W972GG8JB-3ITR

Advanced Product / Process Change Notice No.: Z200-APCN-DM201504-01-Q Date: 05/08/2015 Change Title : 2Gb (256Mb x8 and 128Mb x16) DDR2 technology migration from 65nm to 46nm Change Classification:  Major  Minor Change item :  Design  Raw Material  Wafer FAB  Package Assembly  Testing  Others Affected Product(s) : W972GG8JB-18 , W972GG8JB18A , W972GG8JB18I , W972GG8JB-25 , W972GG8JB25A , W972GG8JB25I , W972GG8JB25K , W972GG8JB-3 , W972GG8JB-3A , W972GG8JB-3I , W972GG8JB-3K , W972GG6JB-18 , W972GG6JB18A , W972GG6JB18I , W972GG6JB-25 , W972GG6JB25A , W972GG6JB25I , W972GG6JB25K , W972GG6JB-3 , W972GG6JB-3A , W972GG6JB-3I , W972GG6JB-3K Description of Change(s) : Technology migration (65nm to 46nm ) for 2Gb DDR2. Reason for Change(s) : According to Winbond product roadmap , launch new 2Gb DDR2 with 46nm technology. Impact of Change(s) : ( positive & negative ) Form : No Change Fit : No Concern (Package size x16 from 11X13 MM^2 (65nm) to 8X12.5 MM^2 (46nm) / x8 from 11X11.5 MM^2 (65nm) to 8X12.5 MM^2 (46nm)), Refer to attachment II in details) Function : No Concern (Compatible between 65nm and 46nm) Reliability : On-going Hazardous Substances: No Concern (Please refer to attachment I) Qualification Plan/ Results : The new sample has passed ESD pass 2KV, latch-up pass 200mA and full qualification is in progress. The result is expected out on June/22/2015. Implementation Plan : The follow-up disposition of 65nm 256Mb x8 and 128Mb x16 DDR2: 1) The date of Last-buy orders for the 65nm 256Mb x8 and 128Mb x16 DDR2: July. 31, 2015. 2) The last shipment date of the 65nm 256Mb x8 and 128Mb x16 DDR2: October, 30, 2015.  Date Code: Originator: (QA Sec. Manager) onward  Lot No: onward Approval: (QA Dept. Manager)  Proposed first ship date: 04/30/2015 Approval: (QRA Director) The above information is the exclusive intellectual property of Winbond Electronics and shall not be disclosed, distributed or reproduced without permission from Winbond. Table No.: 1110-0001-08-A Contact for Questions & Concerns Name: Betty Huang TEL:886-3-5678168 (ext.86549) FAX: 886-3-5796124 Address : # 539, Sec. 2, Wenxing Rd., Jhubei City, Hsinchu County 302, Taiwan E-mail: Hyhuang8@winbond.com Customer Comments: Note: Please sign this notice, and return to Winbond contact within 30 days. If no response is received within 30 days, this Change Request will be assumed to meet your approval.  Approval  Disapproval  Conditional Approval : . Comment: Date: Dept. name: Person in charge: The above information is the exclusive intellectual property of Winbond Electronics and shall not be disclosed, distributed or reproduced without permission from Winbond. Table No.: 1110-0001-08-A DDR2 46nm 128Mb x16 PACKAGE SPECIFICATION DDR2 46nm 256Mb x8 PACKAGE SPECIFICATION Table 1. The comparison table of part no between T65 and T46 Product DDR2 256Mb x8 DDR2 128Mb x16 65nm Part No W972GG8JB W972GG6JB 46nm Part No W972GG8KB W972GG6KB