RFDIP2012050L5T

Approval sheet RFDIP Series – 2012(0805)- RoHS Compliance MULTILAYER CERAMIC DIPLEXER Halogens Free Product 2.4 GHz & 5 GHz ISM Band Working Frequency P/N: RFDIP2012050L5T *Contents in this sheet are subject to change without prior notice. Page 1 of 7 ASC_RFDIP2012050L5T_V02 Feb. 2012 Approval sheet FEATURES 3 1. Miniature footprint: 2.0 X 1.2 X 0.55 mm . 2. Low Profile Thickness 3. Low insertion loss 4. High attenuation on 2nd harmonic suppressed 5. LTCC process APPLICATIONS 1. Dual-band / Dual-mode.2.4 GHz/ 5 GHz WLAN CONSTRUCTION P1 P2 P3 P6 PIN Definition PIN Definition P1 Higher Freq. Port P4 GND P2 GND P5 Common Port P3 Lower Freq. Port P6 GND P5 P4 DIMENSIONS Figure Page 2 of 7 Symbol Dimension (mm) L 2.00 ± 0.10 W 1.25 ± 0.20 T 0.55 ± 0.15 A 0.20 ± 0.15 B 0.30 ± 0.15 C 0.35 ± 0.15 D 0.65 ± 0.15 E 0.20 ± 0.10 ASC_RFDIP2012050L5T_V02 Feb. 2012 Approval sheet ELECTRICAL CHARACTERISTICS RFDIP2012050L5T Specification Frequency range Insertion Loss VSWR 2400-2500 0.7 dB max. 2.0 max 4900-5900 1.0 dB max 2.0 max 50Ω Impedance Attenuation ( min.) 18 min@ 4.8-6.0GHz 18 min@ 7.2-7.5 GHz 19 min@ 1.8-2.5GHz 25 min@ 10.3-10.7GHz o Operation Temperature Range o -40 C ~ +85 C Typical Electrical Chart SOLDER LAND PATTERN Figure Line width to de designed to match 50 Ω characteristic impedance, depending on PCB material and thickness. Grounding through holes is 0.3 mm. Page 3 of 7 ASC_RFDIP2012050L5T_V02 Feb. 2012 Approval sheet RELIABILITY TEST Test item Test condition / Test method Specification Solderability JIS C 0050-4.6 *Solder bath temperature：235 ± 5°C At least 95% of a surface of each terminal JESD22-B102D *Immersion time：2 ± 0.5 sec electrode must be covered by fresh solder. *Solder：Sn3Ag0.5Cu for lead-free Leaching *Solder bath temperature：260 ± 5°C Loss of metallization on the edges of each of metallization) *Leaching immersion time：30 ± 0.5 sec electrode shall not exceed 25%. IEC 60068-2-58 *Solder : SN63A (Resistance to dissolution Resistance to soldering heat *Preheating temperature：120~150℃, JIS C 0050-5.4 1 minute. No mechanical damage. Samples shall satisfy electrical specification *Solder temperature：270±5°C after test. *Immersion time：10±1 sec Loss of metallization on the edges of each electrode shall not exceed 25%. *Solder：Sn3Ag0.5Cu for lead-free Measurement to be made after keeping at room temperature for 24±2 hrs Drop Test JIS C 0044 *Height：75 cm No mechanical damage. *Test Surface：Rigid surface of concrete Samples shall satisfy electrical specification after test. or steel. *Times：6 surfaces for each units；2 times for each side. Adhesive Strength of Termination JIS C 0051- 7.4.3 Bending test JIS C 0051- 7.4.1 *Pressurizing force： 5N(≦0603)；10N(>0603) No remarkable damage or removal of the termination. *Test time：10±1 sec The middle part of substrate shall be No mechanical damage. pressurized by means of the pressurizing Samples shall satisfy electrical specification rod at a rate of about 1 mm/s per second after test. until the deflection becomes 1mm/s and then pressure shall be maintained for 5±1 sec. Measurement to be made after keeping at room temperature for 24±2 hours Page 4 of 7 ASC_RFDIP2012050L5T_V02 Feb. 2012 Approval sheet Temperature cycle JIS C 0025 1. 30±3 minutes at -40°C±3°C, No mechanical damage. 2. 10~15 minutes at room temperature, Samples shall satisfy electrical 3. 30±3 minutes at +85°C±3°C, 4. 10~15 minutes at room temperature, specification after test. Total 100 continuous cycles Measurement to be made after keeping at room temperature for 24±2 hrs Vibration JIS C 0040 *Frequency：10Hz~55Hz~10Hz(1min) No mechanical damage. *Total amplitude：1.5mm Samples shall satisfy electrical specification *Test times：6hrs.(Two hrs each in three after test. mutually perpendicular directions) High temperature JIS C 0021 *Temperature：85°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Humidity (steady conditions) *Humidity：90% to 95% R.H. No mechanical damage. *Temperature：40±2°C Samples shall satisfy electrical specification JIS C 0022 *Time：1000+24/-0 hrs. after test. Measurement to be made after keeping at room temperature for 24±2 hrs ※ 500hrs measuring the first data then 1000hrs data Low temperature JIS C 0020 *Temperature：-40°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Page 5 of 7 ASC_RFDIP2012050L5T_V02 Feb. 2012 Approval sheet SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2, Fig 2. Infrared soldering profile ORDERING CODE RF DIP 201205 0 L 5 T Walsin Product Code Dimension code Unit of dimension Application Specification Packing RF device DIP : Diplexer Per 2 digits of Length, Width, Thickness : 0 : 0.1 mm L : Design code T : Reeled 1 : 1.0 mm 2.4GHz/5GHz e.g. : 2012 = Length 20, Width 12, Thickness 05 Minimum Ordering Quantity: 2000 pcs per reel. PACKAGING Index Dimension (mm) Index Dimension (mm) Page 6 of 7 Ao Bo ΦD T W 1.40 ± 0.10 2.30 ± 0.10 1.55 ± 0.05 0.84 ± 0.10 8.0 ± 0.10 E F Po P1 P2 1.75 ± 0.10 3.50 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.05 ASC_RFDIP2012050L5T_V02 Feb. 2012 Approval sheet Reel dimensions C Index A Φ178.0 Dimension (mm) B Φ60.0 A B C Φ13.0 Taping Quantity:2000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) (2) (3) (4) (5) (6) (7) (8) Aircraft equipment Aerospace equipment Undersea equipment Medical equipment Disaster prevention / crime prevention equipment Traffic signal equipment Transportation equipment (vehicles, trains, ships, etc.) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition.



Products should be storage in the warehouse on the following conditions.


Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Page 7 of 7 Temperature : -10 to +40℃ Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. ASC_RFDIP2012050L5T_V02 Feb. 2012