XC9264A75DMR-G

XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ETR05047-007 18V Operation 0.5A Synchronous Step-Down DC/DC Converters ■GENERAL DESCRIPTION The XC9263/XC9264 series are 18V operation synchronous step-down DC/DC converter ICs with a built-in high-side / low-side driver transistor. The XC9263/XC9264 series has operating voltage range of 3.0V~18.0V and it can support 500mA as an output current with high-efficiency. Compatible with Low ESR capacitors such as ceramic capacitors for the load capacitor (CL). 0.75V reference voltage source is incorporated in the IC, and the output voltage can be set to a value from 1.0V to 15.0V using external resistors (RFB1, RFB2). 500kHz or 1.2MHz or 2.2MHz can be selected for the switching frequency. In PWM/PFM automatic switchover control, IC can change the control method between PWM and PFM based on the output current requirement and as a result IC can achieve high efficiency over the full load range. XC9263/64 has a fixed internal soft start time which is 1.0ms (TYP.), additionally the time can be extended by using an external resistor and capacitor. With the built-in UVLO function, the driver transistor is forced OFF when input voltage goes down to 2.7V or lower. The output state can be monitored using the power good function. Over current protection and thermal shutdown are embedded and they secure a safety operation. ■FEATURES ■APPLICATIONS ● Hot water supply system ● Recorders, Camcorders ● Refrigerators, Air-conditioners ● Low Power Systems Input Voltage Range : 3.0 ~ 18V (Absolute Max 20V) FB Voltage : 0.75V±1.5% Oscillation Frequency : 500kHz, 1.2MHz, 2.2MHz Output Current : 500mA Control Methods : PWM/PFM Auto Efficiency 85%@12V→5V, 1mA PWM control Soft-start Time : Adjustable by RC Protection Circuits : Over Current Protection Automatic Recovery (B Type) Integral Latch Method (A Type) Thermal Shutdown Output Capacitor : Ceramic Capacitor Package : SOT-25 (No Power good) USP-6C (With Power Good) Environmentally Friendly ■TYPICAL APPLICATION CIRCUIT : EU RoHS Compliant, Pb Free ■TYPICAL PERFORMANCE CHARACTERISTICS XC9264x75C (V IN=12V, V OUT =5V, fOSC=1200kHz) L L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), Lx CIN CFB EN/SS 90 FB CL RFB2 RPG GN D PG CL=10μF×2 (GRM188R61E106MA73) 100 RFB1 Efficiency :EFFI[%] VIN 80 70 60 50 40 30 20 XC9264x75C 10 0 0.1 1 10 100 Output Current :IOUT[mA] 1/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■BLOCK DIAGRAM VIN Current SENSE LocalReg EN/SS Chip Enable each circuit Thermal Shutdown Current Limit PFM High Side Buffer Operation Enable Lx Low Side Buffer each circuit + + Err Amp FB Current Limit Gate CLAMP Under Voltage Lock Out Vref Soft Start Current feed back PWM Comparator - PWM/PFM ControlLOGIC - GND OSC Ramp Wave PG(USP-6C Package Only) + PowerGood Comparator *Diodes inside the circuit are an ESD protection diodes and a parasitic diodes. 2/30 XC9263/XC9264 XC9263/XC9264 Series is Not Recommended for New Designs. Series ■PRODUCT CLASSIFICATION ●Ordering Information XC9263①②③④⑤⑥-⑦(*1) XC9264①②③④⑤⑥-⑦(*1) PWM control PWM/PFM Auto DESIGNATOR ITEM ① Type ②③ FB Voltage SYMBOL A Refer to Selection Guide B Oscillation Frequency ④ 75 Output voltage can be adjusted in 1V to 15V 5 500kHz C 1.2MHz D ⑤⑥-⑦ (*1) Packages (Order Unit) DESCRIPTION 2.2MHz MR-G (*1) SOT-25 (3,000pcs/Reel) ER-G(*1) USP-6C (3,000pcs/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. ●Selection Guide FUNCTION A TYPE B TYPE SOT-25 USP-6C SOT-25 USP-6C Chip Enable Yes Yes Yes Yes UVLO Yes Yes Yes Yes Thermal Shutdown Yes Yes Yes Yes Soft Start Yes Yes Yes Yes Power-Good - Yes - Yes - Yes Yes Yes - - Current Limiter (Automatic Recovery) Current Limiter Yes (Latch Protection (*2) ) (*2) The over-current protection latch is an integral latch type. 3/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■PIN CONFIGURATION Lx FB 5 4 1 2 3 VIN GND EN/SS VIN 6 1 Lx EN/SS 5 2 GND PG 4 3 FB USP-6C (BOTTOM VIEW) SOT-25 (TOP VIEW) * The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the GND (No. 2) pin. ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTION 6 VIN Power Input 3 5 EN/SS Enable Soft-start - 4 PG Power good Output 4 3 FB Output Voltage Sense 2 2 GND Ground 5 1 Lx Switching Output SOT-25 USP-6C 1 4/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■FUNCTION CHART PIN NAME EN/SS (*1) SIGNAL STATUS L Stand-by H Active OPEN Undefined State(*1) Please do not leave the EN/SS pin open. Each should have a certain voltage. PIN NAME CONDITION PG SIGNAL VFB > VPGDET H (High impedance) VFB ≦ VPGDET L (Low impedance) EN/SS = H Thermal Shutdown L (Low impedance) EN/SS = L UVLO (VIN < VUVLO1) Stand-by Undefined State L (Low impedance) ■ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNITS VIN Pin Voltage VIN -0.3 ~ 20 V EN/SS Pin Voltage VEN/SS -0.3 ~ 20 V FB Pin Voltage VFB -0.3 ~ 6.2 V PG Pin Voltage (*1) VPG -0.3 ~ 6.2 V PG Pin Current (*1) IPG 8 Lx Pin Voltage VLx Lx Pin Current ILx -0.3 ~ VIN + 0.3 or 20 mA (*2) 1800 V mA 250 Power Dissipation (Ta=25℃) 600 (40mm x 40mm Standard board) (*3) SOT-25 760 (JESD51-7 Board) (*3) Pd USP-6C 120 mW 1000 (40mm x 40mm Standard board) (*3) 1250 (JESD51-7 Board) (*3) Operating Ambient Temperature Topr -40 ~ 105 ℃ Storage Temperature Tstg -55 ~ 125 ℃ * All voltages are described based on the GND pin. (*1) For the USP-6C Package only. (*2) The maximum value should be either VIN+0.3V or 20V in the lowest. (*3) The power dissipation figure shown is PCB mounted and is for reference only. Please refer to PACKAGING INFORMATION for the mounting condition. 5/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■ELECTRICAL CHARACTERISTICS Ta=25℃ PARAMETER SYMBOL FB Voltage VFB Output Voltage Setting Range(*1) VOUTSET Operating Voltage Range VIN UVLO Detect Voltage VUVLO1 CONDITIONS MIN TYP MAX UNIT CIRCUIT 0.739 0.750 0.761 V ② - 1 - 15 V - - 3 - 18 V - 2.60 2.70 2.80 V ② 2.70 2.80 2.90 V ② VFB=0.739V → 0.761V VFB Voltage when Lx pin oscillates VIN:2.8V→2.6V, VFB=0.675V VIN Voltage when Lx pin voltage changes from "H" level to "L" level VIN:2.7V→2.9V, VFB=0.675V UVLO Release Voltage VUVLO2 VIN Voltage when Lx pin voltage changes from "L" level to "H" level Quiescent Current Stand-by Current Oscillation Frequency Iq ISTB fOSC VFB=0.825V XC9264x755 - 11.5 16.5 μA ④ XC9264x75C - 12.5 17.5 μA ④ XC9264x75D - 13.5 18.5 μA ④ - 1.65 2.5 μA ⑤ XC926xx755 458 500 542 kHz ① XC926xx75C 1098 1200 1302 kHz ① XC926xx75D 2013 2200 2387 kHz ① VEN/SS=0V Connected to external components、 IOUT=100mA Minimum Duty Cycle DMIN VFB=0.825V - - 0 % ② Maximum Duty Cycle DMAX VFB=0.675V 100 - - % ② Lx SW "H" On Resistance RLxH VFB=0.675V, ILX=200mA Lx SW "L" On Resistance RLxL VFB=0.825V, ILX=200mA PFM Switch Current High-side Current Limit (*3) IPFM ILIMH Latch Time tLAT Internal Soft-Start Time tSS1 External Soft-Start Time tSS2 Connected to external components、 IOUT=1mA USP-6C - 0.95 1.10 Ω ② SOT-25 - 0.99 1.14 Ω ② USP-6C - 0.69(*2) - Ω ② 0.73 ② SOT-25 - - Ω XC9264x755 - 380 - mA XC9264x75C - 420 - mA XC9264x75D - 370 - mA 920 1100 - mA ② 0.5 1.0 1.7 ms ⑥ 0.5 1.0 1.7 ms ② 17 26 35 ms ③ 0.638 0.675 0.712 V ② - - 0.3 V ② - 85 - % ① - ±100 - ppm/℃ ② VFB=0.675V Type A only, Connected to external components、 VFB=0V VEN/SS=0V→12V,VFB=0.675V Time until Lx pin oscillates (*2) ① VEN/SS=0V→12V,VFB=0.675V RSS=430KΩ,CSS=0.47μF Time until Lx pin oscillates VFB=0.712V→0.638V、RPG:100kΩ pull-up to 5V PG Detect Voltage(*4) VPGDET VFB Voltage when PG pin voltage changes from "H" level to "L" level PG Output Voltage(*4) VPG Efficiency (*5) EFFI FB Voltage ΔVFB/ Temperature Characteristics (ΔTopr・VFB) VFB=0.6V, IPG=1mA Connected to external components、 VOUT=5V, IOUT=1mA -40℃≦Ta≦105℃ Test Condition: Unless otherwise stated, VIN=12V, VEN/SS=12V (*1) : Please use within the range of VOUT/VIN≧0.12 (fosc=500kHz), VOUT/VIN≧0.14 (fosc=1.2MHz), VOUT/VIN≧0.17 (fosc=2.2MHz) (*2) : Design reference value. This parameter is provided only for reference. (*3) : Current limit denotes the level of detection at peak of coil current. (*4) : For the USP-6C Package only. (*5) : EFFI = {(output voltage) x (output current)} / {(input voltage) x (input current)} x 100 6/30 XC9263/XC9264 XC9263/XC9264 Series is Not Recommended for New Designs. Series ■ELECTRICAL CHARACTERISTICS (Continued) Ta=25℃ PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT CIRCUIT FB ‘H’ Current IFBH FB ‘L’ Current IFBL VIN=VEN/SS=18V, VFB=3.0V -0.1 - 0.1 μA ④ VIN=VEN/SS=18V, VFB=0V -0.1 - 0.1 μA EN/SS ‘H’ Current IEN/SSH VIN=VEN/SS=18V, VFB=0.825V ④ - 0.1 0.3 μA EN/SS ‘L’ Current IEN/SSL VIN=18V, VEN/SS=0V, VFB=0.825V ④ -0.1 - 0.1 μA ④ EN/SS ‘H’ Voltage VEN/SSH VEN/SS Voltage when Lx pin voltage changes from 2.5 - 18 V ② - - 0.3 V ② VEN/SS=0.3V→2.5V, VFB=0.71V "L" level to "H" VEN/SS=2.5V→0.3V, VFB=0.71V EN/SS ‘L’ Voltage VEN/SSL VEN/SS Voltage when Lx pin voltage changes from "H" level to "L" Thermal Shutdown Temperature Hysteresis Width TTSD Junction Temperature - 150 - ℃ - THYS Junction Temperature - 25 - ℃ - Test Condition: Unless otherwise stated, VIN=12V, VEN/SS=12V 7/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■TEST CIRCUITS CIRCUIT① VIN A Probe EN/SS L=2.2μH(fos c=2.2MHz ) L=4.7μH(fos c=1.2MHz ) L=1 0μH(fos c=5 00 kH z) L V V OUT Lx 2.2μF V PG C FB A R FB1 FB 1 0μF 1 0μF V R FB2 GND CIRCUIT② Probe VIN V Probe EN/SS 2.2μF Lx 1 00 kΩ V PG FB V A V GND A 1.2kΩ V Probe CIRCUIT③ Probe VIN 4 30 kΩ V Probe EN/SS Lx 2.2μF V 0.4 7μF PG FB GND * PG Pin is USP-6C Package only. 8/30 V V 1.2kΩ XC9263/XC9264 XC9263/XC9264 Series is Not Recommended for New Designs. Series ■TEST CIRCUITS (Continued) CIRCUIT④ VIN A EN/SS A Lx V V PG FB A GND V CIRCUIT⑤ VIN A EN/SS Lx V PG FB V GND CIRCUIT⑥ VIN L=2.2μH(fos c=2.2MHz ) L=4.7μH(fos c=1.2MHz ) L=1 0μH(fos c=5 00 kH z) Probe EN/SS L V Lx 2.2μF V PG C FB R FB1 FB GND 1 0μF R FB2 1 0μF V * PG Pin is USP-6C Package only. 9/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■TYPICAL APPLICATION CIRCUIT / Parts Selection Method L VIN Lx CIN CFB EN/SS RFB1 FB CL RFB2 RPG GN D PG 【Typical Examples】 Oscillation Frequency 500kHz L 1.2MHz 2.2MHz CIN CL MANUFACTU RER PRODUCT NUMBER TDK CLF6045NIT-100M Taiyo Yuden NRS5040T100MMGJ Tokyo Coil SHP0530P-F100AP TDK CLF6045NIT-4R7N TDK VLS252012CX-4R7M-1 Taiyo Yuden NRS5024T4R7MMGJ Tokyo Coil SHP0530P-F4R7AP TDK CLF6045NIT-2R2N TDK VLS252012CX-2R2M-1 Taiyo Yuden NRS4018T2R2MDGJ Tokyo Coil VALUE 10μH 4.7μH 2.2μH 500kHz, 1.2MHz, 2.2MHz Murata SHP0420P-F2R2NAP GRM188R61H225KE11 2.2μF / 50V 500kHz Murata GRM21BZ71E106KE15 10μF / 25V 2parallel 1.2MHz, 2.2MHz Murata GRM188R61E106MA73 10μF / 25V 2parallel The output voltage can be set by adding an external dividing resistor. The output voltage is determined by the equation below based on the values of RFB1 and RFB2. VOUT=VFB×(RFB1+RFB2)/RFB2 With RFB1+RFB2≦1MΩ Adjust the value of the phase compensation speed-up capacitor CFB using the equation below. C FB = 1 2π × fzfb × RFB1 * When fosc=500kHz or 1.2MHz, a target value for fzfb of about is optimum. 1 2π C L × L * When fosc=2.2MHz, a target value for fzfb of about 5kHz is optimum. 【Setting Example】 To set output voltage to 5V with fosc=500kHz, CL=20μF, L=10μH When RFB1=680kΩ, RFB2=120kΩ, VOUT=0.75V×(680kΩ+120kΩ) / 120kΩ=5.0V And fzfb is set to a target of 11.25kHz using the above equation, CFB=1/(2×π×11.25kHz×680kΩ)=20.8pF * The setting range for the output voltage is 1.0V to 15.0V. The condition VOUT/VIN ≧ 0.12 (fosc=500kHz), VOUT/VIN ≧ 0.14 (fosc=1.2MHz), VOUT/VIN ≧ 0.17 (fosc=2.2MHz) must be satisfied. 10/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■TYPICAL APPLICATION CIRCUIT / Parts Selection Method (Continued) The soft-start time can be adjusted by adding a capacitor and a resistor to the EN/SS pin. Soft-start time(tss2) is approximated by the equation below according to values of VEN/SS, RSS, and CSS. tss2=Css×Rss×( -ln( (VEN/SS-1.45)/VEN/SS ) ) 【Setting Example】 When CSS=0.47μF, RSS=430kΩ and VEN/SS=12V, tSS2=0.47x10-6 x 430 x 103 x (-ln((12-1.45)/12))=26ms (Approx.) *The soft-start time is the time from the start of VEN/SS until the output voltage reaches 90% of the set voltage. If the EN/SS pin voltage rises steeply without connecting CSS and RSS (RSS=0Ω), Output rises with taking the soft-start time of tss1=1.0ms (TYP.) which is fixed internally. VEN/SS RSS EN/SS VEN/SS CSS 90 % of se tting voltage VOUT tSS1 tSS2 11/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■OPERATIONAL EXPLANATION The XC9263/XC9264 series consists internally of a reference voltage supply with soft-start function, error amp, PWM comparator, ramp wave circuit, oscillator (OSC) circuit, phase compensation (Current feedback) circuit, current limiting circuit, current limit PFM circuit, High-side driver Tr., Low-side driver Tr., buffer drive circuit, internal power supply (LocalReg) circuit, under-voltage lockout (UVLO) circuit, gate clamp (CLAMP) circuit, thermal shutdown (TSD) circuit, power good comparator, control block and other elements. The voltage feedback from the FB pin is compared to the internal reference voltage by the error amp, the output from the error amp is phase compensated, and the signal is input to the PWM comparator to determine the ON time of switching during PWM operation. The output signal from the error amp is compared to the ramp wave by the PWM comparator, and the output is sent to the buffer drive circuit and output from the LX pin as the duty width of switching. This operation is performed continuously to stabilize the output voltage. The driver transistor current is monitored at each switching by the phase compensation (Current feedback) circuit, and the output signal from the error amp is modulated as a multi-feedback signal. This allows a stable feedback system to be obtained even when a low ESR capacitor such as a ceramic capacitor is used, and this stabilizes the output voltage. VIN Current SENSE LocalReg EN/SS Chip Enable each circuit Thermal Shutdown Current Limit PFM High Side Buffer Operation Enable Lx Low Side Buffer each circuit + + Err Amp FB Current Limit Gate CLAMP Under Voltage Lock Out Vref Soft Start Current feed back PWM Comparator - PWM/PFM ControlLOGIC - GND OSC Ramp Wave PG(USP-6C Package Only) + PowerGood Comparator *Diodes inside the circuit are an ESD protection diodes and a parasitic diodes. The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter. The ramp wave circuit determines switching frequency. 500kHz or 1.2MHz or 2.2MHz is available for the switching frequency. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation. The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by the internal voltage divider, RFB1 and RFB2. When a voltage is lower than the reference voltage, then the voltage is fed back, the output voltage of the error amplifier increases. The error amplifier output is fixed internally to deliver an optimized signal to the mixer. 12/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■OPERATIONAL EXPLANATION (Continued) The current limiting circuit of the XC9263/XC9264 series monitors the current that flows through the High-side driver transistor and Low-side driver transistor, and when over-current is detected, the current limiting function activates. ①High-side driver Tr. current limiting The current in the High-side driver Tr. is detected to equivalently monitor the peak value of the coil current. The High-side driver Tr. current limiting function forcibly turns off the High-side driver Tr. when the peak value of the coil current reaches the High-side driver current limit value ILIMH. When the over-current state is released, normal operation resumes. ②Low-side driver Tr. current limiting The current in the Low-side driver Tr. is detected to equivalently monitor the bottom value of the coil current. The Low-side driver Tr. current limiting function prohibits the High-side driver Tr. from turning on in an over-current state where the bottom value of the coil current is higher than the Low-side driver Tr. current limit value ILIML(TYP. 0.9A). Control to lower the switching frequency fOSC is also performed. When the over-current state is released, normal operation resumes. ③ Over-current latch (Type A) Type A turns off the High-side and Low-side driver Tr. when state ① or ② continues for tLAT (TYP. 1.0ms). The LX pin is latchstopped at the GND level (0V). The latch-stopped state only stops the pulse output from the Lx pin; the internal circuitry of the IC continues to operate. To restart after latch-stopping, L level and then H level must be input into the EN/SS pin, or VIN pin re-input must be performed (after lowering the voltage below the UVLO detection voltage) to resume operation by soft start. The over-current latch function may occasionally be released from the current limit detection state by the effects of ambient noise, and it may also happen that the latch time becomes longer or latching does not take place due to board conditions. For this reason, place the input capacitor as close as possible to the IC. Type B is an automatic recovery type that performs the operation of ① or ② until the over-current state is released. tLAT (TYP. 1ms) Latch Protection (Type A) ILIMH (TYP. 1.1A) ILIML (TYP. 0.9A) ILX VLX VOUT VEN/SS Current limiting timing chart 13/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■OPERATIONAL EXPLANATION (Continued) The reference voltage applied to the error amplifier is restricted by the start-up voltage of the EN/SS pin. This ensures that the error amplifier operates with its two inputs in balance, thereby preventing ON-time signal from becoming longer than necessary. Therefore, start-up time of the EN/SS pin becomes the set-time of soft-start. The soft-start time can be adjusted by adding a capacitor and a resistor to the EN/SS pin. If the EN/SS pin voltage rises steeply without connecting CSS and RSS (RSS=0Ω), Output rises with taking the soft-start time of tss1=1.0ms (TYP.) which is fixed internally. The soft-start function operates when the voltage at the EN/SS pin is between 0.3V to 2.5V. If the voltage at the EN/SS pin does not start from 0V but from a middle level voltage when the power is switched on, the soft-start function will become ineffective and the possibilities of large inrush currents and ripple voltages occurring will be increased. The thermal shutdown (TSD) as an over current limit is built in the XC9263/XC9264 series. When the junction temperature reaches the detection temperature, the driver transistor is forcibly turned off. When the junction temperature falls to the release temperature while in the output stop state, restart takes place by soft-start. This is a function to monitor the internal power supply and to prevent the output of false pulses from the Lx pin when the output from the internal power supply is unstable at low voltages. As the VIN pin voltage goes down, the internal power supply voltage falls. So the VIN voltage drops, the UVLO function is activated. When the VIN pin voltage falls below VUVLO1 (TYP. 2.7V), the UVLO function is activated, the high side driver FET and low side driver FET are forcibly turned off to prevent false pulse output due to instable operation of the internal circuits. When the VIN pin voltage rises above VUVLO2 (TYP. 2.8V), the UVLO function is released, the soft start function activates, and output start operation begins. Stopping by UVLO is not shutdown; only pulse output is stopped and the internal circuits continue to operate. On USP-6C Package, the output state can be monitored using the power good function. CONDITION SIGNAL VFB > VPGDET H (High impedance) VFB ≦ VPGDET L (Low impedance) EN/SS = H Thermal Shutdown L (Low impedance) EN/SS = L UVLO (VIN < VUVLO1) Stand-by Undefined State L (Low impedance) The PG pin is an Nch open drain output, therefore a pull-up resistance (approx. 100kΩ) must be connected to the PG pin. When not using the power good function, connect the PG terminal to GND or use it open. 14/30 XC9263/XC9264 XC9263/XC9264 Series is Not Recommended for New Designs. Series ■NOTES ON USE 1) In the case of a temporary and transient voltage drop or voltage rise. If the absolute maximum ratings are exceeded, the IC may deteriorate or be destroyed. If a voltage exceeding the absolute maximum voltage is applied to the IC due to chattering caused by a mechanical switch or an external surge voltage, please use a protection element such as a TVS and a protection circuit as a countermeasure. Please see the countermeasures from (a) to (c) shown below. (a) When voltage exceeding the absolute maximum ratings comes into the VIN pin due to the transient change on the power line, there is a possibility that the IC breaks down in the end. To prevent such a failure, please add a TVS between VIN and GND as a countermeasure (b) When the input voltage decreases below the output voltage, there is a possibility that an overcurrent will flow in the IC’s internal parasitic diode and exceed the absolute maximum rating of the Lx pin. If the current is pulled into the input side by the low impedance between VIN -GND, then countermeasures, such as adding an SBD between VOUT-VIN, should be taken. (c) When a negative voltage is applied to the input voltage by a reverse connection or chattering, an overcurrent could flow in the IC’s parasitic diode and damage the IC. Take countermeasures, such as adding a reverse touching protection diode (b)SBD (c)Reverse-Touching Protection Diode L VIN (a)TVS CIN2 Lx CFB CIN1 EN/SS RFB1 FB RFB2 CL1 CL2 RPG GN D 2) PG Make sure that the absolute maximum ratings of the external components and of this IC are not exceeded. 3) The DC/DC converter characteristics depend greatly on the externally connected components as well as on the characteristics of this IC, so refer to the specifications and standard circuit examples of each component when carefully considering which components to select. Be especially careful of the capacitor characteristics and use B characteristics (JIS standard) or X7R, X5R (EIA standard) ceramic capacitors. The capacitance decrease caused by the bias voltage may become remarkable depending on the external size of the capacitor. 4) If there is a large dropout voltage, then there might be pulse-skip during light loads even with PWM control. 5) The DC/DC converter of this IC uses a current-limiting circuit to monitor the coil peak current. If the potential dropout voltage is large or the load current is large, the peak current will increase, which makes it easier for current limitation to be applied which in turn could cause the operation to become unstable. When the peak current becomes large, adjust the coil inductance and sufficiently check the operation. 6) If there is a large dropout voltage, a circuit delay could create the ramp-up of coil current with staircase waveform exceeding the current limit. 15/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■NOTES ON USE (Continued) 7) The ripple voltage could be increased when switching from discontinuous conduction mode to Continuous conduction mode. Please evaluate IC well on customer’s PCB. 8) The operation of the IC becomes unstable below the minimum operating voltage. 9) If the voltage at the EN/SS Pin does not start from 0V but it is at the midpoint potential when the power is switched on, the soft start function may not work properly and it may cause the larger inrush current and bigger ripple voltages. 10) The effects of ambient noise and the state of the circuit board may cause release from the current limiting state, and the latch time may lengthen or latch operation may not take place. Please evaluate IC well on customer’s PCB. 11) In order to drive the IC normally, supply a stable input voltage to the VIN pin after reducing the AC impedance due to the bypass capacitor. In particular, if the amplitude of the input voltage fluctuates by 2V or more and ±0.1V/μs or more, there is a possibility that the UVLO function malfunctions due to fluctuations of the internal power supply of the IC. In that case, switching is stopped in a protected state that prevents false pulse output from the Lx pin. After that, the soft start function gets started, it shifts to normal operation. If the input voltage fluctuates momentarily, take measures such as increasing the input capacitance. 12) Instructions of pattern layouts The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high, please place the input capacitor(CIN) and the output capacitor (CL) as close to the IC as possible. (1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN and GND pins. If fluctuation of the VIN potential is expected, please take measures such as increasing input capacitor(CIN). (b)SBD (c)Reverse-Touching Protection Diode L VIN (a)TVS CIN2 Lx CFB (1)CIN1 EN/SS RFB1 FB RFB2 CL1 CL2 RPG GN D PG (2) Please mount each external component as close to the IC as possible. Please place the external parts on the same side of the PCB as the IC, not on the reverse side of the PCB and elsewhere. (3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit Impedance. (4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. (5) Please note that internal driver transistors bring on heat because of the load current and ON resistance of High-side driver transistor, Low-side driver transistor 16/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■NOTES ON USE (Continued) SOT-25(Front) USP-6C(Front) SOT-25(Back) USP-6C(Back) 12) Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 17/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output current XC9263x755/XC9264x755 XC9263x755/XC9264x755 (VIN=12V, VOUT=3.3V, fOSC=500kHz) (VIN=12V, VOUT=5V, fOSC=500kHz) L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM21BZ71E106KE15) 100 100 90 90 80 80 70 60 50 40 30 20 XC9263x755 10 XC9264x755 Efficiency :EFFI[%] Efficiency :EFFI[%] CL=10μF×2 (GRM21BZ71E106KE15) 0 0.1 1 10 70 60 50 40 30 20 XC9263x755 10 XC9264x755 0 100 0.1 Output Current :IOUT[mA] XC9263x75C/XC9264x75C (VIN=12V, VOUT=5V, fOSC=1200kHz) L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 100 100 90 90 80 80 70 60 50 40 30 20 XC9263x75C 10 XC9264x75C Efficiency :EFFI[%] Efficiency :EFFI[%] 100 (VIN=12V, VOUT=3.3V, fOSC=1200kHz) 0 70 60 50 40 30 20 XC9263x75C 10 XC9264x75C 0 0.1 1 10 100 Output Current :IOUT[mA] 0.1 10 100 XC9263x75D/XC9264x75D XC9263x75D/XC9264x75D (VIN=12V, VOUT=3.3V, ｆOSC=2200kHz) (VIN=12V, VOUT=5V, fOSC=2200kHz) L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 100 90 90 80 80 70 60 50 40 30 20 XC9263x75D 10 XC9264x75D 0 1 10 Output Current :IOUT[mA] 100 Efficiency :EFFI[%] 100 0.1 1 Output Current :IOUT[mA] L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) Efficiency :EFFI[%] 10 XC9263x75C/XC9264x75C L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 18/30 1 Output Current :IOUT[mA] 70 60 50 40 30 20 XC9263x75D 10 XC9264x75D 0 0.1 1 10 100 Output Current :IOUT[mA] XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■TYPICAL PERFORMANCE CHARACTERISTICS(Continued) (2) Output Voltage vs. Output Current XC9263x755/XC9264x755 XC9263x755/XC9264x755 (VIN=12V, VOUT=3.3V, fOSC=500kHz) (VIN=12V, VOUT=5V, fOSC=500kHz) L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM21BZ71E106KE15) L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM21BZ71E106KE15) 5.30 Output Voltage : VOUT[V] Output Voltage : VOUT[V] 3.60 3.50 3.40 3.30 3.20 XC9263x755 3.10 XC9264x755 5.20 5.10 5.00 4.90 XC9263x755 4.80 XC9264x755 4.70 3.00 1 10 100 1 1000 10 Output Current :IOUT[mA] XC9263x75C/XC9264x75C (VIN=12V, VOUT=3.3V, fOSC=1200kHz) (VIN=12V, VOUT=5V, fOSC=1200kHz) L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 3.60 5.30 Output Voltage : VOUT[V] Output Voltage : VOUT[V] 1000 XC9263x75C/XC9264x75C L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 3.50 3.40 3.30 3.20 XC9263x75C 3.10 XC9264x75C 3.00 5.20 5.10 5.00 4.90 XC9263x75C 4.80 XC9264x75C 4.70 10 1 100 1000 10 1 Output Current :IOUT[mA] 100 1000 Output Current :IOUT[mA] XC9263x75D/XC9264x75D XC9263x75D/XC9264x75D (VIN=12V, VOUT=3.3V, fOSC=2200kHz) (VIN=12V, VOUT=5V, fOSC=2200kHz) L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 3.60 5.30 Output Voltage : VOUT[V] Output Voltage : VOUT[V] 100 Output Current :IOUT[mA] 3.50 3.40 3.30 3.20 XC9263x75D 3.10 XC9264x75D 5.20 5.10 5.00 4.90 XC9263x75D 4.80 XC9264x75D 4.70 3.00 1 10 100 Output Current :IOUT[mA] 1000 1 10 100 1000 Output Current :IOUT[mA] 19/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■TYPICAL PERFORMANCE CHARACTERISTICS(Continued) (3) Ripple Voltage vs. Output Current XC9263x75C/XC9264x75C (VIN=12V, VOUT=5V, fOSC=500kHz) (VIN=12V, VOUT=5V, fOSC=1200kHz) L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM21BZ71E106KE15) 100 100 90 XC9263x755 80 XC9264x755 Ripple Voltage :Vr[mV] Ripple Voltage :Vr[mV] XC9263x755/XC9264x755 70 60 50 40 30 20 10 90 XC9263x75C 80 XC9264x75C 70 60 50 40 30 20 10 0 1 0.1 10 0 100 0.1 1 Output Current :IOUT[mA] 10 100 Output Current :IOUT[mA] XC9263x75D/XC9264x75D (VIN=12V, VOUT=5V, fOSC=2200kHz) L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) Ripple Voltage :Vr[mV] 100 90 XC9263x75D 80 XC9264x75D 70 60 50 40 30 20 10 0 0.1 1 10 100 Output Current :IOUT[mA] (4) FB Voltage vs. Ambient Temperature (5) UVLO Voltage vs. Ambient Temperature XC9263/XC9264 XC9263/XC9264 VIN =12V 0.755 0.750 0.745 0.740 -50 -25 0 25 50 75 Ambient Temperature :Ta[℃] 20/30 3.0 UVLO Voltage :VUVLO1 ,VUVLO2 [V] FB Voltage :VFB[V] 0.760 100 125 VUVLO1(DetectVoltage) 2.9 VUVLO2(ReleaseVoltage) 2.8 2.7 2.6 2.5 -50 -25 0 25 50 75 Ambient Temperature :Ta[℃] 100 125 XC9263/XC9264 XC9263/XC9264 Series is Not Recommended for New Designs. Series ■TYPICAL PERFORMANCE CHARACTERISTICS(Continued) (6) Oscillation Frequency vs. Ambient Temperature XC9263x75C/XC9264x75C XC9263x755/XC9264x755 (fOSC=1200kHz) (fOSC=500kHz) VIN =12V 550 500 450 VIN =12V 1440 Oscillation Frequency:fOSC [kHz] Oscillation Frequency:fOSC [kHz] 600 400 1360 1280 1200 1120 1040 960 -50 -25 0 25 50 75 100 125 -50 -25 Ambient Temperature :Ta[℃] 0 25 50 75 100 125 Ambient Temperature :Ta[℃] XC9263x75D/XC9264x75D (fOSC=2200kHz) VIN =12V Oscillation Frequency:fOSC [kHz] 2650 2500 2350 2200 2050 1900 1750 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] (7) Stand-by Current vs. Ambient Temperature (8) Lx SW ON Resistance vs. Ambient Temperature XC9263/XC9264 XC9263/XC9264 VIN =12V VIN =12V 2.0 Lx SW ON Resistance :RON[Ω] Stand-by Current :ISTB[μA] 4.0 3.0 2.0 1.0 0.0 -50 -25 0 25 50 75 Ambient Temperature :Ta[℃] 100 125 1.5 1.0 0.5 Hig hs ide SW . Lows ide SW . 0.0 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] 21/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■TYPICAL PERFORMANCE CHARACTERISTICS(Continued) (9) Quiescent Current vs. Ambient Temperature XC9263x755/XC9264x755 XC9263x75C/XC9264x75C (fOSC=500kHz) (fOSC=1200kHz) VIN =12V 200 VIN =12V 200 XC9263x75C Quiescent Current :Iq[uA] Quiescent Current :Iq[uA] XC9263x755 XC9264x755 150 100 50 0 XC9264x75C 150 100 50 0 -50 0 -25 25 50 75 100 125 -50 0 -25 Ambient Temperature :Ta[℃] 25 50 75 100 125 Ambient Temperature :Ta[℃] XC9263x75D/XC9264x75D (fOSC=2200kHz) VIN =12V Quiescent Current :Iq[uA] 200 XC9263x75D XC9264x75D 150 100 50 0 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] (10) Internal Soft-Start Time vs. Ambient Temperature (11) External Soft-Start Time vs. Ambient Temperature XC9263/XC9264 XC9263/XC9264 VIN =12V 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 Ambient Temperature :Ta[℃] 22/30 100 125 VIN=12V, RSS=430kΩ, CSS=0.47μF 35 External lSoft-StartTime :tSS2 [ms] Internal Soft-StartTime :tSS1 [ms] 2.0 30 25 20 15 -50 -25 0 25 50 75 Ambient Temperature :Ta[℃] 100 125 XC9263/XC9264 XC9263/XC9264 Series is Not Recommended for New Designs. Series ■TYPICAL PERFORMANCE CHARACTERISTICS(Continued) (12) PFM Current vs. Ambient Temperature XC9264x75C XC9264x755 (VIN=12V, VOUT=5V, fOSC=1200kHz) (VIN=12V, VOUT=5V, fOSC=500kHz) 500 PFM Current :IPFM[mA] PFM Current :IPFM[mA] 500 L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM21BZ71E106KE15) 450 400 350 300 250 -50 -25 0 25 50 75 100 125 L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 450 400 350 300 250 -50 -25 Ambient Temperature :Ta[℃] 0 25 50 75 100 125 Ambient Temperature :Ta[℃] XC9264x75D (VIN=12V, VOUT=5V, fOSC=2200kHz) PFM Current :IPFM[mA] 500 L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 450 400 350 300 250 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] (13) PG Detect Voltage vs. Ambient Temperature (14) PG Output Voltage vs. Ambient Temperature XC9263/XC9264 XC9263/XC9264 VIN =12V 0.70 0.65 0.60 -50 VIN =12V, IPG=1mA 0.4 PG Output Voltage :VPG[V] PG Detect Voltage :VPGDET[V] 0.75 0.3 0.2 0.1 0.0 -25 0 25 50 75 Ambient Temperature :Ta[℃] 100 125 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] 23/30 XC9263/XC9264 Series XC9263/XC9264 Series is Not Recommended for New Designs. ■TYPICAL PERFORMANCE CHARACTERISTICS(Continued) (15) EN/SS Voltage vs. Ambient Temperature XC9263/XC9264 VIN =12V 4.0 EN/SS"H" EN/SS Voltage :VCE[V] EN/SS"L" 3.0 2.0 1.0 0.0 -50 -25 0 25 50 75 Ambient Temperature :Ta[℃] 24/30 100 125 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■TYPICAL PERFORMANCE CHARACTERISTICS(Continued) (16) Load Transient Response XC9263x755、 fOSC =500kHz XC9264x755、 fOSC =500kHz VIN =12V, VOUT=5.0V, IOUT=1mA→300mA VIN =12V, VOUT=5.0V, IOUT=1mA→300mA L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM21BZ71E106KE15) L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM21BZ71E106KE15) 1.0ms/div 1.0ms/div IOUT =1mA→300mA IOUT =1mA→300mA V OUT : 500mV/div V OUT : 500mV/div XC9263x75C、 fOSC =1200kHz XC9264x75C、 fOSC =1200kHz VIN =12V, VOUT=5.0V, IOUT=1mA→300mA VIN =12V, VOUT=5.0V, IOUT=1mA→300mA L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) CL=10μF×2 (GRM188R61E106MA73) 1.0ms/div 1.0ms/div IOUT =1mA→300mA IOUT =1mA→300mA V OUT : 500mV/div V OUT : 500mV/div XC9264x75D、 fOSC =2200kHz XC9263x75D、 fOSC =2200kHz VIN =12V, VOUT=5.0V, IOUT=1mA→300mA L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), VIN =12V, VOUT=5.0V, IOUT=1mA→300mA L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) CL=10μF×2 (GRM188R61E106MA73) 1.0ms/div 1.0ms/div IOUT =1mA→300mA IOUT =1mA→300mA V OUT : 500mV/div V OUT : 500mV/div 25/30 XC9263/XC9264 Series is Not Recommended for New Designs. XC9263/XC9264 Series ■TYPICAL PERFORMANCE CHARACTERISTICS(Continued) (17) Input Transient Response XC9263x755、 fOSC =500kHz XC9264x755、 fOSC =500kHz VIN =12V→18V, VOUT=5V, IOUT=300mA VIN =12V→18V, VOUT=5V, IOUT=300mA L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM21BZ71E106KE15) L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM21BZ71E106KE15) 1.0ms/div 1.0ms/div V N=12V→18V V N=12V→18V V OUT : 500mV/div V OUT : 500mV/div XC9263x75C、 fOSC =1200kHz XC9264x75C、 fOSC =1200kHz VIN =12V→18V, VOUT=5V, IOUT=300mA VIN =12V→18V, VOUT=5V, IOUT=300mA L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 1.0ms/div 1.0ms/div V N=12V→18V V N=12V→18V V OUT : 500mV/div V OUT : 500mV/div XC9263x75D、 fOSC =2200kHz XC9264x75D、 fOSC =2200kHz VIN =12V→18V, VOUT=5V, IOUT=300mA VIN =12V→18V, VOUT=5V, IOUT=300mA L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 1.0ms/div 1.0μs/div V N=12V→18V V N=12V→18V V OUT : 500mV/div V OUT : 500mV/div 26/30 XC9263/XC9264 XC9263/XC9264 Series is Not Recommended for New Designs. Series ■TYPICAL PERFORMANCE CHARACTERISTICS(Continued) (18) EN/SS Rising Response XC9263x755、 fOSC =500kHz XC9264x755、 fOSC =500kHz VIN =12V, VCE=0→12V, VOUT=5V, IOUT=300mA VIN =12V, VCE=0→12V, VOUT=5V, IOUT=300mA L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM21BZ71E106KE15) L=10μH(CLF6045NIT-100), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM21BZ71E106KE15) 200μs/div 200μs/div EN/SS=0V→12V V OUT : 2V/div EN/SS=0V→12V V OUT : 2V/div XC9263x75C、 fOSC =1200kHz XC9264x75C、 fOSC =1200kHz VIN =12V, VCE=0→12V, VOUT=5V, IOUT=300mA VIN =12V, VCE=0→12V, VOUT=5V, IOUT=300mA L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) L=4.7μH(CLF6045NIT-4R7), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 200μs/div EN/SS=0V→12V V OUT : 2V/div 200μs/div EN/SS=0V→12V V OUT : 2V/div XC9263x75D、 fOSC =2200kHz XC9264x75D、 fOSC =2200kHz VIN =12V, VCE=0→12V, VOUT=5V, IOUT=300mA VIN =12V, VCE=0→12V, VOUT=5V, IOUT=300mA L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) L=2.2μH(CLF6045NIT-2R2), CIN =2.2μF(GRM188R61H225KE11), CL=10μF×2 (GRM188R61E106MA73) 200μs/div 200μs/div EN/SS=0V→12V V OUT : 2V/div EN/SS=0V→12V V OUT : 2V/div 27/30 XC9263/XC9264 Series XC9263/XC9264 Series is Not Recommended for New Designs. ■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLINE / LAND PATTERN THERMAL CHARACTERISTICS SOT-25 SOT-25 PKG SOT-25 Power Dissipation USP-6C USP-6C PKG USP-6C Power Dissipation 28/30 XC9263/XC9264 XC9263/XC9264 Series is Not Recommended for New Designs. Series ■MARKING RULE ●SOT-25(Under dot) / USP-6C SOT-25(Under ●SOT-25 (Under dot)dot仕様) 5 4 ●USP-6C USP-6C Enlarge ② ③ ④ ⑤ ② ③ 3 ⑤ 2 ④ 2 1 ① 1 ① 3 6 5 4 ①②③ represents products series, products type, Oscillation Frequency ① MARK ② ③ 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 A B C D E F H K L M N P SERIES TYPE OSCILLATION FREQUENCY PRODUCT SERIES XC9263 XC9263 XC9263 XC9263 XC9263 XC9263 XC9264 XC9264 XC9264 XC9264 XC9264 XC9264 A A A B B B A A A B B B 5 C D 5 C D 5 C D 5 C D XC9263A755xx-G XC9263A75Cxx-G XC9263A75Dxx-G XC9263B755xx-G XC9263B75Cxx-G XC9263B75Dxx-G XC9264A755xx-G XC9264A75Cxx-G XC9264A75Dxx-G XC9264B755xx-G XC9264B75Cxx-G XC9264B75Dxx-G ④⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 29/30 XC9263/XC9264 Series XC9263/XC9264 Series is Not Recommended for New Designs. 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 30/30