RFLPF1608050K0T

Approval sheet RFLPF Series – 1608(0603)- RoHS Compliance MULTILAYER CERAMIC LOW PASS FILTER Halogens Free Product 5 GHz Wireless Communication Band Working Frequency P/N: RFLPF1608050K0T *Contents in this sheet are subject to change without prior notice. Page 1 of 7 ASC_RFLPF1608050K0T_V01 Dec. 2011 Approval sheet FEATURES 1. Miniature footprint: 1.6 X 0.8 X 0.5 mm 2. Low Profile Thickness 3. Low Insertion loss 4. LTCC process 3 APPLICATIONS 1. 4900 – 5950 MHz band RF applications 2. 5G wireless communication system applications, WLAN, etc. CONSTRUCTION P1 P2 PIN Connection 1 Input port 2 GND 3 Output port 4 GND P4 P3 DIMENSIONS Figure Page 2 of 7 Symbol Dimension (mm) L 1.60 ± 0.15 W 0.80 ± 0.15 T 0.50 ± 0.10 A 0.45 ± 0.15 B 0.70 ± 0.15 C 0.20 ± 0.15 D 0.20 ± 0.15 E 0.25 ± 0.15 F 0.30 ± 0.15 ASC_RFLPF1608050K0T_V01 Dec. 2011 Approval sheet ELECTRICAL CHARACTERISTICS RFLPF1608050K0T Specification Frequency range (MHz) 4900 ~ 5950 MHz Insertion Loss (dB) 0.6 dB max. @ 4900 ~ 5950MHz VSWR 2.0 max Impedance (Ω) 50 Ω 25 dB@ 9800 MHz Attenuation (dB min.) 30 dB@ 11900 MHz 20 dB@ 17850 MHz (reference) Operation Temperature Range -40°C ~ +85°C Typical Electrical Chart 0 S-parameter (dB) -10 -20 -30 -40 S21 S11 -50 -60 4 6 8 10 12 14 16 18 Frequency (GHz) SOLDER LAND PATTERN SOLDER LAND PATTERN unit: mm Line width to de designed to match 50 Ω characteristic impedance, depending on PCB material and thickness. D1 and D2 are the grounding through holes. Page 3 of 7 ASC_RFLPF1608050K0T_V01 Dec. 2011 Approval sheet RELIABILITY TEST Test item Test condition / Test method Specification Solderability JIS C 0050-4.6 *Solder bath temperature：235 ± 5°C At least 95% of a surface of each terminal JESD22-B102D *Immersion time：2 ± 0.5 sec electrode must be covered by fresh solder. *Solder：Sn3Ag0.5Cu for lead-free Leaching *Solder bath temperature：260 ± 5°C Loss of metallization on the edges of each of metallization) *Leaching immersion time：30 ± 0.5 sec electrode shall not exceed 25%. IEC 60068-2-58 *Solder : SN63A (Resistance to dissolution Resistance to soldering heat *Preheating temperature：120~150℃, JIS C 0050-5.4 1 minute. No mechanical damage. Samples shall satisfy electrical specification *Solder temperature：270±5°C after test. *Immersion time：10±1 sec Loss of metallization on the edges of each electrode shall not exceed 25%. *Solder：Sn3Ag0.5Cu for lead-free Measurement to be made after keeping at room temperature for 24±2 hrs Drop Test JIS C 0044 *Height：75 cm No mechanical damage. *Test Surface：Rigid surface of concrete Samples shall satisfy electrical specification after test. or steel. *Times：6 surfaces for each units；2 times for each side. Adhesive Strength of Termination JIS C 0051- 7.4.3 Bending test JIS C 0051- 7.4.1 *Pressurizing force： 5N(≦0603)；10N(>0603) No remarkable damage or removal of the termination. *Test time：10±1 sec The middle part of substrate shall be No mechanical damage. pressurized by means of the pressurizing Samples shall satisfy electrical specification rod at a rate of about 1 mm/s per second after test. until the deflection becomes 1mm/s and then pressure shall be maintained for 5±1 sec. Measurement to be made after keeping at room temperature for 24±2 hours Page 4 of 7 ASC_RFLPF1608050K0T_V01 Dec. 2011 Approval sheet Temperature cycle JIS C 0025 1. 30±3 minutes at -40°C±3°C, No mechanical damage. 2. 10~15 minutes at room temperature, Samples shall satisfy electrical 3. 30±3 minutes at +85°C±3°C, 4. 10~15 minutes at room temperature, specification after test. Total 100 continuous cycles Measurement to be made after keeping at room temperature for 24±2 hrs Vibration JIS C 0040 *Frequency：10Hz~55Hz~10Hz(1min) No mechanical damage. *Total amplitude：1.5mm Samples shall satisfy electrical specification *Test times：6hrs.(Two hrs each in three after test. mutually perpendicular directions) High temperature JIS C 0021 *Temperature：85°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Humidity (steady conditions) *Humidity：90% to 95% R.H. No mechanical damage. *Temperature：40±2°C Samples shall satisfy electrical specification JIS C 0022 *Time：1000+24/-0 hrs. after test. Measurement to be made after keeping at room temperature for 24±2 hrs ※ 500hrs measuring the first data then 1000hrs data Low temperature JIS C 0020 *Temperature：-40°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Page 5 of 7 ASC_RFLPF1608050K0T_V01 Dec. 2011 Approval sheet SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2, Fig 2. Infrared soldering profile ORDERING CODE RF LPF 160805 Walsin Product Code Dimension code RF device LPF : Per 2 digits of Length, Width, Thickness : Low Pass Filter 0 K Unit of dimension 0 : 0.1 mm 0 T Application Specification Packing K : 5 GHZ ISM Band Design Code T : Reeled 1 : 1.0 mm e.g. : 160805 = Length 16, Width 08, Thickness05 Minimum Ordering Quantity: 4000 pcs per reel. PACKAGING Paper Tape specifications (unit :mm) Index Dimension (mm) Index Dimension (mm) Page 6 of 7 Ao Bo ΦD T W 0.975 ± 0.05 1.76 ± 0.05 1.55 + 0.05 0.75 ± 0.03 8.0 ± 0.10 E F Po P1 P2 1.75 ± 0.10 3.50 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.05 ASC_RFLPF1608050K0T_V01 Dec. 2011 Approval sheet Reel dimensions C Index A Φ178.0 Dimension (mm) B Φ60.0 A B C Φ13.0 Taping Quantity: 4000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) (2) (3) (4) (5) (6) (7) (8) Aircraft equipment Aerospace equipment Undersea equipment Medical equipment Disaster prevention / crime prevention equipment Traffic signal equipment Transportation equipment (vehicles, trains, ships, etc.) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition.



Products should be storage in the warehouse on the following conditions.


Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Page 7 of 7 Temperature : -10 to +40℃ Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. ASC_RFLPF1608050K0T_V01 Dec. 2011