TB67S142NG
Toshiba BiCD Process Integrated Circuit Silicon Monolithic
TB67S142NG
Clock controlled Unipolar stepping motor driver
NG
The TB67S142NG is a Clock controlled PWM chopping type 2 phase
unipolar stepping motor driver. Using the BiCD process, the TB67
S142NG can be operated with VM voltage of 45V, output voltage
of 84V, and output current of 3.0A at max (absolute maximum ratings).
Features
P-SDIP24-0723-1.78-001
Weight 1.29(g) (typ.)
・BiCD processed monolithic integrated circuit.
・Capable of operating one unipolar stepping motor.
・PWM controlled constant current drive.
・Full, half(a), quarter step resolution.
・Low on resistance(0.25Ω(typ.) output MOSFET.
・High voltage and current (For specification, please refer to the absolute maximum ratings and operation ranges).
・Brake mode function
・Standby (low power) mode function
・Error detect feedback signal output function (Over current/Thermal shutdown).
・Error detect function (Thermal shutdown(TSD), Over current(ISD), and Low voltage(POR).
・Built-in VCC regulator for internal circuit use.
・Fixed off time can be adjusted by external components.
Note) Please be careful about the thermal conditions during use.
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TB67S142NG
Pin assign (TB67S142NG)
(Top View)
VCC
1
24
VM
VREF
2
23
GND
OSCM
3
22
VCOM
ERR
4
21
OUTB+
ALM
5
20
RSGNDB
MO
6
19
OUTB-
DMODE1
7
18
OUTA-
DMODE2
8
17
RSGNDA
RESET
9
16
OUTA+
CLK
10
15
NC
ENABLE
11
14
GND
CW/CCW
12
13
BRAKE
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TB67S142 block diagram
RESET
ENABLE
Ach
Polarity and Angle control
CW/CCW
MO
VREF
Ach
Pre
OUT
drv
Nch×2
VREF
External brake
Error detect
(TSD/ISD)
POR
Pre TSD
VCC regulator
RS Comp
CLK
BRAKE
Step Resolution Control
DMODE2
ERR
ALM
VCOM
Bch
DMODE1
RSGNDA
Control
Internal OSC
VM
VCC
OUT A-
RS Comp
STANDBY
OSCM
OUT A+
Bch
Pre
OUT
drv
Nch×2
OUT B+
OUT BRSGNDB
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.
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Application Notes
All the grounding wires of the device must run on the solder mask on the PCB and be externally terminated at
only one point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VDD(VM) and GND traces, to avoid short circuits
across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently
damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power
supply pins (VM, RSGND, OUT, GND) through which a particularly large current may run. If these pins are
wired incorrectly, an operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current
running through the IC that is larger than the specified current.
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Pin explanations
TB67S142NG (WQFN48)
Pin No.1 to 24
Pin No.
Pin Name
Function
1
VCC
Internal VCC regulator monitor pin
2
VREF
Constant current threshold set pin
3
OSCM
Fixed off time set pin
4
ERR
Error detect feedback signal output pin
5
ALM
Thermal alarm output pin
6
MO
Electrical angle monitor pin
7
DMODE1
Step setting pin 1
8
DMODE2
Step setting pin 2
9
RESET
Electrical angle reset pin
10
CLK
External Clock input pin
11
ENABLE
Motor output ON/OFF pin
12
CW/CCW
Clock-wise/Counter Clock-wise setting pin
13
BRAKE
14
GND
15
NC
16
OUTA+
17
RSGNDA
18
OUTA-
Motor output
A-pin
19
OUTB-
Motor output
B-pin
20
RSGNDB
21
OUTB+
Motor output
22
VCOM
Common pin
23
GND
24
VM
Brake input pin
Ground pin
Non connection
Motor output
A+ pin
Ach current sense ground pin
Bch current sense ground pin
B+ pin
Ground pin
VM power supply pin
(*) Note:
・Please do not run patterns under NC pins.
・Please connect the pins with the same pin name, while using the device.
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INPUT/OUTPUT Equivalent circuit
DMODE1
Input / Output
Equivalent circuit
Input
DMODE2
Logic input (VIH/VIL)
CLK
VIH: 2.0V(min) to 5.5V(max)
CW/CCW
RESET
ENABLE
1kΩ
Logic
100kΩ
Pin name
VIL : 0V(min) to 0.8V(max)
GND
BRAKE
Logic
Output
ERR
ALM
MO
Logic output (VOH/VOL)
(Pullup resistance :10k to 100kΩ)
GND
VCC
VCC
VREF
VCC voltage range
4.75V(min) to 5.0V(typ.) to 5.25V(max)
1kΩ
VREF
VREF input voltage range
0V to 4.0V (Constant current control)
VCC short(Constant current control : off)
GND
0.82MHz(min)
8.2MHz(max)
to
3.2MHz(typ.)
500Ω
OSCM
1kΩ
OSCM
OSCM frequency setup (reference)
to
(R_OSCM=3.9kΩ to 10kΩ to 39kΩ)
GND
VCOM
OUT A+
OUT A-
10V(min) to 40V(max)
RSGNDA
OUT pin voltage range
RSGNDB
VCOM
(-) pin
(+) pin
VM voltage range
OUT B+
OUT B-
OUTPUT
OUTPUT
10V(min) to 80V(max)
RSGND
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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TB67S142 function explanation
CLK function
The CLK pin controls the rotation speed of the motor. Each CLK signal will shift the motor’s electrical angle per step,
due to each up-edge of the CLK signal.
CLK
Function
↑ (Low to High)
Shifts the electrical angle per step.
↓ (High to Low)
－ (State of the electrical angle does not change.)
ENABLE function
The ENABLE pin controls the ON and OFF of the corresponding output stage. (For accurate operation, please
set the ENABLE to ‘Low( during VM power-on and power-off sequence.
ENABLE
Function
High
Output stage=’ON’ (Normal operation mode)
Low
Output stage=’OFF’ (High impedance mode)
CW/CCW function
The CW/CCW pin controls the rotation direction of the motor.
CW/CCW
Function
High
Clock-wise (CW)
Low
Counter Clock-wise (CCW)
When set to ‘CW’, the Ach current phase leads the Bch current phase by 90°.
When set to ‘CCW’, the Bch current phase leads the Ach current phase by 90°.
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RESET function
The RESET pin controls the resetting of the internal electrical angle. (For accurate operation,
please set the RESET pin to ‘High’ during VM power-on. Switch the RESET to ‘Low’, once the
VM voltage has reached the operation range.)
RESET
Function
High
Sets the electrical angle to the initial position.
Low
Normal operation
The current setting for each channel (while RESET is applied) is shown in the table below.
MO pin level will show ‘Low’ level at this time.
Step resolution setting
Ach current
Bch current
Electrical angle
Full step
100%
100%
45°
Half step (a)
100%
100%
45°
Quarter step
71%
71%
45°
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DMODE (Step resolution setting) function
The DMODE pin controls the Standby mode and the step resolution setting.
DMODE1
DMODE2
Function
Low
Low
Standby mode (The internal oscillator is disabled and the output stage is set to
‘OFF’ status. The internal status is Full step, Torque100% (*))
Low
High
Full step
High
Low
Half step(a)
High
High
Quarter step
(*) [Full step, Torque 100%] written above shows the initial status of the logic. During Standby mode, the internal
oscillator and output stage is set to OFF, therefore does not mean that the device will operate at [Full step, Torque 100%].
Standby mode function
Setting all of the DMODE pins(DMODE1,DMODE2) to Low will set the device to Standby mode. During Standby mode,
the internal bias current is cut so that the device be set to low power mode. Also, setting the device to Standby mode
will release the error detection such as TSD and ISD.
Standby mode
Function
ON (DMODE1,2=L,L)
Standby mode : ON (Low power mode)
OFF (other than DMODE1,2=L,L)
Standby mode: OFF (Normal operation)
After the device detects an error such as TSD or ISD, setting the device to Standby mode to OFF and then ON again
will release the error detect latch signal. (Reasserting the VM power will also release the error detect latch signal.)
Note) After setting the Standby mode: OFF, the internal circuit will restart from low power mode. During the
startup period (10μs after setting the Standby mode : OFF), please do not send any control signals. (If the
signal is sent to the device during the startup period, the device may not be able to accept the signal correctly.)
Step resolution and current ratio
Characteristics
Full
Step resolution setting
Half(a)
Quarter
○
Current
Ratio
○
-
Step
Typ.
○
θ32
100
○
θ16
71
○
θ8
38
○
θ0
0
Unit
%
○
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BRAKE mode function
OUTA-
OUTA+
OUTB-
OUTB+
VCOM
RSGNDA
RSGNDB
Equivalent circuit(s) may be omitted for explanatory purpose.
BRAKE
Function
H
Brake mode: ON
L
Brake mode: OFF (Normal operation)
(During Constant current control; VREF≤4.0V)
Internal phase status when BRAKE is set to ‘High’
IOUT=+100% to 0%
IOUT=-100% to 0%
IOUT
+100%
-100%
Note)
If CLK is sent to the device while BRAKE is set to ‘High’, the internal electrical angle (current ratio) status
will be shifted as normal.
The current ratio will be set to 100% while BRAKE is set to ‘High’.
The current is mentioned as +(plus) when OUT+ is turned on at Charge status, and –(minus) when OUT- is turned on.
(During Constant current control “off”; VREF-VCC direct connected)
When BRAKE is set to ‘High’; All four output MOSFETs(OUTA+,A-,B+,B-) will turn on.
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Monitor pin functions (MO feedback)
MO
Function
Hi-Z (*)
- (Other than the initial angle)
Low
Initial electrical angle
(*) The MO pin is an open drain logic output. To use the function correctly, please make sure the MO
pin is connected to 3.3V or 5.0V with a pull-up resistance. If the internal electrical angle is at the initial angle,
the pin level will be Low (internal MOSFET: ON). If the internal electrical angle is not at the initial angle,
the pin level will be Hi-Z (internal MOSFET:OFF) (it will show High level when pulled up correctly).
Please refer to the ‘RESET function’ for the initial angle.
MO pin should be left open; when not using the MO feedback function.
3.3V or 5V
Pull-up resistance
(10kΩ to 100kΩ)
MO pin
MO logic
[MO MOSFET]
ON：Initial angle
OFF：Other than the initial angle
Equivalent circuit(s) may be omitted for explanatory purpose.
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Monitor pin functions (ERR feedback)
ERR
Function
Hi-Z (*)
Normal operation
Low
Error detected (TSD or ISD)
(*) The ERR pin is an open drain logic output. To use the function correctly, please make sure the ERR
pin is connected to 3.3V or 5.0V with a pull-up resistance. During normal operation, the pin level will be
Hi-Z (internal MOSFET:OFF) (it will show High level when pulled up), and once an error (TSD or ISD) has
been detected, the pin level will be Low (internal MOSFET: ON).
Reasserting the VM power supply or using the STBY function, the ERR pin will return to the initial status
(internal MOSFET: OFF).
ERR pin should be left open; when not using the ERR feedback function.
3.3V or 5V
Pull-up resistance
(10kΩ to 100kΩ)
ERR pin
ERR logic
[ERR MOSFET]
ON: TSD or ISD detected
OFF: Normal operation
Equivalent circuit(s) may be omitted for explanatory purpose.
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Monitor pin functions (Thermal ALM feedback)
ALM
Function
Hi-Z (*)
Normal operation
Low
Thermal Alarm detected
(*) The ALM pin is an open drain logic output. To use the function correctly, please make sure the ALM
pin is connected to 3.3V or 5.0V with a pull-up resistance. During normal operation, the pin level will be
Hi-Z (internal MOSFET:OFF) (it will show High level when pulled up), and once the device detects a
temperature rise, the pin level will be Low (internal MOSFET: ON).
The ALM is an auto recovery type output. Once the device reaches the ALM detect threshold(120°C±15°C),
the pin level will show Low (internal MOSFET:ON), and after the device reaches the ALM release threshold
(‘detect threshold’-30°C), the pin level will show Hi-Z (internal MOSFET:OFF) (it will show High level when
pulled up)
ALM pin should be left open; when not using the thermal ALM feedback function.
Pull-up voltage
(3.3V or 5V)
ALM pin
GND
90°C(±15°C)
120°C(±15°C)
3.3V or 5V
Pull-up resistance
(10kΩ to 100kΩ)
ALM pin
ALM logic
[ALM MOSFET]
ON: ALM detect threshold
OFF: Normal operation
or ALM release threshold
Timing charts may be simplified for explanatory purpose.
Equivalent circuit(s) may be omitted for explanatory purpose.
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TB67S142 setup
Constant-current threshold setting
The constant-current threshold can be set by VREF voltage.
IOUT(max)=VREF × 3/4
Example: Current setting 100%, VREF=2.0V: The constant current thredhold(peak current) will be as shown below.
IOUT = 2.0×3/4=1.5A
To set the constant-current function ‘off’, connect the VCC and VREF pin directly (do not use any external power supply).
Also, please be careful about the thermal conditions during use.
Fixed off time setting
To set the fixed off time for constant-current PWM control, please connect a pull-down resistance to the OSCM pin.
The relation between the pull-down resistance(ROSCM) and fixed off time is as shown below.
(For reference)
Pull-down resistance (ROSCM)
Fixed off time (toff)
3.9kΩ
4.7kΩ
5.6kΩ
6.8kΩ
8.2kΩ
10kΩ
15kΩ
18kΩ
22kΩ
27kΩ
39kΩ
4.1μs
4.9μs
5.8μs
7.0μs
8.3μs
10μs
15μs
18μs
21μs
26μs
37μs
Note) The value shown in the graph above does not include any dispersion of the device / external components.
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TB67S142NG
Absolute maximum ratings（Ta=25°C）
Characteristics
Symbol
Rating
Unit
VM(max)
45
V
VM-VCOM voltage differential
VDIFF(max)
45
V
Motor output voltage
VOUT(max)
84
V
Motor output current (per channel)
IOUT(max)
3.0
A
Internal logic power supply
VCC(max)
6.0
V
VIN(H)(max)
6.0
V
VIN(L)(min)
-0.4
V
VREF input voltage
VREF(max)
6.0
V
Open drain output pin (ERR,ALM,MO) voltage
VOD(max)
6.0
V
Open drain output pin (ERR,ALM,MO) inflow current
IOD(max)
20
mA
Power dissipation (WQFN48; device alone)
PD
1.78
W
Operating temperature
Topr
-20 to 85
°C
Storage temperature
Tstr
-55 to 150
°C
Junction temperature
Tj(max)
150
°C
Motor power supply
Logic input voltage
Caution）Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in
injury by explosion or combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under
any circumstances. The device does not have overvoltage detection circuit. Therefore, the device is
damaged if a voltage exceeding its rated maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and
considerations described later should also be referred to.
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Operation ranges
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Motor power supply
VM
-
10
-
40
V
Motor output voltage
VOUT
-
10
-
80
V
Motor output current (per channel)
IOUT
Ta=25°C
-
1.0
-
A
Internal logic power supply
VCC
-
4.75
5.0
5.25
V
VIN(H)
Logic input high level
2.0
-
5.5
V
VIN(L)
Logic input low level
0
-
0.8
V
VREF input voltage range
VREF(range)
-
GND
-
5.5
V
Open drain pin voltage range
VOD(range)
ERR,ALM,MO pin
3.0
-
5.5
V
Open drain pin inflow current range
IOD(range)
ERR,ALM,MO pin
-
-
10
mA
Internal oscillator frequency range
fOSCM(range)
-
820
3200
8200
kHz
tOFF(range)
-
5
10
40
μs
Logic input voltage
Fixed off time range
Note) Please use the device with extra margin regarding the absolute maximum ratings.
Note) Please be careful about the thermal conditions during use.
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Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Min
Typ.
Max
Unit
VIH
Logic input pin High level (*)
2.0
-
5.5
V
VIL
Logic input pin Low level (*)
GND
-
0.8
V
VIN(HYS)
Logic input pin (*)
100
-
300
mV
High
IIN(H)
Logic input voltage High level (VIN=VIH)
-
33
55
μA
Low
IIN(L)
Logic input voltage Low level (VIN=VIL)
-
-
1
μA
IM1
Output pins=open, Standby mode
-
-
1.0
mA
-
3.0
5.0
mA
0
-
0.5
V
-5
0
+5
%
Logic input voltage
Logic input
hysteresis voltage
Logic input current
Test condition
Power consumption
Open drain output
pin voltage
Motor current
channel differential
Motor current setting
accuracy
Source-drain diode
forward voltage
Motor output off leak
current
IM2
VOD(L)
⊿IOUT1
Output pins=open, Normal operation
Full step resolution
IOD=10mA
Current differential between channels
(IOUT=1.0A)
⊿IOUT2
IOUT=1.0A
-6
0
+6
%
VFN
IOUT=2.0A
1.0
-
1.6
V
Ileak
VOUT=80V, Output MOSFET:OFF
-
-
1
μA
IOUT=2.0A
-
0.25
0.35
Ω
Motor output ON-resistance
RON
(Low side)
（D-S）
(*) VIN (H) is defined as the VIN voltage that causes the outputs (OUTA, OUTB) to change when a pin
under test is gradually raised from 0 V. VIN (L) is defined as the VIN voltage that causes the outputs (OUTA,
OUTB) to change when the pin is then gradually lowered. The difference between VIN (L) and VIN (H) is
defined as the VIN(HYS).
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Electrical Specifications 2 (Ta =25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
4.75
5
5.25
V
VCC regulator voltage
VCC
ICC=5.0mA
VCC regulator current
ICC
4.75V≤VCC≤5.25V
-
2.5
5.0
mA
VREF input current
IREF
VREF=2.0V
-
0
1.0
μA
Thermal shutdown(TSD） threshold (*)
TjTSD
-
140
155
170
°C
VCC recovery voltage
VCCR
-
3.5
4.0
4.5
V
VM recovery voltage
VMR
-
7.0
8.0
9.0
V
Over-current detection(ISD) threshold (*)
ISD
-
3.1
4.0
5.0
A
(*) About Thermal shutdown (TSD)
When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal
reset circuit then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection.
Once the TSD circuit is triggered; the detect latch signal can be cleared by reasserting the VM power source, or
setting the device to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore
is not recommended to be used aggressively.
(*) About Over-current detection (ISD)
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns
off the output transistors. Once the ISD circuit is triggered, the detect latch signal can be cleared by reasserting
the VM power source, or setting the device to standby mode. For fail-safe, please insert a fuse to avoid secondary
trouble.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the
motor current recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might
rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor
characteristics. It must be fully verified that there is no risk that the device or other components will
be damaged or fail due to the motor back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an
output short-circuit; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device
may be damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such condition
persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be removed
immediately by external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
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AC Electrical Specification (Ta =25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
CLK input frequency
Test condition
Min
Typ.
Max
Unit
-
-
100
kHz
fCLK
fOSCM=3200kHz
tCLK(twp)
-
50
-
-
ns
tCLK(twn)
-
50
-
-
ns
tr
-
50
100
150
ns
tf
-
50
100
150
ns
tpLH(CLK)
CLK→OUT
200
700
1200
ns
tpHL(CLK)
CLK→OUT
200
700
1200
ns
Analog noise blanking time
AtBLK
Analog tblank
250
400
550
ns
OSCM frequency
fOSCM
ROSC=10kΩ
2720
3200
3680
kHz
OSCS frequency
fOSCS
-
5120
6400
7680
kHz
Fixed off time
tOFF
fOSCM=3.2MHz
8.5
10
11.5
μs
Over current (ISD) detect
tISD(mask)
fOSCS(=6.4MHz)*8clk
1.0
1.25
1.5
μs
tTSD(mask)
fOSCS(=6.4MHz)*32clk
4.0
5.0
6.0
μs
tALM(mask)
fOSCS(=6.4MHz)*16clk
2.0
2.5
3.0
μs
Minimum CLK pulse width
Output MOSFET switching specific
Output MOSFET switching specific
masking time
Thermal shutdown (TSD) detect
masking time
Thermal Alarm(ALM) detect
masking time
AC specification timing chart
tCLK(twn)
[CLK]
50%
50%
50%
tCLK(twp)
fCLK
[OUT]
90%
tpLH(CLK)
50%
50%
10%
10%
90%
tr
tf
90%
[OUT]
50%
tpHL(CLK)
10%
Timing charts may be simplified for explanatory purpose.
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0.5V
3.3V
10kΩ
10kΩ
10kΩ
10kΩ
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
100μF
1
0.1μF
0.1μF
Application circuit example
ZD
M
24V
The application circuit above is an example; therefore, mass-production design is not guaranteed.
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Package dimensions (Unit:mm) : P-SDIP24-0723-1.78-001
Weight: 1.29(g)(typ.)
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Notes on Contents
Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
Timing Charts
Timing charts may be simplified for explanatory purposes.
Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required,
especially at the mass-production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device breakdown, damage or
deterioration, and may result in injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of
overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum
ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a
large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the effects of the flow of a
large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit
location, are required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent
device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative
current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use
a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function
may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of
power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may
cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion.
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is applied even just
once.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such
as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as from input or negative feedback condenser, the IC output DC voltage
will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure may
cause smoke or ignition. (The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay
attention when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly.
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Points to remember on handling of ICs
Overcurrent detection Circuit
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances.
If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the overcurrent
detection circuit to operate improperly or IC breakdown may occur before operation. In addition, depending on the method
of use and usage conditions, if overcurrent continues to flow for a long time after operation, the IC may generate heat
resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate
against the over-temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal
shutdown circuit to operate improperly or IC breakdown to occur before operation.
Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is
appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,
deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the
effect of IC heat radiation with peripheral components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power supply
owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply
and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take the
effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
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incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant
TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product
and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the
application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or
applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b)
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