TLP265J(TPL,E

TLP265J Photocouplers Infrared LED & Photo Triac TLP265J 1. Applications • Triac Drivers • Programmable Logic Controllers (PLCs) • AC-Output Modules • Solid-State Relays 2. General The TLP265J consists of a non zero crossing photo triac, optically coupled to an infrared LED. The TLP265J is housed in the SO6 package and guarantees a creepage distance of 5.0 mm (min), a clearance of 5.0 mm (min) and insulation thickness of 0.4 mm (min). Therefore, the TLP265J meets the reinforced insulation class requirements of international safety standards. 3. Features (1) Peak off-state voltage: 600 V (min) (2) Non zero crossing functionary (NZC) (3) Trigger LED current: 10 mA (max) (4) On-state current: 70 mA (max) (5) Isolation voltage: 3750 Vrms (min) (6) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1) CQC-approved: GB4943.1, GB8898 Japan and Thailand Factory Note 1: When a VDE approved type is needed, please designate the Option (V4) (V4). Trigger LED Current (Note) (Unless otherwise specified, Ta = 25 ) Table Rank IFT Rank Marking None 10 (IFT7) 7 Note: Trigger LED Current IFT (min) Trigger LED Current IFT (max) Unit VT = 6 V  10 mA VT = 6 V  7 Test Condition Specify both the part number and a rank in this format when ordering. Example: TLP265J (IFT7) For safety standard certification, however, specify the part number alone. Example: TLP265J Start of commercial production ©2012-2020 Toshiba Electronic Devices & Storage Corporation 1 2012-11 2020-03-17 Rev.11.0 TLP265J 4. Packaging and Pin Assignment 1: Anode 3: Cathode 4: Triac Terminal 6: Triac Terminal 11-4M1S 5. Mechanical Parameters Characteristics 2.54-mm pitch Unit Creepage distances 5.0 (min) mm Clearance distances 5.0 (min) Internal isolation thickness 0.4 (min) 6. Product Naming Conventions Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification is as below. Example) TLP265J(TPL,E Part number: TLP265J Tape type: TPL (Note 1) [[G]]/RoHS COMPATIBLE: E (Note 2) Note 1: At the part of tape type, below options are used. TPL, TPR Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. ©2012-2020 Toshiba Electronic Devices & Storage Corporation 2 2020-03-17 Rev.11.0 TLP265J 7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward current Input forward current derating (Ta ≥ 53 ) Note Rating Unit IF 50 mA ∆IF/∆Ta -0.7 mA/ 1 A 5 V Input forward current (pulsed) IFP Input reverse voltage VR Input power dissipation (Note 1) PD 100 mW ∆PD/∆Ta -1.4 mW/ Junction temperature Tj 125  Detector Off-state output terminal voltage VDRM 600 V Input power dissipation derating (Ta ≥ 53 ) R.M.S. on-state current (Ta = 25 ) IT(RMS) 70 mA R.M.S. on-state current (Ta = 70 ) IT(RMS) 40 mA R.M.S. on-state current derating (Ta ≥ 25 ) ∆IT(RMS)/∆Ta -0.67 mA/ 2 A ON-state current (pulsed) IONP (Note 2) Peak non-repetitive surge current ITSM (Note 3) 1.2 A PO 200 mW ∆PO/∆Ta -2.0 mW/ Tj 125  Topr -40 to 100  Tstg -55 to 125 Output power dissipation Output power dissipation derating (Ta ≥ 25 ) Junction temperature Common Operating temperature Storage temperature Lead soldering temperature Isolation voltage (10 s) Tsol AC, 60 s, R.H. ≤ 60 % BVS (Note 4) 260  3750 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) ≤ 100 µs, 100 pps Note 2: Pulse width (PW) ≤ 100 µs, 120 pps Note 3: Pulse width (PW) ≤ 10 ms Note 4: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4 and 6 are shorted together. 8. Recommended Operating Conditions (Note) Characteristics Symbol AC mains voltage Input forward current Note Min Typ. Max Unit VAC   240 V IF 15 20 25 mA ON-state current (pulsed) IONP   1 A Operating temperature Topr -25  85  Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. ©2012-2020 Toshiba Electronic Devices & Storage Corporation 3 2020-03-17 Rev.11.0 TLP265J 9. Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward voltage Note Test Condition Min Typ. Max Unit 1.27 1.4 V VF IF = 10 mA 1.0 Input reverse current IR VR = 5 V   10 µA Input capacitance Ct V = 0 V, f = 1 MHz  30  pF Detector Peak off-state current IDRM VDRM = 600 V  10 1000 nA Peak on-state voltage VTM ITM = 70 mA  1.7 2.8 V   1.0  mA Vin = 240 V, Ta = 85  See Fig. 9.1  500  V/µs Vin = 60 Vrms, IT = 15 mA See Fig. 9.1  0.2  Holding current IH Critical rate of rise of off-state voltage Critical rate of rise of commutating voltage (dv/dt) dv/dt dv/dt(c) Fig. 9.1 dv/dt Test Circuit and Waveform 10. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Note Test Condition Min Typ. Max Unit Trigger LED current IFT VT = 6 V   10 mA Turn-on time ton VD = 6 → 4 V, RL = 100 Ω, IF = Rated IFT × 1.5  20 100 µs Min Typ. Max Unit  0.8  pF 11. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Note Test Condition Total capacitance (input to output) CS (Note 1) VS = 0 V, f = 1 MHz Isolation resistance RS (Note 1) VS = 500 V, R.H. ≤ 60% 1012 1014  Ω (Note 1) AC, 60 s 3750   Vrms Isolation voltage BVS Note 1: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4 and 6 are shorted together. ©2012-2020 Toshiba Electronic Devices & Storage Corporation 4 2020-03-17 Rev.11.0 TLP265J 12. Characteristics Curves (Note) Fig. 12.1 IF - Ta Fig. 12.2 IT(RMS) - Ta Fig. 12.3 IF - VF Fig. 12.4 IFP - DR Fig. 12.5 IFP - VFP Fig. 12.6 Normalized IFT - Ta ©2012-2020 Toshiba Electronic Devices & Storage Corporation 5 2020-03-17 Rev.11.0 TLP265J Note: Fig. 12.7 Normalized IDRM - Ta Fig. 12.8 Normalized VDRM - Ta Fig. 12.9 Normalized IH - Ta Fig. 12.10 Normalized IF/IFT - IF_PW The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. ©2012-2020 Toshiba Electronic Devices & Storage Corporation 6 2020-03-17 Rev.11.0 TLP265J 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. • When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 13.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used • When using soldering flow Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds. Mounting condition of 260  within 10 seconds is recommended. Flow soldering must be performed once. • When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not exceeding 350  Heating by soldering iron must be done only once per lead. 13.2. Precautions for General Storage • Avoid storage locations where devices may be exposed to moisture or direct sunlight. • Follow the precautions printed on the packing label of the device for transportation and storage. • Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %, respectively. • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. • Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. • When restoring devices after removal from their packing, use anti-static containers. • Do not allow loads to be applied directly to devices while they are in storage. • If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. ©2012-2020 Toshiba Electronic Devices & Storage Corporation 7 2020-03-17 Rev.11.0 TLP265J 14. Land Pattern Dimensions (for reference only) (Unit: mm) 15. Marking (Note) Note: A different marking is used for photocouplers that have been qualified according to option (V4) of EN 60747. See Fig.16.3 and Fig.16.4. ©2012-2020 Toshiba Electronic Devices & Storage Corporation 8 2020-03-17 Rev.11.0 TLP265J 16. EN 60747-5-5 Option (V4) Specification • Part number: TLP265J (Note) • The following part naming conventions are used for the devices that have been qualified according to option (V4) of EN 60747. Example: TLP265J(V4-TPL,E V4: EN 60747 option TPL: Tape type E: [[G]]/RoHS COMPATIBLE (Note 1) Note: Use TOSHIBA standard type number for safety standard application. e.g., TLP265J(V4-TPL,E → TLP265J Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Fig. 16.1 EN 60747 Insulation Characteristics ©2012-2020 Toshiba Electronic Devices & Storage Corporation 9 2020-03-17 Rev.11.0 TLP265J Fig. 16.2 Insulation Related Specifications (Note) Note: Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e. g., at a standard distance between soldering eye centers of 3.5 mm). If this is not permissible, the user shall take suitable measures. This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 16.3 Marking on packing Fig. 16.4 Marking Example (Note) Note: The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN 60747. ©2012-2020 Toshiba Electronic Devices & Storage Corporation 10 2020-03-17 Rev.11.0 TLP265J Fig. 16.5 Measurement Procedure ©2012-2020 Toshiba Electronic Devices & Storage Corporation 11 2020-03-17 Rev.11.0 TLP265J Package Dimensions Unit: mm Weight: 0.08 g (typ.) Package Name(s) TOSHIBA: 11-4M1S ©2012-2020 Toshiba Electronic Devices & Storage Corporation 12 2020-03-17 Rev.11.0 TLP265J RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". 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