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XC9280A75CYR-G

XC9280A75CYR-G

  • 厂商:

    TOREX(特瑞仕)

  • 封装:

    SOT-26

  • 描述:

    IC REG BUCK ADJUSTABLE 3A TSOT26

  • 数据手册
  • 价格&库存
XC9280A75CYR-G 数据手册
XC9280 Series 18V Operation 3.0A Synchronous Step-Down DC/DC Converters ETR05064-003 ■GENERAL DESCRIPTION The XC9280 series is 18V bootstrap synchronous step-down DC/DC converter with built-in Nch-Nch driver transistors, the operating voltage range is 4.5V~18.0V, designed to allow the use of ceramic capacitors. 0.75V reference voltage source is incorporated in the IC, and the output voltage can be set to a value from 1.8V to 7.0V using external resistors (RFB1, RFB2). Switching frequency is 1.2MHz. In PWM/PFM automatic switchover control, IC can change the control method between PWM and PFM based on the output current requirement and as a result IC can achieve high efficiency over the full load range. XC9280 has a fixed internal soft start time which is 0.95ms (TYP.), additionally the time can be extended by using an external resistor and capacitor. With the built-in UVLO function, the driver transistor is forced OFF when input voltage goes down to 3.33V (TYP.) or lower. Over current protection and thermal shutdown are embedded and they secure a safety operation. ■APPLICATIONS ■FEATURES ● Digital TV Input Voltage Range : 4.5V ~ 18V (Absolute Max 20V) ● Set Top Box Output Voltage Range : 1.8V ~ 7.0V or VIN x 0.7 ● Security camera FB Voltage : 0.75V±1.5% ● Smart meter Oscillation Frequency : 1.2MHz Output Current : 3A peak ● Security system 2.0A DC (VIN=12V, VOUT=5V) Control Method : PWM/PFM Automatic Soft-start Time : 0.95ms Protection function : UVLO Over Current Protection (Automatic Recovery) Thermal Shutdown Output Capacitor : Ceramic Capacitor Package : TSOT-26 Environmentally Friendly : EU RoHS Compliant, Pb Free Adjustable by RC ■TYPICAL APPLICATION CIRCUIT VIN BST CIN (ceramic) CBST EN/SS L Lx CFB GND ■TYPICAL PERFORMANCE CHARACTERISTICS RFB1 FB RFB2 CL (ceramic) 1/28 XC9280 Series ■BLOCK DIAGRAM VIN Local Reg EN EN/SS UVLO Control Logic BST Control Switch Current Feedback Thermal Shutdown Current Limit Nch Highside DRV Tr. Current Limit PFM Soft Start VREF + - Output Buffer LX ERR AMP Phase Compensation PWM Comparator PWM/PFM Control Logic Nch Lowside DRV Tr. Ramp Wave Generator, OSC FB GND * Diodes inside the circuit are an ESD protection diodes and a parasitic diodes. ■PRODUCT CLASSIFICATION 1) Ordering Information XC9280①②③④⑤⑥-⑦(*1) DESIGNATOR ITEM SYMBOL DESCRIPTION ① Type A Refer to Selection Guide ②③ FB Voltage 75 0.75V ④ Oscillation Frequency C 1.2MHz Packages (Order Unit) YR-G(*1) TSOT-26 (3,000pcs/Reel) ⑤⑥-⑦ (*1) (*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. 2) Selection Guide 2/28 BST TYPE Chip Enable UVLO Thermal Shutdown A Yes Yes Yes TYPE Soft Start Current Limiter Automatic Recovery (Current Limiter) A Yes Yes Yes XC9280 Series ■PIN CONFIGURATION BST EN/SS FB 6 5 4 1 2 3 GND LX VIN TSOT-26 (TOP VIEW) ■PIN ASSIGNMENT PIN NUMBER FUNCTIONS TSOT-26 PIN NAME 1 GND Ground 2 LX Switching Output 3 VIN Power Input 4 FB Output Voltage Sense 5 EN/SS Enable/Soft-start 6 BST Bootstrap ■FUNCTION CHART PIN NAME EN/SS (*1) SIGNAL STATUS H Active L Stand-by OPEN Undefined State (*1) Please do not leave the EN/SS pin open. Each should have a certain voltage. 3/28 XC9280 Series ■ABSOLUTE MAXIMUM RATINGS PARAMETER (*2) RATINGS UNITS VIN Pin Voltage VIN -0.3 ~ 20 V EN/SS Pin Voltage VEN/SS -0.3 ~ 20 V FB Pin Voltage VFB -0.3 ~ 6.2 V BST Pin Voltage VBST VLX - 0.3 ~ VLX + 6.2 V VLx Lx Pin Current ILx 6.0 A Pd 1300 (High heat dissipation board) (*2) mW Operating Ambient Temperature Topr -40 ~ 105 ℃ Storage Temperature Tstg -55 ~ 125 ℃ TSOT-26 -0.3 ~ VIN + 0.3 or 20 (*1) Lx Pin Voltage Power Dissipation (Ta=25℃) (*1) SYMBOL The maximum value should be either VIN+0.3V or 20V in the lowest. The power dissipation figure shown is PCB mounted and is for reference only. The mounting condition is please refer to PACKAGING INFORMATION. 4/28 V XC9280 Series ■ELECTRICAL CHARACTERISTICS Ta=25℃ PARAMETER SYMBOL FB Voltage VFB Setting Output Voltage Range(*1) Operating Input Voltage Range(*1) CONDITIONS VFB=0.761V → 0.739V VFB Voltage when Lx pin oscillates MIN. TYP. MAX. UNIT CIRCUIT 0.739 0.750 0.761 V ① V - 7.0 or VOUTSET - 1.8 - VIN - 4.5 - 18 V - 2.70 3.33 - V ① - 3.38 4.40 V ① VIN=VEN/SS=12V、VFB=0.825V、VLX=0V - 80 180 μA ② VIN=12V、VEN/SS=VFB=VLX=0V - 3.0 6.0 μA ⑤ 1.0 1.2 1.4 MHz ① 75 90 - % ① VINx0.7(*4) VIN:4.4V→2.7V、VFB=0.675V UVLO Detect Voltage VUVLOD VIN Voltage which Lx pin voltage changes from "oscillation" to "L" level VIN:2.7V→4.4V、VFB=0.675V UVLO Release Voltage VUVLOR VIN Voltage which Lx pin voltage changes from "L" level to "oscillation" Quiescent Current Iq Stand-by Current ISTBY Connected to external components, Oscillation Frequency fOSC Maximum Duty Cycle DMAX Lx SW "H" On Resistance RLxH - - 166(*2) - mΩ - Lx SW "L" On Resistance RLxL VFB=5.5V、ILX=100mA - 130 - mΩ ③ Lx SW "H" Off Current ILXH -1.0 - - μA ⑥ Lx SW "L" Off Current ILXL - - 1.0 μA ⑧ - 1.2 - A ④ VIN=VEN/SS=6.0V、VFB=0.675V Connected to external components, VIN=VEN/SS=6.0V、VFB=0.675V VIN=18V、VEN/SS=0V、VFB=1.5V VLX=6.0V、VBST=VLX+5.0V VIN=18V、VEN/SS=VFB=VLX=0V Connected to external components, PFM Switch Current IPFM Current Limit ILIM - - 5.1 - A - Internal Soft-Start Time tSS1 VFB=0.675V - 0.95 - ms ① - 26 - ms ⑦ - 90 - % ④ - ±100 - ppm/℃ ① External Soft-Start Time tSS2 Efficiency(*3) EFFI FB Voltage ΔVFB/ Temperature Characteristics (ΔTopr・VFB) VIN=12V、VOUT=5.0V、IOUT=1mA VFB=0.675V RSS=430kΩ、CSS=0.47μF Connected to external components, VIN=12V、VOUT=5.0V、IOUT=1.0A -40℃≦Topr≦105℃ Test Condition: Unless otherwise stated, VIN=12V, VEN/SS=12V (*1): (*2) Please use within the range of VOUT/VIN≧0.136 : Design reference value. This parameter is provided only for reference. (*3): EFFI = {(output voltage) x (output current)} / {(input voltage) x (input current)} x 100 (*4): The maximum value should be either 7.0 or VINx0.7 in the lowest. 5/28 XC9280 Series ■ELECTRICAL CHARACTERISTICS Ta=25℃ PARAMETER SYMBOL FB “H” Current IFBH CONDITIONS MIN. TYP. MAX. UNIT CIRCUIT VIN=VEN/SS=18V、VFB=3.0V、VLX=0V -0.1 - 0.1 μA ⑧ FB “L” Current IFBL VIN=VEN/SS=18V、VFB=VLX=0V -0.1 - 0.1 μA ⑧ EN/SS “H” Voltage VEN/SSH VIN=18V、VFB=0.71V 2.5 - 18 V ① EN/SS “L” Voltage VEN/SSL VIN=18V、VFB=1.5V - - 0.3 V ① EN/SS “H” Current IEN/SSH VIN=VEN/SS=18V、VFB=1.5V、VLX=0V - 0.1 0.3 μA ⑧ EN/SS “L” Current IEN/SSL VIN=18V、VEN/SS=VFB=VLX=0V -0.1 - 0.1 μA ⑧ Thermal Shutdown Temperature Hysteresis Width TTSD Junction Temperature - 150 - ℃ - THYS Junction Temperature - 10 - ℃ - Test Condition: Unless otherwise stated, VIN=12V, VEN/SS=12V 6/28 XC9280 Series ■TEST CIRCUITS CIRCUIT① CIN=10μF 2parallel LX pulse CL=22μF 2parallel CBST=0.1μF A L=3.3μH VIN BST EN/SS CBST Lx L FB CL CIN 500Ω GND CIRCUIT② A VIN BST EN/SS 0.1μ F Lx A FB A GND CIRCUIT③ VIN BST EN/SS 0.1μ F Lx FB GND V ILX 7/28 XC9280 Series ■TEST CIRCUITS(Continued) CIN=10μF 2parallel CL=22μF 2parallel CIRCUIT④ CBST=0.1μF L=3.3μH A CFB=56pF VIN RFB1=220kΩ BST EN/SS RFB2=39kΩ CBST Lx L CFB RFB1 FB CL CIN RFB2 GND IOUT CIRCUIT⑤ A VIN BST EN/SS 0.1μ F Lx FB GND CIRCUIT⑥ A VIN BST EN/SS 0.1μ F Lx A FB A GND 8/28 A XC9280 Series ■TEST CIRCUITS(Continued) CIN=10μF 2parallel CIRCUIT⑦ CL=22μF 2parallel CBST=0.1μF LX pulse L=3.3μH RSS=430kΩ CSS=0.47μΩ VIN BST CBST RSS EN/SS Lx L FB CL CIN CSS 500Ω GND CIRCUIT⑧ A VIN BST EN/SS 0.1μ F Lx A FB A A GND 9/28 XC9280 Series ■TYPICAL APPLICATION CIRCUIT VIN BST CIN (ceramic) CBS T EN/SS L CFB GN D VOUT Lx RFB1 FB CL (ceramic) RFB2 VOUT MANUFACTURER 5.0V ~ 7.0V TDK 1.8V ~ 4.9V TDK - TDK 3.3V ~ 7.0V TDK 1.8V ~ 3.2V TDK - - PRODUCT NUMBER VLS5045EX-3R3N VLS5045EX-2R2N 2.2μH CLF7045NIT-2R2N CL CBST 3.3μH CLF7045NIT-3R3N L CIN VALUE C2012X5R1E106K 10μF/25V 2Parallel C3216X7R1E106K 10μF/25V 2Parallel C3216X5R1E226M 22μF/25V 2Parallel C4532X7R1E226M 22μF/25V 2Parallel C3216X5R1E226M 22μF/25V 3Parallel C4532X7R1E226M 22μF/25V 3Parallel - 0.1μF/25V The output voltage can be set by adding an external dividing resistor. The output voltage is determined by the equation below based on the values of RFB1 and RFB2. VOUT=0.75×(RFB1+RFB2)/RFB2 With RFB2≦50kΩ Adjust the value of the phase compensation speed-up capacitor CFB using the equation below. C FB  1 2  fzfb  RFB1 When VOUT=3.3V~7.0V, a target value for fzfb of about 10k~15kHz is optimum. When VOUT=1.8V~3.2V, a target value for fzfb of about 30k~35kHz is optimum. 【Setting Example】 VOUT setting= 5.0V, RFB1=220kΩ, RFB2=39kΩ VOUT=0.75V×(220kΩ+39kΩ) / 39kΩ =5.0V fzfb=12.9kHz CFB= 1/(2×π×12.9kHz×220kΩ) =56pF 【examples】 VOUT RFB1 RFB2 CFB 5.0V 220kΩ 39kΩ 56pF 3.3V 91kΩ 27kΩ 120pF 1.8V 51kΩ 36kΩ 100pF 10/28 XC9280 Series ■TYPICAL APPLICATION CIRCUIT (Continued) <Soft-start Time Setting> The soft-start time can be adjusted by adding a capacitor and a resistor to the EN/SS pin. Soft-start time (tss2) is approximated by the equation below according to values of V EN/SS, RSS, and CSS. tss2=Css × Rss × ( ln( VEN/SS/(VEN/SS-1.45) ) ) 【Setting Example】 CSS=0.47μF, RSS=430kΩ, VEN/SS=12V tSS2=0.47x10-6 x 430x103 x (ln(12/(12-1.45) ) )=26ms * The soft-start time is the time from the start of VEN/SS until the output voltage reaches 90% of the set voltage. If the EN/SS pin voltage rises without connecting CSS and RSS (RSS=0Ω), Output rises with taking the soft-start time of tss1=0.95ms (TYP.) which is fixed internally. VEN/SS RSS EN/SS VEN/SS CSS 90 % of se tting voltage VOUT tSS1 tSS2 11/28 XC9280 Series ■OPERATIONAL EXPLANATION The XC9280 series consists of a reference voltage source circuit, soft-start circuit, error amplifier circuit, PWM comparator circuit, PWM/PFM control circuit, ramp wave circuit、oscillator (OSC) circuit、phase compensation (Current feedback) circuit, current limit circuit, current limit PFM circuit, Nch High-side driver Tr.,Nch Low-side driver Tr.,output buffer circuit, internal power supply (LocalReg) circuit, under-voltage lockout (UVLO) circuit,、BST control circuit, thermal shutdown (TSD) circuit、control logic circuit . The voltage feedback from the FB pin is compared to the internal reference voltage by the error amp, the output from the error amp is phase compensated, and the signal is input to the PWM comparator to determine the ON time of switching during PWM operation. The output signal from the error amp is compared to the ramp wave by the PWM comparator, and the output is sent to the buffer drive circuit and output from the LX pin as the duty width of switching. This operation is performed continuously to stabilize the output voltage. The driver transistor current is monitored at each switching by the phase compensation (Current feedback) circuit, and the output signal from the error amp is modulated as a multi-feedback signal. This allows a stable feedback system to be obtained even when a low ESR capacitor such as a ceramic capacitor is used, and this stabilizes the output voltage. VIN Local Reg EN EN/SS UVLO Control Logic BST Control Switch Current Feedback Thermal Shutdown Current Limit Nch Highside DRV Tr. Current Limit PFM VREF Soft Start + - Output Buffer PWM Comparator FB LX ERR AMP Phase Compensation PWM/PFM Control Logic BST Nch Lowside DRV Tr. Ramp Wave Generator, OSC GND * Diodes inside the circuits are ESD protection diodes and parasitic diodes. The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter. The ramp wave circuit determines switching frequency (1.2MHz). Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation. The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by the internal voltage divider, RFB1 and RFB2. When a voltage is lower than the reference voltage, then the voltage is fed back, the output voltage of the error amplifier increases. The error amplifier output is fixed internally to deliver an optimized signal to the mixer. 12/28 XC9280 Series ■OPERATIONAL EXPLANATION (Continued) < Current limiting, Short-circuit protection > The XC9280 series incorporates a foldback circuit for current limiting and short-circuit protection. When the output current reaches the current limit, the output voltage falls and the output current is limited. When the overcurrent condition is canceled, the output voltage automatically recovers. The output voltage is soft-started by soft-starting the reference voltage. The rise time of this reference voltage is the soft start time. The soft-start time is set to 0.95ms (TYP.) which is fixed internally or to the time set by adding a capacitor and a resistor to the EN/SS pin whichever is later. The thermal shutdown (TSD) as an over temperature limit is built in the XC9280 series. When the junction temperature reaches the detection temperature, the driver transistor is forcibly turned off. When the junction temperature falls to the release temperature while in the output stop state, restart takes place by soft-start 0.95ms (TYP.). This is a function to monitor the internal power supply and to prevent the output of false pulses from the Lx pin when the output from the internal power supply is unstable at low voltages. As the VIN pin voltage goes down, the internal power supply voltage falls. So the V IN voltage drops, the UVLO function is activated. When the VIN pin voltage falls below VUVLOD (TYP. 3.33V), the driver transistor is forcibly turned off to prevent false pulse output due to instable operation of the internal circuits. When the V IN pin voltage rises above VUVLOR (TYP. 3.38V), the UVLO function is released, the soft-start function activates, and output start operation begins. Stopping by UVLO is not shutdown; only pulse output is stopped and the internal circuits continue to operate. When the VIN pin voltage falls below VUVLOD (TYP. 3.33V), the UVLO function is activated. 13/28 XC9280 Series ■NOTE ON USE 1) 1) For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated if IC is used beyond the absolute MAX. specifications. 2) Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the design has been completed, verification with actual components should be done. 3) Make sure that the absolute maximum ratings of the external components and of this IC are not exceeded. 4) The DC/DC converter characteristics depend greatly on the externally connected components as well as on the characteristics of this IC, so refer to the specifications and standard circuit examples of each component when carefully considering which components to select. Be especially careful of the capacitor characteristics and use B characteristics (JIS standard) or X7R, X5R (EIA standard) ceramic capacitors. The capacitance decrease caused by the bias voltage may become remarkable depending on the external size of the capacitor. 5) The ripple voltage could be increased when switching from discontinuous conduction mode to Continuous conduction mode. Especially when the input / output potential difference voltage is low, the ripple voltage may increase. Please evaluate IC well on customer’s PCB. 6) If the voltage at the EN/SS Pin does not start from 0V but it is at the midpoint potential when the power is switched on, the soft-start function may not work properly and it may cause the larger inrush current. 7) The actual coil current may exceed the current limit value due to internal propagation delay. 8) When the voltage difference between input voltage and output voltage is low, the load regulation may be deteriorated by being limited by MAXDUTY. 9) In order to drive the IC normally, supply a stable input voltage to the V IN pin after reducing the AC impedance due to the bypass capacitor. In particular, if the amplitude of the input voltage fluctuates by 7V or more and ±0.4V/μs or more, there is a possibility that the UVLO function malfunctions due to fluctuations of the internal power supply of the IC. In that case, switching is stopped in a protected state that prevents false pulse output from the Lx pin. After that, the soft start function gets started, it shifts to normal operation. If the input voltage fluctuates momentarily, take measures such as increasing the input capacitance. 10) Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 14/28 XC9280 Series ■NOTE ON USE (Continued) 10) Instructions of pattern layouts The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high, please place the input capacitor(CIN) and the output capacitor (CL) as close to the IC as possible. (1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN and GND pins. (2) Please mount each external component as close to the IC as possible. (3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. (4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. (5) Please note that internal driver Tr. bring on heat because of the load current and ON resistance of High-side driver Tr., Low-side driver Tr.. (6) Please note that Tj should be lower than 125℃. If it exceeds the value calculated from the following calculation formula, the thermal shutdown will operate due to the heat generation of the IC due to safety. Reference Pattern LayoutθJA= 64[℃/W] Calculated values may not match actual operation depending on usage environment, usage conditions, transient conditions, etc. Please evaluate IC well on customer’s PCB. <DC Maximum Output Voltage vs. Operating Ambient Temperature> P_loss=VOUT×IOUT×(1/EFFI-1)[W] θJA=64 [℃/W] Tj(Operating junction Temperature)≦125[℃] Operating Ambient Temperature =Tj-θJA×P_loss Top Layer (1) Middle Layer (2,3) Bottom Layer (4) Board : Dimensions 50mm×60mm(4 layer) Copper thickness : 35μm Material : Glass Epoxy (FR-4) Thickness :1.6mm θJA=64 [℃/W] 15/28 XC9280 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output current XC9280 (V IN =12V, V OUT=3.3V) XC9280 (V IN =12V, V OUT=5.0V) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) 100 90 90 Efficiency :EFFI[%] Efficiency :EFFI[%] CL =22μ F *2parallel(C3216X5R1E226M) 100 80 70 60 50 40 30 VIN=12V(Continuous IOUT) 20 VIN=12V(Instantaneous IOUT) 70 60 50 40 30 VIN=12V(Continuous IOUT) 20 VIN=12V(Instantaneous IOUT) 10 10 0 0.001 80 0.01 0.1 1 0 0.001 10 0.01 0.1 1 10 Output Current :IOUT[A] Output Current :IOUT[A] (2) Output Voltage vs. Output Current XC9280 (V IN =12V, V OUT=1.8V) XC9280 (V IN =12V, V OUT=5.0V) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *3parallel(C3216X5R1E226M) L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) 5.2 Output Voltage : V OUT[V] 100 Efficiency :EFFI[%] 90 80 70 60 50 40 30 VIN=12V(Continuous IOUT) 20 VIN=12V(Instantaneous IOUT) 5.1 5.0 4.9 4.8 VIN=12V(Continuous IOUT) 4.7 VIN=12V(Instantaneous IOUT) 10 0 0.001 0.01 0.1 1 4.6 0.001 10 10 CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *3parallel(C3216X5R1E226M) 3.4 2.0 Output Voltage : V OUT[V] Output Voltage : V OUT[V] 1 L=2.2μ H(CLF7045T2R2N) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) 3.3 3.2 3.1 VIN=12V(Continuous IOUT) 3.0 VIN=12V(Instantaneous IOUT) 2.9 0.01 0.1 Output Current :IOUT[A] 16/28 0.1 XC9280 (V IN =12V, V OUT=1.8V) XC9280 (V IN=12V, V OUT =3.3V) 2.8 0.001 0.01 Output Current :IOUT[A] Output Current :IOUT[A] 1 10 1.9 1.8 1.7 VIN=12V(Continuous IOUT) 1.6 VIN=12V(Instantaneous IOUT) 1.5 1.4 0.001 0.01 0.1 Output Current :IOUT[A] 1 10 XC9280 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Ripple Voltage vs. Output Current XC9280 (V IN =12V, V OUT=3.3V) XC9280 (V IN =12V, V OUT=5.0V) 100 100 90 Ripple Voltage :V r [mV] Ripple Voltage :V r [mV] L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) 80 70 60 50 40 30 20 90 80 70 60 50 40 30 20 10 10 0 0.001 0.01 0.1 1 0 0.001 10 0.01 Output Current :IOUT [A] XC9280 (V IN =12V, V OUT=1.8V) 1 10 (4) FB Voltage vs. Ambient Temperature L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *3parallel(C3216X5R1E226M) XC9280 VIN =12V 0.760 100 90 80 FB Voltage :V FB[V] Ripple Voltage :V r [mV] 0.1 Output Current :IOUT [A] 70 60 50 40 30 0.755 0.750 0.745 20 10 0.740 0 0.001 0.01 0.1 1 -50 10 -25 Output Current :IOUT [A] (5) UVLO Voltage vs. Ambient Temperature 0 25 50 75 100 Ambient Temperature :Ta[℃] (6) Oscillation Frequency vs. Ambient Temperature XC9280 XC9280 VIN =12V 1.5 Oscillation Frequency:f OSC [MHz] UVLO Voltage :V UVLO1,V UVLO2[V] 3.5 3.4 3.3 3.2 VUVLO1(DetectVoltage) VUVLO2(ReleaseVoltage) 3.1 125 3.0 1.4 1.3 1.2 1.1 1.0 0.9 -50 -25 0 25 50 75 Ambient Temperature :Ta[℃] 100 125 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] 17/28 XC9280 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) Stand-by Current vs. Ambient Temperature (8) Lx SW ON Resistance vs. Ambient Temperature XC9280 XC9280 VIN =12V VIN =12V 0.25 Lx SW ON Resistance :RON [Ω] Stand-by Current :ISTB[μ A] 5.0 4.0 3.0 2.0 1.0 0.20 0.15 0.10 Highside SW 0.05 Lowside SW 0.00 0.0 -50 -25 0 25 50 75 100 Ambient Temperature :Ta[℃] -50 125 (9) Quiescent Current vs. Ambient Temperature -25 0 25 50 75 100 Ambient Temperature :Ta[℃] (10) Internal Soft-Start Time vs. Ambient Temperature XC9280 XC9280 VIN =12V 150 VIN =12V 2.0 Internal Soft-StartTime :tSS1[ms] Quiescent Current :Iq[μ A] 125 125 100 75 50 25 1.5 1.0 0.5 0.0 0 -50 -25 0 25 50 75 100 -50 125 -25 Ambient Temperature :Ta[℃] (11) External Soft-Start Time vs. Ambient Temperature 0 25 50 75 100 Ambient Temperature :Ta[℃] 125 (12) PFM Current vs. Ambient Temperature XC9280 L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) XC9280 VIN =12V, R SS=430kΩ, CSS=0.47μ F 30 25 20 1.4 1.3 1.2 1.1 1.0 15 -50 -25 0 25 50 75 Ambient Temperature :Ta[℃] 18/28 VIN =12V 1.5 PFM Current :IPFM[A] External lSoft-StartTime :tSS2[ms] 35 100 125 -50 -25 0 25 50 75 Ambient Temperature :Ta[℃] 100 125 XC9280 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (13) EN/SS Voltage vs. Ambient Temperature (14) IOUT-VIN Operation Area XC9280 (V OUT =5.0V) L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) XC9280 VIN =12V 4.0 18 T a=25℃ (Continuous) 3.0 Input Voltage:V IN[V] EN/SS Voltage :VEN/SS[V] EN/SS"H" EN/SS"L" 2.0 1.0 0.0 Ta=60℃ (Continuous) 17 T a=25℃ (Instantaneous) T a=60℃ (Instantaneous) 9 Operation Area 8 7 6 -50 -25 0 25 50 75 100 Ambient Temperature :Ta[℃] 125 0.0 0.5 XC9280 (V OUT =3.3V) 13.2 13.2 T a=25℃ (Continuous) Input Voltage:V IN[V] Input Voltage:V IN[V] T a=60℃ (Continuous) Ta=25℃ (Instantaneous) T a=60℃ (Instantaneous) Operation Area 6 3.0 L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *3parallel(C3216X5R1E226M) 18 17 2.5 XC9280 (V OUT =1.8V) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) 5 T a=25℃ (Continuous) 12 T a=60℃ (Continuous) 11 Ta=25℃ (Instantaneous) 10 T a=60℃ (Instantaneous) 9 Operation Area 8 7 6 5 4 4 0.0 1.0 1.5 2.0 Output Current:Iout[A] 0.5 1.0 1.5 2.0 Output Current:Iout[A] 2.5 0.0 3.0 (15) VOUT-VIN Operation Area 0.5 1.0 1.5 2.0 Output Current:Iout[A] 2.5 3.0 (16) IOUT Transient Operation Area XC9280 VIN =12V, VOUT=1.8V,3.3V,5.0V IOUT=0mA→ IOUTMAX,θJA=64[℃/W] 18 3.5 16 3.0 Maxmum Output Current:IOUT MAX [A] Input Voltage:V IN[V] XC9280 14 Operation Area 12 10 8 2.5 2.0 1.5 1.0 0.01s 0.1s 6 0.5 4 0.0 1s DC 1.0 2.0 3.0 4.0 5.0 6.0 Output Voltage:V out[V] 7.0 8.0 -50 -25 0 25 50 75 100 Ambient Temperature :Ta[℃] 125 19/28 XC9280 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (17-1) Load Transient Response (VOUT=5.0V) XC9280 XC9280 (V IN=12V, V OUT =5.0V, IOUT =1.0A⇔2.0A) (V IN=12V, V OUT =5.0V, IOUT =0.5A⇔1.5A) L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) CL =22μ F *2parallel(C3216X5R1E226M) 100μ s/div 100μ s/div V OUT : 500mV/div V OUT : 500mV/div IOUT =0.5A⇔1.5A( Slew rate=1.0A/μ sec ) IOUT =1.0A⇔2.0A ( Slew rate=1.0A/μ sec) XC9280 XC9280 (V IN=12V, V OUT =5.0V, IOUT =1.5A⇔3.0A) (V IN=12V, V OUT =5.0V, IOUT =0.1A⇔3.0A) L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) 100μ s/div V OUT : 500mV/div IOUT =1.5A⇔3.0A (Slew rate=1.0A/μ sec) 20/28 100μ s/div V OUT : 500mV/div IOUT =0.1A⇔3.0A( Slew rate = 3.0A / 50μ sec ) XC9280 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (17-2) Load Transient Response (VOUT=3.3V) XC9280 XC9280 (V IN=12V, V OUT =3.3V, IOUT =1.0A⇔2.0A) (V IN=12V, V OUT =3.3V, IOUT =0.5A⇔1.5A) L=2.2μ H(CLF7045T2R2N) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) V OUT : 500mV/div 100μ s/div 100μ s/div V OUT : 500mV/div IOUT =1.0A⇔2.0A (Slew rate=1.0A/μ sec) IOUT =0.5A⇔1.5A (Slew rate=1.0A/μ sec) XC9280 XC9280 (V IN=12V, V OUT =3.3V, IOUT =1.5A⇔3.0A) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) V OUT : 500mV/div IOUT =1.5A⇔3.0A (Slew rate=1.0A/μ sec) (V IN=12V, V OUT =3.3V, IOUT =0.1A⇔3.0A) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) 100μ s/div 100μ s/div V OUT : 500mV/div IOUT =0.1A⇔3.0A (Slew rate = 3.0A / 50μ sec) 21/28 XC9280 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (17-3) Load Transient Response (VOUT=1.8V) XC9280 XC9280 (V IN=12V, V OUT =1.8V, IOUT =1.0A⇔2.0A) (V IN=12V, V OUT =1.8V, IOUT =0.5A⇔1.5A) L=2.2μ H(CLF7045T2R2N) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *3parallel(C3216X5R1E226M) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *3parallel(C3216X5R1E226M) 100μ s/div V OUT : 500mV/div 100μ s/div V OUT : 500mV/div IOUT =1.0A⇔2.0A (Slew rate=1.0A/μ sec) IOUT =0.5A ⇔ 1.5A (Slew rate=1.0A/μ sec) XC9280 XC9280 (V IN=12V, V OUT =1.8V, IOUT =1.5A⇔3.0A) (V IN=12V, V OUT =1.8V, IOUT =0.1A⇔3.0A) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *3parallel(C3216X5R1E226M) CL =22μ F *3parallel(C3216X5R1E226M) 100μ s/div V OUT : 500mV/div 100μ s/div V OUT : 500mV/div IOUT =1.5A ⇔ 3.0A (Slew rate=1.0A/μ sec) IOUT =0.1A ⇔ 3.0A (Slew rate = 3.0A / 50μ sec) 22/28 XC9280 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (18) Input Transient Response XC9280 XC9280 (V IN=11.5V⇔13.5V, V OUT=5.0V, IOUT=1.0A) (V IN=11.5V⇔13.5V, V OUT=3.3V, IOUT=1.0A) L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) L=2.2μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) 100μ s/div 100μ s/div VIN=11.2V⇔13.2V( Slew rate = 2.0V / μ sec ) V IN=11.2V⇔13.2V(Slew rate = 2.0V / μ sec) V OUT : 100mV/div V OUT : 100mV/div XC9280 (V IN=11.5V⇔13.5V, V OUT=1.8V, IOUT=1.0A) L=2.2μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *3parallel(C3216X5R1E226M) 100μ s/div VIN=11.2V⇔13.2V (Slew rate = 2.0V / μ sec) V OUT : 100mV/div 23/28 XC9280 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (19) EN/SS Rising Response XC9280 XC9280 (V IN=12V, V CE =0→12V, V OUT =5.0V, IOUT =1.0A) (V IN=12V, V CE =0→12V, V OUT =3.3V, IOUT =1.0A) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) L=3.3μ H(CLF7045T3R3N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) 200μ s/div EN/SS=0V→12V(Slew rate = 12V / μ sec) EN/SS=0V→12V(Slew rate = 12V / μ sec) V OUT : 2.0V/div V OUT : 2.0V/div XC9280 (V IN=12V, V CE =0→12V, V OUT =1.8V, IOUT =1.0A) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *3parallel(C3216X5R1E226M) 200μ s/div EN/SS=0V→12V(Slew rate = 12V / μ sec) V OUT : 2.0V/div 24/28 200μ s/div XC9280 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (20) Output Voltage vs. Output Current XC9280 XC9280 (V IN=12V, V OUT =5.0V) (V IN=12V, V OUT =3.3V) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ fF *2parallel(C3216X5R1E226M) L=3.3μ H(CLF7045T3R3N) 6.0 3.5 5.0 3.0 Output Voltage : V OUT[V] Output Voltage : V OUT[V] CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) 4.0 -50℃ 3.0 25℃ 60℃ 2.0 1.0 2.5 -50℃ 2.0 25℃ 1.5 60℃ 1.0 0.5 0.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 Output Current :IOUT[A] 6.0 7.0 0.0 1.0 XC9280 4.0 5.0 6.0 7.0 XC9280 (V OUT =5.0V) L=3.3μ H(CLF7045T3R3N) L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) CL =22μ F *3parallel(C3216X5R1E226M) 6.0 2.0 5.0 1.6 1.2 Output Voltage : V OUT[V] Output Voltage : V OUT[V] 3.0 Output Current :IOUT[A] (V IN=12V, V OUT =1.8V) -50℃ 25℃ 0.8 60℃ 0.4 0.0 4.0 7.0V 3.0 12V 18V 2.0 1.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 Output Current :IOUT[A] 6.0 7.0 0.0 1.0 2.0 3.0 4.0 5.0 Output Current :IOUT[A] XC9280 XC9280 (V OUT =3.3V) (V OUT =1.8V) L=2.2μ H(CLF7045T2R2N) 2.0 3.5 Output Voltage : V OUT[V] 3.0 2.5 7.0V 2.0 12V 1.5 18V 1.0 0.5 6.0 7.0 L=2.2μ H(CLF7045T2R2N) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *3parallel(C3216X5R1E226M) CIN=10μ F *2parallel(C2012X5R1E106K) CL =22μ F *2parallel(C3216X5R1E226M) Output Voltage : V OUT[V] 2.0 1.6 6.2V 1.2 12V 0.8 0.4 0.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 Output Current :IOUT[A] 6.0 7.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Output Current :IOUT[A] 7.0 25/28 XC9280 Series ■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLIN / LAND PATTERN THERMAL CHARACTERISTICS TSOT-26 TSOT-26 PKG TSOT-26 Power Dissipation 26/28 XC9280 Series ■MARKING RULE TSOT-26 5 6 4 ① ② ③ ④ ⑤ 1 2 3 ①,②,③ Type、Oscillation Frequency Mark ① ② ③ 1 1 A Type Oscillation Frequency Product Series A 1.2MHz XC9280A75CYR-G ④,⑤ represents production lot number 01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ repeated (G,I,J,O,Q,W excluded)* No character inversion used. 27/28 XC9280 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 28/28
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