circuits Type Maximum Output Current ③④ ⑤⑥-⑦ SYMBOL Au wire Cu wire (*1) Packages DESCRIPTION Refer to Selection Guide D 05 0.5A 10 1.0A 15 1.5A 20 2.0A ER-G USP-6C (3,000pcs/Reel) (*2) MR-G SOT-25 (3,000pcs/Reel) (*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. (*2) USP - 6C package is available for the A/B Type. ●Selection Guide TYPE CE LOGIC SELECTABLE SOFT-START CURRENT LIMITTER AC, XC Active High Yes Yes AD, XD Active High Yes Yes BC, YC Active Low Yes Yes BD, YD Active Low Yes Yes TYPE UVLO FLG OUTPUT REVERSE CURRENT PREVENTION AC, XC Yes Yes Yes AD, XD Yes Yes Yes BC, YC Yes Yes Yes BD, YD Yes Yes Yes TYPE THERMAL SHUT DOWN LATCH PROTECTION AC, XC Yes No AD, XD Yes Yes BC, YC Yes No BD, YD Yes Yes 3/24 XC8107 Series ■PIN CONFIGURATION FLG 3 4 CE NC 2 5 VSS VOUT 1 6 VIN USP-6C USP-6C (BOTTOM (BOTTOM VIEW) VIEW) VOUT 1 VSS 2 FLG 3 5 VIN 4 CE SOT-25 SOT-25 (TOPVIEW) VIEW) (TOP * The dissipation pad for the USP-6C packages should be solder-plated for mounting strength and heat dissipation. Please refer to the reference mount pattern and metal masking. The dissipation pad should be connected to the VSS (No. 5) pin. ■PIN ASSIGNMENT PIN NAME PIN NAME FUNCTIONS 1 VOUT Output 2 - NC No connection 3 3 FLG Fault Report 4 4 CE ON/OFF Control 5 2 VSS Ground 6 5 VIN Power Input USP-6C SOT-25 1 ■FUNCTION PIN NAME TYPE A, X Signal STATUS H Active L Stand-by OPEN Undefined State (*1) H Stand-by L Active OPEN Undefined State (*1) CE B, Y * Avoid leaving the CE pin open; set to any fixed voltage. 4/24 XC8107 Series ■ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN -0.3 ~ +6.0 V Output Voltage VOUT -0.3 ~ +6.0 V CE Input Voltage VCE -0.3 ~ +6.0 V FLG Pin Voltage VFLG -0.3 ~ +6.0 V FLG Pin Current IFLG 15 mA Pd 120 1000 (40mm x 40mm Standard board) (*1) 1250 (JESD51-7 board) (*1) 250 600 (40mm x 40mm Standard board) (*1) 760 (JESD51-7 board) (*1) mW Operating Ambient Temperature Topr -40 ~ +105 ℃ Storage Temperature Tstg -55 ~ +125 ℃ USP-6C Power Dissipation (Ta=25℃) SOT-25 * All voltages are described based on the VSS. (*1) The power dissipation figure shown is PCB mounted and is for reference only. Please see the power dissipation page for the mounting condition. 5/24 XC8107 Series ■ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL Input Voltage VIN CONDITIONS SOT-25 (XC8107A,B) RON SOT-25 (XC8107X,Y) MAX. UNITS CIRCUIT 2.5 - 100 5.5 110 V mΩ ① VIN=3.3V (*1) VIN=5.0V (*1) VIN=3.3V (*1) - 85 115 104 135 mΩ mΩ VIN=5.0V (*1) VIN=3.3V (*1) - 100 110 120 130 mΩ mΩ ① - 95 40 115 75 mΩ μA ② ISTBY VIN=5.5V, VOUT=OPEN VCE=VSS (XC8107A,X series) VCE=VIN (XC8107B,Y series) - 0.01 1.0 μA ② ILEAK VIN=5.5V, VOUT=0V VCE=VSS (XC8107A,X series) VCE=VIN (XC8107B,Y series) - 0.01 1.0 μA ② VOUT=VIN-0.3V, XC8107xx05 series 0.81 0.90 0.99 A VOUT=VIN-0.3V, XC8107xx10 series 1.26 1.40 1.54 A VOUT=VIN-0.3V, XC8107xx15 series 1.71 1.90 2.09 A VOUT=VIN-0.3V, XC8107xx20 series 2.16 2.40 2.64 A VOUT=0V, XC8107xx05 series - 0.45 - A VOUT=0V, XC8107xx10 series - 0.70 - A VOUT=0V, XC8107xx15 series - 0.95 - A VOUT=0V, XC8107xx20 series - 1.20 - A μs ① V ① ISS Stand-by Current Switch Leakage Current Short-Circuit Current TYP. VOUT=OPEN Supply Current Current Limit MIN. USP-6C On Resistance Ta=25℃ ILIMT ISHORT VIN=5.0V (*1) ① ① VIN=5.0V, VOUT: OPEN→0V Measure from VOUT=0V to when current falls below a certain ILIM value VIN=5.5V, XC8107A,X series - 2.0 - 1.5 - 5.5 VIN=5.5V, XC8107B,Y series VIN=5.5V, XC8107A,X series - - 0.8 0.8 1.5 -0.1 - 5.5 0.1 V ① ICEH VIN=5.5V, XC8107B,Y series VIN=5.5V, VCE=5.5V μA ① CE "L" Level Current ICEL VIN=5.5V, VCE=0V -0.1 - 0.1 μA ① UVLO Detected Voltage VUVLOD VIN: 2.2V→1.7V 1.8 1.9 2.0 V ① UVLO Released Voltage VUVLOR VIN: 1.7V→2.2V 1.9 2.0 2.1 V ① UVLO Hysteresis VUHYS - - 0.1 - V ① Current Limit Circuit Response Time (*2) tCLR CE "H" Level Voltage VCEH CE "L" Level Voltage VCEL CE "H" Level Current NOTE: Unless otherwise stated, VIN=5.0V, IOUT=1mA, VCE=VIN (XC8107A, X series) or VCE=VSS (XC8107B, Y series) (*1) IOUT=0.25A (XC8107xx05 series), IOUT=0.5A (XC8107xx10 series), IOUT=0.75A (XC8107xx15series), IOUT=1.0A (XC8107xx20 series) (*2) Design reference value. This parameter is provided only for reference. 6/24 XC8107 Series ■ELECTRICAL CHARACTERISTICS (Continued) Ta=25℃ PARAMETER SYMBOL turn-on time tON turn-off time CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT RLOAD=10Ω, VCE=0V→2.2V - 0.60 1.00 ms ① tOFF RLOAD=10Ω, VCE=2.2V→0V - 0.08 0.13 ms ① FLG output FET On-resistance RFLG IFLG=10mA, VOUT=5.5V - 15 20 Ω ③ FLG output FET Leakage Current IFOFF VIN=5.5V, VFLG=5.5V, VOUT=OPEN - 0.01 0.1 μA ③ tFD1 over-current condition 6.5 7.5 8.5 ms ① tFD2 reverse-voltage condition 2.7 4.0 4.7 ms ① VOUT=5.5V VCE=5.0V (XC8107A,X series) VCE=VSS (XC8107B,Y series) - 0.1 1.0 μA ① USP-6C - 140 - - 170 - mV ① - 160 - FLG delay time N=0V, Reverse Current IREV Reverse Current Prevention Detect Voltage VREV_D VIN: 5.0V→4.7V VOUT=5.0V SOT-25 (XC8107A,B) SOT-25 (XC8107X,Y) Thermal Shutdown Detect Temperature TTSD Junction Temperature - 150 - ℃ ① Thermal Shutdown Release Temperature TTSR Junction Temperature - 130 - ℃ ① Thermal Shutdown Hysteresis Width THYS Junction Temperature - 20 - ℃ ① NOTE: Unless otherwise stated, VIN=5.0V, IOUT=1mA, VCE=VIN (XC8107A, X series) or VCE=VSS (XC8107B, Y series) ■TIMING CHART ●turn-on time, turn-off time Voltege[V] Voltege[V] VCE CE "H" Level Voltage CE "L" Level Voltage CE "L" Level Voltage CE "H" Level Voltage VCE 90% 90% 10% VOUT tON tOFF XC8107 Series, Type A, X Time[ms] 10% VOUT tON tOFF Time[ms] XC8107 Series, Type B, Y 7/24 XC8107 Series ■TEST CIRCUITS CIN=1.0μF, CL=1.0μF 1) CIRCUIT① Measurement Waveform A VOUT VIN RFLG=100kΩ Measurement Waveform A FLG IOUT VIN V CIN (ceramic) A VCE CE VOUT VSS CL (ceramic) V V 2) CIRCUIT② A VIN VOUT RFLG=100kΩ FLG CE VIN VSS 3) CIRCUIT③ VOUT VIN FLG A V VFLG CIN (ceramic) 8/24 ↓ VIN V CE VCE VOUT VSS V CL (ceramic) V XC8107 Series ■OPERATIONAL EXPLANATION The XC8107 series is a P-channel MOSFET power switch IC. The XC8107 series consists of a CE circuit, UVLO circuit, thermal shutdown circuit, current limiter circuit, reverse current prevention circuit, control block and others. The gate voltage of the power switch transistor is controlled with control block. The current limiter circuit and reverse current prevention circuit will operate based on the output voltage and output current. (See the BLOCK DIAGRAM below) Reverse Current Prevention VOUT VIN CURRENT SENSE UVLO CE ON/OFF Control each circuit CURRENT LIMIT CONTROL 4ms Delay 7.5ms Delay THERMAL SHUTDOWN FLG VSS BLOCK DIAGRAM (XC8107 Series) The voltage level which is fed to CE pin controls the status of this IC. If either “H” level or “L” level which is defined as the electrical specification is fed to CE pin, then XC8107 can operate in standard manner. However, if the middle voltage which is neither “H” level nor “L” level is fed to CE pin, the consumption current will increase due to the shoot-through current at internal circuits. Also if CE pin is open, the status of XC8107 cannot be fixed and the behavior will be unstable. For protection against heat damage of the ICs, thermal shutdown function is built in. When the internal junction temperature reaches the temperature limit, the thermal shutdown circuit operates and the power switch transistor will turn OFF. The IC resumes its operation when the thermal shutdown function is released and the IC’s operation is automatically restored because the junction temperature drops to the level of the thermal shutdown release temperature. When the thermal shutdown circuit detects higher junction temperature than the detect temperature, the voltage level of FLG pin is low level. When the thermal shutdown circuit detects lower junction temperature than the release temperature, the thermal shutdown function is released and the voltage level of FLG pin is high level. When the VIN pin voltage goes down to lower voltage than UVLO detected voltage, the power switch transistor turns OFF by UVLO function in order to prevent false output caused by unstable operation of the internal circuitry. When the VIN pin voltage goes up to higher voltage than UVLO released voltage, the UVLO function is released and the power switch transistor can turn ON. The soft-start circuit can reduce the in-rush current charged on the output capacitor when IC starts up. Additionally, due to the reduction of the in-rush current, the circuit can reduce the fluctuation of the input voltage as well. The soft-start time is optimized internally and defined as turn-on time. (TYP: 0.6ms) 9/24 XC8107 Series ■OPERATIONAL EXPLANATION (Continued) When the output current reaches the current limit value, the constant current limiter circuit activates and as a result, the output voltage goes down. If the short circuit comes at the VOUT pin, the output current is limited to the current which is specified as the short-circuit current value. If the over-current state lasts for 7.5ms (TYP.), the FLG pin changes to Low level output. Two types are available for the current limiter circuit: an auto recovery type (product type C) and a latch off type (product type D). After the current limiter circuit activates and the FLG pin outputs low level, the operation is different between these two types. The auto recovery type continuously limits the output current by the current limit value. When the over-current status finishes and the status of that the output current is less than the current limit value continues for 7.5ms (TYP.) or more, the voltage of FLG pin goes up “H” level again. The latch off type turns off the power switch transistor after the FLG pin outputs Low level. The off state is maintained regardless of whether the over-current state is released. Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below the UVLO detected voltage once and after that raising it higher than UVLO released voltage. An internal circuit is built in that prevents reverse current from the VOUT pin to the VIN pin. When the difference between input voltage and VOUT pin voltage is higher than the detect voltage set internally, the reverse current prevention circuit activates, and the power switch transistor turns off, then the reverse current from the VOUT pin to the VIN pin is reduced to 0.1μA (TYP.). If the reverse-voltage state lasts for 4ms (TYP.), the FLG pin changes to Low level output. Two types are available for the reverse current prevention circuit: the auto recovery type (product type C) and the latch off type (product type D). After the reverse current prevention circuit activates and the FLG pin outputs low level, the operation is different between these two types. On the auto recovery type, when the output voltage drops below the input voltage, the reverse current prevention circuit stops immediately, and the power switch transistor turns on again. If the output voltage remains lower than the input voltage for 4ms (TYP.), the FLG pin returns to High level output. On the latch off type, the power switch transistor remains in the off state even if the reverse voltage state is released. Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below the UVLO detected voltage once and after that raising it higher than UVLO released voltage. 10/24 XC8107 Series ■OPERATIONAL EXPLANATION (Continued) The flag circuit is built in which monitors the state of the power switch. The FLG pin outputs Low level when the reverse current prevention function is operating. A resistance of 10kΩ to 100kΩ is recommended for the FLG pin pull-up resistance. Auto recovery type (product type C) Protective function FLG pin Low level output Return to FLG pin High level output Current limiter 7.5ms after over-current detection 7.5ms after over-current release Reverse current prevention 4.0ms after reverse voltage detection 4.0ms after reverse voltage release Thermal shutdown Same time as overheat state is detected Same time as overheat state is released Protective function FLG pin Low level output Return to FLG pin High level output Current limiter 7.5ms after over-current detection When latch operation is released Reverse current prevention 4.0ms after reverse voltage detection When latch operation is released Thermal shutdown Same time as overheat state is detected Same time as overheat state is released Latch off type (product type D) 11/24 XC8107 Series ■NOTES ON USE 1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated if IC is used beyond the absolute MAX. specifications. 2. Where wiring impedance is high, operations may become unstable due to noise depending on output current. Please keep the resistance low between VIN and VSS wiring in particular. 3. Please place the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible. For the input or output capacitor, a capacitance of 1.0μF or higher is recommended. 4. When the voltage which is higher than the maximum input voltage is fed to the VIN pin, and VOUT is shorted to the VSS level, in this case the short circuit may cause a fatal impact to operation for the IC. Please use within the operational voltage range. 5. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. 12/24 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) UVLO detect Voltage vs. Input Voltage (2) UVLO release Voltage vs. Input Voltage XC8107xxxxxR XC8107xxxxxR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) UVLO release Voltage : UVLO [V] UVLO detect Voltage : UVLO [V] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 Ta=105℃ Ta=25℃ Ta=-40℃ 2.5 2.0 1.5 1.0 0.5 0.0 3.0 Ta=105℃ Ta=25℃ Ta=-40℃ 2.5 2.0 1.5 1.0 0.5 0.0 1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 Input Voltage : VIN [V] 1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 Input Voltage : VIN [V] (3) UVLO threshold Voltage vs. Ambient Temperature XC8107xxxxxR UVLO threshold Voltage : UVLO [V] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 2.5 2.0 1.5 1.0 UVLO detect UVLO release 0.5 0.0 -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 (4)　Stand-by Current vs. Input Voltage (5)　Stand-by Current vs. Ambient Temperature XC8107xxxxxR XC8107xxxxxR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 Ta=105℃ 2.5 Ta=25℃ Ta=-40℃ 2.0 1.5 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Stand-by Current : Istby [μA] Stand-by Current : Istby [μA] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 Istby 2.5 2.0 1.5 1.0 0.5 0.0 -50 Input Voltage : VIN [V] -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 13/24 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6)　Supply Current vs. Input Voltage（sweep up） (7)　Supply Current vs. Ambient Temperature XC8107xxxxxR XC8107xxxxxR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) Supply Current : ISS [μA] Supply Current : ISS [μA] VIN=5.0V, CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 50 45 40 35 30 25 20 15 10 5 0 Ta=105℃ Ta=25℃ Ta=-40℃ 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 50 45 40 35 30 25 20 15 10 5 0 -50 Input Voltage : VIN [V] (8)　CE "H" Level Voltage vs. Input Voltage VIN=5.0V -25 0 25 50 75 100 Ambient Temperature : Ta [℃] (9)　CE "L" Level Voltage vs. Input Voltage XC8107xxxxxR XC8107xxxxxR 2.5 2.0 1.5 Ta=105℃ Ta=25℃ 0.5 Ta=-40℃ 0.0 0.0 0.5 1.0 1.5 2.0 Input Voltage : VIN [V] 2.5 (10)　CE threshold Voltage vs. Ambient Temperature XC8107xxxxxR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) CE threshold Voltage : VCE [V] 3.0 CE"H"Level 2.5 CE"L"Level 2.0 1.5 1.0 0.5 0.0 -50 14/24 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) CE "L" Level Voltage : VCEL [V] CE "H" Level Voltage : VCEH [V] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 1.0 125 125 3.0 2.5 2.0 1.5 1.0 Ta=105℃ Ta=25℃ 0.5 Ta=-40℃ 0.0 0.0 0.5 1.0 1.5 2.0 Input Voltage : VIN [V] 2.5 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (11)　On Resistance vs. Input Voltage (USP-6C) (12)　On Resistance vs. Ambient Temperature (USP-6C) XC8107xxxxER XC8107xxxxER CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic) On Resistance : Ron [mΩ] On Resistance : Ron [mΩ] CIN =1.0μF(ceramic), CL=1.0μF(ceramic) 180 160 140 120 100 80 60 40 20 0 2.0 Ta=105℃ Ta=25℃ Ta=-40℃ 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : V IN [V] 5.5 180 160 140 120 100 80 60 40 20 0 VIN=4.5V VIN=5.0V VIN=5.5V -50 6.0 (13)　On Resistance vs. Input Voltage (SOT-25:XC8107A,B) VIN=2.5V VIN=3.5V -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 (14)　On Resistance vs. Ambient Temperature (SOT-25:XC8107A,B) XC8107xxxxMR XC8107xxxxMR CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic) On Resistance : Ron [mΩ] On Resistance : Ron [mΩ] CIN =1.0μF(ceramic), CL=1.0μF(ceramic) 180 160 140 120 100 80 60 40 20 0 2.0 Ta=105℃ Ta=25℃ Ta=-40℃ 2.5 3.0 3.5 4.0 4.5 Input Voltage : V IN [V] 5.0 5.5 180 160 140 120 100 80 60 40 20 0 -50 6.0 (15)　On Resistance vs. Input Voltage (SOT-25:XC8107X,Y) VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 (16)　On Resistance vs. Ambient Temperature (SOT-25:XC8107X,Y) XC8107xxxxMR XC8107xxxxMR Ta=105℃ Ta=25℃ Ta=-40℃ 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : V IN [V] 5.5 CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic) On Resistance : Ron [mΩ] On Resistance : Ron [mΩ] CIN =1.0μF(ceramic), CL=1.0μF(ceramic) 180 160 140 120 100 80 60 40 20 0 2.0 6.0 180 160 140 120 100 80 60 40 20 0 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 15/24 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (17)　turn-on time vs. Input Voltage (18)　turn-on time vs. Ambient Temperature XC8107xxxxxR XC8107xxxxxR 0.7 0.6 0.6 turn-on time : tDLY(ON) [ms] turn-on time : tDLY(ON) [ms] CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic) 0.7 0.5 0.4 0.3 0.2 Ta=105℃ Ta=25℃ Ta=-40℃ 0.1 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : V IN [V] 5.5 0.5 0.4 0.3 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V 0.2 0.1 0.0 6.0 (19)　turn-off time vs. Input Voltage CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic) -50 -25 turn-off time : tDLY(OFF) [ms] turn-off time : tDLY(OFF) [ms] XC8107xxxxxR 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 Ta=105℃ Ta=25℃ Ta=-40℃ 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : V IN [V] 5.5 6.0 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V -50 -25 0 25 50 (22)　FLG delay time reverse-voltage vs. Ambient Temperature vs. Ambient Temperature VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V -25 0 25 50 75 Ambient Temperature : Ta [℃] 16/24 100 125 XC8107xxxxxR CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic) 100 125 FLG reverse-voltage : tFD [ms] FLG over-current : tFD [ms] XC8107xxxxxR -50 75 Ambient Temperature : Ta [℃] (21)　FLG delay time over-current 9.0 8.5 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5 4.0 125 (20)　turn-off time vs. Ambient Temperature XC8107xxxxxR 2.0 0 25 50 75 100 Ambient Temperature : Ta [℃] CIN =1.0μF(ceramic), CL=1.0μF(ceramic) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V -50 -25 0 25 50 75 Ambient Temperature : Ta [℃] 100 125 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (23)　Output Voltage vs. Output Current XC8107xCxxxR 0.5A 1.0A 1.5A 2.0A 3.0 2.0 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Output Current : IOUT [A] 3.5 4.0 (24)　turn-on Delay vs. Rise Time (CL=1.0μF) 4.0 3.0 2.0 1.0 If the over-current state lasts for 7.5ms, the latch off type turns off the power switch transistor. 0.0 0.0 4.0 3.5 8.0 3.0 6.0 2.5 2.0 Output Voltage 0.0 2.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 Supply Current -8.0 0.0 Voltage : [V] CE Input Voltage 2.0 -6.0 2.5 2.0 2.0 0.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 0.0 Supply Current -8.0 -0.5 Time [500μs/div] 8.0 3.5 Supply Current 0.0 -0.5 VCE= 5.0V→0V, tf= 5μs, RL= 10Ω, Ta= 25℃ VIN =5.0V, CIN = 1.0μF, CL= 120μF(ceramic) 6.0 Voltage : [V] Output Voltage 0.5 XC8107xx10xR 3.0 CE Input Voltage 1.0 (27)　turn-oｆｆ Delay vs. Fall Time (CL=120μF) Supply Current : Isupply [A] Voltage : [V] 4.0 4.0 Time [100μs/div] XC8107xx10xR 6.0 1.5 CE Input Voltage -8.0 -0.5 2.5 2.0 0.0 -2.0 3.5 3.0 Output Voltage -4.0 (26)　turn-on Delay vs. Rise Time (CL=120μF) 8.0 3.5 VCE= 5.0V→0V, tf= 5μs, RL= 10Ω, Ta= 25℃ VIN =5.0V, CIN =CL= 1.0μF(ceramic) 4.0 Time [100μs/div] VCE= 0V→5.0V, tr= 5μs, RL= 10Ω, Ta= 25℃ VIN =5.0V, CIN = 1.0μF, CL= 120μF(ceramic) 1.0 1.5 2.0 2.5 3.0 Output Current : IOUT [A] XC8107xx10xR Supply Current : Isupply [A] Voltage : [V] 6.0 VCE= 0V→5.0V, tr= 5μs, RL= 10Ω, Ta= 25℃ VIN =5.0V, CIN =CL= 1.0μF(ceramic) 0.5 (25)　turn-oｆｆ Delay vs. Fall Time (CL=1.0μF) XC8107xx10xR 8.0 type type type type Supply Current : Isupply [A] 4.0 0.5A 1.0A 1.5A 2.0A 5.0 3.0 4.0 2.5 Output Voltage 2.0 2.0 1.5 0.0 -2.0 3.5 CE Input Voltage -4.0 1.0 0.5 -6.0 0.0 Supply Current : Isupply [A] 5.0 CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic) 6.0 type type type type Output Voltage : V OUT [V] 6.0 Output Voltage : V OUT [V] XC8107xDxxxR CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic) Supply Current -8.0 -0.5 Time [500μs/div] 17/24 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (28)　Short Circuit Current, Device Enabled Into Short XC8107xx10xR XC8107xx10xR VCE= 0V→5.0V, tr= 5μs, Ta= 25℃ VIN =5.0V, CIN =CL= 1.0μF(ceramic) 3.0 4.0 2.5 2.0 2.0 0.0 1.5 Output Voltage -2.0 1.0 -4.0 0.5 Supply Current 2.5 2.0 2.0 0.0 XC8107xC10xR 2.5 2.0 0.0 1.5 Output Voltage 1.0 0.5 Supply Current -6.0 0.0 -0.5 Time [2ms/div] Voltage : [V] FLG Voltage 6.0 Supply Current : Isupply [A] Voltage : [V] 3.0 2.0 -8.0 8.0 3.5 VOUT = Short circuit to Vss 6.0 -4.0 4.0 0.0 -8.0 18/24 1.5 1.0 0.5 Time [2ms/div] 0.5 Supply Current 0.0 -0.5 Time [2ms/div] 0.0 -0.5 VIN = 5.0V, tr= 100μs, Ta= 25℃ FLG= 100kΩ, CIN =CL= 1.0μF(ceramic) 3.5 VOUT = Removed Short circuit Voltage : [V] 2.5 2.0 Supply Current 1.0 6.0 Supply Current : Isupply [A] Voltage : [V] -8.0 3.0 FLG Voltage -4.0 -6.0 8.0 3.5 VOUT = Short circuit to Vss Output Voltage 1.5 XC8107xC10xR 8.0 0.0 2.0 FLG Voltage -6.0 VIN = 5.0V, tf= 100μs, Ta= 25℃ FLG= 100kΩ, CIN =CL= 1.0μF(ceramic) -2.0 2.5 Output Voltage -2.0 -4.0 3.5 3.0 2.0 XC8107xC10xR 2.0 VOUT = Removed Short circuit (VOUT=short→open, CL=1.0μF) (VOUT=open→short, CL=1.0μF) 4.0 VIN = 5.0V, tr= 100μs, Ta= 25℃ FLG= 100kΩ, CIN =CL= 1.0μF(ceramic) （32）　Short-Curcuit Transient Response （31）　Short-Curcuit Transient Response 6.0 -0.5 Time [40μs/div] (VOUT=short→5.0Ω, CL=1.0μF) VIN = 5.0V, tf= 100μs, Ta= 25℃ FLG= 100kΩ, CIN =CL= 1.0μF(ceramic) -2.0 0.0 -6.0 XC8107xC10xR 4.0 0.5 Supply Current （30）　Short-Curcuit Transient Response (VOUT=5.0Ω→short, CL=1.0μF) 8.0 1.5 1.0 -4.0 -8.0 （29）　Short-Curcuit Transient Response Output Voltage -2.0 -0.5 Time [40μs/div] 3.0 4.0 Supply Current : Isupply [A] -8.0 0.0 6.0 4.0 3.0 2.5 Output Voltage 2.0 FLG Voltage 2.0 0.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 -8.0 Supply Current Time [2ms/div] 0.0 -0.5 Supply Current : Isupply [A] -6.0 3.5 Supply Current : Isupply [A] CE Input Voltage Voltage : [V] 6.0 VCE= 5.0V→0V, tf= 5μs, Ta= 25℃ VIN =5.0V, CIN = 1.0μF, CL= 120μF(ceramic) CE Input Voltage 3.5 Supply Current : Isupply [A] Voltage : [V] 8.0 8.0 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （33）　Short-Curcuit Transient Response （34）　Short-Curcuit Transient Response (VOUT=5.0Ω→short, CL=120μF) (VOUT=short→5.0Ω, CL=120μF) XC8107xC10xR VIN = 5.0V, tf= 100μs, Ta= 25℃ FLG= 100kΩ, CIN = 1.0μF, CL= 120μF(ceramic) 3.0 4.0 FLG Voltage 2.0 2.5 2.0 0.0 1.5 Output Voltage -2.0 1.0 -4.0 0.5 Supply Current -6.0 Time [2ms/div] 4.0 1.5 1.0 Supply Current -8.0 0.0 -0.5 Time [2ms/div] （36）　Short-Curcuit Transient Response XC8107xC10xR VOUT = Short circuit to Vss 3.5 3.0 FLG Voltage 2.5 2.0 Output Voltage 1.5 -2.0 1.0 -4.0 8.0 0.5 6.0 Voltage : [V] VIN = 5.0V, tf= 100μs, Ta= 25℃ FLG= 100kΩ, CIN = 1.0μF, CL= 120μF(ceramic) Supply Current : Isupply [A] Voltage : [V] 0.5 -4.0 -0.5 0.0 -6.0 2.0 (VOUT=short→open, CL=120μF) 4.0 2.0 FLG Voltage 0.0 XC8107xC10xR 6.0 2.5 -2.0 -6.0 (VOUT=open→short, CL=120μF) 8.0 3.5 3.0 Output Voltage 2.0 0.0 （35）　Short-Curcuit Transient Response VOUT = Removed Short circuit -8.0 VOUT = Removed Short circuit 2.5 Output Voltage 2.0 FLG Voltage 0.0 1.5 -2.0 1.0 -4.0 0.5 0.0 Supply Current -8.0 -0.5 3.5 3.0 2.0 -6.0 0.0 Supply Current 4.0 VIN = 5.0V, tr= 100μs, Ta= 25℃ FLG= 100kΩ, CIN = 1.0μF, CL= 120μF(ceramic) Time [2ms/div] Supply Current : Isupply [A] -8.0 6.0 Voltage : [V] Voltage : [V] 6.0 8.0 3.5 VOUT = Short circuit to Vss Supply Current : Isupply [A] 8.0 VIN = 5.0V, tr= 100μs, Ta= 25℃ FLG= 100kΩ, CIN = 1.0μF, CL= 120μF(ceramic) Supply Current : Isupply [A] XC8107xC10xR -0.5 Time [2ms/div] (37)　UVLO Transient Response (CL=1.0μF) Voltage : [V] 6.0 4.0 2.0 3.0 Input Voltage 2.5 Output Voltage 0.0 1.0 -4.0 -6.0 2.0 1.5 -2.0 0.5 Supply Current -8.0 0.0 -0.5 Time [500μs/div] 8.0 3.5 6.0 Voltage : [V] 8.0 XC8107xxxxxR Supply Current : Isupply [A] VIN = 0V→5.0V, tr= 3ms, Ta= 25℃ RL= 5Ω, CIN =CL= 1.0μF(ceramic) VIN = 5.0V→0V, tf= 3ms, Ta= 25℃ RL= 5Ω, CIN =CL= 1.0μF(ceramic) 3.5 3.0 Input Voltage 4.0 2.5 2.0 2.0 0.0 -2.0 1.5 Output Voltage -4.0 -6.0 1.0 0.5 Supply Current -8.0 0.0 Supply Current : Isupply [A] XC8107xxxxxR -0.5 Time [500μs/div] 19/24 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (38)　UVLO Transient Response (CL=120μF) 8.0 3.0 6.0 4.0 2.5 2.0 2.0 0.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 Supply Current -8.0 0.0 2.5 2.0 2.0 -6.0 8.0 5.0 6.0 0.0 -2.0 2.0 1.0 -4.0 0.0 Supply Current -6.0 -1.0 -8.0 -2.0 Voltage : [V] 6.0 3.0 FLG Voltage 4.0 Input Voltage 2.0 0.0 -2.0 -6.0 -2.0 -8.0 20/24 5.0 4.0 2.0 -1.0 -2.0 Time [500μs/div] 1.0 0.0 Supply Current -6.0 -1.0 -8.0 -2.0 8.0 6.0 0.0 Supply Current 2.0 VIN =5.0V, Ta=25℃ CIN = 1.0μF, CL= 120μF(ceramic) 1.0 -4.0 3.0 XC8107xxxxxR 3.0 FLG Voltage 4.0 Output Voltage FLG Voltage -4.0 6.0 Voltage : [V] Output Voltage 5.0 Input Voltage (42)　Reverse Voltage Released Voltage (CL=120μF) Supply Current : Isupply [A] Voltage : [V] 4.0 VOUT=5.5V forced 6.0 VOUT = 5.5V Removed 0.0 XC8107xxxxxR 6.0 VIN =5.0V, RL= 5Ω, Ta= 25℃ CIN =CL= 1.0μF(ceramic) Time [500μs/div] (41)　Reverse Voltage Detected Voltage (CL=120μF) 8.0 -0.5 2.0 Time [500μs/div] VIN =5.0V, Ta=25℃ CIN = 1.0μF, CL= 120μF(ceramic) 0.0 Supply Current XC8107xxxxxR 4.0 Input Voltage 2.0 0.5 (40)　Reverse Voltage Released Voltage (CL=1.0μF) Supply Current : Isupply [A] Voltage : [V] 4.0 Output Voltage 1.0 Time [500μs/div] XC8107xxxxxR VOUT=5.5V forced Input Voltage -8.0 (39)　Reverse Voltage Detected Voltage (CL=1.0μF) 6.0 1.5 0.0 -2.0 Time [500μs/div] 8.0 3.0 Output Voltage 4.0 -4.0 -0.5 VIN =5.0V, RL= 5Ω, Ta= 25℃ CIN =CL= 1.0μF(ceramic) 3.5 Supply Current : Isupply [A] Output Voltage VIN = 5.0V→0V, tf= 3ms, Ta= 25℃ RL= 5Ω, CIN = 1.0μF, CL= 120μF(ceramic) 4.0 2.0 6.0 VOUT = 5.5V Removed Input Voltage Output Voltage FLG Voltage 5.0 4.0 3.0 0.0 2.0 -2.0 1.0 -4.0 0.0 Supply Current -6.0 -1.0 -8.0 -2.0 Time [500μs/div] Supply Current : Isupply [A] Input Voltage 3.5 Voltage : [V] Voltage : [V] 6.0 XC8107xxxxxR Supply Current : Isupply [A] 8.0 VIN = 0V→5.0V, tr= 3ms, Ta= 25℃ RL= 5Ω, CIN = 1.0μF, CL= 120μF(ceramic) Supply Current : Isupply [A] XC8107xxxxxR XC8107 Series ■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （43）　CE Transient Response XC8107xxxxxR XC8107xxxxxR 0.030 4.0 0.025 2.0 0.020 0.0 0.5A type 1.0A type -2.0 1.5A type -4.0 -6.0 -8.0 2.0A type In Rush Current Time [500μs/div] 0.015 0.010 0.005 0.000 8.0 Voltage : [V] 6.0 0.035 CE Voltage In Rush Current : IRUSH [A] Voltage : [V] 8.0 3.5 CE Voltage 6.0 4.0 2.5 2.0 2.0 0.0 0.5A 1.0A 1.5A 2.0A -2.0 -4.0 1.5 1.0 0.5 0.0 In Rush Current -8.0 -0.5 Time [500μs/div] (45)　Current Limit adapted time XC8107xx10xR 14.0 12.0 10.0 4.0 2.0 8.0 Output Voltage 0.0 6.0 -2.0 4.0 -4.0 2.0 In Rush Current -6.0 0.0 -8.0 -2.0 Time [2μs/div] VIN =5.0V, Ta=25℃ CL=open Current Limit Response : [μs] VOUT = Short circuit to Vss XC8107xx10xR In Rush Current : [A] VIN =5.0V, Ta=25℃ CL=open 8.0 Voltage : [V] type type type type -6.0 -0.005 (44)　Short Applied 6.0 3.0 In Rush Current : IRUSH [A] VCE= 0→5.0V, tr= 5μs, Ta= 25℃ VIN =5.0V, CIN = 1.0μF, CL= 120μF(ceramic) VCE= 0→5.0V, tr= 5μs, Ta= 25℃ VIN =5.0V, CIN =CL= 1.0μF(ceramic) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0.0 1.0 2.0 3.0 4.0 5.0 Peak Limit Current [A] 6.0 21/24 XC8107 Series ■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLINE / LAND PATTERN SOT-25 SOT-25 PKG THERMAL CHARACTERISTICS Standard Board SOT-25 Power Dissipation JESD51-7 Board Standard Board USP-6C USP-6C PKG USP-6C Power Dissipation JESD51-7 Board 22/24 XC8107 Series ■MARKING RULE ●SOT-25(Au Wire) / USP-6C(Au Wire) / SOT-25(Cu Wire) ① SOT-25 SOT-25 5 ① represents products series 4 ② ③ ④ ② ⑤ 2 PRODUCT SERIES Z XC8107******-G represents product type MARK 1 MARK Wire Type 1 3 2 3 USP-6C Active High Au Active Low 4 R ③ ⑤ 3 ② ④ 2 ① 1 S 6 T 5 CE LOGIC Active High Cu Active Low U Protection Circuits PRODUCT SERIES Auto-recovery XC8107AC****-G Latch-off XC8107AD****-G Auto-recovery XC8107BC****-G Latch-off XC8107BD****-G Auto-recovery XC8107XC****-G Latch-off XC8107XD****-G Auto-recovery XC8107YC****-G Latch-off XC8107YD****G 4 ③ represents maximum output current MARK CURRENT PRODUCT SERIES 1 2 0.5 1.0 XC8107**05**-G XC8107**10**-G 3 1.5 XC8107**15**-G 4 2.0 XC8107**20**-G ④⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 23/24 XC8107 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 24/24